# EMI Filter, 2-Channel, ESD Protection, 20 MHz, UDFN-8 ![Product image](https://novapart.co/image/farnell:2844909RL/) **URL**: https://novapart.co/products/NUF2450MUT2G/emi-filter-2-channel-esd-protection-20-mhz-udfn-8 **SKU**: NUF2450MUT2G **Manufacturer**: ONSEMI **Category**: Passive Components || Filters || Integrated Passive Filters **Price**: €0.1490 **Stock**: 10+ ## Datasheet 📄 [Download PDF](https://novapart.co/datasheet/farnell:2844909RL/) ## NUF2450 ## 2 Line EMI Filter with ESD Protection This device is a 2 line EMI filter array for audio applications. Greater than −30 dB attenuation is obtained at frequencies from 800 MHz to 5.0 GHz. The NUF2450MU has a cut−off frequency of 20 MHz and minimal line resistance, making it ideal for applications requiring low bandpass attenuation. This UDFN package is specifically designed to enhance EMI filtering for low−profile or slim design electronics especially where space and height is a premium. It also offers ESD protection−clamping transients from static discharges. ESD protection is provided across all capacitors. ## **Features** - EMI Filtering and ESD Protection - Integration of 10 Discrete Components - Compliance with IEC61000−4−2 (Level 4) 20 kV (Contact) ## **www.onsemi.com** **==> picture [155 x 106] intentionally omitted <==** **----- Start of picture text -----**
L
1 8
Cd Cd
L
4 5
Cd Cd
(Top View)
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- UDFN Package, 1.2 x 1.8 mm - Moisture Sensitivity Level 1 - ESD Ratings: Machine Model = C - Human Body Model = 3B - These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS Compliant ## **Benefits** - Reduces EMI/RFI Emissions on Audio Lines - Low Profile Package; Typical Height of 0.5 mm - Design−Friendly and Easy−to−Use Pin Configurations, Particularly for Portable Electronics - Integrated Solution Offers Cost and Space Savings in UDFN Package - Reduces Parasitic Inductances Which Offer a More “Ideal” Low Pass Filter Response - Integrated Solution Improves System Reliability - Excellent ESD Performance with Large GND Pad ## **Applications** - Headsets, MP3 Players, and PDAs **==> picture [152 x 117] intentionally omitted <==** **----- Start of picture text -----**
8
MARKING
wy 1 DIAGRAM
UDFN8 24 M
CASE 517AD
1
24 = Specific Device Code
M = Month Code
= Pb−Free Package
(Note: Microdot may be in either location)
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## **PIN CONNECTIONS** **==> picture [69 x 94] intentionally omitted <==** **----- Start of picture text -----**
1 4
GND
8 5
(Bottom View)
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- Portable DVDs - Hands−Free Interface **==> picture [115 x 8] intentionally omitted <==** **----- Start of picture text -----**
ORDERING INFORMATION
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**Device Package Shipping**[†] NUF2450MUT2G UDFN8 3000 / Tape & Reel (Pb−Free) ~~==~~ †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. Publication Order Number: **1** © Semiconductor Components Industries, LLC, 2017 **February, 2017 − Rev. 1** **NUF2450/D** **NUF2450** ## **MAXIMUM RATINGS** |**MAXIMUM RATINGS**|||| |---|---|---|---| |**Parameter**|**Symbol**|**Value**|**Unit**| |ESD Discharge IEC61000−4−2
Contact Discharge
Machine Model
Human Body Model|VPP|20
1.6
16|kV| |Operating Temperature Range|TOP|−40 to 85|°C| |Storage Temperature Range|TSTG|−55 to 150|°C| |Maximum Lead Temperature for Soldering Purposes (1.8 in from case for 10 s)|TL|260|°C| Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. ## **ELECTRICAL CHARACTERISTICS** (TJ = 25 ° C unless otherwise noted) |**ELECTRICAL CHARACTERIST**|**ICS**(TJ= 2|5°C unless otherwise noted)||||| |---|---|---|---|---|---|---| |**Parameter**|**Symbol**|**Test Conditions**|**Min**|**Typ**|**Max**|**Unit**| |Maximum Reverse Working Voltage|
VRWM||−|−|5.0|V| |Breakdown Voltage|VBR|IR= 1.0 mA|6.0|7.0|8.0|V| |Leakage Current|IR|VRWM= 3.3 V|−|−|100|nA| |Inductance|L||−|2.3|−|nH| |Series Resistance|RS||0.9|1.3|1.7|�| |Capacitance (Note 1)|Cline|VR= 0 V, f = 1.0 MHz|190|240|290|pF| |Cut−Off Frequency (Note 2)|f3dB|Above this frequency,
Appreciable Attenuation Occurs|−|20|−|MHz| Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. 1. Measured at 25 ° C. 2. 50 � source and 50 � load termination. ## **TYPICAL CHARACTERISTICS** **==> picture [493 x 175] intentionally omitted <==** **----- Start of picture text -----**
0 0
−5
−10
−10
−15 −20
−20
−30
−25
−40
−30
−35
−50
−40
−60
−45
−50 −70
1.00E+06 1.00E+07 1.00E+08 1.00E+09 1.00E+10 1.E+06 1.E+07 1.E+08 1.E+09 1.E+10
FREQUENCY (Hz) FREQUENCY (Hz)
S21 (dB) S41 (dB)
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**Figure 1. Typical Insertion Loss Characteristics (S21 Measurement)** **Figure 2. Analog Crosstalk Curve (S41 Measurement)** **www.onsemi.com** **2** **NUF2450** ## **PACKAGE DIMENSIONS** **UDFN8, 1.8x1.2, 0.4P** CASE 517AD ISSUE D **==> picture [473 x 371] intentionally omitted <==** **----- Start of picture text -----**
MOLD CMPD
D A EXPOSED Cu NOTES:
1. DIMENSIONING AND TOLERANCING PER
2X B ÇÇ ASME Y14.5M, 1994.
0.10 C 2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
A1 ÉÉ A3 AND IS MEASURED BETWEEN 0.15 AND
REFERENCEPIN ONE ÉÉÉ E DETAIL B 4. 0.30 mm FROM TERMINAL.COPLANARITY APPLIES TO THE EXPOSED
cul, ALTERNATE PAD AS WELL AS THE TERMINALS.
2X ÉÉÉ CONSTRUCTIONS
MILLIMETERS
eT 0.10 C DIM MIN MAX
TOP VIEW A 0.45 0.55
A1 0.00 0.05
0.05 MIN A3 0.13 REF
DETAIL B A b 0.15 0.25
0.05 C (A3) D 1.80 BSC
E 1.20 BSC
e 0.40 BSC
(0.10) D2 0.90 1.10
8X 0.05 C DETAIL A E2 0.20 0.30
NOTE 4 SIDE VIEWA1 C [SEATING] PLANE KJ 0.19 REF0.20 TYP
L L 0.20 0.30
Buy = L1 −−− 0.10
J
DETAIL A
8X L D2 L1 SOLDERING FOOTPRINT*
1 E2 DETAIL A 1.10
OPTIONAL 8X
CONSTRUCTION 7X 0.25 0.45
PACKAGE
8X K 8 8X b OUTLINE
e 0.10 C A B
e/2 0.05 C NOTE 3 1.50
BOTTOM VIEW
0.35
1
Saace t e ibe
0.35
"eo 0.40 PITCH |
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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