# EMI Filter, 2-Channel, ESD Protection, USB Downstream Terminator, TSOP-6

![Product image](https://novapart.co/image/farnell:2824960/)

**URL**: https://novapart.co/products/NUF2101MT1G/emi-filter-2-channel-esd-protection-usb-downstream
**SKU**: NUF2101MT1G
**Manufacturer**: ONSEMI
**Category**: Passive Components || Filters || Integrated Passive Filters
**Price**: €0.2540
**Stock**: 1000+
**Lead Time**: 92 days (indicative)

## Description

EMI Filter Type:USB Downstream and Terminator EMI Filter with ESD; No. of Data Lines:3 Data Lines; Filter Circuit:RC Pi Filter; Filter Case Style:TSOP; No. of Pins:6Pins; Product Rang

## Specifications

| Parameter | Value |
|---|---|
| Svhc | No SVHC (25-Jun-2025) |
| No. Of Pins | 6Pins |
| Product Range | - |
| Filter Circuit | RC Pi Filter |
| Emi Filter Type | USB Downstream and Terminator EMI Filter with ESD |
| No. Of Data Lines | 3 Data Lines |
| Filter Case / Package | TSOP |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:2824960/)

## NUF2101M 

## USB Filter with ESD Protection 

This device is designed for applications requiring **Line Termination** , **EMI Filtering** and **ESD Protection** . It is intended for use in downstream USB 1.1 ports, Cellular phones, Wireless equipment and computer applications. This device offers an integrated solution in a small package (TSOP−6, Case 318G) reducing PCB space and cost. 

## **Features:** 

- Provides USB Line Termination, Filtering and ESD Protection 

- Single IC Offers Cost Savings by Replacing 4 Resistors, 2 Capacitors, and 5 TVs diodes 

- EMI Filtering Prevents Noise from Entering/Leaving the System 

- IEC61000−4−2 (Level 4) 

   - 8 kV (Contact) 15 kV (Air) 

- ESD Ratings: Machine Model = C 

   - Human Body Model = 3B 

## **http://onsemi.com** 

## **SCHEMATIC** 

**==> picture [174 x 119] intentionally omitted <==**

**----- Start of picture text -----**<br>
D+OUT RS D+IN<br>1 6<br>15 k<br>VBUS<br>2 5<br>15 k<br>D−OUT D−IN<br>3 4<br>**----- End of picture text -----**<br>


- Pb−Free Package is Available 

## **Benefits:** 

- TSOP−6 Package Minimizes PCB Space 

- Integrated Circuit Increases System Reliability versus Discrete Component Implementation 

- TVs Devices Provide ESD Protection That is Better than a Discrete Implementation because the Small IC minimizes Parasitic Inductances 

**==> picture [5 x 7] intentionally omitted <==**

**----- Start of picture text -----**<br>
1<br>**----- End of picture text -----**<br>


**TSOP−6 CASE 318G STYLE 10** 

## **MARKING DIAGRAM** 

## **Typical Applications:** 

- USB Hubs 

6V[M] 1 6V = Specific Device Code M = Date Code = Pb−Free Package (Note: Microdot may be in either location) 

- Computer Motherboards 

## **MAXIMUM RATINGS** (TA = 25 ° C) 

|||||6V<br>= Specific Device Code|
|---|---|---|---|---|
|**Rating**||**Symbol**<br>**Value**<br>**Unit**||6V<br>= Specific Device Code<br>M<br>= Date Code|
|Steady State Power||PD<br>225<br>mW||= Pb−Free Package|
|Maximum Junction Temperature||TJ(max)<br>125<br>°C||(Note: Microdot may be in either location)|
|Operating Temperature Range||TJ<br>−55 to +125<br>°C|||
|Storage Temperature Range||Tstg<br>−55 to +125<br>°C||**ORDERING INFORMATION**|
|Lead Solder Temperature<br>(10 second duration)<br>TL<br>260<br>°C<br>Maximum ratings are those values beyond which device damage can occur.<br>Maximum ratings applied to the device are individual stress limit values (not<br>normal operating conditions) and are not valid simultaneously. If these limits are<br>exceeded, device functional operation is not implied, damage may occur and<br>reliability may be affected.||||**Device**<br>**Package**<br>**Shipping**†<br>NUF2101MT1<br>TSOP−6<br>3000/Tape & Reel<br>NUF2101MT1G<br>TSOP−6<br>(Pb−Free)<br>3000/Tape & Reel<br>~~——~~|
|||||†For information on tape and reel specifications,|
|||||including part orientation and tape sizes, please|
|||||refer to our Tape and Reel Packaging Specification|
|||||Brochure, BRD8011/D.|



Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected. 

Publication Order Number: 

**1** 

© Semiconductor Components Industries, LLC, 2005 **August, 2005 − Rev. 1** 

**NUF2101M/D** 

**NUF2101M** 

## **ELECTRICAL CHARACTERISTICS** (TA = 25 ° C) 

|**ELECTRICAL C**|**HARACTE**|**RISTIC**|**S**(TA= 25°C)|**S**(TA= 25°C)||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|**Device**|**Device**<br>**Marking**|**VRWM**<br>**(Volts)**|**VBR@**<br>**1 mA**<br>**(Volts)**||**Max IR**<br>**@ VRWM**<br>**= 5.25 V**<br>**VBUS to**<br>**GND**<br>**(**�**A)**|**Max IR**<br>**@ VRWM**<br>**= 3.3 V**<br>**VBUS Pin**<br>**(**�**A)**|**Typical Line**<br>**Capacitance**<br>**(pF)**<br>(Notes 2, 3)|**Series Resistor**<br>**RS (**�**)**(Note 1)|||**Pulldown**<br>**Resistor**<br>**Rpd (k**�**)**|||
||||**Min**|**Max**||||**Min**|**Nom**|**Max**|**Min**|**Nom**|**Max**|
|NUF2101MT1|6V|5.25|6.0|8.0|1.0|0.1|55|26.3|30|33.7|13|15|17|
|NUF2101MT1G|6V|5.25|6.0|8.0|1.0|0.1|55|26.3|30|33.7|13|15|17|



1. For other RS values (i.e. RS = 30 � ) contact your local ON Semiconductor sales representative. 

2. Measured at 25 ° C, VR = 0 V, f = 1 MHz, Pins 2, 3, 4 or 5 to GND with Pin 1 also grounded. 

3. For other capacitance values contact your local ON Semiconductor sales representative. 

**http://onsemi.com** 

**2** 

**NUF2101M** 

## **TYPICAL CHARACTERISTICS** 

**==> picture [488 x 169] intentionally omitted <==**

**----- Start of picture text -----**<br>
0 0<br>−5<br>−10<br>−10<br>−20<br>−15<br>−30<br>−20<br>−40<br>−25<br>−50<br>−30<br>−35 −60<br>1 10 100 1000 10000 10 100 1000 10000<br>FREQUENCY (MHz) FREQUENCY (MHz)<br>S21 (dB) S41 (dB)<br>**----- End of picture text -----**<br>


**Figure 1. Insertion Loss Characteristics** 

**Figure 2. Analog Cross−Talk** 

**==> picture [488 x 389] intentionally omitted <==**

**----- Start of picture text -----**<br>
33 16500<br>32 16000<br>31 15500<br>30 15000<br>29 14500<br>28 14000<br>27 13500<br>−35 −15 5 25 45 65 85 −35 −15 5 25 45 65 85<br>TEMPERATURE ( ° C) TEMPERATURE ( ° C)<br>Figure 3. RS vs. Temperature Figure 4. Rpd vs. Temperature<br>58<br>56<br>54<br>52<br>50<br>48<br>46<br>44<br>42<br>40<br>0 1 2 3 4<br>Vr, REVERSE VOLTAGE (V)<br>S pd<br>R R<br>CAPACITANCE (pF)<br>**----- End of picture text -----**<br>


**Figure 5. Typical Capacitance** 

**http://onsemi.com** 

**3** 

**NUF2101M** 

## **PACKAGE DIMENSIONS** 

**TSOP−6** CASE 318G−02 ISSUE P 

- NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 

**==> picture [471 x 164] intentionally omitted <==**

**----- Start of picture text -----**<br>
D 1. DIMENSIONING AND TOLERANCING PER<br>ANSI Y14.5M, 1982.<br>2. CONTROLLING DIMENSION: MILLIMETER.<br>3. MAXIMUM LEAD THICKNESS INCLUDES LEAD<br>FINISH THICKNESS. MINIMUM LEAD<br>il 6 5 4 . THICKNESS IS THE MINIMUM THICKNESS OF<br>HE E BASE MATERIAL.<br>1 2 3 4. DIMENSIONS A AND B DO NOT INCLUDE<br>MOLD FLASH, PROTRUSIONS, OR GATE<br>BURRS.<br>bert<br>b MILLIMETERS INCHES<br>e DIM MIN NOM MAX MIN NOM MAX<br>A 0.90 1.00 1.10 0.035 0.039 0.043<br>A1 0.01 0.06 0.10 0.001 0.002 0.004<br>b 0.25 0.38 0.50 0.010 0.014 0.020<br>a a n ===<br>c 0.10 0.18 0.26 0.004 0.007 0.010<br>c<br>0.05 (0.002) A DE 2.901.30 3.001.50 3.101.70 0.0510.114 0.0590.118 0.1220.067<br>e 0.85 0.95 1.05 0.034 0.037 0.041<br>A1 L L 0.20 0.40 0.60 0.008 0.016 0.024<br>m m 2 9) H E 2.50 2.75 3.00 0.099 0.108 0.118<br>0° − 1 0° 0° − 1 0°<br>**----- End of picture text -----**<br>


STYLE 10: PIN 1. D(OUT)+ 

2. GND 

3. D(OUT)− 

4. D(IN)− 

5. VBUS 

6. D(IN)+ 

## **SOLDERING FOOTPRINT*** 

**==> picture [238 x 141] intentionally omitted <==**

**----- Start of picture text -----**<br>
2.4<br>0.094<br>4<br>0.95<br>0.037<br>1.9<br>0.075 0.95<br>0.037<br>0.7<br>0.028<br>Et<br>1.0<br>0.039 mm<br>SCALE 10:1<br>Sr inches<br>**----- End of picture text -----**<br>


*For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. 

**ON Semiconductor** and          are registered trademarks of Semiconductor Components Industries, LLC (SCILLC).  SCILLC reserves the right to make changes without further notice to any products herein.  SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time.  All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts.  SCILLC does not convey any license under its patent rights nor the rights of others.  SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur.  Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part.  SCILLC is an Equal Opportunity/Affirmative Action Employer.  This literature is subject to all applicable copyright laws and is not for resale in any manner. 

## **PUBLICATION ORDERING INFORMATION** 

**ON Semiconductor Website** :  http://onsemi.com 

**LITERATURE FULFILLMENT** : **N. American Technical Support** : 800−282−9855 Toll Free **ON Semiconductor Website** :  http://onsemi.com Literature Distribution Center for ON Semiconductor USA/Canada P.O. Box 61312, Phoenix, Arizona 85082−1312 USA **Order Literature** : http://www.onsemi.com/litorder **Phone** : 480−829−7710 or 800−344−3860 Toll Free USA/Canada **Japan** : ON Semiconductor, Japan Customer Focus Center **Fax** : 480−829−7709 or 800−344−3867 Toll Free USA/Canada 2−9−1 Kamimeguro, Meguro−ku, Tokyo, Japan 153−0051 For additional information, please contact your **Email** : orderlit@onsemi.com **Phone** : 81−3−5773−3850 local Sales Representative. 

## **LITERATURE FULFILLMENT** : 

**http://onsemi.com** 

**NUF2101M/D** 

**4** 



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- [Supplier page](https://es.farnell.com/on-semiconductor/nuf2101mt1g/emi-filter-w-esd-protection-tsop/dp/2824960)
---

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