# EMI Filter, ESD Protection, C-R-C Pi Filter, 2 Data Lines, SOT-563-6
**URL**: https://novapart.co/products/NUF2230XV6T1G/emi-filter-esd-protection-c-r-pi-2-data-lines-sot
**SKU**: NUF2230XV6T1G
**Manufacturer**: ONSEMI
**Category**: Passive Components || Filters || Integrated Passive Filters
**Price**: €0.0950
**Stock**: 10+
**Lead Time**: 92 days (indicative)
## Specifications
| Parameter | Value |
|---|---|
| Svhc | No SVHC (25-Jun-2025) |
| No. Of Pins | 6Pins |
| Product Range | - |
| Filter Circuit | C-R-C Pi Filter |
| Emi Filter Type | EMI Filter with ESD Protection |
| No. Of Data Lines | 2 Data Lines |
| Filter Case / Package | SOT-563 |
## Datasheet
📄 [Download PDF](https://novapart.co/datasheet/farnell:4319782/)
## NUF2230XV6
## 2 Line EMI Filter with ESD Protection
This device is a 2 line EMI filter array for wireless applications. Greater than −30 dB attenuation is obtained at frequencies from 800 MHz to 900 MHz. It also offers ESD protection−clamping transients from static discharges. ESD protection is provided across all capacitors.
## **Features**
- EMI Filtering and ESD Protection
- Integration of 10 Discrete Components
- Compliance with IEC61000−4−2 (Level 4) > 8.0 kV (Contact)
- SOT−563 Package
- Moisture Sensitivity Level 1
- ESD Ratings: Machine Model = C Human Body Model = 3B
## **http://onsemi.com**
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Pin 6 Pin 5 Pin 4
D(2) GND O(2)
Pin 1 Pin 2 Pin 3
D(1) GND O(1)
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- These are Pb−Free Devices
## **Benefits**
- Reduces EMI/RFI Emissions on a Data Line
- Integrated Solution Offers Cost and Space Savings in a SOT−563 Package
- Reduces Parasitic Inductances Which Offer a More “Ideal” Low Pass Filter Response
- Integrated Solution Improves System Reliability
## **Applications**
- EMI Filtering and ESD Protection for Data Lines
- Wireless Phones
- PDAs and Handheld Products
- Notebook Computers
- LCD Displays
## **MARKING DIAGRAM**
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SOT−563
6 23 M
CASE 463A
1 1
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- 23 = Specific Device Code
M = Month Code = Pb−Free Package (Note: Microdot may be in either location)
**==> picture [191 x 94] intentionally omitted <==**
**----- Start of picture text -----**
(Note: Microdot may be in either location)
ORDERING INFORMATION
Device Package Shipping [[†]]
NUF2230XV6T1 SOT−563 4000/Tape & Reelpe & Reele & Reel
NUF2230XV6T1G SOT−563 4000/Tape & Reel
oa
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**ORDERING INFORMATION Device Package Shipping**[[†]] NUF2230XV6T1 SOT−563 4000/Tape & Reelpe & Reele & Reel NUF2230XV6T1G SOT−563 4000/Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D.
Publication Order Number: **NUF2230XV6/D**
**1**
© Semiconductor Components Industries, LLC, 2005 **July, 2005 − Rev.3**
**NUF2230XV6**
## **MAXIMUM RATINGS** (TJ = 25 ° C unless otherwise noted)
|**MAXIMUM RATINGS**(TJ= 25°C unless otherwise noted)||||
|---|---|---|---|
|**Parameter**|**Symbol**|**Value**|**Unit**|
|ESD Discharge IEC61000−4−2
Air Discharge
Contact Discharge|VPP|15
8.0|kV|
|Steady−State Power per Resistor|PR||mW|
|Steady−State Power per Package|PT||mW|
|Operating Temperature Range|TOP|−40 to 85|°C|
|Storage Temperature Range|TSTG|−55 to 150|°C|
|Maximum Lead Temperature for Soldering Purposes (1.8 in from case for 10 seconds)|TL|260|°C|
Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected.
## **ELECTRICAL CHARACTERISTICS** (TJ = 25 ° C unless otherwise noted)
|**ELECTRICAL CHARACTERISTICS**|(TJ= 25°C u|nless otherwise noted)|||||
|---|---|---|---|---|---|---|
|**Parameter**|**Symbol**|**Test Conditions**|**Min**|**Typ**|**Max**|**Unit**|
|Maximum Reverse Working Voltage|VRWM||||5.0|V|
|Breakdown Voltage|VBR|IR= 1.0 mA|6.0|7.0||V|
|Leakage Current|IR|VRWM= 3.0 V|||1.0|�A|
|Resistance|RA|IR= 20 mA|90|100|110|�|
|Capacitance (Notes 1 and 2)|Cd|VR= 2.5 V, f = 1.0 MHz||16||pF|
|Cut−Off Frequency (Note 3)|f3dB|Above this frequency,
appreciable attenuation occurs||125||MHz|
1. Measured at 25 ° C, VR = 2.5 V, f = 1.0 MHz.
2. Total line capacitance is 2 times the Diode Capacitance (Cd).
3. 50 � source and 50 � load termination.
**http://onsemi.com**
**2**
**NUF2230XV6**
**==> picture [491 x 174] intentionally omitted <==**
**----- Start of picture text -----**
2
0
−5
1.5
−10
−15
1
−20
−25
0.5
−30
−35 0
1.E+06 1.E+07 1.E+08 1.E+09 1.E+10 0 1 2 3 4 5
FREQUENCY (Hz) REVERSE VOLTAGE (V)
S21 (dB)
NORMALIZED CAPACITANCE
**----- End of picture text -----**
**Figure 1. Insertion Loss Characteristic (50** � **Source and 50** � **Lead Termination)**
**Figure 2. Typical Capacitance vs. Reverse Biased Voltage (Normalized Capacitance, Cd @ 2.5 V)**
**==> picture [248 x 173] intentionally omitted <==**
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110
108
106
104
102
100
98
96
94
92
90
−40 −20 0 20 40 60 80
TEMPERATURE ( ° C)
) �
RESISTANCE (
**----- End of picture text -----**
**Figure 3. Typical Resistance over Temperature**
**http://onsemi.com**
**3**
**NUF2230XV6**
## **PACKAGE DIMENSIONS**
**SOT−563, 6 LEAD** CASE 463A−01 ISSUE F
**==> picture [410 x 129] intentionally omitted <==**
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NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
D 2. CONTROLLING DIMENSION: MILLIMETERS
−X− A 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD
L FINISH THICKNESS. MINIMUM LEAD THICKNESS
IS THE MINIMUM THICKNESS OF BASE MATERIAL.
6 5 4 MILLIMETERS INCHES
−Y−E HE DIMA 0.50 MIN NOM 0.55 MAX 0.60 0.020 MIN 0.021 NOM 0.023 MAX
1 2 3 b 0.17 0.22 0.27 0.007 0.009 0.011
C 0.08 0.12 0.18 0.003 0.005 0.007
m e i Se
D 1.50 1.60 1.70 0.059 0.062 0.066
b 6 5 PL C E 1.10 1.20 1.30 0.043 0.047 0.051
e 0.08 (0.003) M X Y Le 0.10 0.5 BSC0.20 0.30 0.004 0.02 BSC0.008 0.012
HE 1.50 1.60 1.70 0.059 0.062 0.066
**----- End of picture text -----**
## **SOLDERING FOOTPRINT***
**==> picture [153 x 170] intentionally omitted <==**
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0.3
0.0118
Ty
0.45
0.0177
1.0
THe, 1.35 0.0394
0.0531
Lape
| __| 0.5 ___ 0.5 |
0.0197 0.0197
SCALE 20:1 mm
_ inches
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*For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
**ON Semiconductor** and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
## **PUBLICATION ORDERING INFORMATION**
**ON Semiconductor Website** : http://onsemi.com
**N. American Technical Support** : 800−282−9855 Toll Free USA/Canada
## **LITERATURE FULFILLMENT** :
Literature Distribution Center for ON Semiconductor USA/Canada P.O. Box 61312, Phoenix, Arizona 85082−1312 USA **Order Literature** : http://www.onsemi.com/litorder **Phone** : 480−829−7710 or 800−344−3860 Toll Free USA/Canada **Japan** : ON Semiconductor, Japan Customer Focus Center **Fax** : 480−829−7709 or 800−344−3867 Toll Free USA/Canada 2−9−1 Kamimeguro, Meguro−ku, Tokyo, Japan 153−0051 For additional information, please contact your **Email** : orderlit@onsemi.com **Phone** : 81−3−5773−3850 local Sales Representative.
**http://onsemi.com**
**NUF2230XV6/D**
**4**
## Links
- [View this product on Novapart](https://novapart.co/products/NUF2230XV6T1G/emi-filter-esd-protection-c-r-pi-2-data-lines-sot)
- [Request a quote for this part](https://novapart.co/quote/)
- [Supplier page](https://es.farnell.com/onsemi/nuf2230xv6t1g/emi-filter-w-esd-sot-563-6/dp/4319782)
---
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