# Power MOSFET, P Channel, 20 V, 1.37 A, 0.12 ohm, SOT-323, Surface Mount

![Product image](https://novapart.co/image/farnell:1453617/)

**URL**: https://novapart.co/products/NTS4101PT1G/power-mosfet-p-channel-20-v-137-a-012-ohm-sot-323
**SKU**: NTS4101PT1G
**Manufacturer**: ONSEMI
**Category**: Semiconductors - Discretes || FETs || Single MOSFETs
**Price**: €0.0740
**Stock**: 1000+
**Lead Time**: 141 days (indicative)

## Description

Transistor Polarity:P Channel; Continuous Drain Current Id:1.37A; Drain Source Voltage Vds:-20V; On Resistance Rds(on):0.12ohm; Rds(on) Test Voltage Vgs:-4.5V; Threshold Voltage Vgs:-640mV; Power

## Specifications

| Parameter | Value |
|---|---|
| Msl | MSL 1 - Unlimited |
| Svhc | No SVHC (25-Jun-2025) |
| No. Of Pins | 3Pins |
| Channel Type | P Channel |
| Product Range | - |
| Qualification | - |
| Power Dissipation | 329mW |
| Transistor Mounting | Surface Mount |
| Rds(On) Test Voltage | 4.5V |
| Transistor Case Style | SOT-323 |
| Drain Source Voltage Vds | 20V |
| Operating Temperature Max | 150°C |
| Continuous Drain Current Id | 1.37A |
| Drain Source On State Resistance | 0.12ohm |
| Gate Source Threshold Voltage Max | 640mV |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:1453617/)

NTS4101P 

## Power MOSFET 

## **−20 V, −1.37 A, Single P−Channel, SC−70** 

## **Features** 

- Leading −20 V Trench for Low RDS(on) 

## **http://onsemi.com** 

- −2.5 V Rated for Low Voltage Gate Drive 

- SC−70 Surface Mount for Small Footprint (2x2 mm) 

- Pb−Free Package is Available 

## **Applications** 

- High Side Load Switch 

|**V(BR)DSS**|**RDS(on) Typ**|**ID Max**|
|---|---|---|
|−20 V|83 m @ −4.5 V<br>88 m @ −3.6 V<br>104 m @ −2.5 V|−1.37 A|



- Charging Circuit 

• Single Cell Battery Applications such as: Cell Phones, Digital Cameras, PDAs S 

**==> picture [78 x 7] intentionally omitted <==**

**----- Start of picture text -----**<br>
P−Channel MOSFET<br>**----- End of picture text -----**<br>


**==> picture [489 x 299] intentionally omitted <==**

**----- Start of picture text -----**<br>
MAXIMUM RATINGS  (TJ = 25 ° C unless otherwise stated)<br>G<br>Parameter Symbol Value Units<br>Drain−to−Source Voltage VDSS −20 V<br>Gate−to−Source Voltage VGS ± 8 V<br>Continuous Drain  Steady TA = 25 ° C ID −1.37 A D<br>Current (Note 1) State TA = 70 ° C −0.62<br>———— es<br>Power Dissipation Steady TA = 25 ° C PD 0.329 W MARKING DIAGRAM &<br>(Note 1) State PIN ASSIGNMENT<br>a<br>3 D<br>Pulsed Drain Current tp = 10 s IDM −4.0 A<br>3<br>Operating Junction and Storage Temperature TJ, −55 to ° C<br>TSTG 150 1 TT M<br>2<br>Source Current (Body Diode), Continuous IS −0.5 A SC−70/SOT−323<br>Lead Temperature for Soldering Purposes TL 260 ° C CASE 419 1 2<br>(1/8” from case for 10 s) STYLE 8 G S<br>Pe<br>THERMAL RESISTANCE RATINGS<br>ee * TT = Device Code<br>Parameter Symbol Max Units M = Date Code*<br>Junction−to−Ambient – Steady State (Note 1) R JA 380 ° C/W = Pb−Free Package<br>(Note: Microdot may be in either location)<br>Stresses exceeding Maximum Ratings may damage the device. Maximum<br>Ratings are stress ratings only. Functional operation above the Recommended *Date Code orientation may vary depending<br>Operating Conditions is not implied. Extended exposure to stresses above the upon manufacturing location.<br>Recommended Operating Conditions may affect device reliability.<br>**----- End of picture text -----**<br>


1. Surface−mounted on FR4 board using 1 in sq pad size (Cu area = 1.127 in sq [1 oz] including traces). 

## **ORDERING INFORMATION** 

|**Device**|**Package**|**Shipping**†|
|---|---|---|
|NTS4101PT1|SOT−323|3000/Tape & Reel|
|NTS4101PT1G|SOT−323<br>(Pb−Free)|3000/Tape & Reel|



†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D. 

Publication Order Number: 

**1** 

© Semiconductor Components Industries, LLC, 2011 **April, 2011 − Rev. 3** 

**NTS4101P/D** 

## **NTS4101P** 

**ELECTRICAL CHARACTERISTICS** (TJ=25 ° C unless otherwise stated) 

|**ELECTRICAL CHARACTERISTIC**|**S**(TJ=25°C unl|ess otherwise stated)|ess otherwise stated)|||||
|---|---|---|---|---|---|---|---|
|**Parameter**|**Symbol**|**Test Condition**||**Min**|**Typ**|**Max**|**Unit**|
|**OFF CHARACTERISTICS**||||||||
|Drain−to−Source Breakdown Voltage|V(BR)DSS|VGS= 0 V, ID=|−250�A|−20|−24.5||V|
|Drain−to−Source Breakdown Voltage<br>Temperature Coefficient|V(BR)DSS/TJ||||−13.7||mV/°C|
|Zero Gate Voltage Drain Current|IDSS|VGS= 0 V,<br>VDS= −16 V|TJ= 25°C|||−1.0|�A|
||||TJ= 70°C|||−5.0||
|Gate−to−Source Leakage Current|IGSS|VDS= 0 V, VGS=±8 V||||±100|nA|
|**ON CHARACTERISTICS**(Note 2)||||||||
|Gate Threshold Voltage|VGS(TH)|VGS= VDS, ID= −250�A||−0.45|−0.64|−1.5|V|
|Negative Threshold<br>Temperature Coefficient|VGS(TH)/TJ||||2.7||mV/°C|
|Drain−to−Source On Resistance|RDS(on)|VGS= −4.5 V, ID= −1.0 A|||83|120|m�|
|||VGS= −3.6 V, ID= −0.7 A|||88|130||
|||VGS= −2.5 V, ID= −0.3 A|||104|160||
|Forward Transconductance|GFS|VDS= −5.0 V, ID= −1.3 A|||5.2||S|
|**CHARGES AND CAPACITANCES**||||||||
|Input Capacitance|CISS|VGS= 0 V, f = 1.0 MHz,<br>VDS= −20 V|||603|840|pF|
|Output Capacitance|COSS||||90|125||
|Reverse Transfer Capacitance|CRSS||||62|85||
|Total Gate Charge|QG(TOT)|VGS= −4.5 V, VDS= −4.5 V,<br>ID= −1.0 A|||6.4|9.0|nC|
|Threshold Gate Charge|QG(TH)||||0.7|||
|Gate−to−Source Charge|QGS||||1.0|||
|Gate−to−Drain Charge|QGD||||1.5|||
|**SWITCHING CHARACTERISTICS**(Note 3)||||||||
|Turn−On Delay Time|td(ON)|VGS= −4.5 V, VDD= −4.0 V,<br>ID= −1.0 A, RG= 6.2�|||6.2|12|ns|
|Rise Time|tr||||14.9|25||
|Turn−Off Delay Time|td(OFF)||||26|40||
|Fall Time|tf||||18|30||
|**DRAIN−SOURCE DIODE CHARACTERISTICS**||||||||
|Forward Diode Voltage|VSD|VGS= 0 V,<br>IS= −0.3 A|TJ= 25°C||−0.61|−1.2|V|
||||TJ= 125°C||−0.5|||
|Reverse Recovery Time|tRR|VGS= 0 V, dISD/dt = 100 A/�s,<br>IS= −1.0 A|||10.9|20|ns|
|Charge Time|Ta||||7.1|||
|Discharge Time|Tb||||3.8|||
|Reverse Recovery Charge|QRR||||4.25||nC|



2. Pulse Test: pulse width ≤ 300 � s, duty cycle ≤ 2%. 

3. Switching characteristics are independent of operating junction temperatures. 

**http://onsemi.com** 

**2** 

**NTS4101P** 

## **TYPICAL CHARACTERISTICS** 

**==> picture [492 x 622] intentionally omitted <==**

**----- Start of picture text -----**<br>
6 6<br>−2.0 V TJ = 25 ° C VDS �  −10 V<br>5 VGS = −4.5 V 5<br>−3.5 V −1.8 V<br>−3.0 V<br>4 −2.5 V 4<br>−2.2 V<br>3 −1.6 V 3<br>2 2<br>−1.4 V<br>1 −1.2 V 1 TJ = 125 ° C TJ = 25 ° C<br>−1.0 V TJ = −55 ° C<br>0 0<br>0 2 4 6 8 0 0.4 0.8 1.2 1.6 2.0 2.4<br>−VDS, DRAIN−TO−SOURCE VOLTAGE (V) −VGS, GATE−TO−SOURCE VOLTAGE (V)<br>Figure 1. On−Region Characteristics Figure 2. Transfer Characteristics<br>0.16 0.16<br>VGS = −4.5 V VGS = −3.6 V<br>TJ = 125 ° C<br>TJ = 125 ° C<br>0.12 0.12<br>TJ = 25 ° C<br>TJ = 25 ° C<br>0.08 0.08<br>TJ = −55 ° C TJ = −55 ° C<br>0.04 0.04<br>0 0<br>0 1 2 3 4 5 6 0 1 2 3 4 5 6<br>−ID, DRAIN CURRENT (A) −ID, DRAIN CURRENT (A)<br>Figure 3. On−Resistance versus Drain Current Figure 4. On−Resistance versus Drain Current<br>and Temperature and Temperature<br>1.5 1000<br>ID = −1.0 A TJ = 25 ° C<br>VGS = −4.5 V VGS = 0 V<br>800<br>1.3 CISS<br>600<br>1.1<br>400<br>0.9 COSS<br>200<br>CRSS<br>0.7 0<br>−50 −25 0 25 50 75 100 125 150 0 4 8 12 16 20<br>TJ, JUNCTION TEMPERATURE ( ° C) −DRAIN−TO−SOURCE VOLTAGE (V)<br>, DRAIN CURRENT (A) , DRAIN CURRENT (A)<br>D D<br>−I −I<br>) � ) �<br>, DRAIN−TO−SOURCE RESISTANCE ( , DRAIN−TO−SOURCE RESISTANCE (<br>DS(on) DS(on)<br>R R<br>(NORMALIZED)<br>C, CAPACITANCE (pF)<br>, DRAIN−TO−SOURCE RESISTANCE<br>DS(on)<br>R<br>**----- End of picture text -----**<br>


**Figure 5. On−Resistance Variation with Temperature** 

**Figure 6. Capacitance Variation** 

**http://onsemi.com** 

**3** 

**NTS4101P** 

## **TYPICAL CHARACTERISTICS** 

**==> picture [232 x 175] intentionally omitted <==**

**----- Start of picture text -----**<br>
5<br>QT<br>4<br>VGS<br>3<br>2<br>Q1 Q2<br>1<br>ID = −1.0 A<br>TJ = 25 ° C<br>0<br>0 2 4 6 8<br>Qg, TOTAL GATE CHARGE (nC)<br>, GATE−TO−SOURCE VOLTAGE (V)<br>GS<br>−V<br>**----- End of picture text -----**<br>


**Figure 7. Gate−to−Source and Drain−to−Source Voltage versus Total Charge** 

**==> picture [236 x 174] intentionally omitted <==**

**----- Start of picture text -----**<br>
3<br>VGS = 0 V<br>2<br>1<br>TJ = 125 ° C<br>TJ = 25 ° C<br>0<br>0 0.2 0.4 0.6 0.8 1<br>−VSD, SOURCE−TO−DRAIN VOLTAGE (V)<br>, SOURCE CURRENT (A)<br>S<br>−I<br>**----- End of picture text -----**<br>


**Figure 8. Diode Forward Voltage versus Current** 

**http://onsemi.com** 

**4** 

**NTS4101P** 

## **PACKAGE DIMENSIONS** 

**SC−70 (SOT−323)** CASE 419−04 ISSUE N 

**==> picture [480 x 338] intentionally omitted <==**

**----- Start of picture text -----**<br>
D NOTES:<br>1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.<br>e1 2. CONTROLLING DIMENSION: INCH.<br>MILLIMETERS INCHES<br>3 DIM MIN NOM MAX MIN NOM MAX<br>A 0.80 0.90 1.00 0.032 0.035 0.040<br>HE E A1 0.00 0.05 0.10 0.000 0.002 0.004<br>1 2 A2 0.70 REF 0.028 REF<br>b 0.30 0.35 0.40 0.012 0.014 0.016<br>c 0.10 0.18 0.25 0.004 0.007 0.010<br>ij aai nl = D =====— 1.80 2.10 2.20 0.071 0.083 0.087<br>b E 1.15 1.24 1.35 0.045 0.049 0.053<br>e 1.20 1.30 1.40 0.047 0.051 0.055<br>e e1 0.65 BSC 0.026 BSC<br>L 0.20 0.38 0.56 0.008 0.015 0.022<br>H E 2.00 2.10 2.40 0.079 0.083 0.095<br>STYLE 8:<br>A A2 c PIN 1. GATE<br> 2. SOURCE<br> 3. DRAIN<br>Eo, 0.05 (0.002) A1 Jo L l<br>SOLDERING FOOTPRINT*<br>0.65<br>0.65 0.025<br>0.025<br>1.9<br>bia<br>0.075<br>0.9<br>0.035<br>0.7<br>Ey<br>0.028<br>SCALE 10:1 mm<br>at _ inches<br>**----- End of picture text -----**<br>


*For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. 

**ON Semiconductor** and          are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. 

## **PUBLICATION ORDERING INFORMATION** 

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## **LITERATURE FULFILLMENT** : 

**NTS4101P/D** 

**http://onsemi.com 5** 



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---

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