# Power MOSFET, N Channel, 60 V, 300 mA, 5 ohm, TO-236AB, Surface Mount

![Product image](https://novapart.co/image/farnell:1081473RL/)

**URL**: https://novapart.co/products/PMBF170,215/power-mosfet-n-channel-60-v-300-ma-5-ohm-to-236ab
**SKU**: PMBF170,215
**Manufacturer**: NEXPERIA
**Category**: Semiconductors - Discretes || FETs || Single MOSFETs
**Price**: €0.0870
**Stock**: 10+
**Lead Time**: 373 days (indicative)

## Description

Transistor Polarity:N Channel; Continuous Drain Current Id:300mA; Drain Source Voltage Vds:60V; On Resistance Rds(on):2.8ohm; Rds(on) Test Voltage Vgs:10V; Threshold Voltage Vgs:2V; Power Dissipation P

## Specifications

| Parameter | Value |
|---|---|
| Msl | MSL 1 - Unlimited |
| Svhc | No SVHC (25-Jun-2025) |
| No. Of Pins | 3Pins |
| Channel Type | N Channel |
| Product Range | - |
| Qualification | - |
| Power Dissipation | 830mW |
| Transistor Mounting | Surface Mount |
| Rds(On) Test Voltage | 10V |
| Transistor Case Style | TO-236AB |
| Drain Source Voltage Vds | 60V |
| Operating Temperature Max | 150°C |
| Continuous Drain Current Id | 300mA |
| Drain Source On State Resistance | 5ohm |
| Gate Source Threshold Voltage Max | 2V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:1081473RL/)

## **Important notice** 

Dear Customer, 

On 7 February 2017 the former NXP Standard Product business became a new company with the tradename **Nexperia** . Nexperia is an industry leading supplier of Discrete, Logic and PowerMOS semiconductors with its focus on the automotive, industrial, computing, consumer and wearable application markets 

In data sheets and application notes which still contain NXP or Philips Semiconductors references, use the references to Nexperia, as shown below. 

Instead of http://www.nxp.com, http://www.philips.com/ or http://www.semiconductors.philips.com/, use **http://www.nexperia.com** 

Instead of sales.addresses@www.nxp.com or sales.addresses@www.semiconductors.philips.com, use **salesaddresses@nexperia.com** (email) 

Replace the copyright notice at the bottom of each page or elsewhere in the document, depending on the version, as shown below: 

- © NXP N.V. (year). All rights reserved or © Koninklijke Philips Electronics N.V. (year). All rights reserved 

Should be replaced with: 

- **© Nexperia B.V. (year). All rights reserved** . 

If you have any questions related to the data sheet, please contact our nearest sales office via e-mail or telephone (details via **salesaddresses@nexperia.com** ). Thank you for your cooperation and understanding, 

Kind regards, 

Team Nexperia 

## **PMBF170** 

**Rev. 03 — 23 June 2000 Product specification** 

## **1. Description** 

TrenchMOS™[1] technology. 

Product availability: 

PMBF170 in SOT23. 

## **2. Features** 

I TrenchMOS™ technology 

- I Very fast switching 

- I Logic level compatible 

- I Subminiature surface mount package. 

## **3. Applications** 

- I Relay driver 

I High speed line driver 

I Logic level translator. 

## **4. Pinning information** 

## **Table 1:** 

|**Pin**<br>**Description**<br>**Simplifed outline**<br>**Symbol**|**Pin**<br>**Description**<br>**Simplifed outline**<br>**Symbol**|**Pin**<br>**Description**<br>**Simplifed outline**<br>**Symbol**|**Pin**<br>**Description**<br>**Simplifed outline**<br>**Symbol**|**Pin**<br>**Description**<br>**Simplifed outline**<br>**Symbol**|**Pin**<br>**Description**<br>**Simplifed outline**<br>**Symbol**|**Pin**<br>**Description**<br>**Simplifed outline**<br>**Symbol**|**Pin**<br>**Description**<br>**Simplifed outline**<br>**Symbol**|
|---|---|---|---|---|---|---|---|
|1<br>gate (g)<br>2<br>source (s)<br>3<br>drain (d)|||**3**|||||
|||||||||
|||||||||
||||||||0|
|||||||||
||**1**|||||||



1. TrenchMOS is a trademark of Royal Philips Electronics. 

**==> picture [229 x 70] intentionally omitted <==**

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## **5. Quick reference data** 

## **Table 2: Quick reference data** 

|**Symbol**<br>**Parameter**|**Conditions**<br>**Typ**<br>**Max**<br>**Unit**|
|---|---|
|VDS<br>drain-source voltage (DC)|Tj= 25 to 150°C<br>−<br>60<br>V|
|ID<br>drain current (DC)|Tsp= 25°C; VGS= 10 V<br>−<br>300<br>mA|
|Ptot<br>total power dissipation|Tsp= 25°C<br>−<br>0.83<br>W|
|Tj<br>junction temperature|−<br>150<br>°C|
|RDSon<br>drain-source on-state resistance|VGS= 10 V; ID= 500 mA<br>2.8<br>5<br>Ω|
||VGS= 4.5 V; ID= 75 mA<br>3.8<br>5.3<br>Ω|



## **6. Limiting values** 

## **Table 3: Limiting values** 

In accordance with the Absolute Maximum Rating System (IEC 60134). 

|**Symbol**<br>**Parameter**|**Conditions**<br>**Min**<br>**Max**<br>**Unit**|
|---|---|
|VDS<br>drain-source voltage (DC)|Tj= 25 to 150°C<br>−<br>60<br>V|
|VDGR<br>drain-gate voltage (DC)|Tj= 25 to 150°C; RGS= 20 kΩ<br>−<br>60<br>V|
|VGS<br>gate-source voltage (DC)|−<br>±20<br>V|
|ID<br>drain current (DC)|Tsp= 25°C; VGS= 10 V;<br>Figure 2and3<br>−<br>300<br>mA|
||Tsp= 100°C; VGS= 10 V;Figure 2<br>−<br>190<br>mA|
|IDM<br>peak drain current|Tsp= 25°C; pulsed; tp≤10µs;<br>Figure 3<br>−<br>1.2<br>A|
|Ptot<br>total power dissipation|Tsp= 25°C;Figure 1<br>−<br>0.83<br>W|
|Tstg<br>storage temperature|−65<br>+150<br>°C|
|Tj<br>operating junction temperature|−65<br>+150<br>°C|
|**Source-drain diode**||
|IS<br>source (diode forward) current (DC)|Tsp= 25°C<br>−<br>300<br>mA|
|ISM<br>peak source (diode forward) current|Tsp= 25°C; pulsed; tp≤10µs<br>−<br>1.2<br>A|



© Philips Electronics N.V. 2000. All rights reserved. 

9397 750 07208 

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## 

**==> picture [497 x 272] intentionally omitted <==**

**----- Start of picture text -----**<br>
03aa17 03aa25<br>120 120<br>Ider (%)<br>Pder  100 100<br>(%)<br>80 80<br>60 60<br>40 40<br>20 20<br>0 0<br>0 25 50 75 100 125 150 175 0 25 50 75 100 125 150 175<br>Tsp ( [o] C)<br>Tsp ( [o] C)<br>Pder = ---------------------- PtotP ( tot25 ° C ) × 100 % V I der GS ≥ = 4.5 V----------------- I D ( I25D ° C - ) × 100 %<br>Fig 1. Normalized total power dissipation as a Fig 2. Normalized continuous drain current as a<br>function of solder point temperature. function of solder point temperature.<br>**----- End of picture text -----**<br>


**==> picture [293 x 170] intentionally omitted <==**

**----- Start of picture text -----**<br>
03aa03<br>10<br>(A)ID Tsp = 25 [o] C<br>tp = 10 µs<br>1 RDSon = VDS/ ID<br>100 µs<br>1 ms<br>P δ = tp<br>10 [-1] T 10 ms<br>D.C.<br>tp t 100 ms<br>T<br>10 [-2]<br>1 10 10 [2]<br>VDS (V)<br>**----- End of picture text -----**<br>


Tsp = 25 °C; IDM is single pulse. 

**Fig 3. Safe operating area; continuous and peak drain currents as a function of drain-source voltage.** 

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## **7. Thermal characteristics** 

## **Table 4: Thermal characteristics** 

|**Symbol**|**Parameter**|**Conditions**|**Value**|**Unit**|
|---|---|---|---|---|
|Rth(j-sp)|thermal resistance from junction to solder|mounted on a metal clad substrate;|150|K/W|
||point|Figure 4|||
|Rth(j-a)|thermal resistance from junction to ambient|mounted on a printed circuit board;|350|K/W|
|||minimum footprint|||



## **7.1 Transient thermal impedance** 

**==> picture [311 x 177] intentionally omitted <==**

**----- Start of picture text -----**<br>
03aa01<br>10 [3]<br>Zth(j-sp)<br> K/W<br>δ = 0.5<br>10 [2]<br>0.2<br>0.1<br>10<br>0.02 P δ = tp<br>T<br>1 single pulse 0.05<br>tp t<br>T<br>10 [-1]<br>10 [-5] 10 [-4] 10 [-3] 10 [-2] 10 [-1] 1 10<br>tp (s)<br>Mounted on metal clad substrate.<br>**----- End of picture text -----**<br>


**Fig 4. Transient thermal impedance from junction to solder point as a function of pulse duration.** 

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## **8. Characteristics** 

**Table 5: Characteristics** Tj = 25 °C unless otherwise specified 

|**Symbol**<br>**Parameter**|**Conditions**<br>**Min**<br>**Typ**<br>**Max**<br>**Unit**|
|---|---|
|**Static characteristics**||
|V(BR)DSS<br>drain-source breakdown<br>voltage|ID= 10µA; VGS= 0 V<br>Tj= 25°C<br>60<br>75<br>−<br>V|
||Tj=−55°C<br>55<br>−<br>−<br>V|
|VGS(th)<br>gate-source threshold voltage|ID= 1 mA; VDS= VGS;<br>Figure 9<br>Tj= 25°C<br>1<br>2<br>−<br>V|
||Tj= 150°C<br>0.6<br>−<br>−<br>V|
||Tj=−55°C<br>−<br>−<br>3.5<br>V|
|IDSS<br>drain-source leakage current|VDS= 48 V; VGS= 0 V<br>Tj= 25°C<br>−<br>0.01<br>1.0<br>µA|
||Tj= 150°C<br>−<br>−<br>10<br>µA|
||VDS= 25 V; VGS= 0 V<br>Tj= 25°C<br>−<br>5<br>500<br>nA|
|IGSS<br>gate-source leakage current|VGS=±15 V; VDS= 0 V<br>−<br>10<br>100<br>nA|
|RDSon<br>drain-source on-state<br>resistance|VGS= 10 V; ID= 500 mA;<br>Figure 7and8<br>Tj= 25°C<br>−<br>2.8<br>5<br>Ω|
||Tj= 150°C<br>−<br>−<br>9.25<br>Ω|
||VGS= 4.5 V; ID= 75 mA;<br>Figure 7and8<br>Tj= 25°C<br>−<br>3.8<br>5.3<br>Ω|
|**Dynamic characteristics**||
|gfs<br>forward transconductance|VDS= 10 V; ID= 200 mA;<br>Figure 11<br>100<br>300<br>−<br>mS|
|Ciss<br>input capacitance|VGS= 0 V; VDS= 10 V;<br>f = 1 MHz;Figure 12<br>−<br>25<br>40<br>pF<br>−<br>18<br>30<br>pF<br>−<br>7.5<br>10<br>pF|
|Coss<br>output capacitance||
|Crss<br>reverse transfer capacitance||
|ton<br>turn-on time|VDD= 50 V; RD= 250Ω;<br>VGS= 10 V; RG= 50Ω;<br>RGS= 50Ω<br>−<br>3<br>10<br>ns<br>−<br>12<br>15<br>ns|
|toff<br>turn-off time||
|**Source-drain diode**||
|VSD<br>source-drain (diode forward)<br>voltage|IS= 300 mA; VGS= 0 V;<br>Figure 13<br>−<br>0.85<br>1.5<br>V|
|trr<br>reverse recovery time|IS= 300 mA;<br>dIS/dt =−100 A/µs;<br>VGS= 0 V; VDS= 25 V<br>−<br>30<br>−<br>ns<br>−<br>30<br>−<br>nC|
|Qr<br>recovered charge||



© Philips Electronics N.V. 2000. All rights reserved. 

9397 750 07208 

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## 

**==> picture [497 x 484] intentionally omitted <==**

**----- Start of picture text -----**<br>
03aa04 03aa06<br>1 0.8<br>ID (A) Tj = 25 [o] C ID (A)0.7 VDS > ID X RDSon<br>0.8<br>VGS = 10 V 0.6<br>Tj = 25 [o] C<br>0.5 150 [o] C<br>0.6<br>4.5 V<br>0.4<br>0.4 4 V<br>0.3<br>3.5 V 0.2<br>0.2<br>3 V 0.1<br>0 0<br>0 0.4 0.8 1.2 1.6 2 0 1 2 3 4 5 6 7<br>VDS (V) VGS (V)<br>Tj = 25 °C Tj = 25 °C and 150 °C; VDS ≥ ID × RDSon<br>Fig 5. Output characteristics: drain current as a Fig 6. Transfer characteristics: drain current as a<br>function of drain-source voltage; typical values. function of gate-source voltage; typical values.<br>03aa05 03aa28<br>10 2.2<br>RDSon (Ω9) 3 V 3.5V Tj = 25 [o] C a 2<br>8 1.8<br>1.6<br>7<br>1.4<br>6<br>4 V<br>1.2<br>5<br>1<br>4 4.5 V<br>0.8<br>3<br>VGS = 10 V 0.6<br>2 0.4<br>1 0.2<br>0 0<br>0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 -60 -20 20 60 100 140 180<br>ID (A) Tj ( [o] C)<br>Tj = 25 °C a = -------------------------- RDSon -<br>RDSon ( 25 ° C )<br>Fig 7. Drain-source on-state resistance as a function Fig 8. Normalized drain-source on-state resistance<br>of drain current; typical values. factor as a function of junction temperature.<br>**----- End of picture text -----**<br>


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**==> picture [176 x 166] intentionally omitted <==**

**----- Start of picture text -----**<br>
03aa34<br>3<br>VGS(th) (V)<br>2.5<br>typ<br>2<br>1.5<br>min<br>1<br>0.5<br>0<br>-60 -20 20 60 100 140 180<br>Tj ( [o] C)<br>**----- End of picture text -----**<br>


## ID = 1 mA; VDS = VGS 

**Fig 9. Gate-source threshold voltage as a function of junction temperature.** 

**==> picture [165 x 171] intentionally omitted <==**

**----- Start of picture text -----**<br>
03aa07<br>0.5<br>gfs (S) VDS > ID X RDSon<br>0.45<br>0.4 Tj = 25 [o] C<br>0.35<br>150 [o] C<br>0.3<br>0.25<br>0.2<br>0.15<br>0.1<br>0.05<br>0<br>0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8<br>ID (A)<br>**----- End of picture text -----**<br>


Tj = 25 °C and 150 °C; VDS ≥ ID × RDSon 

**Fig 11. Forward transconductance as a function of drain current; typical values.** 

**==> picture [159 x 164] intentionally omitted <==**

**----- Start of picture text -----**<br>
03aa37<br>10 [-1]<br>ID<br>(A)<br>10 [-2]<br>min typ<br>10 [-3]<br>10 [-4]<br>10 [-5]<br>10 [-6]<br>0 0.5 1 1.5 2 2.5 3<br>VGS (V)<br>**----- End of picture text -----**<br>


**==> picture [76 x 10] intentionally omitted <==**

**----- Start of picture text -----**<br>
Tj = 25 °C; VDS = 5 V<br>**----- End of picture text -----**<br>


**Fig 10. Sub-threshold drain current as a function of gate-source voltage.** 

**==> picture [175 x 162] intentionally omitted <==**

**----- Start of picture text -----**<br>
03aa09<br>10 [2]<br>Ciss, Coss<br>Crss (pF)<br>Ciss<br>10 Coss<br>Crss<br>1<br>10 [-1] 1 10 10 [2]<br>VDS (V)<br>**----- End of picture text -----**<br>


**==> picture [75 x 8] intentionally omitted <==**

**----- Start of picture text -----**<br>
VGS = 0 V; f = 1 MHz<br>**----- End of picture text -----**<br>


**Fig 12. Input, output and reverse transfer capacitances as a function of drain-source voltage; typical values.** 

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**==> picture [158 x 162] intentionally omitted <==**

**----- Start of picture text -----**<br>
03aa08<br>1<br>VGS = 0 V<br>IS (A)<br>0.8<br>0.6<br>150 [o] C<br>0.4<br>Tj = 25 [o] C<br>0.2<br>0<br>0 0.2 0.4 0.6 0.8 1 1.2<br>VSD (V)<br>**----- End of picture text -----**<br>


Tj = 25 °C and 150 °C; VGS = 0 V 

**Fig 13. Source (diode forward) current as a function of source-drain (diode forward) voltage; typical values.** 

© Philips Electronics N.V. 2000. All rights reserved. 

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## **9. Package outline** 

**==> picture [482 x 588] intentionally omitted <==**

**----- Start of picture text -----**<br>
Plastic surface mounted package; 3 leads SOT23<br>D B E A X<br>HE v M A<br>3<br>Q<br>A<br>A1<br>1 2 c<br>e1 bp w M B Lp<br>e<br>detail X<br>0 1 2 mm<br>scale<br>DIMENSIONS (mm are the original dimensions)<br>UNIT A max.A1 bp c D E  e e1 HE Lp Q v w<br>1.1 0.48 0.15 3.0 1.4 2.5 0.45 0.55<br>mm 0.1 1.9 0.95 0.2 0.1<br>0.9 0.38 0.09 2.8 1.2 2.1 0.15 0.45<br>OUTLINE  REFERENCES EUROPEAN<br>ISSUE DATE<br>VERSION  IEC  JEDEC  EIAJ PROJECTION<br>97-02-28<br> SOT23 TO-236AB<br>99-09-13<br>**----- End of picture text -----**<br>


## **Fig 14. SOT23.** 

© Philips Electronics N.V. 2000. All rights reserved. 

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## **10. Revision history** 

|**Table**|**6:**<br>**Revision history**|**6:**<br>**Revision history**||
|---|---|---|---|
|**Rev**|**Date**|**CPCN**|**Description**|
|**03**|**20000622**|**HZG303**|**Product specifcation; third version; supersedes PMBF170_CNV_2 of 970623.**|
||||Converted from VDMOS (Nijmegen) to TrenchMOS™ technology (Hazel Grove).|
|**02**|**19970623**|**-**|**Product specifcation; second version.**|
|**01**|**19901031**|**-**|**Product specifcation; initial version.**|



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## **11. Data sheet status** 

|**Datasheet status**|**Product status**|**Defnition** [1]|
|---|---|---|
|Objective specifcation|Development|This data sheet contains the design target or goal specifcations for product development. Specifcation may|
|||change in any manner without notice.|
|Preliminary specifcation|Qualifcation|This data sheet contains preliminary data, and supplementary data will be published at a later date. Philips|
|||Semiconductors reserves the right to make changes at any time without notice in order to improve design and|
|||supply the best possible product.|
|Product specifcation|Production|This data sheet contains fnal specifcations. Philips Semiconductors reserves the right to make changes at any|
|||time without notice in order to improve design and supply the best possible product.|



[1] Please consult the most recently issued data sheet before initiating or completing a design. 

## **12.** 

## **13. Disclaimers** 

The data in a short-form is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. 

Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. 

**Application information  —** Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification. 

**Life support —** These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. 

**Right to make changes —** Philips Semiconductors reserves the right to make changes, without notice, in the products, including circuits, standard cells, and/or software, described or contained herein in order to improve design and/or performance. Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no licence or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified. 

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(SCA69) 

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**Philips Semiconductors** 

## **Contents** 

|**1**|**Description**. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1|
|---|---|
|**2**|**Features**. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1|
|**3**|**Applications**. . . . . . . . . . . . . . . . . . . . . . . . . . . . 1|
|**4**|**Pinning information**. . . . . . . . . . . . . . . . . . . . . . 1|
|**5**|**Quick reference data**. . . . . . . . . . . . . . . . . . . . . 2|
|**6**|**Limiting values**. . . . . . . . . . . . . . . . . . . . . . . . . . 2|
|**7**|**Thermal characteristics**. . . . . . . . . . . . . . . . . . . 4|
|7.1|Transient thermal impedance . . . . . . . . . . . . . . 4|
|**8**|**Characteristics**. . . . . . . . . . . . . . . . . . . . . . . . . . 5|
|**9**|**Package outline**. . . . . . . . . . . . . . . . . . . . . . . . . 9|
|**10**|**Revision history**. . . . . . . . . . . . . . . . . . . . . . . . 10|
|**11**|**Data sheet status**. . . . . . . . . . . . . . . . . . . . . . . 11|
|**12**|**Definitions**. . . . . . . . . . . . . . . . . . . . . . . . . . . . 11|
|**13**|**Disclaimers**. . . . . . . . . . . . . . . . . . . . . . . . . . . . 11|



## **© Philips Electronics N.V. 2000.** 

## **Printed in The Netherlands** 

All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. 

The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. 

**==> picture [229 x 117] intentionally omitted <==**

**Date of release: 23 June 2000** 

**Document order number: 9397 750 07208** 



## Links

- [View this product on Novapart](https://novapart.co/products/PMBF170,215/power-mosfet-n-channel-60-v-300-ma-5-ohm-to-236ab)
- [Request a quote for this part](https://novapart.co/quote/)
- [Supplier page](https://es.farnell.com/nexperia/pmbf170-215/mosfet-n-sot-23/dp/1081473RL)
---

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