# Power MOSFET, N Channel, 60 V, 63 A, 0.0102 ohm, TO-220AB, Through Hole

![Product image](https://novapart.co/image/farnell:2724422/)

**URL**: https://novapart.co/products/NTP5864NG/power-mosfet-n-channel-60-v-63-a-00102-ohm-to
**SKU**: NTP5864NG
**Manufacturer**: ONSEMI
**Category**: Semiconductors - Discretes || FETs || Single MOSFETs
**Price**: €0.2360
**Stock**: 10+

## Specifications

| Parameter | Value |
|---|---|
| No. Of Pins | 3Pins |
| Channel Type | N Channel |
| Power Dissipation | 107W |
| Transistor Mounting | Through Hole |
| Transistor Polarity | N Channel |
| Power Dissipation Pd | 107W |
| Rds(On) Test Voltage | 10V |
| On Resistance Rds(On) | 0.0102ohm |
| Transistor Case Style | TO-220AB |
| Drain Source Voltage Vds | 60V |
| Operating Temperature Max | 175°C |
| Continuous Drain Current Id | 63A |
| Drain Source On State Resistance | 0.0102ohm |
| Gate Source Threshold Voltage Max | 4V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:2724422/)

NTP5864N 

## Power MOSFET **60 V, 63 A, 12.4 m** 

## **Features** 

- Low RDS(on) 

- High Current Capability 

**www.onsemi.com** 

- Avalanche Energy Specified 

• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS **ID MAX** Compliant **V(BR)DSS RDS(ON) MAX** (Note 1) 60 V 12.4 m Ω @ 10 V 63 A ~~pF~~ **MAXIMUM RATINGS** (TJ = 25 ° C unless otherwise stated) **Parameter Symbol Value Units N−Channel** Drain−to−Source Voltage VDSS 60 V D Gate−to−Source Voltage − Continuous VGS ± 20 V Gate−to−Source Voltage − VGS ± 30 V ~~a~~ Non−Repetitive (tp = 10 s) Continuous Drain Steady TC = 25 ° C ID ~~i~~ 63 A G Current − R JC (Note 1) State TC = 100 ° C 45 Power Dissipation − Steady TC = 25 ° C PD 107 W S R JC (Note 1) State TC = 100 ° C 54 **MARKING DIAGRAM** ~~==~~ Pulsed Drain Current tp = 10 s IDM 252 A **& PIN ASSIGNMENT** Operating Junction and Storage Temperature TJ, −55 to ° C 4 TSTG 175 4 Drain Source Current (Body Diode) Pulsed IS 63 A Single Pulse Drain−to Source Avalanche EAS 80 mJ Energy − (L = 0.1 mH) ~~Es~~ IAS 40 A @ **TO−220AB** Lead Temperature for Soldering Purposes TL 260 ° C **CASE 221A** NTP5864NG (1/8” from case for 10 s) **STYLE 5** AYWW Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be 1 1 3 assumed, damage may occur and reliability may be affected. 2 Gate Source 3 **THERMAL RESISTANCE RATINGS** 2 **Parameter Symbol Max Units** A = Assembly Location Drain Junction−to−Case (Drain) − Steady State R θ JC 1.4 ° C/W Y = Year (Note 1) WW = Work Week Junction−to−Ambient − Steady State (Note 1) R θ JA 33 ° C/W G = Pb−Free Package ~~ee~~ 1. Surface mounted on FR4 board using 1 in sq pad size ~~ee~~ (Cu area = 1.127 in sq [2 oz] including traces). **ORDERING INFORMATION Device Package Shipping** NTP5864NG TO−220 50 Units / Rail (Pb−Free) ~~FS~~ 

- These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS Compliant 

Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 

**Parameter Symbol Max Units** Junction−to−Case (Drain) − Steady State R θ JC 1.4 ° C/W (Note 1) Junction−to−Ambient − Steady State (Note 1) R θ JA 33 ° C/W ~~ee~~ 1. Surface mounted on FR4 board using 1 in sq pad size ~~ee~~ (Cu area = 1.127 in sq [2 oz] including traces). 

Publication Order Number: 

**1** 

© Semiconductor Components Industries, LLC, 2015 **January, 2015 − Rev. 1** 

**NTP5864N/D** 

## **NTP5864N** 

**ELECTRICAL CHARACTERISTICS** (TJ = 25 ° C unless otherwise stated) 

|**ELECTRICAL CHARACTERISTIC**|**S**(TJ= 25°C u|nless otherwise stated)|nless otherwise stated)|||||
|---|---|---|---|---|---|---|---|
|**Parameter**|**Symbol**|**Test Condition**||**Min**|**Typ**|**Max**|**Unit**|
|**OFF CHARACTERISTICS**||||||||
|Drain−to−Source Breakdown Voltage|V(BR)DSS|VGS= 0 V, ID= 250�A||60|||V|
|Drain−to−Source Breakdown Voltage<br>Temperature Coefficient|V(BR)DSS/TJ||||58||mV/°C|
|Zero Gate Voltage Drain Current|IDSS|VGS= 0 V,<br>VDS= 60 V|TJ= 25°C|||1.0|�A|
|Gate−to−Source Leakage Current|IGSS|VDS= 0 V, VGS=±20 V||||±100|nA|
|**ON CHARACTERISTICS**(Note 2)||||||||
|Gate Threshold Voltage|VGS(TH)|VGS= VDS, ID= 250�A||2.0||4.0|V|
|Gate Threshold Temperature<br>Coefficient|VGS(TH)/TJ||||−10||mV/°C|
|Drain−to−Source On Resistance|RDS(on)|VGS= 10 V, ID= 20 A|||10.2|12.4|m�|
|Forward Transconductance|gFS|VDS= 15 V, ID= 20 A|||10||S|
|**CHARGES AND CAPACITANCES**||||||||
|Input Capacitance|CISS|VGS= 0 V, f = 1.0 MHz,<br>VDS= 25 V|||1680||pF|
|Output Capacitance|COSS||||189|||
|Reverse Transfer Capacitance|CRSS||||124|||
|Total Gate Charge|QG(TOT)|VGS= 10 V, VDS= 48 V,<br>ID= 20 A|||31||nC|
|Threshold Gate Charge|QG(TH)||||2.0|||
|Gate−to−Source Charge|QGS||||7.3|||
|Gate−to−Drain Charge|QGD||||10|||
|Gate Resistance|Rg||||0.5||�|
|**SWITCHING CHARACTERISTICS, VGS = 10 V**(Note 3)||||||||
|Turn−On Delay Time|td(ON)|VGS= 10 V, VDD= 48 V,<br>ID= 20 A, RG= 2.5�|||10||ns|
|Rise Time|tr||||6.4|||
|Turn−Off Delay Time|td(OFF)||||18|||
|Fall Time|tf||||4.6|||
|**DRAIN−SOURCE DIODE CHARACTERISTICS**||||||||
|Forward Diode Voltage|VSD|VGS= 0 V,<br>IS= 40 A|TJ= 25°C||0.94|1.2|V|
||||TJ= 125°C||0.84|||
|Reverse Recovery Time|tRR|VGS= 0 V, dISD/dt = 100 A/�s,<br>IS= 20 A|||24||ns|
|Charge Time|ta||||16|||
|Discharge Time|tb||||7.9|||
|Reverse Recovery Charge|QRR||||20||nC|



2. Pulse Test: pulse width ≤ 300 � s, duty cycle ≤ 2%. 

3. Switching characteristics are independent of operating junction temperatures. 

**www.onsemi.com** 

**2** 

**NTP5864N** 

## **TYPICAL CHARACTERISTICS** 

**==> picture [492 x 638] intentionally omitted <==**

**----- Start of picture text -----**<br>
125 125<br>VGS = 10 V 7.5 V TJ = 25 ° C VDS ≥  10 V<br>7 V<br>100 100<br>6.5 V<br>5.5 V<br>75 75<br>5.0 V<br>50 50<br>TJ = 25 ° C<br>25 4.5 V 25<br>TJ = 125 ° C TJ = −55 ° C<br>0 0<br>0 1 2 3 4 5 2 3 4 5 6 7<br>VDS, DRAIN−TO−SOURCE VOLTAGE (V) VGS, GATE−TO−SOURCE VOLTAGE (V)<br>Figure 1. On−Region Characteristics Figure 2. Transfer Characteristics<br>0.030 0.0115<br>0.025 TIDJ = 25 = 20 A ° C VTGSJ = 25 = 10 V ° C<br>0.0110<br>0.020<br>0.015 0.0105<br>0.010<br>0.0100<br>0.005<br>0.000 0.0095<br>4 5 6 7 8 9 10 10 15 20 25 30 35 40 45 50 55 60<br>VGS, GATE−TO−SOURCE VOLTAGE (V) ID, DRAIN CURRENT (A)<br>Figure 3. On−Resistance vs. Gate Voltage Figure 4. On−Resistance vs. Drain Current<br>2.2 100000<br>2.0 ID = 20 A VGS = 0 V<br>VGS = 10 V<br>1.8<br>1.6 10000 TJ = 150 ° C<br>1.4<br>1.2 TJ = 125 ° C<br>1000<br>1.0<br>0.8<br>0.6 100<br>−50 −25 0 25 50 75 100 125 150 175 10 20 30 40 50 60<br>TJ, JUNCTION TEMPERATURE ( ° C) VDS, DRAIN−TO−SOURCE VOLTAGE (V)<br>Figure 5. On−Resistance Variation with Figure 6. Drain−to−Source Leakage Current<br>Temperature vs. Voltage<br>, DRAIN CURRENT (A)<br>ID , DRAIN CURRENT (A)<br>ID<br>) � ) �<br>, DRAIN−TO−SOURCE RESISTANCE ( , DRAIN−TO−SOURCE RESISTANCE (<br>DS(on) DS(on)<br>R R<br>, LEAKAGE (nA)<br>IDSS<br>, DRAIN−TO−SOURCE RESISTANCE (NORMALIZED)<br>DS(on)<br>R<br>**----- End of picture text -----**<br>


**www.onsemi.com** 

**3** 

**NTP5864N** 

## **TYPICAL CHARACTERISTICS** 

**==> picture [245 x 173] intentionally omitted <==**

**----- Start of picture text -----**<br>
2500<br>VGS = 0 V<br>TJ = 25 ° C<br>2000<br>Ciss<br>1500<br>1000<br>500<br>Coss<br>0 Crss<br>0 10 20 30 40 50 60<br>VDS, DRAIN−TO−SOURCE VOLTAGE (V)<br>C, CAPACITANCE (pF)<br>**----- End of picture text -----**<br>


**Figure 7. Capacitance Variation** 

**==> picture [240 x 175] intentionally omitted <==**

**----- Start of picture text -----**<br>
10<br>QT<br>8<br>6<br>Q gs Q gd<br>4<br>2<br>ID = 20 A<br>TJ = 25 ° C<br>0<br>0 5 10 15 20 25 30<br>Qg, TOTAL GATE CHARGE (nC)<br>, GATE−TO−SOURCE VOLTAGE (V)<br>GS<br>V<br>**----- End of picture text -----**<br>


**Figure 8. Gate−to−Source vs. Total Charge** 

**==> picture [250 x 400] intentionally omitted <==**

**----- Start of picture text -----**<br>
1000<br>VDD = 48 V<br>ID = 20 A<br>VGS = 10 V<br>100<br>td(off)<br>td(on)<br>10<br>tr<br>tf<br>1<br>1 10 100<br>RG, GATE RESISTANCE ( � )<br>Figure 9. Resistive Switching Time Variation<br>vs. Gate Resistance<br>1000<br>100  � s 10  � s<br>1 ms<br>100<br>10 ms<br>dc<br>10<br>VGS = 10 V<br>SINGLE PULSE<br>1 TC = 25 ° C<br>RDS(on) LIMIT<br>THERMAL LIMIT<br>PACKAGE LIMIT<br>0.1<br>0.1 1 10 100<br>VDS, DRAIN−TO−SOURCE VOLTAGE (V)<br>t, TIME (ns)<br>, DRAIN CURRENT (A)<br>ID<br>**----- End of picture text -----**<br>


**==> picture [242 x 399] intentionally omitted <==**

**----- Start of picture text -----**<br>
100<br>90 VGS = 0 V<br>TJ = 25 ° C<br>80<br>70<br>60<br>50<br>40<br>30<br>20<br>10<br>0<br>0.40 0.50 0.60 0.70 0.80 0.90 1.00 1.10 1.20<br>VSD, SOURCE−TO−DRAIN VOLTAGE (V)<br>Figure 10. Diode Forward Voltage vs. Current<br>80<br>ID = 40 A<br>70<br>60<br>50<br>40<br>30<br>20<br>10<br>0<br>25 50 75 100 125 150 175<br>TJ, STARTING JUNCTION TEMPERATURE<br>, SOURCE CURRENT (A)<br>IS<br>AVALANCHE ENERGY (mJ)<br>**----- End of picture text -----**<br>


**Figure 11. Maximum Rated Forward Biased Safe Operating Area** 

**Figure 12. Maximum Avalanche Energy versus Starting Junction Temperature** 

**www.onsemi.com** 

**4** 

**NTP5864N** 

## **TYPICAL CHARACTERISTICS** 

**==> picture [491 x 171] intentionally omitted <==**

**----- Start of picture text -----**<br>
10<br>Duty Cycle = 0.5<br>1<br>0.2<br>0.1<br>0.05<br>0.1<br>0.02<br>0.01<br>SINGLE PULSE<br>0.01<br>0.000001 0.00001 0.0001 0.001 0.01 0.1 1 10<br>t, PULSE TIME (s)<br>C/W) EFFECTIVE TRANSIENT<br> ( ° THERMAL RESISTANCE<br>JC(t)<br>�<br>R<br>**----- End of picture text -----**<br>


**Figure 13. Thermal Response** 

**www.onsemi.com** 

**5** 

**NTP5864N** 

## **PACKAGE DIMENSIONS** 

**TO−220** CASE 221A−09 ISSUE AH 

**==> picture [232 x 185] intentionally omitted <==**

**----- Start of picture text -----**<br>
SEATING<br>−T− PLANE<br>B F C<br>T S<br>4<br>Q we A o F<br>1 2 3 U<br>H<br>K<br>Z<br>L R<br>V J<br>G<br>D<br>N<br>**----- End of picture text -----**<br>


|NOTES:|||||
|---|---|---|---|---|
|1. DIMENSIONING AND TOLERANCING PER ANSI|||||
|Y14.5M, 1982.|||||
|2. CONTROLLING DIMENSION: INCH.<br>3. DIMENSION Z DEFINES A ZONE WHERE ALL<br>BODY AND LEAD IRREGULARITIES ARE<br>ALLOWED.<br>**DIM**<br>**MIN**<br>**MAX**<br>**MIN**<br>**MAX**<br>**MILLIMETERS**<br>**INCHES**<br>**A**<br>0.570<br>0.620<br>14.48<br>15.75<br>**B**<br>0.380<br>0.415<br>9.66<br>10.53<br>~~ee~~|||||
|**C**<br>0.160|0.190|4.07|4.83||
|**D**<br>0.025|0.038|0.64|0.96||
|**F**<br>0.142|0.161|3.61|4.09||
|**G**<br>0.095|0.105|2.42|2.66||
|**H**<br>0.110|0.161|2.80|4.10||
|**J**<br>0.014|0.024|0.36|0.61||
|**K**<br>0.500|0.562|12.70|14.27||
|**L**<br>0.045|0.060|1.15|1.52||
|**N**<br>0.190|0.210|4.83|5.33||
|**Q**<br>0.100|0.120|2.54|3.04||
|**R**<br>0.080|0.110|2.04|2.79||
|**S**<br>0.045|0.055|1.15|1.39||
|**T**<br>0.235|0.255|5.97|6.47||
|**U**<br>0.000|0.050|0.00|1.27||
|**V**<br>0.045|---|1.15|---||
|**Z**<br>---|0.080|---|2.04||
|STYLE 5:|||||
|PIN 1.<br>GATE|||||
|2.<br>DRAIN|||||
|3.<br>SOURCE|||||
|4.<br>DRAIN|||||



ON Semiconductor and the         are registered trademarks of Semiconductor Components Industries, LLC (SCILLC) or its subsidiaries in the United States and/or other countries. SCILLC owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf.  SCILLC reserves the right to make changes without further notice to any products herein.  SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.  “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time.  All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts.  SCILLC does not convey any license under its patent rights nor the rights of others.  SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur.  Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part.  SCILLC is an Equal Opportunity/Affirmative Action Employer.  This literature is subject to all applicable copyright laws and is not for resale in any manner. 

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**NTP5864N/D** 

**6** 



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