# EMI Filter, 1-Channel, ESD Protection, 220 MHz, SC-75-3

![Product image](https://novapart.co/image/farnell:2728060/)

**URL**: https://novapart.co/products/NZF220TT1G/emi-filter-1-channel-esd-protection-220-mhz-sc-75
**SKU**: NZF220TT1G
**Manufacturer**: ONSEMI
**Category**: Passive Components || Filters || Integrated Passive Filters
**Price**: €0.1190
**Stock**: 10+

## Specifications

| Parameter | Value |
|---|---|
| No. Of Pins | 3Pins |
| Filter Circuit | RC Pi Filter |
| Emi Filter Type | EMI Filter with ESD Protection |
| Filter Case Style | SC-75 |
| No. Of Data Lines | 1 Data Lines |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:2728060/)

## NZF220TT1 

## EMI Filter with ESD Protection 

## **Features:** 

- EMI/RFI Bi−directional “Pi” Low−Pass Filters 

- ESD Protection Meets IEC61000−4−2 

- Diode Capacitance: 7 − 10 pF 

- Zener/Resistor Line Capacitance: 22 ± 20% pF 

**http://onsemi.com CIRCUIT DESCRIPTION** 

- Low Zener Diode Leakage: 1 A Maximum | 

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1 toe 3 2<br>3 MARKING<br>DIAGRAM<br>1 [2]<br>SC−75 X6 M<br>CASE 463<br>STYLE 4<br>" 1 &<br>X6 = Device Code<br>M = Date Code*<br>= Pb−Free Package<br>(Note: Microdot may be in either location)<br>*Date  Code orientation may vary depending<br>upon manufacturing location.<br>**----- End of picture text -----**<br>


- Zener Breakdown Voltage; 6 − 8 Volts 

- Pb−Free Package is Available 

## **Benefits:** 

- Designed to Suppress EMI/RFI Noise in Systems Subjected to Electromagnetic Interference 

- Small Package Size Minimizes Parasitic Inductance, Thus a More “Ideal” Low Pass Filtering Response 

## **Applications:** 

- Cellular Phones 

- Communication Systems 

- Computers 

• Portable Products with Input/Output Conductors 

= Pb−Free Package **MAXIMUM RATINGS** (Note: Microdot may be in either location) **Rating Symbol Value Unit** *Date  Code orientation may vary depending upon manufacturing location. Peak Power Dissipation (Note 1) PPK 14 W 8 × 20 s Pulse Maximum Junction Temperature TJ 150 ° C **ORDERING INFORMATION** ~~55s—~~ Stresses exceeding Maximum Ratings may damage the device. Maximum **Device Package Shipping**[†] Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the NZF220TT1 SC−75 3000/Tape & Reel Recommended Operating Conditions may affect device reliability. 1. All diodes under power NZF220TT1G SC−75 3000/Tape & Reel (Pb−Free) ~~=~~ †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D. © Semiconductor Components Industries, LLC, 2006 **1** Publication Order Number: **March, 2006 − Rev. 3 NZF220TT1/D** 

**NZF220TT1** 

## **ELECTRICAL CHARACTERISTICS** 

|**ELECTRICAL CHARACTERISTICS**||||||
|---|---|---|---|---|---|
|**Characteristic**|**Symbol**|**Min**|**Typ**|**Max**|**Unit**|
|Zener Breakdown Voltage, @ IZT= 1 mA|VZ|6.0|−|8.0|V|
|Zener Leakage Current, @ VR= 3 V|Ir|N/A|−|1.0|�A|
|Zener Forward Voltage, @ IF= 50 mA|VF|N/A|−|1.25|V|
|Zener Internal Capacitance, @ 0 V Bias|C|7.0|−|10|pF|
|Zener/Resistor Array Line Capacitance|C|17.6|−|26.4|pF|
|Resistance|R|90|−|110|�|
|Cutoff Frequency|FC(Note 2)|−|220|−|MHz|



2. 50 � Source and 50 � Lead Termination per Figure 2 

## **Applications Information** 

## **Suppressing Noise at the Source** 

- Filter all I/O signals leaving the noisy environment 

- Locate I/O driver circuits close to the connector 

- Use the longest rise/fall times possible for all digital signals 

## **Reducing Noise at the Receiver** 

- Filter all I/O signals entering the unit 

- Locate the I/O filters as close as possible to the connector 

## **Minimizing Noise Coupling** 

- Use multilayer PCBs to minimize power and ground inductance 

- Keep clock circuits away from the I/O connector 

- Ground planes should be used whenever possible 

- Minimize the loop area for all high speed signals 

- Provide for adequate power decoupling 

## **ESD Protection** 

- Locate the suppression devices as close to the I/O connector as possible 

- Minimize the PCB trace length to the suppression device 

- Minimize the PCB trace length for the ground return for the suppression device 

**http://onsemi.com** 

**2** 

**NZF220TT1** 

## **Frequency Response Specification** 

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TG OUTPUT RF INPUT<br>TEST BOARD<br>NZF220T<br>**----- End of picture text -----**<br>


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TRACKING SPECTRUM<br>GENERATOR ANALYZER<br>50  �<br>NZF220T<br>50  �<br>VG Vin Vout<br>Test Conditions:<br>Source Impedance = 50  �<br>Load Impedance = 50  �<br>Input Power = 0 dB<br>**----- End of picture text -----**<br>


**Figure 1. Measurement Conditions** 

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−6.3<br>�<br>� OUTPUT<br>3 dB = 220 MHz<br>−50<br>1.0 10 100 1000 3000<br>f, FREQUENCY (MHz)<br>GAIN (dB)<br>**----- End of picture text -----**<br>


**Figure 2. Typical EMI Filter Response (50** � **Source and 50** � **Lead Termination)** 

**http://onsemi.com** 

**3** 

**NZF220TT1** 

## **OUTLINE DIMENSIONS** 

**SC−75/SOT−416** CASE 463−01 ISSUE F 

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TT −E−<br>2<br>3<br>e −D−<br>1<br>b 3 PL<br>0.20 (0.008) M D<br>HE 0.20 (0.008) E<br>a<br>C<br>A<br>L A1<br>**----- End of picture text -----**<br>


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NOTES:<br>1. DIMENSIONING AND TOLERANCING PER ANSI<br>Y14.5M, 1982.<br>2. CONTROLLING DIMENSION: MILLIMETER.<br>MILLIMETERS INCHES<br>DIM MIN NOM MAX MIN NOM MAX<br>A 0.70 0.80 0.90 0.027 0.031 0.035<br>A1 0.00 0.05 0.10 0.000 0.002 0.004<br>b 0.15 0.20 0.30 0.006 0.008 0.012<br>C 0.10 0.15 0.25 0.004 0.006 0.010<br>D 1.55 1.60 1.65 0.059 0.063 0.067<br>FSSEEEE E 0.70 0.80 0.90 0.027 0.031 0.035<br>e 1.00 BSC 0.04 BSC<br>L 0.10 0.15 0.20 0.004 0.006 0.008<br>HE 1.50 1.60 1.70 0.061 0.063 0.065<br>STYLE 4:<br>PIN 1. CATHODE<br> 2. CATHODE<br> 3. ANODE<br>**----- End of picture text -----**<br>


## **SOLDERING FOOTPRINT*** 

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0.356<br>0.014<br>a<br>1.803 0.787<br>0.071 0.031<br>7 Mm _<br>_ 0.508 a<br>0.020 1.000<br>0.039<br>SCALE 10:1 mm<br>(—) inches<br>*For additional information on our Pb−Free strategy and soldering<br>details, please download the ON Semiconductor Soldering and<br>Mounting Techniques Reference Manual, SOLDERRM/D.<br>**----- End of picture text -----**<br>


**ON Semiconductor** and          are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. 

## **PUBLICATION ORDERING INFORMATION** 

**LITERATURE FULFILLMENT** : **N. American Technical Support** : 800−282−9855 Toll Free **ON Semiconductor Website** : http://onsemi.com Literature Distribution Center for ON Semiconductor USA/Canada P.O. Box 61312, Phoenix, Arizona 85082−1312 USA **Order Literature** : http://www.onsemi.com/litorder **Phone** : 480−829−7710 or 800−344−3860 Toll Free USA/Canada **Japan** : ON Semiconductor, Japan Customer Focus Center **Fax** : 480−829−7709 or 800−344−3867 Toll Free USA/Canada 2−9−1 Kamimeguro, Meguro−ku, Tokyo, Japan 153−0051 For additional information, please contact your **Email** : orderlit@onsemi.com **Phone** : 81−3−5773−3850 local Sales Representative. 

## **LITERATURE FULFILLMENT** : 

**NZF220TT1/D** 

**http://onsemi.com 4** 



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