# Bipolar (BJT) Single Transistor, General Purpose, PNP, 60 V, 2 A, 800 mW, SOT-223, Surface Mount

![Product image](https://novapart.co/image/farnell:2317591RL/)

**URL**: https://novapart.co/products/PZT751T1G/bipolar-bjt-single-transistor-general-purpose-pnp
**SKU**: PZT751T1G
**Manufacturer**: ONSEMI
**Category**: Semiconductors - Discretes || Transistors || Bipolar Transistors || Single Bipolar Junction Transistors - BJT
**Price**: €0.1570
**Stock**: 500+
**Lead Time**: 2 days (indicative)

## Description

Transistor Polarity:PNP; Collector Emitter Voltage V(br)ceo:-60V; Transition Frequency ft:75MHz; Power Dissipation Pd:800mW; DC Collector Current:-2A; DC Current Gain hFE:40hFE; Tra

## Specifications

| Parameter | Value |
|---|---|
| Msl | MSL 3 - 168 hours |
| Svhc | Lead (25-Jun-2025) |
| No. Of Pins | 4Pins |
| Product Range | - |
| Qualification | AEC-Q101 |
| Power Dissipation | 800mW |
| Transistor Mounting | Surface Mount |
| Transistor Polarity | PNP |
| Transition Frequency | 75MHz |
| Transistor Case Style | SOT-223 |
| Dc Current Gain Hfe Min | 40hFE |
| Operating Temperature Max | 150°C |
| Continuous Collector Current | 2A |
| Collector Emitter Voltage Max | 60V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:2317591RL/)

## PZT751 

## PNP Silicon Planar Epitaxial Transistor 

This PNP Silicon Epitaxial transistor is designed for use in industrial and consumer applications. The device is housed in the SOT−223 package which is designed for medium power surface mount applications. 

## **www.onsemi.com** 

## **Features** 

## **SOT−223 PACKAGE HIGH CURRENT NPN SILICON TRANSISTOR SURFACE MOUNT** 

- High Current 

- The SOT−223 Package can be soldered using wave or reflow. 

- SOT−223 Package Ensures Level Mounting, Resulting in Improved Thermal Conduction, and Allows Visual Inspection of Soldered Joints. The Formed Leads Absorb Thermal Stress During Soldering, Eliminating the Possibility of Damage to the Die 

4 Soldered Joints. The Formed Leads Absorb Thermal Stress During 1 Soldering, Eliminating the Possibility of Damage to the Die 2 3 • NPN Complement is PZT651T1G **SOT−223 CASE 318E** • S Prefix for Automotive and Other Applications Requiring Unique **STYLE 1** Site and Control Change Requirements; AEC−Q101 Qualified and PPAP Capable COLLECTOR 2, 4 • These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS Compliant* BASE 1 **MAXIMUM RATINGS** (TC = 25 ° C unless otherwise noted) ~~te~~ ) EMITTER 3 **Rating Symbol Value Unit** Collector−Emitter Voltage VCEO −60 Vdc **MARKING DIAGRAM** Collector−Base Voltage VCBO −80 Vdc Emitter−Base Voltage VEBO −5.0 Vdc AYW Collector Current IC −2.0 Adc ZT751 Total Power Dissipation PD W 1 @ TA = 25 ° C (Note 1) 0.8 mW/ ° C Derate above 25 ° C 6.4 A = Assembly Location Storage Temperature Range Tstg −65 to 150 ° C Y = Year Junction Temperature TJ 150 ° C W = Work Week ~~Ss~~ = Pb−Free Package Stresses exceeding those listed in the Maximum Ratings table may damage the (Note: Microdot may be in either location) device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. Device mounted on a FR−4 glass epoxy printed circuit board using minimum **ORDERING INFORMATION** recommended footprint. **Device Package Shipping[†] THERMAL CHARACTERISTICS** PZT751T1G SOT−223 1,000 / Tape & Reel **Rating Symbol Value Unit** (Pb−Free) Thermal Resistance from Junction−to−Ambient in Free Air R JA 156 ° C/W SPZT751T1G SOT−223 1,000 / Tape & Reel (Pb−Free) Maximum Temperature for Soldering TL 260 ° C Purposes †For information on tape and reel specifications, Time in Solder Bath 10 Sec including part orientation and tape sizes, please ~~5~~ refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. 

Publication Order Number: 

**1** 

© Semiconductor Components Industries, LLC, 2015 **January, 2015 − Rev. 9** 

**PZT751T1/D** 

**PZT751** 

## **ELECTRICAL CHARACTERISTICS** (TA = 25 ° C unless otherwise noted) 

|**ELECTRICAL CHARACTERISTICS **(TA= 25°C unless otherwise noted)|||||
|---|---|---|---|---|
|**Characteristics**|**Symbol**|**Min**|**Max**|**Unit**|
|**OFF CHARACTERISTICS**|||||
|Collector−Emitter Breakdown Voltage<br>(IC= −10 mAdc, IB= 0)|V(BR)CEO|−60|−|Vdc|
|Collector−Emitter Breakdown Voltage<br>(IC= −100�Adc, IE= 0)|V(BR)CBO|−80|−|Vdc|
|Emitter−Base Breakdown Voltage<br>(IE= −10�Adc, IC= 0)|V(BR)EBO|−5.0|−|Vdc|
|Base−Emitter Cutoff Current<br>(VEB= −4.0 Vdc)|IEBO|−|−0.1|�Adc|
|Collector−Base Cutoff Current<br>(VCB= −80 Vdc, IE= 0)|ICBO|−|−100|nAdc|
|**ON CHARACTERISTICS**(Note 2)|||||
|DC Current Gain<br>(IC= −50 mAdc, VCE= −2.0 Vdc)<br>(IC= −500 mAdc, VCE= −2.0 Vdc)<br>(IC= −1.0 Adc, VCE= −2.0 Vdc)<br>(IC= −2.0 Adc, VCE= −2.0 Vdc)|hFE|75<br>75<br>75<br>40|−<br>−<br>−<br>−|−|
|Collector−Emitter Saturation Voltages<br>(IC= −2.0 Adc, IB= −200 mAdc)<br>(IC= −1.0 Adc, IB= −100 mAdc)|VCE(sat)|−<br>−|−0.5<br>−0.3|Vdc|
|Base−Emitter Voltages<br>(IC= −1.0 Adc, VCE= −2.0 Vdc)|VBE(on)|−|−1.0|Vdc|
|Base−Emitter Saturation Voltage<br>(IC= −1.0 Adc, IB= −100 mAdc)|VBE(sat)|−|−1.2|Vdc|
|Current−Gain−Bandwidth<br>(IC= −50 mAdc, VCE= −5.0 Vdc, f = 100 MHz)|fT|75|−|MHz|



2. Pulse Test: Pulse Width ≤ 300 � s, Duty Cycle = 2.0%. 

**www.onsemi.com** 

**2** 

**PZT751** 

## **TYPICAL CHARACTERISTICS** 

**==> picture [487 x 385] intentionally omitted <==**

**----- Start of picture text -----**<br>
250 TJ = 125°C -2.0<br>225 VCE = -2.0 V -1.8<br>200 -1.6<br>175 -1.4<br>25°C<br>150 -1.2<br>125 -1.0 VBE(sat) @ IC/IB = 10<br>100 -�55°C -0.8<br>75 -0.6 VBE(on) @ VCE = 2.0 V<br>50 -0.4<br>25 -0.2 VCE(sat) @ IC/IB = 10<br>0 0<br>-10 -�20 -�50 -100 -�200 -�500 -1.0 A -2.0 A -4.0 A -50 -100 -200 -500 -1.0 A -2.0 A -4.0 A<br>IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)<br>Figure 1. Typical DC Current Gain Figure 2. On Voltages<br>-1.0<br>-0.9<br>-0.8 T J  = 25°C<br>-0.7<br>-0.6<br>-0.5<br>-0.4<br>IC = -500 mA IC = -2.0 A<br>-0.3<br>-0.2<br>IC = -10 mA IC = -100 mA<br>-0.1<br>0<br>-0.05 -0.1 -0.2 -0.5 -1.0 -2.0 -5.0 -10 -20 -50 -100-200 -500<br>IB, BASE CURRENT (mA)<br>V, VOLTAGE (VOLTS)<br>hFE, DC CURRENT GAIN<br>VCE, COLLECTOR-EMITTER VOLTAGE (VOLTS)<br>**----- End of picture text -----**<br>


**Figure 3. Collector Saturation Region** 

**www.onsemi.com** 

**3** 

MECHANICAL CASE OUTLINE **PACKAGE DIMENSIONS** 

**SOT−223 (TO−261)** CASE 318E−04 ISSUE R 

**SCALE 1:1** 

## DATE 02 OCT 2018 

**DOCUMENT NUMBER: 98ASB42680B** 

**DESCRIPTION: SOT−223 (TO−261)** 

Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed  versions are uncontrolled  except when stamped  “CONTROLLED COPY” in red. 

**PAGE 1 OF 2** 

ON Semiconductor and          are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the rights of others. 

www.onsemi.com 

© Semiconductor Components Industries, LLC, 2018 

DATE 02 OCT 2018 

## **SOT−223 (TO−261)** CASE 318E−04 ISSUE R 

STYLE 1: STYLE 2: STYLE 3: STYLE 4: STYLE 5: PIN 1. BASE PIN 1. ANODE PIN 1. GATE PIN 1. SOURCE PIN 1. DRAIN 2. COLLECTOR 2. CATHODE 2. DRAIN 2. DRAIN 2. GATE 3. EMITTER 3. NC 3. SOURCE 3. GATE 3. SOURCE 4. COLLECTOR 4. CATHODE 4. DRAIN 4. DRAIN 4. GATE STYLE 6: STYLE 7: STYLE 8: STYLE 9: STYLE 10: PIN 1. RETURN PIN 1. ANODE 1 CANCELLED PIN 1. INPUT PIN 1. CATHODE 2. INPUT 2. CATHODE 2. GROUND 2. ANODE 3. OUTPUT 3. ANODE 2 3. LOGIC 3. GATE 4. INPUT 4. CATHODE 4. GROUND 4. ANODE STYLE 11: STYLE 12: STYLE 13: PIN 1. MT 1 PIN 1. INPUT PIN 1. GATE 2. MT 2 2. OUTPUT 2. COLLECTOR 3. GATE 3. NC 3. EMITTER 4. MT 2 4. OUTPUT 4. COLLECTOR **GENERIC MARKING DIAGRAM*** AYW XXXXX 1 ~~|~~ A = Assembly Location Y = Year W = Work Week XXXXX = Specific Device Code = Pb−Free Package (Note: Microdot may be in either location) *This information is generic. Please refer to device data sheet for actual part marking. Pb−Free indicator, “G” or microdot “ ”, may or may not be present. Some products may not follow the Generic Marking. 

Electronic versions are uncontrolled except when accessed directly from the Document Repository. **DOCUMENT NUMBER: 98ASB42680B** Printed  versions are uncontrolled  except when stamped  “CONTROLLED COPY” in red. **DESCRIPTION: SOT−223 (TO−261) PAGE 2 OF 2** ~~—ee~~ ON Semiconductor and          are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the rights of others. 

www.onsemi.com 

© Semiconductor Components Industries, LLC, 2018 

**onsemi** , , and other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “ **onsemi** ” or its affiliates and/or subsidiaries in the United States and/or other countries. **onsemi** owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of **onsemi** ’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. **onsemi** reserves the right to make changes at any time to any products or information herein, without notice. The information herein is provided “as−is” and **onsemi** makes no warranty, representation or guarantee regarding the accuracy of the information, product features, availability, functionality, or suitability of its products for any particular purpose, nor does **onsemi** assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using **onsemi** products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by **onsemi** . “Typical” parameters which may be provided in **onsemi** data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. **onsemi** does not convey any license under any of its intellectual property rights nor the rights of others. **onsemi** products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use **onsemi** products for any such unintended or unauthorized application, Buyer shall indemnify and hold **onsemi** and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that **onsemi** was negligent regarding the design or manufacture of the part. **onsemi** is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. 

## **PUBLICATION ORDERING INFORMATION** 

**LITERATURE FULFILLMENT** : **TECHNICAL SUPPORT Email Requests to:** orderlit@onsemi.com **North American Technical Support: Europe, Middle East and Africa Technical Support:** Voice Mail: 1 800−282−9855 Toll Free USA/Canada Phone: 00421 33 790 2910 **onsemi Website:** www.onsemi.com Phone: 011 421 33 790 2910 For additional information, please contact your local Sales Representative 

◊ 

**==> picture [232 x 43] intentionally omitted <==**



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