# Power MOSFET, N Channel, 100 V, 1.9 A, 0.25 ohm, SOT-23, Surface Mount

![Product image](https://novapart.co/image/farnell:2439758/)

**URL**: https://novapart.co/products/PMV213SN,215/power-mosfet-n-channel-100-v-19-a-025-ohm-sot-23
**SKU**: PMV213SN,215
**Manufacturer**: NEXPERIA
**Category**: Semiconductors - Discretes || FETs || Single MOSFETs
**Price**: €0.2040
**Stock**: 10+
**Lead Time**: 372 days (indicative)

## Description

Transistor Polarity:N Channel; Continuous Drain Current Id:1.9A; Drain Source Voltage Vds:100V; On Resistance Rds(on):0.213ohm; Rds(on) Test Voltage Vgs:10V; Threshold Voltage Vgs:

## Specifications

| Parameter | Value |
|---|---|
| Msl | MSL 1 - Unlimited |
| Svhc | No SVHC (25-Jun-2025) |
| No. Of Pins | 3Pins |
| Channel Type | N Channel |
| Qualification | - |
| Power Dissipation | 2W |
| Transistor Mounting | Surface Mount |
| Rds(On) Test Voltage | 10V |
| Transistor Case Style | SOT-23 |
| Drain Source Voltage Vds | 100V |
| Operating Temperature Max | 150°C |
| Continuous Drain Current Id | 1.9A |
| Drain Source On State Resistance | 0.25ohm |
| Gate Source Threshold Voltage Max | 3V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:2439758/)

**Product data** 

## **PMV213SN** 

**==> picture [64 x 40] intentionally omitted <==**

**----- Start of picture text -----**<br>
M3D088<br>**----- End of picture text -----**<br>


µTrenchMOS™ standard level FET 

**Rev. 02 — 19 February 2003** 

## **1.** 

## **1.1 Description** 

TrenchMOS™ technology. 

Product availability: 

PMV213SN in SOT23. 

## **1.2 Features** 

I Low on-state resistance in a small surface mount package. 

## **1.3 Applications** 

I DC-to-DC primary side switching. 

## **1.4 Quick reference data** 

I VDS ≤ 100 V I ID ≤ 1.9 A I Ptot ≤ 2 W I RDSon ≤ 250 mΩ 

## **2. Pinning information** 

**Table 1:** 

**==> picture [497 x 116] intentionally omitted <==**

**----- Start of picture text -----**<br>
Pin Description Simplified outline Symbol<br>1 gate (g)<br>3 d<br>2 source (s)<br>3 drain (d)<br>g<br>1 2<br>MBB076 s<br>Top view MSB003<br>SOT23<br>**----- End of picture text -----**<br>


**==> picture [229 x 70] intentionally omitted <==**

**PMV213SN** 

**Philips Semiconductors** 

µ **TrenchMOS™ standard level FET** 

## **3. Limiting values** 

## **Table 2: Limiting values** 

In accordance with the Absolute Maximum Rating System (IEC 60134). 

|**Symbol**<br>**Parameter**|**Conditions**<br>**Min**<br>**Max**<br>**Unit**|
|---|---|
|VDS<br>drain-source voltage (DC)|25°C≤Tj≤150°C<br>-<br>100<br>V|
|VDGR<br>drain-gate voltage (DC)|25°C≤Tj≤150°C; RGS= 20 kΩ<br>-<br>100<br>V|
|VGS<br>gate-source voltage (DC)|-<br>±30<br>V|
|ID<br>drain current (DC)|Tsp= 25°C; VGS= 10 V;Figure 2and3<br>-<br>1.9<br>A|
||Tsp= 100°C; VGS= 10 V;Figure 2<br>-<br>1.2<br>A|
|IDM<br>peak drain current|Tsp= 25°C; pulsed; tp≤10µs;Figure 3<br>-<br>7.6<br>A|
|Ptot<br>total power dissipation|Tsp= 25°C;Figure 1<br>-<br>2<br>W|
|Tstg<br>storage temperature|−55<br>+150<br>°C|
|Tj<br>junction temperature|−55<br>+150<br>°C|
|**Source-drain diode**||
|IS<br>source (diode forward) current (DC)|Tsp= 25°C<br>-<br>1.7<br>A|
|ISM<br>peak source (diode forward) current|Tsp= 25°C; pulsed; tp≤10µs<br>-<br>6.9<br>A|



© Koninklijke Philips Electronics N.V. 2003. All rights reserved. 

9397 750 11128 

**Product data** 

**Rev. 02 — 19 February 2003** 

**2 of 12** 

**PMV213SN** 

**Philips Semiconductors** 

## µ **TrenchMOS™ standard level FET** 

**==> picture [497 x 278] intentionally omitted <==**

**----- Start of picture text -----**<br>
03aa25<br>120 03aa17 120<br>Pder Ider<br>(%) (%)<br>80 80<br>40 40<br>0 0<br>0 50 100 150 200 0 50 100 150 200<br>Tsp (°C) Tsp (°C)<br>Pder = ----------------------- PtotP ( tot25 ° C ) × 100 % I der = ------------------- I D ( I25D ° C ) × 100 %<br>Fig 1. Normalized total power dissipation as a Fig 2. Normalized continuous drain current as a<br>function of solder point temperature. function of solder point temperature.<br>**----- End of picture text -----**<br>


**==> picture [430 x 220] intentionally omitted <==**

**----- Start of picture text -----**<br>
03aj44<br>    10<br>tp = 10 µ s<br>ID<br>(A)<br>      1 100 µ s<br>1 ms<br>10 [-1] Limit RDSon = VDS/ID DC 10 ms<br>100 ms<br>10 [-2]<br>10 [-3]<br>   1   10  10 [2]  10 [3]<br>VDS (V)<br>**----- End of picture text -----**<br>


Tsp = 25 °C; IDM is single pulse; VGS = 10V **Fig 3. Safe operating area; continuous and peak drain currents as a function of drain-source voltage.** 

© Koninklijke Philips Electronics N.V. 2003. All rights reserved. 

9397 750 11128 

**Product data** 

**Rev. 02 — 19 February 2003** 

**3 of 12** 

**PMV213SN** 

**Philips Semiconductors** 

µ **TrenchMOS™ standard level FET** 

## **4. Thermal characteristics** 

## **Table 3: Thermal characteristics** 

|**Symbol**<br>**Parameter**<br>**Conditions**|**Min**<br>**Typ**<br>**Max**<br>**Unit**|
|---|---|
|Rth(j-sp)<br>thermal resistance from junction to solder point Figure 4<br>-<br>-<br>60<br>K/W||



## **4.1 Transient thermal impedance** 

**==> picture [431 x 220] intentionally omitted <==**

**----- Start of picture text -----**<br>
03aj43<br>  10 [2]<br>Zth(j-sp)<br> (K/W)<br>δ = 0.5<br>0.2<br>    10<br>0.1<br>0.05 t<br>P δ = p<br>T<br>0.02<br>single pulse tp t<br>T<br>      1<br>10 [-4] 10 [-3] 10 [-2] 10 [-1]    1   10<br>tp (s)<br>**----- End of picture text -----**<br>


**Fig 4. Transient thermal impedance from junction to solder point as a function of pulse duration.** 

© Koninklijke Philips Electronics N.V. 2003. All rights reserved. 

9397 750 11128 

**Product data** 

**Rev. 02 — 19 February 2003** 

**4 of 12** 

**PMV213SN** 

**Philips Semiconductors** 

µ **TrenchMOS™ standard level FET** 

## **5. Characteristics** 

|**5.**<br>**Characteristics**||
|---|---|
|**Table 4:**<br>**Characteristics**<br>Tj= 25°C unless otherwise specified.||
|**Symbol**<br>**Parameter**|**Conditions**<br>**Min**<br>**Typ**<br>**Max**<br>**Unit**|
|**Static characteristics**||
|V(BR)DSS drain-source breakdown voltage|ID= 250µA; VGS= 0 V|
||Tj= 25°C<br>100<br>-<br>-<br>V|
||Tj=−55°C<br>90<br>-<br>-<br>V|
|VGS(th)<br>gate-source threshold voltage|ID= 1 mA; VDS= VGS;Figure 9|
||Tj= 25°C<br>2<br>3<br>4<br>V|
||Tj= 150°C<br>1.2<br>-<br>-<br>V|
||Tj=−55°C<br>-<br>-<br>4.4<br>V|
|IDSS<br>drain-source leakage current|VDS= 100 V; VGS= 0 V|
||Tj= 25°C<br>-<br>-<br>1<br>µA|
||Tj= 150°C<br>-<br>-<br>100<br>µA|
|IGSS<br>gate-source leakage current|VGS=±20 V; VDS= 0 V<br>-<br>10<br>100<br>nA|
|RDSon<br>drain-source on-state resistance|VGS= 10 V; ID= 0.5 A;Figure 7and8|
||Tj= 25°C<br>-<br>213<br>250<br>mΩ|
||Tj= 150°C<br>-<br>490<br>575<br>mΩ|
|**Dynamic characteristics**||
|Qg(tot)<br>total gate charge|ID= 1.2 A; VDD= 80 V; VGS= 10 V;Figure 13<br>-<br>7<br>-<br>nC<br>-<br>1.4<br>-<br>nC<br>-<br>2.5<br>-<br>nC|
|Qgs<br>gate-source charge||
|Qgd<br>gate-drain (Miller) charge||
|Ciss<br>input capacitance|VGS= 0 V; VDS= 20 V; f = 1 MHz;Figure 11<br>-<br>330<br>-<br>pF<br>-<br>36<br>-<br>pF<br>-<br>22<br>-<br>pF|
|Coss<br>output capacitance||
|Crss<br>reverse transfer capacitance||
|td(on)<br>turn-on delay time|VDD= 50 V; RL= 33Ω; VGS= 10 V; RG= 6Ω<br>-<br>5.5<br>-<br>ns<br>-<br>5<br>-<br>ns<br>-<br>9.5<br>-<br>ns<br>-<br>3<br>-<br>ns|
|tr<br>rise time||
|td(off)<br>turn-off delay time||
|tf<br>fall time||
|**Source-drain diode**||
|VSD<br>source-drain (diode forward) voltage|IS= 1.5 A; VGS= 0 V;Figure 12<br>-<br>0.83<br>1.2<br>V|
|trr<br>reverse recovery time|IS= 1.2 A; dIS/dt =−100 A/µs; VGS= 0 V<br>-<br>36<br>-<br>ns<br>-<br>23<br>-<br>nC|
|Qr<br>recovered charge||



© Koninklijke Philips Electronics N.V. 2003. All rights reserved. 

9397 750 11128 

**Product data** 

**Rev. 02 — 19 February 2003** 

**5 of 12** 

**PMV213SN** 

**Philips Semiconductors** 

µ **TrenchMOS™ standard level FET** 

**==> picture [174 x 182] intentionally omitted <==**

**----- Start of picture text -----**<br>
03aj45<br>6<br>10 V 6 V<br>ID 5.4 V<br>(A)<br>5.2 V<br>4<br>5 V<br>4.8 V<br>2<br>4.6 V<br>4.4 V<br>VGS = 4.2 V<br>0<br>0 0.5 1 1.5 2<br>VDS (V)<br>**----- End of picture text -----**<br>


**==> picture [36 x 10] intentionally omitted <==**

**----- Start of picture text -----**<br>
Tj = 25 °C<br>**----- End of picture text -----**<br>


**Fig 5. Output characteristics: drain current as a function of drain-source voltage; typical values.** 

**==> picture [188 x 209] intentionally omitted <==**

**----- Start of picture text -----**<br>
03aj46<br>400<br>5.2 V 5.4 V<br>Tj = 25 °C VGS = 5 V<br>RDSon<br>(mΩ)<br>300<br>6 V<br>10 V<br>200<br>100<br>0<br>0 2 4 ID (A) 6<br>Tj = 25 °C<br>**----- End of picture text -----**<br>


**Fig 7. Drain-source on-state resistance as a function of drain current; typical values.** 

**==> picture [227 x 195] intentionally omitted <==**

**----- Start of picture text -----**<br>
03aj47<br>6<br>VDS > ID x RDSon<br>ID<br>(A)<br>4<br>2<br>25 °C Tj = 150 °C<br>0<br>0 2 4 6<br>VGS (V)<br>**----- End of picture text -----**<br>


Tj = 25 °C and 150 °C; VDS > ID × RDSon 

**Fig 6. Transfer characteristics: drain current as a function of gate-source voltage; typical values.** 

**==> picture [223 x 255] intentionally omitted <==**

**----- Start of picture text -----**<br>
03aa29<br>3<br>a<br>2<br>1<br>0<br>-60 0 60 120 Tj (°C) 180<br>R<br>a = ---------------------------- DSon -<br>RDSon ( 25 ° C )<br>Fig 8. Normalized drain-source on-state resistance<br>factor as a function of junction temperature.<br>**----- End of picture text -----**<br>


© Koninklijke Philips Electronics N.V. 2003. All rights reserved. 

9397 750 11128 

**Product data** 

**Rev. 02 — 19 February 2003** 

**6 of 12** 

**PMV213SN** 

**Philips Semiconductors** 

## µ **TrenchMOS™ standard level FET** 

**==> picture [497 x 259] intentionally omitted <==**

**----- Start of picture text -----**<br>
03aa32 03aa35<br>5  10 [-1]<br>VGS(th)  ID<br>(V) (A)<br>4 max  10 [-2]<br>3 typ  10 [-3] min typ max<br>2 min  10 [-4]<br>1  10 [-5]<br>0  10 [-6]<br>-60 0 60 120 Tj (°C) 180 0 2 4 VGS (V) 6<br>ID = 1 mA; VDS = VGS Tj = 25 °C<br>Fig 9. Gate-source threshold voltage as a function of Fig 10. Sub-threshold drain current as a function of<br>junction temperature. gate-source voltage.<br>**----- End of picture text -----**<br>


**==> picture [307 x 207] intentionally omitted <==**

**----- Start of picture text -----**<br>
03aj49<br>  10 [3]<br>C Ciss<br>(pF)<br>  10 [2]<br>Coss<br>Crss<br>    10<br>      1<br>10 [-1]    1   10  10 [2]<br>VDS (V)<br>VGS = 0 V; f = 1 MHz<br>**----- End of picture text -----**<br>


**==> picture [462 x 9] intentionally omitted <==**

**----- Start of picture text -----**<br>
Fig 11. Input, output and reverse transfer capacitances as a function of drain-source voltage; typical values.<br>**----- End of picture text -----**<br>


© Koninklijke Philips Electronics N.V. 2003. All rights reserved. 

9397 750 11128 

**Product data** 

**Rev. 02 — 19 February 2003** 

**7 of 12** 

**PMV213SN** 

**Philips Semiconductors** 

µ **TrenchMOS™ standard level FET** 

**==> picture [497 x 270] intentionally omitted <==**

**----- Start of picture text -----**<br>
03aj48 03aj50<br>6 10<br>VGS = 0 V VGS ID = 1.2 A VDD = 20 V<br>(A)IS (V) 8 Tj = 25 °C<br>4<br>6<br>80 V<br>50 V<br>4<br>2<br>150 °C Tj = 25 °C 2<br>0 0<br>0 0.3 0.6 0.9 1.2 0 2 4 6 8<br>VSD (V) QG (nC)<br>Tj = 25 °C and 150 °C; VGS = 0 V ID = 1.2 A; VDD = 20 V, 50 V, 80 V<br>Fig 12. Source (diode forward) current as a function of Fig 13. Gate-source voltage as a function of gate<br>source-drain (diode forward) voltage; typical charge; typical values.<br>values.<br>**----- End of picture text -----**<br>


© Koninklijke Philips Electronics N.V. 2003. All rights reserved. 

9397 750 11128 

**Product data** 

**Rev. 02 — 19 February 2003** 

**8 of 12** 

**PMV213SN** 

**Philips Semiconductors** 

µ **TrenchMOS™ standard level FET** 

## **6. Package outline** 

## **Plastic surface mounted package; 3 leads** 

**SOT23** 

**==> picture [482 x 575] intentionally omitted <==**

**----- Start of picture text -----**<br>
D B E A X<br>HE v M A<br>3<br>Q<br>A<br>A1<br>1 2 c<br>e1 bp w M B Lp<br>e<br>detail X<br>0 1 2 mm<br>scale<br>DIMENSIONS (mm are the original dimensions)<br>UNIT A max.A1 bp c D E  e e1 HE Lp Q v w<br>1.1 0.48 0.15 3.0 1.4 2.5 0.45 0.55<br>mm 0.1 1.9 0.95 0.2 0.1<br>0.9 0.38 0.09 2.8 1.2 2.1 0.15 0.45<br>OUTLINE  REFERENCES EUROPEAN<br>ISSUE DATE<br>VERSION  IEC  JEDEC  EIAJ PROJECTION<br>97-02-28<br> SOT23 TO-236AB<br>99-09-13<br>**----- End of picture text -----**<br>


## **Fig 14. SOT23.** 

© Koninklijke Philips Electronics N.V. 2003. All rights reserved. 

9397 750 11128 

**Product data** 

**Rev. 02 — 19 February 2003** 

**9 of 12** 

**PMV213SN** 

**Philips Semiconductors** 

µ **TrenchMOS™ standard level FET** 

## **7. Revision history** 

## **Table 5: Revision history** 

|**Rev**|**Date**|**CPCN**|**Description**|
|---|---|---|---|
|**02**|**20030219**|**-**|**Product data (9397 750 11128)**|
||||Modifcations:|
||||**•** Section 1.4 “Quick reference data”IDmodifed due to improved Rth.|
||||**•** Section 1.4 “Quick reference data”Ptotmodifed due to improved Rth.|
||||**•** Section 3 “Limiting values”ID, IDM, Ptot, IS, ISMmodifed due to improved Rth.|
||||**•** Section 3 “Limiting values” Figure 3SOA graph modifed due to improved Rth.|
||||**•** Section 4 “Thermal characteristics”Rth(j-sp)improved.|
||||**•** Section 4 “Thermal characteristics” Figure 4to refect the improvement in Rth(j-sp).|
|**01**|**20030115**|**-**|**Product data (9397 750 10893)**|



© Koninklijke Philips Electronics N.V. 2003. All rights reserved. 

9397 750 11128 **Product data** 

**Rev. 02 — 19 February 2003** 

**10 of 12** 

**PMV213SN** 

**Philips Semiconductors** 

**µ TrenchMOS™ standard level FET** 

## **8. Data sheet status** 

|**Level**|**Data sheet status**[1]|**Product status**[2][3]|**Defnition**|
|---|---|---|---|
|I|Objective data|Development|This data sheet contains data from the objective specifcation for product development. Philips<br>Semiconductors reserves the right to change the specifcation in any manner without notice.|
|II|Preliminary data|Qualifcation|This data sheet contains data from the preliminary specifcation. Supplementary data will be published<br>at a later date. Philips Semiconductors reserves the right to change the specifcation without notice, in|
||||order to improve the design and supply the best possible product.|
|III|Product data|Production|This data sheet contains data from the product specifcation. Philips Semiconductors reserves the|
||||right to make changes at any time in order to improve the design, manufacturing and supply. Relevant<br>changes will be communicated via a Customer Product/Process Change Notifcation (CPCN).|



- [1] Please consult the most recently issued data sheet before initiating or completing a design. 

[2] The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com. 

[3] For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status. 

## **9.** 

extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. 

Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. 

**Application information  —** Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification. 

customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. 

**Right to make changes —** Philips Semiconductors reserves the right to make changes in the products - including circuits, standard cells, and/or software - described or contained herein in order to improve design and/or performance. When the product is in full production (status ‘Production’), relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN). Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no licence or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified. 

## **11. Trademarks** 

## **10. Disclaimers** 

**TrenchMOS  —** is a trademark of Koninklijke Philips Electronics N.V. 

**Life support —** These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors 

## **Contact information** 

For additional information, please visit **http://www.semiconductors.philips.com** . For sales office addresses, send e-mail to: **sales.addresses@www.semiconductors.philips.com** . 

**Fax: +31 40 27 24825** 

**© Koninklijke Philips Electronics N.V. 2003. All rights reserved.** 

**9397 750 11128** 

**Product data** 

**Rev. 02 — 19 February 2003** 

**11 of 12** 

**PMV213SN** 

**Philips Semiconductors** 

µ **TrenchMOS™ standard level FET** 

## **Contents** 

|**1**|**Product profle . . . . . . . . . . . . . . . . . . . . . . . . . .  1**|
|---|---|
|1.1|Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1|
|1.2|Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1|
|1.3|Applications  . . . . . . . . . . . . . . . . . . . . . . . . . . . 1|
|1.4|Quick reference data. . . . . . . . . . . . . . . . . . . . . 1|
|**2**|**Pinning information. . . . . . . . . . . . . . . . . . . . . .  1**|
|**3**|**Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . .  2**|
|**4**|**Thermal characteristics. . . . . . . . . . . . . . . . . . .  4**|
|4.1|Transient thermal impedance . . . . . . . . . . . . . . 4|
|**5**|**Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . .  5**|
|**6**|**Package outline . . . . . . . . . . . . . . . . . . . . . . . . .  9**|
|**7**|**Revision history. . . . . . . . . . . . . . . . . . . . . . . .  10**|
|**8**|**Data sheet status . . . . . . . . . . . . . . . . . . . . . . .  11**|
|**9**|**Defnitions  . . . . . . . . . . . . . . . . . . . . . . . . . . . .  11**|
|**10**|**Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . .  11**|
|**11**|**Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . .  11**|



## **© Koninklijke Philips Electronics N.V. 2003. Printed in The Netherlands** 

All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. 

The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. 

**==> picture [229 x 117] intentionally omitted <==**

**Date of release: 19 February 2003** 

**Document order number: 9397 750 11128** 



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