# MOSFET Relay, SPST-NO (1 Form A), AC / DC, 800 V, 100 mA, Flatpack-6 (8-Pin Body), Surface Mount

![Product image](https://novapart.co/image/farnell:3995966/)

**URL**: https://novapart.co/products/PLA171PTR/mosfet-relay-spst-no-1-form-a-ac-dc-800-v-100-ma
**SKU**: PLA171PTR
**Manufacturer**: LITTELFUSE
**Category**: Switches & Relays || Relays || Solid State Relays & Contactors || MOSFET Solid State Relays
**Price**: €1.8600
**Stock**: 10+
**Lead Time**: 169 days (indicative)

## Specifications

| Parameter | Value |
|---|---|
| Svhc | To Be Advised |
| Load Type | AC / DC |
| Contact Form | SPST-NO (1 Form A) |
| Load Current | 100mA |
| Product Range | OptoMOS Series |
| Relay Mounting | Surface Mount |
| Relay Terminals | Gull Wing |
| Load Voltage Max | 800V |
| Isolation Voltage | 5kV |
| I/O Capacitance Typ | 3pF |
| On State Resistance Max | 50ohm |
| Mosfet Relay Package Style | Flatpack-6 (8-Pin Body) |
| Off State Leakage Current Max | 1µA |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:3995966/)

**PLA171 800V, 100mA Single-Pole, Normally Open Relay** 

INTEGRATED CIRCUITS DIVISION 

|**Parameter**|**Rating**|**Units**|
|---|---|---|
|Load Voltage|800|VP|
|Load Current|100|mArms/ mADC|
|On-Resistance(max)|50||
|Input Control Current|2|mA|



## **Features** 

- 7mm Separation of Output Pins 

- 800VP Blocking Voltage 

- 5000Vrms Input/Output Isolation 

- Low Drive Power Requirements 

- No EMI/RFI Generation 

- Small Surface Mount Package 

- Flammability Rating UL 94 V-0 

## **Description** 

Specially designed to provide 7mm of separation between the two output pins, IXYS Integrated Circuits' PLA171 is a single-pole, normally open (1-Form-A) Solid State Relay that uses optically coupled MOSFET technology to provide an en hanced input to output isolation of 5000Vrms. 

Its optically coupled outputs, which use the patented OptoMOS architecture, are controlled by a highly efficient infrared LED. 

The PLA171 is designed to replace, and offers superior reliability over, electromechanical relays. This device provides bounce-free switching in a compact surface-mount package. 

## **Approvals** 

## **Applications** 

- Instrumentation 

   - UL Certified Component: File E76270 

   - TUV EN 62368-1: Certificate # B 082667 0008 

- Multiplexers 

- Data Acquisition 

- Electronic Switching 

- I/O Subsystems 

- Meters (Watt-Hour, Water, Gas) 

- Medical Equipment—Patient/Equipment Isolation 

- Automotive High-Voltage Circuitry 

**Ordering Information** 

**Part # Description** PLA171P 6-Pin (8-Pin Body) Flatpack (50/Tube) ~~—~~ PLA171PTR 6-Pin (8-Pin Body) Flatpack, Tape & Reel (1000/Reel) 

- Industrial Controls 

## **Pin Configuration** 

**==> picture [134 x 63] intentionally omitted <==**

**----- Start of picture text -----**<br>
1 8<br>NC Load<br>2<br>+ Control<br>3<br>– Control<br>4 5<br>NC Load<br>**----- End of picture text -----**<br>


## **Switching Characteristics of Normally Open Devices** 

**==> picture [118 x 77] intentionally omitted <==**

**----- Start of picture text -----**<br>
Form-A<br>IF<br>90%<br>10%<br>ILOAD<br>ton toff<br>**----- End of picture text -----**<br>


**1** 

DS-PLA171-R05 

**www.ixysic.com** 

**PLA171** 

INTEGRATED CIRCUITS DIVISION 

## **Absolute Maximum Ratings @ 25ºC** 

|**Parameter**|**Ratings**|**Units**|
|---|---|---|
|BlockingVoltage|800|VP|
|Reverse Input Voltage|5|V|
|Input Control Current<br>Peak(10ms)|50|mA|
||1|A|
|Input Power Dissipation1|150|mW|
|Total Power Dissipation2|800|mW|
|ESD, Human BodyModel|8|kV|
|Isolation Voltage, Input to Output(60 Seconds)|5000|Vrms|
|Operational Temperature, Ambient|-40 to +85|°C|
|Storage Temperature|-40 to +125|°C|



_Absolute Maximum Ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied._ 

_Typical values are characteristic of the device at +25°C, and are the result of engineering evaluations. They are provided for information purposes only, and are not part of the manufacturing testing requirements._ 

1  Derate linearly 1.33 mW / ºC 

2  Derate output power linearly 6.67 mW / ºC 

## **Electrical Characteristics @ 25ºC** 

|**Parameter**|**Conditions**|**Symbol**|**Min**|**Typ**|**Max**|**Units**|
|---|---|---|---|---|---|---|
|**Output Characteristics**|||||||
|Blocking Voltage|IL=1A|VDRM|800|-|-|VP|
|Load Current1<br>Continuous<br>Peak<br>~~a~~|IF=2mA|IL|-|-|100|mArms/ mADC|
||IF=2mA , t=10ms<br>~~ee~~|ILPK<br>~~e~~|-<br>~~eee~~|-<br>~~eee e~~|±350<br>~~e~~|mAP<br>~~ee~~|
|On-Resistance2<br>~~a~~|IF=2mA, IL= 100mA<br>~~ee~~|RON<br>~~e~~|-<br>~~eee~~|40<br>~~eee e~~|50<br>~~e~~|<br>~~ee~~|
||IF=5mA, IL=1mA<br>~~ee~~||-<br>~~eee~~|70<br>~~eee e~~|85<br>~~e~~||
|Off-State Leakage Current<br>~~a~~|IF=0mA, VL=800V<br>~~ee~~|ILEAK<br>~~e~~|-<br>~~eee~~|-<br>~~eee e~~|1<br>~~e~~|µA<br>~~ee~~|
|Switching Speeds<br>Turn-On<br>Turn-Off<br>~~a~~<br>~~eee~~|IF=5mA, VL=10V<br>~~ee~~<br>~~eee~~|ton<br>~~e ~~<br>~~eee~~|-<br> ~~eee~~<br>~~eee~~|0.42<br>~~eee e~~<br>~~eee~~|5<br>~~e~~<br>~~eee~~|ms<br>~~ee~~<br>~~eee~~|
|||toff<br>~~eee~~|-<br>~~eee~~|0.15<br>~~eee~~|5<br>~~eee~~||
|Output Capacitance<br>~~eee~~|IF=0mA, VL=50V, f=1MHz<br>~~eee~~|COUT<br>~~eee~~|-<br>~~eee~~|11<br>~~eee~~|-<br>~~eee~~|pF<br>~~eee~~|
|**Input Characteristics**|||||||
|Input Control Current to Activate3|IL=100mA|IF|-|0.39|2|mA|
|Input Control Current to Deactivate|-|IF|0.1|-|-|mA|
|Input Voltage Drop|IF=5mA|VF|0.9|1.36|1.5|V|
|Reverse Input Current|VR=5V|IR|-|-|10|µA|
|**Common Characteristics**|||||||
|Input to Output Capacitance|VIO=0V, f=1MHz|CIO|-|3|-|pF|



1  Load derates linearly from 100mA @ 25oC to 55mA @85oC. 

2  Measurement taken within one second of on-time. 

3  For applications requiring high temperature operation (greater than 60oC) a minimum LED drive current of 5mA is recommended. 

R05 

**www.ixysic.com** 

**2** 

**PLA171** 

INTEGRATED CIRCUITS DIVISION 

## **PERFORMANCE DATA*** 

**==> picture [498 x 567] intentionally omitted <==**

**----- Start of picture text -----**<br>
Typical LED Forward Voltage Drop Typical Turn-On Time Typical Turn-Off Time<br>(N=50, IF=5mA) (N=50, IF=5mA, IL=100mA) (N=50, IF=5mA, IL=100mA)<br>30 25 20<br>25 20<br>= 15 FT Ley ft<br>20<br>15<br>15 10<br>10<br>10<br>5<br>5 5<br>0 a_i 0 0 aa iis<br>1.364 1.366 1.368 1.370 1.372 0.36 0.38 0.40 0.42 0.44 0.46 0.48 0.135 0.140 0.145 0.150 0.155 0.160 0.165<br>LED Forward Voltage Drop (V) Turn-On Time (ms) Turn-Off Time (ms)<br>Typical IF for Switch Operation Typical On-Resistance Distribution Typical Blocking Voltage Distribution<br>(N=50, IL=100mA) (N=50, IF=2mA, IL=100mA) (N=50)<br>15 35 15<br>30<br>10 | 25 10<br>e e 20 e] Soo e eeee Pee<br>15<br>5 ltt 10 oe 5 | Be<br>5<br>0 Tit 0 —H 0 wail<br>0.33 0.35 0.37 0.39 0.41 0.43 0.45 40.0 40.5 41.0 41.5 42.0 42.5 956 964 972 980 988 996 1004<br>LED Current (mA)  On-Resistance ( ) Blocking Voltage (VP)<br>Typical Turn-On Time Typical Turn-Off Time<br>Typical LED Forward Voltage Drop vs. LED Forward Current vs. LED Forward Current<br>1.8 vs. Temperature 0.7 (IL=55mA) 0.160 (IL=55mA)<br>1.7<br>0.6 0.158<br>1.6<br>1.5 IIFF=10mA=5mA 0.5 0.156<br>1.4 I F =2mA 0.4 0.154<br>1.3<br>0.3 0.152<br>1.2<br>SPS 0.2 AE 0.150<br>1.1<br>1.0 SF 0.1 eS 0.148<br>-50 -25 0 25 50 75 100 0 10 20 30 40 50 0 10 20 30 40 50<br>Temperature (ºC) LED Current (mA) LED Current (mA)<br>LED Current to Operate<br>vs. Temperature Typical Turn-On Time Typical Turn-Off Time<br>(IL=55mA) vs. Temperature vs. Temperature<br>0.55 0.9 0.20<br>0.8 0.18<br>0.50 Toh sees Sooo<br>0.7 IF=2mA<br>IF=2mA 0.16<br>0.45 0.6<br>POOP) soe 0.14 FS<br>0.5<br>0.40 Ue 0.4 e IF=5mA e 0.12 IF=5mA<br>0.35 leer EL) 0.3 eer4 $C 0.10 NeEEN<br>-40 -20 0 20 40 60 80 100 -40 -20 0 20 40 60 80 100 -40 -20 0 20 40 60 80 100<br>Temperature (ºC) Temperature (ºC) Temperature (ºC)<br>Device Count (N) Device Count (N) Device Count (N)<br>Device Count (N) Device Count (N) Device Count (N)<br>Turn-On Time (ms) Turn-Off Time (ms)<br>LED Forward Voltage Drop (V)<br>LED Current (mA) Turn-On Time (ms) Turn-Off Time (ms)<br>**----- End of picture text -----**<br>


*Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC. 

**www.ixysic.com** 

R05 

**3** 

call INTEGRATED CIRCUITS DIVISION **PLA171** ~~a~~ 

## **PERFORMANCE DATA*** 

**==> picture [500 x 282] intentionally omitted <==**

**----- Start of picture text -----**<br>
Typical On-Resistance Typical Load Current Maximum Load Current<br>vs. Temperature vs. Load Voltage vs. Temperature<br>70 (IF=5mA) 100 (IF=2mA) 110 (IF=5mA)<br>60 IL=30mA 100<br>50<br>90<br>e 50 ee U4<br>ae 0 PE 80<br>40 —pectert LL) Seen<br>IL=55mA -50 70<br>30 Te] | |tt a/ry 60 EeeE<br>20 ALTLEELER -100 L EVEL LL | 50 [eeeINE I<br>-40 -20 0 20 40 60 80 100 -6 -4 -2 0 2 4 6 -40 -20 0 20 40 60 80 100<br>Temperature (ºC) Voltage (V) Temperature (ºC)<br>Typical Leakage Current<br>Typical Blocking Voltage vs. Temperature<br>1040 vs. Temperature 80 (VL=800V) 1.0 Energy Rating Curve<br>1020 70<br>0.8<br>1000 a 60 oe 1 1 A<br>980 HHA 50 EE EEE 0.6 ORI<br>960 40 0.4<br>940 Sy 30 we | 80 Hl<br>0.2<br>920 Cat 20 Ee a<br>900 eT? 10 7 ee 0.0 FAME MTT) Tact<br>-40 -20 0 20 40 60 80 100 -40 -20 0 20 40 60 80 100 10 s 100 s 1ms 10ms 100ms 1s 10s 100s<br>Temperature (ºC) Temperature (ºC) Time<br>)<br>On-Resistance ( Load Current (mA) Load Current (mA)<br>)P<br>Blocking Voltage (V Leakage Current (nA) Load Current (A)<br>**----- End of picture text -----**<br>


*Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC. 

R05 

**www.ixysic.com** 

**4** 

**PLA171** 

INTEGRATED CIRCUITS DIVISION 

## **Manufacturing Information** 

## **Moisture Sensitivity** 

All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated Circuits classifies its plastic encapsulated devices for moisture sensitivity according to the latest version of % the joint industry standard, **IPC/JEDEC J-STD-020** , in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. 

Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. 

This product carries a **Moisture Sensitivity Level (MSL)** classification as shown below, and should be handled according to the requirements of the latest version of the joint industry standard **IPC/JEDEC J-STD-033** . 

|**Device**<br>~~ee~~|**Moisture Sensitivity Level (MSL) Classifi cation**<br>~~ee~~|
|---|---|
|PLA171P<br>~~ee~~|MSL 1<br>~~ee~~|



## **ESD Sensitivity** 

This product is ESD Sensitive, and should be handled according to the industry standard **JESD-625** . 

## **Soldering Profile** 

Provided in the table below is the **IPC/JEDEC J-STD-020** Classification Temperature (TC) and the maximum total dwell time (tP) in all reflow processes that the body temperature of these surface mount devices may be (TC - 5)°C or greater. The device’s body temperature must not exceed the Classification Temperature at any time during reflow soldering processes. 

|**Device**<br>~~PT~~|**Classifi cation Temperature (Tc)**<br>~~PT~~|**Dwell Time (tP)**<br>~~PT~~|**Max Refl ow Cycles**<br>~~PT~~|
|---|---|---|---|
|PLA171P<br>~~PT~~|260ºC<br>~~PT~~|30 seconds<br>~~PT~~|3<br>~~PT~~|



## **Board Wash** 

IXYS Integrated Circuits recommends the use of no-clean flux formulations. Board washing to reduce or remove flux residue following the solder reflow process is acceptable provided proper precautions are taken to prevent damage to the device. These precautions include but are not limited to: using a low pressure wash and providing a follow up bake cycle sufficient to remove any moisture trapped within the device due to the washing process. Due to the variability of the wash parameters used to clean the board, determination of the bake temperature and duration necessary to remove the moisture trapped within the package is the responsibility of the user (assembler). Cleaning or drying methods that employ ultrasonic energy may damage the device and should not be used. Additionally, the device must not be exposed to halide flux or solvents. 

**www.ixysic.com** 

R05 

**5** 

**PLA171** 

INTEGRATED CIRCUITS DIVISION 

## **Mechanical Dimensions** 

## **PLA171P** 

**==> picture [457 x 399] intentionally omitted <==**

**----- Start of picture text -----**<br>
Recommended PCB Land Pattern<br>2.286 MAX<br>(0.300) TYP7.620 TYP (0.090) MAXSee Note 3 0.051±0.051<br>(0.002±0.002) 7.62<br>(0.30)<br>6.350 ± 0.127 9.398 ± 0.127 7.620 ± 0.254<br>(0.250 ± 0.005) (0.370 ± 0.005) (0.300 ± 0.010)<br>8.70<br>tt Pin 1 a 1 (0.3425)<br>0.457 ± 0.076 0.203 ± 0.025<br>2.540 ± 0.127 iee (0.018 ± 0.003) (0.008 ± 0.001) e  | 7<br>(0.100 ± 0.005) fe “ 0.635 ± 0.127 e f 1.55 t oo o<br>(0.025 ± 0.005) (0.0610) 2.54<br>F I L, LL (0.10)<br>9.652 ± 0.381<br>0.65<br>(0.380 ± 0.015) 2.159 ± 0.025 (0.0255)<br>(0.085 ± 0.001) Notes:<br>1. Coplanarity = 0.102mm (0.004”) MAX<br>2. Leadframe thickness does not include solder<br>e 0.864 ± 0.102 al     plating (1000 microinches MAX)3. Sum of package height, standoff, and coplanarity Dimensions —_ mm<br>d L (0.034 ± 0.004)     shall not exceed 2.286mm (0.090”) (inches)<br>4. Controlling dimension: Inches<br>PLA171PTR Tape & Reel<br>2.00 4.00<br>330.2 DIA. (0.079) (0.157)<br>(13.00 DIA.)<br>7.50<br>Top Cover (0.295)<br>Tape Thickness0.102 MAX. Bo = 10.30 W = 16.00(0.63)<br>(0.406)<br>(0.004 MAX.)<br>Ao = 10.30<br>P1 = 12.00<br>K0 = 2.70 (0.406) (0.472)<br>(0.106)<br>Dimensions<br>Embossed Carrier OS : K1 (0.079)= 2.00 ; User Direction of Feed a a (inches)mm<br>NOTES:<br>1. All dimensions carry tolerances of EIA Standard 481-2<br>Embossment 2. The tape complies with all “Notes” for constant dimensions listed on page 5 of EIA-481-2<br>3. Controlling dimension: mm<br>**----- End of picture text -----**<br>


## **PLA171PTR Tape & Reel** 

## **For additional information please visit our website at: https://www.ixysic.com** 

**Disclaimer Notice - Information furnished is believed to be accurate and reliable. However, users should independently evaluate the suitability of and test each product selected for their own applications. Littelfuse products are not designed for, and may not be used in, all applications. Read complete Disclaimer Notice at https://www.littelfuse.com/disclaimer-electronics.** 

Specification:  DS-PLA171-R05 ©Copyright 2021, Littelfuse, Inc. OptoMOS® is a registered trademark of IXYS Integrated Circuits All rights reserved.  Printed in USA. 

**6** 

11/5/2021 



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- [Supplier page](https://es.farnell.com/littelfuse/pla171ptr/mosft-relay-spst-no-0-1a-800v/dp/3995966)
---

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