# Power MOSFET, P Channel, 30 V, 3.5 A, 0.075 ohm, SOT-23, Surface Mount

![Product image](https://novapart.co/image/farnell:2317888/)

**URL**: https://novapart.co/products/NTR4171PT1G/power-mosfet-p-channel-30-v-35-a-0075-ohm-sot-23
**SKU**: NTR4171PT1G
**Manufacturer**: ONSEMI
**Category**: Semiconductors - Discretes || FETs || Single MOSFETs
**Price**: €0.1450
**Stock**: 10+
**Lead Time**: 141 days (indicative)

## Description

Transistor Polarity:P Channel; Continuous Drain Current Id:-3.5A; Drain Source Voltage Vds:-30V; On Resistance Rds(on):0.05ohm; Rds(on) Test Voltage Vgs:-10V; Threshold Voltage Vgs:-1

## Specifications

| Parameter | Value |
|---|---|
| Msl | MSL 1 - Unlimited |
| Svhc | No SVHC (25-Jun-2025) |
| No. Of Pins | 3Pins |
| Channel Type | P Channel |
| Product Range | - |
| Qualification | - |
| Power Dissipation | 1.25W |
| Transistor Mounting | Surface Mount |
| Rds(On) Test Voltage | 10V |
| Transistor Case Style | SOT-23 |
| Drain Source Voltage Vds | 30V |
| Operating Temperature Max | 150°C |
| Continuous Drain Current Id | 3.5A |
| Drain Source On State Resistance | 0.075ohm |
| Gate Source Threshold Voltage Max | 1.15V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:2317888/)

NTR4171P 

## Power MOSFET 

## **−30 V, −3.5 A, Single P−Channel, SOT−23** 

## **Features** 

- Low RDS(on) at Low Gate Voltage 

- Low Threshold Voltage 

- High Power and Current Handling Capability 

- This is a Pb−Free Device 

## **Applications** 

- Load Switch 

- Optimized for Battery and Load Management Applications in Portable Equipment like Cell Phones, PDA’s, Media Players, etc. 

**www.onsemi.com** 

|**V(BR)DSS**<br>—~~——E~~|**RDS(on) MAX**<br>~~——E~~|**ID MAX**|
|---|---|---|
|−30 V<br>—~~——E~~|110 m @ −4.5 V<br>75 m @ −10 V<br>150 m @ −2.5 V<br>~~——E~~|−2.2 A|
|||−1.8 A|
|||−1.0 A|



**==> picture [192 x 430] intentionally omitted <==**

**----- Start of picture text -----**<br>
P−CHANNEL MOSFET<br>S<br>G<br>2) D<br>MARKING DIAGRAM/<br>3 PIN ASSIGNMENT<br>3<br>Drain<br>1 Wy<br>2<br>SOT−23 TRFM<br>CASE 318<br>STYLE 21<br>1 _ 2<br>Gate Source<br>TRF = Specific Device Code<br>M = Date Code<br>= Pb−Free Package<br>(Note: Microdot may be in either location)<br>ORDERING INFORMATION<br>Device Package Shipping [†]<br>NTR4171PT1G SOT−23 3000/Tape & Reel<br>(Pb−Free)<br>NTR4171PT3G SOT−23 10000/Tape & Reel<br>(Pb−Free)<br>=<br>†For information on tape and reel specifications,<br>including part orientation and tape sizes, please<br>refer to our Tape and Reel Packaging Specification<br>Brochure, BRD8011/D.<br>**----- End of picture text -----**<br>


**==> picture [277 x 227] intentionally omitted <==**

**----- Start of picture text -----**<br>
MAXIMUM RATINGS  (TJ = 25 ° C unless otherwise noted)<br>a Parameter Symbol Value Unit<br>Drain−to−Source Voltage VDSS −30 V<br>Gate−to−Source Voltage VGS ± 12 V<br>Continuous Drain  Steady TA = 25 ° C −2.2<br>Current (Note 1) State TA = 85 ° C ID −1.5 A<br>es t  ≤  5 s TA = 25 ° C oe −3.5<br>=e<br>Power Dissipation Steady 0.48<br>(Note 1) State TA = 25 ° C PD W<br>t  ≤  5 s 1.25<br>Pulsed Drain Current tp = 10 s IDM −15.0 A<br>TATE Operating Junction and Storage Temperature TJ, −55 to ° C<br>T 150<br>stg<br>Source Current (Body Diode) IS −1.0 A<br>a<br>ee Lead Temperature for Soldering Purposes ee TL  ee 260 ° C<br>(1/8 ″  from case for 10 s)<br>pO<br>**----- End of picture text -----**<br>


Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 

|**THERMAL RESISTANCE RATINGS**<br>**Parameter**<br>**Symbol**<br>**Max**<br>**Unit**<br>Junction−to−Ambient − Steady State (Note 1)<br>R JA<br>260<br>°C/W<br>Junction−to−Ambient − t≤10 s (Note 1)<br>R JA<br>100<br>(Note: Microdot may be in either location)<br>~~eeee=~~|
|---|



1. Surface−mounted on FR4 board using 1 in sq pad size (Cu area = 1.127 in sq [2 oz] including traces) 

Publication Order Number: 

**1** 

© Semiconductor Components Industries, LLC, 2007 **October, 2016 − Rev. 2** 

**NTR4171P/D** 

**NTR4171P** 

**MOSFET ELECTRICAL CHARACTERISTICS** (TJ = 25 ° C unless otherwise noted) 

|**MOSFET ELECTRICAL CHARACTERI**|**STICS **(TJ=|25°C unless otherwise noted)|||||
|---|---|---|---|---|---|---|
|**Parameter**|**Symbol**|**Test Condition**|**Min**|**Typ**|**Max**|**Units**|
|**OFF CHARACTERISTICS**|||||||
|Drain−to−Source Breakdown Voltage|V(BR)DSS|VGS= 0 V, ID= −250�A|−30|||V|
|Drain−to−Source Breakdown Voltage<br>Temperature Coefficient|V(BR)DSS<br>/TJ|ID= −250�A, Reference to 25°C||24||mV/°C|
|Zero Gate Voltage Drain Current|IDSS|VGS= 0 V, VDS= −24 V, TJ= 25°C<br>VGS= 0 V, VDS= −24 V, TJ= 85°C|||−1.0<br>−5.0|�A|
|Gate−to−Source Leakage Current|IGSS|VDS= 0 V, VGS=�12 V|||±0.1|�A|
|**ON CHARACTERISTICS**(Note 3)|||||||
|Gate Threshold Voltage|VGS(TH)|VGS= VDS, ID= −250�A|−0.7|−1.15|−1.4|V|
|Negative Threshold Temperature Coefficient|VGS(TH)/TJ|||3.5||mV/°C|
|Drain−to−Source On−Resistance|RDS(on)|VGS= −10 V, ID= −2.2 A||50|75|m�|
|||VGS= −4.5 V, ID= −1.8 A||60|110||
|||VGS= −2.5 V, ID= −1.0 A||90|150||
|Forward Transconductance|gFS|VDS= −5.0 V, ID= −2.2 A||7.0||S|
|**CHARGES, CAPACITANCES AND GATE RESISTANCE**|||||||
|Input Capacitance|Ciss|VGS= 0 V, f = 1.0 MHz,<br>VDS= −15 V||720||pF|
|Output Capacitance|Coss|||95|||
|Reverse Transfer Capacitance|Crss|||65|||
|Total Gate Charge|QG(TOT)|VGS= −10 V, VDS= −15 V,<br>ID= −3.5 A||15.6||nC|
|Threshold Gate Charge|QG(TH)|||0.7|||
|Gate−to−Source Charge|QGS|||1.6|||
|Gate−to−Drain Charge|QGD|||2.6|||
|Total Gate Charge|QG(TOT)|VGS= −4.5 V, VDS= −15 V,<br>ID= −3.5 A||7.4||nC|
|Threshold Gate Charge|QG(TH)|||0.7|||
|Gate−to−Source Charge|QGS|||1.6|||
|Gate−to−Drain Charge|QGD|||2.6|||
|Gate Resistance|RG|||6.1||�|
|**SWITCHING CHARACTERISTICS, VGS = 4.5 V**(Note 4)|||||||
|Turn−On Delay Time|td(on)|VGS= −10 V, VDS= −15 V,<br>ID= −3.5 A, RG= 6�||8.0||ns|
|Rise Time|tr|||11|||
|Turn−Off Delay Time|td(off)|||32|||
|Fall Time|tf|||14|||
|Turn−On Delay Time|td(on)|VGS= −4.5 V, VDS= −15 V,<br>ID= −3.5 A, RG= 6�||9.0||ns|
|Rise Time|tr|||16|||
|Turn−Off Delay Time|td(off)|||25|||
|Fall Time|tf|||22|||
|**DRAIN−SOURCE DIODE CHARACTERISTICS**|||||||
|Forward Diode Voltage|VSD|VGS= 0 V, IS= −1.0 A, TJ= 25°C||−0.8|−1.2|V|
|Reverse Recovery Time|tRR|VGS= 0 V, IS= −1.0 A,<br>dISD/dt= 100 A/�s||14||ns|
|Charge Time|ta|||10|||
|Discharge Time|tb|||4.0|||
|Reverse Recovery Charge|QRR|||8.0||nC|



Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. 2. Surface−mounted on FR4 board using 1 in sq pad size (Cu area = 1.127 in sq [2 oz] including traces) 3. Pulse Test: Pulse Width � 300 � s, Duty Cycle � 2% 

4. Switching characteristics are independent of operating junction temperatures 

**www.onsemi.com** 

**2** 

**NTR4171P** 

## **TYPICAL CHARACTERISTICS** 

**==> picture [491 x 618] intentionally omitted <==**

**----- Start of picture text -----**<br>
10 10<br>−4.5 V<br>9.0 9.0 VDS = −5 V<br>−2.5 V<br>8.0 −10 V 8.0<br>7.0 7.0<br>6.0 6.0<br>5.0 −2.2 V 5.0<br>4.0 4.0 TJ = 25 ° C<br>3.0 V GS  = −2.0 V 3.0<br>2.0 2.0<br>TJ = 125 ° C<br>1.0 1.0 TJ = −55 ° C<br>0 0<br>0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 1.0 1.25 1.5 1.75 2.0 2.25 2.5 2.75 3.0<br>−VDS, DRAIN−TO−SOURCE VOLTAGE (V) −VGS, GATE−TO−SOURCE VOLTAGE (V)<br>Figure 1. On−Region Characteristics Figure 2. Transfer Characteristics<br>0.30 0.30<br>0.25 TJ = 25 ° C 0.25 −2.0 V −2.2 V TJ = 25 ° C<br>ID = −2.2 A<br>0.20 0.20<br>−2.5 V<br>0.15 0.15<br>0.10 0.10<br>−4.5 V<br>0.05 0.05<br>VGS = −10 V<br>0 0<br>1.0 2.0 3.0 4.0 5.0 6.0 7.0 8.0 9.0 10 0 1.0 2.0 3.0 4.0 5.0 6.0 7.0 8.0 9.0 10<br>−VGS, GATE VOLTAGE (V) −ID, DRAIN CURRENT (A)<br>Figure 3. On−Resistance vs. Gate−to−Source Figure 4. On−Resistance vs. Drain Current and<br>Voltage Gate Voltage<br>1.6 10,000<br>1.5 VGS = −4.5 V<br>1.4 ID = −2.2 A<br>1.3 TJ = 150 ° C<br>1000<br>1.2<br>1.1 TJ = 125 ° C<br>1.0<br>100<br>0.9<br>0.8<br>0.7<br>0.6 10<br>−50 −25 0 25 50 75 100 125 150 0 5.0 10 15 20 25 30<br>TJ, JUNCTION TEMPERATURE ( ° C) −VDS, DRAIN−TO−SOURCE VOLTAGE (V)<br>Figure 5. On−Resistance Variation with Figure 6. Drain−to−Source Leakage Current<br>Temperature vs. Voltage<br>, DRAIN CURRENT (A) , DRAIN CURRENT (A)<br>D D<br>−I −I<br>) � ) �<br>, DRAIN−TO−SOURCE RESISTANCE ( , DRAIN−TO−SOURCE RESISTANCE (<br>DS(on) DS(on)<br>R R<br>) �<br>, LEAKAGE (nA)<br>IDSS<br>, NORMALIZED DRAIN−TO−SOURCE RESISTANCE (<br>DS(on)<br>R<br>**----- End of picture text -----**<br>


**www.onsemi.com** 

**3** 

**NTR4171P** 

## **TYPICAL CHARACTERISTICS** 

**==> picture [491 x 176] intentionally omitted <==**

**----- Start of picture text -----**<br>
1100 12 16<br>1000 VGS = 0 V QT<br>900 Ciss f = 1 MHzTJ = 25 ° C 10 14<br>800 −VDS −VGS 12<br>8.0<br>700 10<br>600<br>6.0 8.0<br>500<br>400300 Coss 4.0 QGS QGD IV T DJDS = −3.5 A  = 25  = −15 V ° C 6.04.0<br>200 2.0<br>2.0<br>100 Crss<br>0 0 0<br>0 5.0 10 15 20 25 30 0 2.0 4.0 6.0 8.0 10 12 14 16<br>−VDS, DRAIN−TO−SOURCE VOLTAGE (V) QG, TOTAL GATE CHARGE (nC)<br>−V<br>DS<br>C, CAPACITANCE (pF)<br>, GATE−TO−SOURCE VOLTAGE (V)<br>GS<br>−V , DRAIN−TO−SOURCE VOLTAGE (V)<br>**----- End of picture text -----**<br>


**Figure 7. Capacitance Variation** 

**Figure 8. Gate−to−Source and Drain−to−Source Voltage vs. Total Charge** 

**==> picture [490 x 382] intentionally omitted <==**

**----- Start of picture text -----**<br>
1000 10<br>VGS = −10 V<br>VDD = −15 V<br>ID = −3.5 A TJ = 125 ° C<br>td(off)<br>100<br>tf TJ = 150 ° C<br>1.0<br>10 tr<br>td(on) TJ = 25 ° C<br>TJ = −55 ° C<br>1.0 0.1<br>1.0 10 100 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2<br>RG, GATE RESISTANCE ( � ) −VSD, SOURCE−TO−DRAIN VOLTAGE (V)<br>Figure 9. Resistive Switching Time Variation Figure 10. Diode Forward Voltage vs. Current<br>vs. Gate Resistance<br>1.5 30<br>1.4 ID = −250  � A<br>25<br>1.3<br>1.2 20<br>1.1<br>15<br>1.0<br>0.9 10<br>0.8<br>5.0<br>0.7<br>0.6 0<br>−50 −25 0 25 50 75 100 125 150 0.001 0.01 0.1 1.0 10 100 1000<br>TJ, TEMPERATURE ( ° C) SINGLE PULSE TIME (s)<br>t, TIME (ns)<br>, SOURCE CURRENT (A)<br>S<br>−I<br> (V)<br>GS(th)<br>−V POWER (W)<br>**----- End of picture text -----**<br>


**Figure 11. Threshold Voltage** 

**Figure 12. Single Pulse Maximum Power Dissipation** 

**www.onsemi.com** 

**4** 

**NTR4171P** 

## **TYPICAL CHARACTERISTICS** 

**==> picture [243 x 173] intentionally omitted <==**

**----- Start of picture text -----**<br>
100<br>VGS = −12 V<br>Single Pulse<br>TC = 25 ° C<br>10 10  � s<br>100  � s<br>1.0<br>1 ms<br>10 ms<br>0.1<br>RDS(on) Limit<br>Thermal Limit<br>Package Limit dc<br>0.01<br>0.1 1.0 10 100<br>−VDS, DRAIN−TO−SOURCE VOLTAGE (V)<br>, DRAIN CURRENT (A)<br>D<br>−I<br>**----- End of picture text -----**<br>


**Figure 13. Maximum Rated Forward Biased Safe Operating Area** 

**==> picture [490 x 173] intentionally omitted <==**

**----- Start of picture text -----**<br>
1.0<br>Duty Cycle = 0.5<br>0.2<br>0.1<br>0.1<br>0.05<br>0.02<br>0.01<br>Single Pulse<br>0.01<br>0.0001 0.001 0.01 0.1 1.0 10 100 1000<br>t, TIME (s)<br>RESPONSE (NORMALIZED)<br>R(t), EFFECTIVE TRANSIENT THERMAL<br>**----- End of picture text -----**<br>


**Figure 14. FET Thermal Response** 

**www.onsemi.com** 

**5** 

**NTR4171P** 

## **PACKAGE DIMENSIONS** 

**SOT−23 (TO−236)** CASE 318−08 ISSUE AR 

**==> picture [468 x 183] intentionally omitted <==**

**----- Start of picture text -----**<br>
D NOTES:<br>1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.<br>2. CONTROLLING DIMENSION: MILLIMETERS.<br>3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH.<br>0.25 MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF<br>Tae 3 THE BASE MATERIAL.<br>E HE T 4. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH,PROTRUSIONS, OR GATE BURRS.<br>1 2<br>MILLIMETERS INCHES<br>DIM MIN NOM MAX MIN NOM MAX<br>L A 0.89 1.00 1.11 0.035 0.039 0.044<br>3X b L1 A1b 0.010.37 0.060.44 0.100.50 0.0000.015 0.0020.017 0.0040.020<br>: : e VIEW C . c 0.08 0.14 0.20 0.003 0.006 0.008<br>TOP VIEW D 2.80 2.90 3.04 0.110 0.114 0.120<br>E 1.20 1.30 1.40 0.047 0.051 0.055<br>e 1.78 1.90 2.04 0.070 0.075 0.080<br>L 0.30 0.43 0.55 0.012 0.017 0.022<br>A L1 0.35 0.54 0.69 0.014 0.021 0.027<br>H E 2.10 2.40 2.64 0.083 0.094 0.104<br>T 0 −−− 10 0 −−− 10<br>GE A1 SIDE VIEW Se SEE VIEW C GR, c STYLE 21: SSS<br>END VIEW PIN 1. GATE<br>2. SOURCE<br>3. DRAIN<br>**----- End of picture text -----**<br>


**==> picture [142 x 135] intentionally omitted <==**

**----- Start of picture text -----**<br>
RECOMMENDED<br>SOLDERING FOOTPRINT*<br>3X<br>2.90 T O 0.90<br>L o| cr<br>3X 0.80 | LLL 0.95<br>PITCH<br>DIMENSIONS: MILLIMETERS<br>**----- End of picture text -----**<br>


*For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. 

ON Semiconductor and      are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. 

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