# Power MOSFET, N Channel, 100 V, 267 A, 1420 µohm, DFNW, Surface Mount

![Product image](https://novapart.co/image/farnell:3588876RL/)

**URL**: https://novapart.co/products/NTMTSC1D6N10MCTXG/power-mosfet-n-channel-100-v-267-a-1420-ohm-dfnw
**SKU**: NTMTSC1D6N10MCTXG
**Manufacturer**: ONSEMI
**Category**: Semiconductors - Discretes || FETs || Single MOSFETs
**Price**: €2.6400
**Stock**: 1000+
**Lead Time**: 134 days (indicative)

## Specifications

| Parameter | Value |
|---|---|
| Msl | MSL 1 - Unlimited |
| Svhc | Lead (25-Jun-2025) |
| No. Of Pins | 8Pins |
| Channel Type | N Channel |
| Product Range | - |
| Qualification | - |
| Power Dissipation | 291W |
| Transistor Mounting | Surface Mount |
| Rds(On) Test Voltage | 10V |
| Transistor Case Style | DFNW |
| Drain Source Voltage Vds | 100V |
| Operating Temperature Max | 175°C |
| Continuous Drain Current Id | 267A |
| Drain Source On State Resistance | 1420µohm |
| Gate Source Threshold Voltage Max | 4V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:3588876RL/)

## MOSFET - Power, Single N-Channel 100 V, 1.7 m 267 A ~~_~~ NTMTSC1D6N10MC 

## **Features** 

- Small Footprint (8x8 mm) for Compact Design 

**www.onsemi.com** 

- Low R to Minimize Conduction Losses DS(on) 

- Low QG and Capacitance to Minimize Driver Losses 

- New Power 88 Dual Cool Package 

- These Devices are Pb−Free and are RoHS Compliant 

**==> picture [162 x 24] intentionally omitted <==**

**----- Start of picture text -----**<br>
|||||
|---|---|---|---|
|V(BR)DSS|RDS(ON) MAX|ID MAX|
|100 V|1.7 m|@ 10 V|267 A|

**----- End of picture text -----**<br>


100 V 1.7 m @ 10 V 

**MAXIMUM RATINGS** (TJ = 25 ° C unless otherwise noted) 

**==> picture [425 x 304] intentionally omitted <==**

**----- Start of picture text -----**<br>
||||||||||
|---|---|---|---|---|---|---|---|---|
|Parameter|Symbol|Value|Unit|D (5−8)|
|Drain−to−Source Voltage|VDSS|100|V|
|Gate−to−Source Voltage|VGS|±|20|V|
|Continuous Drain Current R(Notes 1, 3)JC|Steady|TTCC = 100 = 25|°°|CC|ID|267189|A|G (1)|
|Power Dissipation|State|TC = 25|°|C|PD|291|W|
|R|JC (Note 1)|TC = 100|°|C|145|N−CHANNEL MOSFET|
|Continuous Drain|TA = 25|°|C|ID|35|A|
|jee|Current R(Notes 1, 2, 3)JA|Steady|TA = 100|°|C|25|4|
|Power Dissipation|State|TA = 25|°|C|PD|5.1|W|
|R|JA (Notes 1, 2)|TA = 100|°|C|2.5|
|Pulsed Drain Current|TA = 25|°|C, tp = 10 s|IDM|900|A|TDFNW8|
|Operating Junction and Storage Temperature|TJ, Tstg|−55 to|°|C|CASE 507AS|
|Range|+ 175|
|ee|Source Current (Body Diode)|IS|243|A|MARKING DIAGRAM|
|Single Pulse Drain−to−Source Avalanche|EAS|1550|ee|mJ|
|Energy (IL(pk) = 22.3 A)|
|—E|
|Lead Temperature for Soldering Purposes|TL|260|°|C|
|(1/8|″|from case for 10 s)|
|Stresses exceeding those listed in the Maximum Ratings table may damage the|
|es|ee|
|device. If any of these limits are exceeded, device functionality should not be|
|assumed, damage may occur and reliability may be affected.|

**----- End of picture text -----**<br>


**==> picture [108 x 188] intentionally omitted <==**

**----- Start of picture text -----**<br>
D (5−8)<br>G (1)<br>S (2−4)<br>N−CHANNEL MOSFET<br>4<br>TDFNW8<br>CASE 507AS<br>**----- End of picture text -----**<br>


## **MARKING DIAGRAM** 

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1D6N10M AWLYW<br>**----- End of picture text -----**<br>


## **THERMAL RESISTANCE MAXIMUM RATINGS** 

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|||||||
|---|---|---|---|---|---|
|Parameter|Symbol|Value|Unit|
|Junction−to−Case − Bottom − Steady State|R|JCB|0.5|°|C/W|
|Junction−to−Case − Top − Steady State|R|JCT|0.8|
|Junction−to−Ambient − Steady State (Note 2)|R|JA|29.5|

**----- End of picture text -----**<br>


1. The entire application environment impacts the thermal resistance values shown, they are not constants and are only valid for the particular conditions noted. 

2. Surface−mounted on FR4 board using a 650 mm[2] , 2 oz. Cu pad. 

3. Maximum current for pulses as long as 1 second is higher but is dependent on pulse duration and duty cycle. 

1D6N10M = Specific Device Code A = Assembly Location WL = Wafer Lot Code Y = Year Code W = Work Week Code 

## **ORDERING INFORMATION** 

See detailed ordering, marking and shipping information in the package dimensions section on page 5 of this data sheet. 

Publication Order Number: **NTMTSC1D6N10MC/D** 

**1** 

© Semiconductor Components Industries, LLC, 2018 **August, 2020 − Rev. 0** 

## **NTMTSC1D6N10MC** 

## **ELECTRICAL CHARACTERISTICS** (TJ = 25 ° C unless otherwise specified) 

|**ELECTRICAL CHARACTERISTICS**(TJ=|25°C unless|otherwise specified)|otherwise specified)|||||
|---|---|---|---|---|---|---|---|
|**Parameter**|**Symbol**|**Test Condition**||**Min**|**Typ**|**Max**|**Unit**|
|**OFF CHARACTERISTICS**||||||||
|Drain−to−Source Breakdown Voltage|V(BR)DSS|VGS= 0 V, ID=|250�A|100|||V|
|Drain−to−Source Breakdown Voltage<br>Temperature Coefficient|V(BR)DSS/<br>TJ||||64.5||mV/°C|
|Zero Gate Voltage Drain Current|IDSS|VGS= 0 V,<br>VDS= 100 V|TJ= 25°C|||5|�A|
||||TJ= 125°C|||10||
|Gate−to−Source Leakage Current|IGSS|VDS= 0 V, VGS= 20 V||||100|nA|
|**ON CHARACTERISTICS**(Note 4)||||||||
|Gate Threshold Voltage|VGS(TH)|VGS= VDS, ID= 650�A||2.0||4.0|V|
|Threshold Temperature Coefficient|VGS(TH)/TJ||||−10||mV/°C|
|Drain−to−Source On Resistance|RDS(on)|VGS= 10 V|ID= 90 A||1.42|1.7|m�|
|||VGS= 6 V|ID= 58 A|||4.3||
|Forward Transconductance|gFS|VDS=5 V, ID= 100 A|||233||S|
|**CHARGES, CAPACITANCES & GATE RESISTANCE**||||||||
|Input Capacitance|CISS|VGS= 0 V, f = 100 KHz, VDS= 50 V|||7630||pF|
|Output Capacitance|COSS||||4260|||
|Reverse Transfer Capacitance|CRSS||||80|||
|Total Gate Charge|QG(TOT)|VGS= 10 V, VDS= 50 V; ID= 116 A|||106||nC|
|Threshold Gate Charge|QG(TH)|VGS= 10 V, VDS= 50 V; ID= 116 A|||20|||
|Gate−to−Source Charge|QGS||||35|||
|Gate−to−Drain Charge|QGD||||22|||
|Plateau Voltage|VGP||||5||V|
|**SWITCHING CHARACTERISTICS**(Note 5)||||||||
|Turn−On Delay Time|td(ON)|VGS= 10 V, VDS= 50 V,<br>ID= 116 A, RG= 6�|||34||ns|
|Rise Time|tr||||24|||
|Turn−Off Delay Time|td(OFF)||||69|||
|Fall Time|tf||||29|||
|**DRAIN−SOURCE DIODE CHARACTERISTICS**||||||||
|Forward Diode Voltage|VSD|VGS= 0 V,<br>IS= 90 A|TJ= 25°C||0.83|1.2|V|
||||TJ= 125°C||0.7|||
|Reverse Recovery Time|tRR|VGS= 0 V, dIS/dt = 100 A/�s,<br>IS= 58 A|||54||ns|
|Charge Time|ta||||26|||
|Discharge Time|tb||||28|||
|Reverse Recovery Charge|QRR||||52||nC|
|Reverse Recovery Time|tRR|VGS= 0 V, dIS/dt = 1000 A/�s,<br>IS= 58 A|||43||ns|
|Charge Time|ta||||23|||
|Discharge Time|tb||||19|||
|Reverse Recovery Charge|QRR||||385||nC|



Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. 4. Pulse Test: pulse width � 300 � s, duty cycle � 2%. 

5. Switching characteristics are independent of operating junction temperatures. 

**www.onsemi.com** 

**2** 

**NTMTSC1D6N10MC** 

## **TYPICAL CHARACTERISTICS** 

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**----- Start of picture text -----**<br>
250 250<br>VGS = 10 to 6 V 5.5 V VDS = 5 V<br>200 200<br>150 150<br>5.0 V<br>100 100 T J  = 25 ° C<br>50 50<br>4.5 V<br>4.0 V TJ = 125 ° C TJ = −55 ° C<br>0 0<br>0 1 2 3 4 5 0 1 2 3 4 5 6 7 8 9 10<br>VDS, DRAIN−TO−SOURCE VOLTAGE (V) VGS, GATE−TO−SOURCE VOLTAGE (V)<br>Figure 1. On−Region Characteristics Figure 2. Transfer Characteristics<br>50 4<br>ID = 90 A TJ = 25 ° C<br>40<br>3<br>VGS = 6 V<br>30<br>2<br>20 VGS = 10 V<br>1<br>10<br>T J  = 25 ° C<br>0 0<br>2 3 4 5 6 7 8 9 10 10 60 110 160 210<br>VGS, GATE−TO−SOURCE VOLTAGE (V) ID, DRAIN CURRENT (A)<br>Figure 3. On−Resistance vs. Gate−to−Source Figure 4. On−Resistance vs. Drain Current<br>Voltage<br>100K<br>2.4 ID = 90 A TJ = 150 ° C<br>2.2 VGS = 10 V 10K TJ = 125 ° C<br>2.0 1K<br>1.8 TJ = 85 ° C<br>100<br>1.6<br>10<br>1.4 TJ = 25 ° C<br>1.2 1<br>1.0<br>0.1<br>0.8<br>0.01<br>0.6<br>0.4 0.001<br>−50 −25 0 25 50 75 100 125 150 175 5 15 25 35 45 55 65 75 85 95<br>TJ, JUNCTION TEMPERATURE ( ° C) VDS, DRAIN−TO−SOURCE VOLTAGE (V)<br>Figure 5. On−Resistance Variation with Figure 6. Drain−to−Source Leakage Current<br>Temperature vs. Voltage<br>, DRAIN CURRENT (A) , DRAIN CURRENT (A)<br>ID ID<br>) �<br>, ON−RESISTANCE (m<br>DS(on)<br>R , DRAIN−SOURCE ON−RESISTANCE<br>DS(on)<br>R<br>, REVERSE LEAKAGE CURRENT (nA)<br>, NORMALIZED DRAIN−SOURCE ON−RESISTANCEDS(on) IDSS<br>R<br>**----- End of picture text -----**<br>


**www.onsemi.com** 

**3** 

**NTMTSC1D6N10MC** 

## **TYPICAL CHARACTERISTICS** 

**==> picture [246 x 594] intentionally omitted <==**

**----- Start of picture text -----**<br>
100K<br>10K C ISS<br>COSS<br>1K<br>CRSS<br>100<br>10 VGS = 0 V<br>TJ = 25 ° C<br>f = 1 MHz<br>1<br>0 10 20 30 40 50<br>VDS, DRAIN−TO−SOURCE VOLTAGE (V)<br>Figure 7. Capacitance Variation<br>1000<br>VGS = 10 V<br>V DS  = 50 V<br>I D  = 116 A<br>100<br>td(off)<br>td(on)<br>10 t f<br>tr<br>1<br>1 10 100<br>RG, GATE RESISTANCE ( � )<br>Figure 9. Resistive Switching Time Variation<br>vs. Gate Resistance<br>1000<br>100<br>10  � s<br>10<br>TC = 25 ° C<br>Single Pulse<br>V GS ≤  10 V 0.5 ms<br>1 1 ms<br>RDS(on) Limit 10 ms<br>Thermal Limit<br>Package Limit<br>0.1<br>0.1 1 10 100 1000<br>VDS, DRAIN−TO−SOURCE VOLTAGE (V)<br>C, CAPACITANCE (pF)<br>t, TIME (ns)<br>, DRAIN CURRENT (A)<br>ID<br>**----- End of picture text -----**<br>


**Figure 11. Safe Operating Area** 

**==> picture [239 x 156] intentionally omitted <==**

**----- Start of picture text -----**<br>
12<br>10<br>8<br>6 QGS QGD<br>4<br>VDS = 50 V<br>2 ID = 116 A<br>TJ = 25 ° C<br>0<br>0 25 50 75 100 125<br>, GATE−TO−SOURCE VOLTAGE (V)<br>GS<br>V<br>**----- End of picture text -----**<br>


**==> picture [119 x 9] intentionally omitted <==**

**----- Start of picture text -----**<br>
QG, TOTAL GATE CHARGE (nC)<br>**----- End of picture text -----**<br>


**Figure 8. Gate−to−Source Voltage vs. Total Charge** 

**==> picture [239 x 383] intentionally omitted <==**

**----- Start of picture text -----**<br>
250<br>VGS = 0 V<br>TJ = 175 ° C<br>TJ = 150 ° C<br>TJ = 125 ° C<br>TJ = 25 ° C<br>TJ = −55 ° C<br>25<br>0.1 0.3 0.5 0.7 0.9 1.1<br>VSD, SOURCE−TO−DRAIN VOLTAGE (V)<br>Figure 10. Diode Forward Voltage vs. Current<br>1000<br>100 TJ(initial) = 25 ° C<br>10 TJ(initial) = 100 ° C<br>1<br>0.00001 0.0001 0.001 0.01<br>TIME IN AVALANCHE (s)<br>, SOURCE CURRENT (A)<br>IS<br>, DRAIN CURRENT (A)<br>IPEAK<br>**----- End of picture text -----**<br>


**Figure 12. Maximum Drain Current vs. Time in Avalanche** 

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**4** 

**NTMTSC1D6N10MC** 

## **TYPICAL CHARACTERISTICS** 

**==> picture [484 x 173] intentionally omitted <==**

**----- Start of picture text -----**<br>
100<br>50% Duty Cycle<br>10 20%<br>10%<br>5%<br>1 2%<br>1%<br>0.1<br>0.01<br>Single Pulse<br>0.001<br>0.000001 0.00001 0.0001 0.001 0.01 0.1 1 10 100 1000<br>t, PULSE TIME (s)<br>C/W)<br>°<br> (<br>JA<br>�<br>R<br>**----- End of picture text -----**<br>


**Figure 13. Junction−to−Ambient Transient Thermal Response** 

## **DEVICE ORDERING INFORMATION** 

|**Device**|**Marking**|**Package**|**Shipping**†|
|---|---|---|---|
|NTMTSC1D6N10MCTXG|1D6N10M|POWER 88 Dual Cool<br>(Pb−Free)|3,000 / Tape & Reel|



†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. 

**www.onsemi.com** 

**5** 

**NTMTSC1D6N10MC** 

## **PACKAGE DIMENSIONS** 

## **TDFNW8 8.3x8.4, 2P** 

CASE 507AS ISSUE A 

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**www.onsemi.com** 

**6** 

**NTMTSC1D6N10MC** 

ON Semiconductor and      are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. 

## **PUBLICATION ORDERING INFORMATION** 

**LITERATURE FULFILLMENT** : **Email Requests to:** orderlit@onsemi.com 

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**Europe, Middle East and Africa Technical Support:** Phone: 00421 33 790 2910 For additional information, please contact your local Sales Representative 

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**7** 



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