# Schottky Rectifier, 120 V, 30 A, Dual Common Cathode, TO-263 (D2PAK), 3 Pins, 1.08 V ![Product image](https://novapart.co/image/farnell:2114676/) **URL**: https://novapart.co/products/NTSB30120CTG/schottky-rectifier-120-v-30-a-dual-common-cathode **SKU**: NTSB30120CTG **Manufacturer**: ONSEMI **Category**: Semiconductors - Discretes || Diodes & Rectifiers || Schottky Diodes || Schottky Rectifier Diodes **Price**: €1.1000 **Stock**: 10+ ## Specifications | Parameter | Value | |---|---| | No. Of Pins | 3Pins | | Product Range | NTSB3 | | Diode Mounting | Surface Mount | | Diode Case Style | TO-263 (D2PAK) | | Diode Configuration | Dual Common Cathode | | Forward Voltage Max | 1.08V | | Forward Surge Current | 150A | | Average Forward Current | 30A | | Operating Temperature Max | 150°C | | Repetitive Peak Reverse Voltage | 120V | ## Datasheet 📄 [Download PDF](https://novapart.co/datasheet/farnell:2114676/) ## NTST30120CT, NTSJ30120CTG, NTSB30120CT-1G, NTSB30120CTG, NTSB30120CTT4G ## Very Low Forward Voltage Trench-based Schottky Rectifier ## **Exceptionally Low VF = 0.50 V at IF = 5 A** **www.onsemi.com** **VERY LOW FORWARD VOLTAGE, LOW LEAKAGE SCHOTTKY BARRIER RECTIFIERS 30 AMPERES, 120 VOLTS** ## **Features** - Fine Lithography Trench−based Schottky Technology for Very Low Forward Voltage and Low Leakage **==> picture [86 x 8] intentionally omitted <==** **----- Start of picture text -----**
PIN CONNECTIONS
**----- End of picture text -----**
1 2, 4 - Fast Switching with Exceptional Temperature Stability - Low Power Loss and Lower Operating Temperature 3 - Higher Efficiency for Achieving Regulatory Compliance - Low Thermal Resistance **==> picture [438 x 18] intentionally omitted <==** **----- Start of picture text -----**
4
• High Surge Capability 4
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**==> picture [226 x 106] intentionally omitted <==** **----- Start of picture text -----**
4
4
)
TO−220AB I2PAK
1 CASE 221A “ 1 CASE 418D
2 3 STYLE 6 2 3 STYLE 3
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- These are Pb−Free Devices ## **Typical Applications** - Switching Power Supplies including Notebook / Netbook Adapters, ATX and Flat Panel Display - High Frequency and DC−DC Converters - Freewheeling and OR−ing diodes - Reverse Battery Protection **==> picture [490 x 155] intentionally omitted <==** **----- Start of picture text -----**
• Instrumentation 4
Mechanical Characteristics
• Case: Epoxy, Molded
• Epoxy Meets Flammability Rating UL 94−0 @ 0.125 in
• Finish: All External Surfaces Corrosion Resistant and Terminal
TO−220FP D2PAK
Leads are Readily Solderable
• Lead Temperature for Soldering Purposes: 260°C Maximum for 1 q 2 CASE 221AH [2] CASE 418B
3
10 sec
ORDERING INFORMATION
See detailed ordering and shipping information on page 5 of
this data sheet.
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Publication Order Number: **NTST30120CT/D** **1** © Semiconductor Components Industries, LLC, 2016 **July, 2016 − Rev. 6** ## **NTST30120CT, NTSJ30120CTG, NTSB30120CT−1G, NTSB30120CTG, NTSB30120CTT4G** ## **MAXIMUM RATINGS** |**MAXIMUM RATINGS**|||| |---|---|---|---| |**Rating**|**Symbol**|**Value**|**Unit**| |Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage|VRRM
VRWM
VR|120|V| |Average Rectified Forward Current
(Rated VR, TC= 125°C)
Per device
Per diode|IF(AV)|30
15|A| |Peak Repetitive Forward Current
(Rated VR, Square Wave, 20 kHz, TC= 130°C)
Per device
Per diode|IFRM|60
30|A| |Nonrepetitive Peak Surge Current
(Surge applied at rated load conditions halfwave, single phase, 60 Hz)|IFSM|150|A| |Operating Junction Temperature|TJ|−40 to +150|°C| |Storage Temperature|Tstg|−40 to +150|°C| |Voltage Rate of Change (Rated VR)|dv/dt|10,000|V/�s| Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. ## **THERMAL CHARACTERISTICS** |**THERMAL CHARACTERISTICS**|||||| |---|---|---|---|---|---| |**Rating**|**Symbol**|**NTST30120CTG**
**NTSB30120CT−1G**|**NTSB30120CTG**|**NTSJ30120CTG**|**Unit**| |Maximum Thermal Resistance per Diode
Junction−to−Case
Junction−to−Ambient|R�JC
R�JA|2.5
70|1.14
46.6|4.05
105|°C/W
°C/W| ## **ELECTRICAL CHARACTERISTICS** (Per Leg unless otherwise noted) |**ELECTRICAL CHARACTERISTICS**(Per Leg unless otherwise noted)||||| |---|---|---|---|---| |**Rating**|**Symbol**|**Typ**|**Max**|**Unit**| |Maximum Instantaneous Forward Voltage (Note 1)
(IF= 5 A, TJ= 25°C)
(IF= 7.5 A, TJ= 25°C)
(IF= 15 A, TJ= 25°C)
(IF= 5 A, TJ= 125°C)
(IF= 7.5 A, TJ= 125°C)
(IF= 15 A, TJ= 125°C)|vF|0.56
0.71
0.90
0.50
0.60
0.68|−
−
1.08
−
−
0.76|V| |Maximum Instantaneous Reverse Current (Note 1)
(VR= 90 V, TJ= 25°C)
(VR= 90 V, TJ= 125°C)
(Rated dc Voltage, TJ= 25°C)
(Rated dc Voltage, TJ= 125°C)|IR|16
11
−
25|−
−
800
100|�A
mA
�A
mA| Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. 1. Pulse Test: Pulse Width = 300 � s, Duty Cycle � 2.0% **www.onsemi.com** **2** **NTST30120CT, NTSJ30120CTG, NTSB30120CT−1G, NTSB30120CTG, NTSB30120CTT4G TYPICAL CHARACTERISITICS** **==> picture [245 x 389] intentionally omitted <==** **----- Start of picture text -----**
100
TA = 150°C TA = 25°C
10 TA = 125°C
1.0
0.1
0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8
VF, INSTANTANEOUS FORWARD VOLTAGE (V)
Figure 1. Typical Instantaneous Forward
Characteristics
10000
TJ = 25 ° C
1000
100
10
0.1 1 10 100
VR, REVERSE VOLTAGE (V)
iF, INSTANTANEOUS FORWARD CURRENT (A)
, JUNCTION CAPACITANCE (pF)
J
C
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**==> picture [247 x 170] intentionally omitted <==** **----- Start of picture text -----**
100
TA = 150 ° C
10
TA = 125 ° C
1.0
0.1
0.01 TA = 25 ° C
0.001
20 30 40 50 60 70 80 90 100 110 120
VR, INSTANTANEOUS REVERSE VOLTAGE (V)
, INSTANTANEOUS REVERSE CURRENT (mA)
IR
**----- End of picture text -----**
**Figure 2. Typical Reverse Current Characteristics** **==> picture [235 x 173] intentionally omitted <==** **----- Start of picture text -----**
30
R � JC = 1.3 ° C/W
dc
25
20
15 SQUARE WAVE
10
5
0
0 20 40 60 80 100 120 140
TC, CASE TEMPERATURE ( ° C)
, AVERAGE FORWARD CURRENT (A)
IF(AV)
**----- End of picture text -----**
**Figure 3. Typical Junction Capacitance** **Figure 4. Current Derating per Leg** **==> picture [491 x 172] intentionally omitted <==** **----- Start of picture text -----**
60 30
55 R � JC = 1.3 ° C/W IPK/IAV = 20
50 dc 25
45 IPK/IAV = 10 IPK/IAV = 5
40 20
SQUARE
35 WAVE
30 SQUARE WAVE 15
25
dc
20 10
15
10 5
5 TJ = 150 ° C
0 0
0 20 40 60 80 100 120 140 0 2 4 6 8 10 12 14 16 18 20
TC, CASE TEMPERATURE ( ° C) IF(AV), AVERAGE FORWARD CURRENT (A)
ER DISSIPATION (W)
, AVERAGE FORWARD POW-
F(AV)
P
, AVERAGE FORWARD CURRENT (A)
IF(AV)
**----- End of picture text -----**
**Figure 5. Current Derating** **Figure 6. Forward Power Dissipation** **www.onsemi.com** **3** ## **NTST30120CT, NTSJ30120CTG, NTSB30120CT−1G, NTSB30120CTG, NTSB30120CTT4G TYPICAL CHARACTERISITICS** **==> picture [495 x 620] intentionally omitted <==** **----- Start of picture text -----**
10
rT dE TTTTTTT
a
1
50% Duty Cycle
Soooee enee cee e ee enetteeeeiaee l|
aii ilene
20%
PCE |
RS 10% iii eeeeee -* eT EAL |TTT
0.1
ce 5% rwt [|] LI Ll
prt 2% tt ly mal
1% Single Pulse
0.01 Se— [De erC E L M OR ETHIE ETT TTT DUTY CYCLE, D = ty/ts | iil|
0.000001 0.00001 0.0001 0.001 0.01 0.1 1 10 100 1000
t, Pulse Time (sec)
Figure 7. Typical Transient Thermal Response for NTST30120CT and NTSB30120CT−1G
10
50% Duty Cycle
FSR Rr tH
20%
1 EIN SE EEE EEE A SE een |
ae 10% I | crore ILIE
SS SSSSe eet
ee 5% ee ttt LCL
2%
0.1 =f
mn es Ss
1%
ee
Re
0.01 Peer ETI TTIFEITTTT
Single Pulse
ee
LT [TTT] TTTTTOe QO OO GO
0.001 LL LETHE TE LEME EET EET EE EET ETE EETT
0.000001 0.00001 0.0001 0.001 0.01 0.1 1 10 100 1000
t, Pulse Time (sec)
Figure 8. Typical Transient Thermal Response for NTSJ30120CTG
1 aOe0 2 |
eVVV Va
nnee ee ee el
eena ee ee ee el
50% Duty Cycle
pesmi [nT] |
See ll AZGA ae
0.1 le 20%
et rg EE EE EE EEE Hl
|__te 10% sarPee eaveOe,eam tTmi eeeCT P {- ] (|lI
Pe 5% HTT TTT (ae) | | | | [|
| SAA be |
2%
eee CIM TIE CTT FC CTT “Ee |
1% Single Pulse
0.01 CA ANNE LIN LERNER EEE EPIL oumeveit =e |
0.000001 0.00001 0.0001 0.001 0.01 0.1 1 10 100 1000
t, Pulse Time (sec)
C/W)
°
RESISTANCE (
R(t), TYPICAL TRANSIENT THERMAL
C/W)
°
RESISTANCE (
R(t), TYPICAL TRANSIENT THERMAL
C/W)
°
RESISTANCE (
R(t), TYPICAL TRANSIENT THERMAL
**----- End of picture text -----**
**Figure 9. Typical Transient Thermal Response for NTSB30120CTG** **www.onsemi.com** **4** ## **NTST30120CT, NTSJ30120CTG, NTSB30120CT−1G, NTSB30120CTG, NTSB30120CTT4G** ## **ORDERING INFORMATION** |**ORDERING INFORMATION**||| |---|---|---| |**Device**|**Package**|**Shipping**†| |NTST30120CTG|TO−220AB
(Pb−Free)|50 Units / Rail| |NTSJ30120CTG|TO−220FP
(Halide−Free)|50 Units / Rail| |NTSB30120CT−1G|I2PAK
(Pb−Free)|50 Units / Rail| |NTSB30120CTG|D2PAK
(Pb−Free)|50 Units / Rail| |NTSB30120CTT4G|D2PAK
(Pb−Free)|800 / Tape & Reel| †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. ## **MARKING DIAGRAMS** **==> picture [314 x 109] intentionally omitted <==** **----- Start of picture text -----**
AYWW
AYWW AYWW AYWW TS30120CG
TS30120Cx TS30120CG TS30120CG AKA
AKA
AKA AKA
TO−220AB TO−220FP I [2] PAK D [2] PAK
**----- End of picture text -----**
**==> picture [116 x 68] intentionally omitted <==** **----- Start of picture text -----**
A = Assembly Location
Y = Year
WW = Work Week
AKA = Polarity Designator
x = G or H
G = Pb−Free Package
H = Halide−Free Package
**----- End of picture text -----**
**www.onsemi.com** **5** **NTST30120CT, NTSJ30120CTG, NTSB30120CT−1G, NTSB30120CTG, NTSB30120CTT4G PACKAGE DIMENSIONS** **TO−220** CASE 221A−09 ISSUE AH NOTES: **==> picture [234 x 185] intentionally omitted <==** **----- Start of picture text -----**
SEATING
−T− PLANE
B F C
T S
4
Q A
1 2 3 U
H
K
Z
L R
V J
G
D
N
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1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION Z DEFINES A ZONE WHERE ALL BODY AND LEAD IRREGULARITIES ARE ALLOWED. |**DIM**|**INCHES**|**INCHES**|**MILLIMETERS**|**MILLIMETERS**| |---|---|---|---|---| ||**MIN**
|**MAX**
|**MIN**
|**MAX**
| |**A**|0.570|0.620|14.48|15.75| |**B**|0380|0415|966|1053| |**C**|.
0.160|.
0.190|.
4.07|.
4.83| |**D**|0.025|0.038|0.64|0.96| |**F**|0.142|0.161|3.61|4.09| |**G**|0.095|0.105|2.42|2.66| |**H**|0.110|0.161|2.80|4.10| |**J**|0.014|0.024|0.36|0.61| |**K**|0.500|0.562|12.70|14.27| |**L**|0.045|0.060|1.15|1.52| |**N**|0.190|0.210|4.83|5.33| |**Q**|0100|0120|254|304| |**R**|.
0.080|.
0.110|.
2.04|.
2.79| |**S**|0.045|0.055|1.15|1.39| |**T**|0.235|0.255|5.97|6.47| |**U**|0.000|0.050|0.00|1.27| |**V**|0.045|---|1.15|---| |**Z**|---|0.080|---|2.04| |STYL
PI|E 6:
N 1.
ANODE
2.
CATHODE
3.
ANODE
4.
CATHODE|||| **www.onsemi.com** **6** ## **NTST30120CT, NTSJ30120CTG, NTSB30120CT−1G, NTSB30120CTG, NTSB30120CTT4G PACKAGE DIMENSIONS** **TO−220 FULLPACK, 3−LEAD** CASE 221AH ISSUE F **==> picture [311 x 173] intentionally omitted <==** **----- Start of picture text -----**
A B SEATINGPLANE NOTES:1.
E
E/2 P A 2.
0.14 M B A M H1 A1 3.4.
Q
D C 5.
SCALE 1:1
1 2 3 NOTE 3 6.
L L1
3X b c
3X b2 0.25 M B A M C A2
e SIDE VIEW
FRONT VIEW
**----- End of picture text -----**
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. - CONTOUR UNCONTROLLED IN THIS AREA. 4. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH AND GATE PROTRUSIONS. MOLD FLASH AND GATE PROTRUSIONS NOT TO EXCEED 0.13 PER SIDE. THESE DIMENSIONS ARE TO BE MEASURED AT OUTERMOST EXTREME OF THE PLASTIC BODY. 5. DIMENSION b2 DOES NOT INCLUDE DAMBAR PROTRUSION. LEAD WIDTH INCLUDING PROTRUSION SHALL NOT EXCEED 2.00. |6.|CONT
MAY V
AND H|**MIN**
**MAX**
**MILLIMETERS**
14.70
15.30
9.70
10.30
4.30
4.70
0.54
0.84
3.00
3.40
---
2.80
0.49
0.79
12.50
14.73
1.10
1.40
2.80
3.20
2.50
2.90
2.50
2.90
6.60
7.10
OURS AND FEATURES OF THE MOLDED PACKAGE BODY
ARY WITHIN THE ENVELOP DEFINED BY DIMENSIONS A1
1 FOR MANUFACTURING PURPOSES.
2.54 BSC|**MIN**
**MAX**
**MILLIMETERS**
14.70
15.30
9.70
10.30
4.30
4.70
0.54
0.84
3.00
3.40
---
2.80
0.49
0.79
12.50
14.73
1.10
1.40
2.80
3.20
2.50
2.90
2.50
2.90
6.60
7.10
OURS AND FEATURES OF THE MOLDED PACKAGE BODY
ARY WITHIN THE ENVELOP DEFINED BY DIMENSIONS A1
1 FOR MANUFACTURING PURPOSES.
2.54 BSC| |---|---|---|---| ||**DIM**|**MILLIMETERS**|| |||**MIN**|**MAX**| ||**A**
|4.30
|4.70
| ||**A1**|2.50|2.90| ||**A2**|2.50|2.90| ||**b**

|0.54

|0.84

| ||**c**
**b2**|0.49
1.10|0.79
1.40| ||**D**|14.70|15.30| ||**E**|9.70|10.30| ||**e**|2.54 BSC|| ||**H1**|6.60|7.10| ||**L**|12.50|14.73| ||**L1**|---|2.80| ||**P**|3.00|3.40| ||**Q**|2.80|3.20| ## **SECTION D−D** **==> picture [211 x 114] intentionally omitted <==** **----- Start of picture text -----**
A
NOTE 6
NOTE 6
H1
D D
A SECTION A−A
**----- End of picture text -----**
**==> picture [115 x 7] intentionally omitted <==** **----- Start of picture text -----**
ALTERNATE CONSTRUCTION
**----- End of picture text -----**
**www.onsemi.com** **7** ## **NTST30120CT, NTSJ30120CTG, NTSB30120CT−1G, NTSB30120CTG, NTSB30120CTT4G PACKAGE DIMENSIONS** **D[2] PAK 3** CASE 418B−04 ISSUE K **==> picture [441 x 366] intentionally omitted <==** **----- Start of picture text -----**
NOTES:
C 1. DIMENSIONING AND TOLERANCING
PER ANSI Y14.5M, 1982.
E 2. CONTROLLING DIMENSION: INCH.
−B− V 3. 418B−01 THRU 418B−03 OBSOLETE,NEW STANDARD 418B−04.
W
4 INCHES MILLIMETERS
DIM MIN MAX MIN MAX
A 0.340 0.380 8.64 9.65
B 0.380 0.405 9.65 10.29
A C 0.160 0.190 4.06 4.83
S D 0.020 0.035 0.51 0.89
1 2 3 E 0.045 0.055 1.14 1.40
F 0.310 0.350 7.87 8.89
G 0.100 BSC 2.54 BSC
−T− H 0.080 0.110 2.03 2.79
K J 0.018 0.025 0.46 0.64
SEATINGPLANE G J W KL 0.0900.052 0.0720.110 2.291.32 2.791.83
M 0.280 0.320 7.11 8.13
H N 0.197 REF 5.00 REF
D 3 PL P 0.079 REF 2.00 REF
R 0.039 REF 0.99 REF
0.13 (0.005) M T B M S 0.575 0.625 14.60 15.88
V 0.045 0.055 1.14 1.40
VARIABLE
CONFIGURATION
ZONE N P
R
U
L L L
M M M
F F F
VIEW W−W VIEW W−W VIEW W−W
1 2 3
**----- End of picture text -----**
**www.onsemi.com** **8** **NTST30120CT, NTSJ30120CTG, NTSB30120CT−1G, NTSB30120CTG, NTSB30120CTT4G PACKAGE DIMENSIONS** **I[2] PAK (TO−262)** CASE 418D ISSUE D **==> picture [404 x 214] intentionally omitted <==** **----- Start of picture text -----**
C
E
−B− V
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
4
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
INCHES MILLIMETERS
A DIM MIN MAX MIN MAX
W A 0.335 0.380 8.51 9.65
; 1 2 3 ee ==== B 0.380 0.406 9.65 10.31
C 0.160 0.185 4.06 4.70
D 0.026 0.035 0.66 0.89
F E 0.045 0.055 1.14 1.40
F 0.122 REF 3.10 REF
−T− G 0.100 BSC 2.54 BSC
SEATING H 0.094 0.110 2.39 2.79
PLANE K J 0.013 0.025 0.33 0.64
S K 0.500 0.562 12.70 14.27
S 0.390 REF 9.90 REF
V 0.045 0.070 1.14 1.78
W 0.522 0.551 13.25 14.00
G ; J STYLE 3:PIN 1. ANODE
D 3 PL H 2. CATHODE
3. ANODE
0.13 (0.005) M T B M 4. CATHODE
**----- End of picture text -----**
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