# Power MOSFET, N Channel, 20 V, 361 mA, 0.7 ohm, SOT-883, Surface Mount

![Product image](https://novapart.co/image/farnell:2724420/)

**URL**: https://novapart.co/products/NTNS3164NZT5G/power-mosfet-n-channel-20-v-361-ma-07-ohm-sot-883
**SKU**: NTNS3164NZT5G
**Manufacturer**: ONSEMI
**Category**: Semiconductors - Discretes || FETs || Single MOSFETs
**Price**: €0.0990
**Stock**: 1000+
**Lead Time**: 120 days (indicative)

## Description

Transistor Polarity:N Channel; Continuous Drain Current Id:361mA; Drain Source Voltage Vds:20V; On Resistance Rds(on):0.5ohm; Rds(on) Test Voltage Vgs:4.5V; Threshold Voltage Vgs:1V; P

## Specifications

| Parameter | Value |
|---|---|
| Msl | MSL 1 - Unlimited |
| Svhc | No SVHC (25-Jun-2025) |
| No. Of Pins | 3Pins |
| Channel Type | N Channel |
| Product Range | - |
| Qualification | - |
| Power Dissipation | 155mW |
| Transistor Mounting | Surface Mount |
| Rds(On) Test Voltage | 4.5V |
| Transistor Case Style | SOT-883 |
| Drain Source Voltage Vds | 20V |
| Operating Temperature Max | 150°C |
| Continuous Drain Current Id | 361mA |
| Drain Source On State Resistance | 0.7ohm |
| Gate Source Threshold Voltage Max | 1V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:2724420/)

## NTNS3164NZ 

## MOSFET – Single, N-Channel, Small Signal, SOT-883 (XDFN3), 1.0 x 0.6 x 0.4 mm 

## 20 V, 361 Ma 

## **Features** 

- Single N−Channel MOSFET 

- Ultra Low Profile SOT−883 (XDFN3) 1.0 x 0.6 x 0.4 mm for Extremely Thin Environments Such as Portable Electronics 

- Low RDS(on) Solution in the Ultra Small 1.0 x 0.6 mm Package 

- 1.5 V Gate Drive 

## **http://onsemi.com** 

|**V(BR)DSS**|**RDS(on) MAX**|**ID Max**|
|---|---|---|
|20 V|0.7  @ 4.5 V<br>1.0  @ 2.5 V<br>2.0  @ 1.8 V<br>4.0  @ 1.5 V|361 mA|



- These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS Compliant 

## **N−CHANNEL MOSFET** 

## **Applications** 

- High Side Switch 

- High Speed Interfacing 

- Level Shift and Translate 

- Optimized for Power Management in Ultra Portable Solutions 

**MAXIMUM RATINGS** (TJ = 25 ° C unless otherwise stated) 

|**MAXIMUM RATINGS**(TJ = 25J = 25= 25°C unless otherwise stated)|**MAXIMUM RATINGS**(TJ = 25J = 25= 25°C unless otherwise stated)|**MAXIMUM RATINGS**(TJ = 25J = 25= 25°C unless otherwise stated)|C unless otherwise stated)|C unless otherwise stated)||
|---|---|---|---|---|---|
|**Parameter**|||**Symbol**|**Value**|**Unit**|
|Drain−to−Source Voltage|||VDSS|20|V|
|Gate−to−Source Voltage|||VGS|±8|V|
|Continuous Drain<br>Current (Note 1)<br>~~ES~~<br>~~Po~~|Steady<br>State<br>~~ES~~|TA= 25°C<br>~~ES~~|ID<br>~~ES~~<br>~~P|~~|361<br>~~ES~~|mA<br>~~ES~~<br>~~P|~~|
|||TA= 85°C<br>~~ES~~||260<br>~~ES~~||
||t≤5 s<br>~~ES~~|TA= 25°C<br>~~ES~~<br>~~P|~~||427<br>~~ES~~<br>~~P|~~||
|Power Dissipation<br>(Note 1)<br>~~Po~~|Steady<br>State|TA= 25°C<br>~~P|~~|PD<br>~~P|~~|155<br>~~P|~~|mW<br>~~P|~~|
||t≤5 s|||217<br>~~P|~~||
|Pulsed Drain<br>Current<br>~~Po~~<br>~~a~~|tp= 10 s<br>~~P|~~<br>~~ee~~||IDM<br>~~P|~~<br>~~ee~~<br>~~ee~~|1082<br>~~P|~~<br>~~ee~~|mA<br>~~P|~~<br>~~ee~~|
|Operating Junction and Storage<br>Temperature<br>~~a~~<br>~~ee ~~<br>~~ee~~|||TJ, TSTG<br> ~~ee ~~<br>~~ee~~<br>~~ee~~|−55 to<br>150<br> ~~ee~~<br>~~ee~~|°C<br>~~ee~~<br>~~ee~~|
|Source Current (Body Diode) (Note 2)<br>~~a~~<br>~~ee~~|||IS<br>~~ee~~<br>~~a~~<br>ee|129<br>~~a~~|mA<br>~~a~~|
|Lead Temperature for Soldering Purposes<br>(1/8” from case for 10 s)<br>~~ee~~|||TL<br>ee|260|°C|



2. Pulse Test: pulse width ≤ 300 s, duty cycle ≤ 2% 

**==> picture [86 x 132] intentionally omitted <==**

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D (3)<br>G (1)<br>S (2)<br>**----- End of picture text -----**<br>


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**----- Start of picture text -----**<br>
3 MARKING DIAGRAM<br>64 M<br>2 [1]<br>SOT−883 (XDFN3) SO<br>CASE 506CB<br>64 = Specific Device Code<br>M = Date Code<br>**----- End of picture text -----**<br>


**ORDERING INFORMATION Device Package Shipping**[†] NTNS3164NZT5G SOT−883 8000 / Tape & (Pb−Free) Reel ~~— =~~ †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D. 

Publication Order Number: **NTNS3164NZ/D** 

**1** 

© Semiconductor Components Industries, LLC, 2013 **June, 2019 − Rev. 0** 

**NTNS3164NZ** 

## **THERMAL RESISTANCE RATINGS** 

|**THERMAL RESISTANCE RATINGS**||||
|---|---|---|---|
|**Parameter**|**Symbol**|**Max**|**Unit**|
|Junction−to−Ambient – Steady State (Note 3)|RθJA|806|°C/W|
|Junction−to−Ambient – t≤5 s (Note 3)|RθJA|575||



3. Surface−mounted on FR4 board using the minimum recommended pad size, or 2 mm[2] , 1 oz Cu. 

## **ELECTRICAL CHARACTERISTICS** (TJ = 25 ° C unless otherwise stated) 

|**Parameter**|**Symbol**|**Test Condition**|**Test Condition**|**Min**|**Typ**|**Max**|**Unit**|
|---|---|---|---|---|---|---|---|
|**OFF CHARACTERISTICS**||||||||
|Drain−to−Source Breakdown Voltage|V(BR)DSS|VGS= 0 V, ID= 250�A||20|||V|
|Drain−to−Source Breakdown Voltage<br>Temperature Coefficient|V(BR)DSS/<br>TJ|ID= 250�A, ref to 25°C|||23||mV/°C|
|Zero Gate Voltage Drain Current|IDSS|VGS= 0 V, VDS=  20 V|TJ= 25°C|||1|�A|
|Gate−to−Source Leakage Current|IGSS|VDS= 0 V, VGS=±5 V||||±10|�A|
|**ON CHARACTERISTICS**(Note 4)||||||||
|Gate Threshold Voltage|VGS(TH)|VGS= VDS, ID= 250�A||0.4||1.0|V|
|Negative Threshold Temperature<br>Coefficient|VGS(TH)/TJ||||1.8||mV/°C|
|Drain−to−Source On Resistance|RDS(on)|VGS= 4.5 V, ID= 200 mA|||0.5|0.7|�|
|||VGS= 2.5 V, ID= 100 mA|||0.7|1.0||
|||VGS= 1.8 V, ID= 50 mA|||1.0|2.0||
|||VGS= 1.5 V, ID= 10 mA|||1.2|4.0||
|Forward Transconductance|gFS|VDS= 5 V, ID= 200 mA|||1.26||S|
|Source−Drain Diode Voltage|VSD|VGS= 0 V, IS= 100 mA|||0.75|1.2|V|
|**CHARGES & CAPACITANCES**||||||||
|Input Capacitance|CISS|VGS= 0 V, freq = 1 MHz, VDS= 10 V|||24||pF|
|Output Capacitance|COSS||||5.0|||
|Reverse Transfer Capacitance|CRSS||||3.4|||
|Total Gate Charge|QG(TOT)|VGS= 4.5 V, VDS= 10 V;<br>ID= 200 mA|||0.8||nC|
|Threshold Gate Charge|QG(TH)||||0.1|||
|Gate−to−Source Charge|QGS||||0.2|||
|Gate−to−Drain Charge|QGD||||0.1|||
|**SWITCHING CHARACTERISTICS, VGS**|**= 4.5 V**(Note|4)||||||
|Turn−On Delay Time|td(ON)|VGS= 4.5 V, VDD= 10 V,<br>ID= 200 mA, RG= 2�|||10||ns|
|Rise Time|tr||||11|||
|Turn−Off Delay Time|td(OFF)||||67|||
|Fall Time|tf||||31|||



4. Switching characteristics are independent of operating junction temperatures 

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**2** 

**NTNS3164NZ** 

## **TYPICAL CHARACTERISTICS** 

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1.0 1.0<br>4.5 V 2.5 V<br>0.9 4.0 V 3.0 V V GS  = 2.0 V 0.9 V DS  = 5.0 V T J  = 125 ° C<br>0.80.7 3.5 V 1.8 V 0.80.7 T J  = 25 ° C TJ = −55 ° C<br>0.6 0.6<br>0.5 0.5<br>0.4 1.5 V 0.4<br>0.3 0.3<br>0.2 0.2<br>1.2 V<br>0.1 0.1<br>0 0<br>0 0.5 1.0 1.5 2.0 2.5 3.0 0 0.5 1.0 1.5 2.0 2.5 3.0<br>VDS, DRAIN−TO−SOURCE VOLTAGE (V) VGS, GATE−TO−SOURCE VOLTAGE (V)<br>Figure 1. On−Region Characteristics Figure 2. Transfer Characteristics<br>5.0 5.0<br>4.5 TJ = 25 ° C 4.5 TJ = 25 ° C<br>4.0 4.0<br>3.5 3.5<br>3.0 3.0 VGS = 1.5 V<br>2.5 2.5<br>2.0 2.0 VGS = 1.8 V<br>1.5 ID = 200 mA 1.5<br>1.0 1.0 V GS  = 2.5 V<br>0.5 0.5<br>VGS = 4.5 V<br>0 0<br>1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0<br>VGS, GATE VOLTAGE (V) ID, DRAIN CURRENT (A)<br>Figure 3. On−Resistance vs. Gate−to−Source Figure 4. On−Resistance vs. Drain Current and<br>Voltage Gate Voltage<br>1.8 1000<br>1.7 VGS = 4.5 V<br>1.6 I D  = 200 mA T J  = 150 ° C<br>1.5<br>1.4 100 TJ = 125 ° C<br>1.3 V GS  = 1.8 V<br>1.2 ID = 50 mA<br>1.1<br>1.0 10<br>0.9<br>0.8 TJ = 85 ° C<br>0.7<br>0.6 1<br>−50 −25 0 25 50 75 100 125 150 2 4 6 8 10 12 14 16 18 20<br>TJ, JUNCTION TEMPERATURE ( ° C) VDS, DRAIN−TO−SOURCE VOLTAGE (V)<br>Figure 5. On−Resistance Variation with Figure 6. Drain−to−Source Leakage Current<br>Temperature vs. Voltage<br>, DRAIN CURRENT (A) , DRAIN CURRENT (A)<br>ID ID<br>) � ) �<br>, DRAIN−TO−SOURCE , DRAIN−TO−SOURCE<br>RESISTANCE ( RESISTANCE (<br>DS(on) DS(on)<br>R R<br>) �<br>, LEAKAGE (nA)<br>, NORMALIZED DRAIN−TO− IDSS<br>SOURCE RESISTANCE (<br>DS(on)<br>R<br>**----- End of picture text -----**<br>


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**3** 

**NTNS3164NZ** 

## **TYPICAL CHARACTERISTICS** 

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35 5 12<br>VGS = 0 V QT<br>30 f = 1 MHz<br>CISS TJ = 25 ° C 4 10<br>25 VDS<br>VGS 8<br>3<br>20<br>6<br>15 2 Q GS QGD<br>4<br>10 C OSS VDS = 10 V<br>5 CRSS 1 T ID J  = 0.2 A  = 25 ° C 2<br>0 0 0<br>0 2 4 6 8 10 12 14 16 18 20 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9<br>VDS, DRAIN−TO−SOURCE VOLTAGE (V) QG, TOTAL GATE CHARGE (nC)<br>Figure 7. Capacitance Variation Figure 8. Gate−to−Source and<br>Drain−to−Source Voltage vs. Total Charge<br>100 10<br>td(off) TJ = 125 ° C<br>1 TJ = 25 ° C<br>tf 0.1 T J  = −55 ° C<br>VGS = 4.5 V<br>VDD = 10 V 0.01<br>tr<br>10 td(on) 0.001<br>1 10 100 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2<br>RG, GATE RESISTANCE ( � ) VSD, SOURCE−TO−DRAIN VOLTAGE (V)<br>Figure 9. Resistive Switching Time Variation Figure 10. Diode Forward Voltage vs. Current<br>vs. Gate Resistance<br>0.85 10<br>VGS ≤  8 V<br>0.80 ID = 250  � A Single Pulse<br>TC = 25 ° C<br>0.75 1<br>10  � s<br>0.70<br>100  � s<br>0.65 0.1 1 ms<br>0.60 10 ms<br>0.55 0.01 RDS(on) Limit dc<br>Thermal Limit<br>0.50<br>Package Limit<br>0.45 0.001<br>−50 −25 0 25 50 75 100 125 150 0.1 1 10 100<br>TJ, JUNCTION TEMPERATURE ( ° C) VDS, DRAIN−TO−SOURCE VOLTAGE (V)<br>V<br>DS<br>C, CAPACITANCE (pF)<br>, GATE−TO−SOURCE VOLTAGE (V)<br>GS<br>V , DRAIN−TO−SOURCE VOLTAGE (V)<br>t, TIME (ns)<br>, SOURCE CURRENT (A)<br>IS<br> (V)<br>GS(th)<br>V<br>, DRAIN CURRENT (A)<br>ID<br>**----- End of picture text -----**<br>


**Figure 11. Threshold Voltage** 

**Figure 12. Maximum Rated Forward Biased Safe Operating Area** 

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**4** 

**NTNS3164NZ** 

## **TYPICAL CHARACTERISTICS** 

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**----- Start of picture text -----**<br>
900<br>800 R � JA = 806 ° C/W<br>Steady State<br>700<br>600<br>500<br>Duty Cycle = 0.5<br>400<br>300 0.05 0.02 0.01<br>200 0.2<br>0.1<br>100<br>Single Pulse<br>0<br>1E−06 1E−05 1E−04 1E−03 1E−02 1E−01 1E+00 1E+01 1E+02 1E+03<br>t, TIME (s)<br>C/W)<br>°<br>MAL RESPONSE (<br>R(t), EFFECTIVE TRANSIENT THER-<br>**----- End of picture text -----**<br>


**Figure 13. FET Thermal Response** 

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**5** 

MECHANICAL CASE OUTLINE **PACKAGE DIMENSIONS** 

**SOT−883 (XDFN3), 1.0x0.6, 0.35P** CASE 506CB ISSUE A 

DATE 30 MAR 2012 

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SCALE 8:1<br>**----- End of picture text -----**<br>


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D A B NOTES:<br>1. DIMENSIONING AND TOLERANCING PER<br>REFERENCEPIN ONE o r es 2. ASME Y14.5M, 1994.CONTROLLING DIMENSION: MILLIMETERS.<br>ÉÉ 3. EXPOSED COPPER ALLOWED AS SHOWN.<br>E MILLIMETERS<br>0.10 C ÉÉ<br>ont DIM MIN MAX<br>A 0.340 0.440<br>0.10 C t A1 0.000 0.030<br>TOP VIEW b 0.075 0.200<br>D 0.950 1.075<br>NOTE 3 A D2 0.620 BSC<br>0.10 C e 0.350 BSC<br>_¢<br>E 0.550 0.675<br>E2 0.425 0.550<br>L 0.170 0.300<br>3X 0.10 C<br>A1 GENERIC<br>SIDE VIEW C [SEATING] PLANE MARKING DIAGRAM*<br>D2 XX M<br>E2 XX = Specific Device Code<br>ve nia M = Date Code —<br>e/2<br>e 1 3X L *This information is generic. Please refer<br>2X b to device data sheet for actual part<br>0.10 M C A B marking. Pb−Free indicator, “G”, may<br>0.05 M C or not be present.<br>BOTTOM VIEW<br>RECOMMENDED<br>SOLDER FOOTPRINT*<br>1.10<br>0.41<br>2X 0.43<br>1<br>cs. st 0.55<br>2X 0.20 PACKAGE<br>‘EQ. OUTLINE<br>DIMENSIONS: MILLIMETERS<br>**----- End of picture text -----**<br>


*For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. 

Electronic versions are uncontrolled except when accessed directly from the Document Repository. **DOCUMENT NUMBER: 98AON65407E** Printed  versions are uncontrolled  except when stamped  “CONTROLLED COPY” in red. **DESCRIPTION: SOT−883 (XDFN3), 1.0X0.6, 0.35P PAGE 1 OF 1** ~~[1—_~~ ON Semiconductor and          are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the rights of others. 

~~—_~~ 

www.onsemi.com 

© Semiconductor Components Industries, LLC, 2019 

**onsemi** , , and other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “ **onsemi** ” or its affiliates and/or subsidiaries in the United States and/or other countries. **onsemi** owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of **onsemi’s** product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. **onsemi** reserves the right to make changes at any time to any products or information herein, without notice. The information herein is provided “as−is” and **onsemi** makes no warranty, representation or guarantee regarding the accuracy of the information, product features, availability, functionality, or suitability of its products for any particular purpose, nor does **onsemi** assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using **onsemi** products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by **onsemi** . “Typical” parameters which may be provided in **onsemi** data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. **onsemi** does not convey any license under any of its intellectual property rights nor the rights of others. **onsemi** products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use **onsemi** products for any such unintended or unauthorized application, Buyer shall indemnify and hold **onsemi** and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that **onsemi** was negligent regarding the design or manufacture of the part. **onsemi** is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. 

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◊ 

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