# Power MOSFET, N Channel, 650 V, 30 A, 0.077 ohm, TDFN, Surface Mount

![Product image](https://novapart.co/image/farnell:3766215RL/)

**URL**: https://novapart.co/products/NTMT095N65S3H/power-mosfet-n-channel-650-v-30-a-0077-ohm-tdfn
**SKU**: NTMT095N65S3H
**Manufacturer**: ONSEMI
**Category**: Semiconductors - Discretes || FETs || Single MOSFETs
**Price**: €3.0900
**Stock**: 1000+
**Lead Time**: 2 days (indicative)

## Specifications

| Parameter | Value |
|---|---|
| No. Of Pins | 4Pins |
| Channel Type | N Channel |
| Product Range | SUPERFET III |
| Power Dissipation | 208W |
| Transistor Mounting | Surface Mount |
| Transistor Polarity | N Channel |
| Power Dissipation Pd | 208W |
| Rds(On) Test Voltage | 10V |
| On Resistance Rds(On) | 0.077ohm |
| Transistor Case Style | TDFN |
| Drain Source Voltage Vds | 650V |
| Operating Temperature Max | 150°C |
| Continuous Drain Current Id | 30A |
| Drain Source On State Resistance | 0.077ohm |
| Gate Source Threshold Voltage Max | 4V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:3766215RL/)

## MOSFET - Power, N‐Channel, SUPERFET III, FAST 

## 650 V, 95 m 30 A 

## NTMT095N65S3H 

**www.onsemi.com** 

## **Description** 

SUPERFET III MOSFET is ON Semiconductor’s brand−new high voltage super−junction (SJ) MOSFET family that is utilizing charge balance technology for outstanding low on−resistance and lower gate charge performance. This advanced technology is tailored to minimize conduction loss, provide superior switching performance, and withstand extreme dv/dt rate. Consequently, SUPERFET III FAST MOSFET is suitable for various AC/DC power conversion for system miniaturization and higher efficiency. 

The Power88 package is an ultra−slim surface−mount package (1 mm high) with a low profile and small footprint (8 x 8 mm[2] ). SUPERFET III MOSFET in a Power88 package offers excellent switching performance due to lower parasitic source inductance and separated power and drive sources. Power88 offers Moisture Sensitivity Level 1 (MSL 1). 

## **Features** 

- 700 V @ TJ = 150°C 

- Typ. RDS(on) = 77 m 

- • Ultra Low Gate Charge (Typ. Qg = 58 nC) • Low Effective Output Capacitance (Typ. Coss(eff.) • 100% Avalanche Tested 7 

- Low Effective Output Capacitance (Typ. Coss(eff.) = 522 pF) 

- These Devices are Pb−Free and are RoHS Compliant 

|**VDSS**|**RDS(ON) MAX**|**ID MAX**|
|---|---|---|
|650 V|95 m @ 10 V|30 A|



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G<br>S1: Driver Source<br>S2: Power Source<br>S1 S2<br>[3] POWER MOSFET<br>**----- End of picture text -----**<br>


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G<br>S1<br>S2<br>S2<br>os<br>TDFN4 8X8 2P<br>CASE 520AB<br>**----- End of picture text -----**<br>


## **Applications** 

- Telecom / Server Power Supplies 

- Industrial Power Supplies 

- UPS / Solar 

**MARKING DIAGRAM** NTMT095 N65S3H AWLYWW = NTMT095N65S3H = Specific Device Code A = Assembly Location WL = Wafer Lot Y = Year WW = Work Week 

## **ORDERING INFORMATION** 

See detailed ordering and shipping information on page 2 of this data sheet. 

Publication Order Number: **NTMT095N65S3H/D** 

**1** 

© Semiconductor Components Industries, LLC, 2020 **March, 2021 − Rev. 1** 

**NTMT095N65S3H** 

**ABSOLUTE MAXIMUM RATINGS** (TC = 25 ° C, Unless otherwise noted) 

|**ABSOLUTE M**|**AXIMUM RATINGS**(TC= 25°C, Unless other|wise noted)|||
|---|---|---|---|---|
|**Symbol**|**Parameter**||**Value**|**Unit**|
|VDSS|Drain to Source Voltage||650|V|
|VGSS|Gate to Source Voltage|− DC|±30|V|
|||− AC (f > 1 Hz)|±30||
|ID|Drain Current|− Continuous (TC= 25°C)|30|A|
|||− Continuous (TC= 100°C)|18||
|IDM|Drain Current|− Pulsed (Note 1)|84|A|
|EAS|Single Pulsed Avalanche Energy (Note 2)||284|mJ|
|IAS|Avalanche Current (Note 2)||5.5|A|
|EAR|Repetitive Avalanche Energy (Note 1)||2.08|mJ|
|dv/dt|MOSFET dv/dt||120|V/ns|
||Peak Diode Recovery dv/dt (Note 3)||20||
|PD|Power Dissipation|(TC= 25°C)|208|W|
|||− Derate Above 25°C|1.67|W/°C|
|TJ, TSTG|Operating and Storage Temperature Range||−55 to +150|°C|
|TL|Maximum Lead Temperature for Soldering, 1/8″f|rom Case for 5 seconds|260|°C|



Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 

1. Repetitive rating: pulse−width limited by maximum junction temperature. 

2. IAS = 5.5 A, RG = 25 � , starting TJ = 25 ° C. 

3. ISD ≤ 15 A, di/dt ≤ 200 A/ � s, VDD ≤ 400 V, starting TJ = 25 ° C. 

## **THERMAL CHARACTERISTICS** 

|**Symbol**|**Parameter**|**Value**|**Unit**|
|---|---|---|---|
|R�JC|Thermal Resistance, Junction to Case, Max.|0.60|�C/W|
|R�JA|Thermal Resistance, Junction to Ambient, Max. (Note 4)|45||



4. Device on 1 in[2] pad 2 oz copper pad on 1.5 x 1.5 in. board of FR−4 material. 

## **PACKAGE MARKING AND ORDERING INFORMATION** 

|**Part Number**|**Top Marking**|**Package**|**Reel Size**|**Tape Width**|**Shipping Quantity**†|
|---|---|---|---|---|---|
|NTMT095N65S3H|NTMT095N65S3H|TDFN4|13″|13.3 mm|3000 Units / Tape & Reel|



†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. 

**www.onsemi.com** 

**2** 

**NTMT095N65S3H** 

**ELECTRICAL CHARACTERISTICS** (TC = 25 ° C unless otherwise noted) 

|**ELECTRICAL**|**CHARACTERISTICS**(TC= 25°C unl|ess otherwise noted)|||||
|---|---|---|---|---|---|---|
|**Symbol**|**Parameter**|**Test Conditions**|**Min**|**Typ**|**Max**|**Unit**|
|**OFF CHARACTERISTICS**|||||||
|BVDSS|Drain to Source Breakdown Voltage|VGS= 0 V, ID= 1 mA, TJ= 25�C|650|−|−|V|
|||VGS= 0 V, ID= 1 mA, TJ= 150�C|700|−|−|V|
|�BVDSS/�TJ|Breakdown Voltage Temperature<br>Coefficient|ID= 10 mA, Referenced to 25�C|−|0.63|−|V/�C|
|IDSS|Zero Gate Voltage Drain Current|VDS= 650 V, VGS= 0 V|−|−|10|�A|
|||VDS= 520 V, TC= 125�C|−|1.8|−||
|IGSS|Gate to Body Leakage Current|VGS=±30 V, VDS= 0 V|−|−|±100|nA|
|**ON CHARACTERISTICS**|||||||
|VGS(th)|Gate Threshold Voltage|VGS= VDS, ID= 2.8 mA|2.4|−|4.0|V|
|RDS(on)|Static Drain to Source On Resistance|VGS= 10 V, ID= 15 A|−|77|95|m�|
|gFS|Forward Transconductance|VDS= 20 V, ID= 15 A|−|30|−|S|
|**DYNAMIC CHARACTERISTICS**|||||||
|Ciss|Input Capacitance|VDS= 400 V, VGS= 0 V, f = 250 kHz|−|2833|−|pF|
|Coss|Output Capacitance||−|43|−|pF|
|Coss(eff.)|Effective Output Capacitance|VDS= 0 V to 400 V, VGS= 0 V|−|522|−|pF|
|Coss(er.)|Energy Related Output Capacitance|VDS= 0 V to 400 V, VGS= 0 V|−|75|−|pF|
|Qg(tot)|Total Gate Charge at 10V|VDS= 400 V, ID= 15 A, VGS= 10 V<br>(Note 4)|−|58|−|nC|
|Qgs|Gate to Source Gate Charge||−|14|−|nC|
|Qgd|Gate to Drain “Miller” Charge||−|15|−|nC|
|ESR|Equivalent Series Resistance|f = 1 MHz|−|1.2|−|�|
|**SWITCHING CHARACTERISTICS**|||||||
|td(on)|Turn-On Delay Time|VDD= 400 V, ID= 15 A,<br>VGS= 10 V, Rg= 4.7�<br>(Note 4)|−|23|−|ns|
|tr|Turn-On Rise Time||−|6.5|−|ns|
|td(off)|Turn-Off Delay Time||−|69|−|ns|
|tf|Turn-Off Fall Time||−|2.5|−|ns|
|**SOURCE-DRAIN DIODE CHARACTERISTICS**|||||||
|IS|Maximum Continuous Source to Drain|Diode Forward Current|−|−|30|A|
|ISM|Maximum Pulsed Source to Drain Diode Forward Current||−|−|84|A|
|VSD|Source to Drain Diode Forward<br>Voltage|VGS= 0 V, ISD= 15 A|−|−|1.2|V|
|trr|Reverse Recovery Time|VDD= 400 V, ISD= 15 A,<br>dIF/dt = 100 A/�s|−|352|−|ns|
|Qrr|Reverse Recovery Charge||−|5.8|−|�C|



Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. 5. Essentially independent of operating temperature typical characteristics. 

**www.onsemi.com** 

**3** 

**NTMT095N65S3H** 

## **TYPICAL CHARACTERISTICS** (TC = 25 ° C unless otherwise noted) 

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60<br>10 V 6.0 V 250  � s Pulse Test<br>7.0 V TC = 25 ° C<br>50<br>5.0 V<br>40<br>30<br>4.5 V<br>20<br>10 V GS  = 4.0 V<br>0<br>0 5 10 15 20<br>VDS, DRAIN−TO−SOURCE VOLTAGE (V)<br>Figure 1. On−Region Characteristics<br>0.20<br>TC = 25 ° C<br>0.15<br>0.10 VGS = 10 V<br>VGS = 20 V<br>0.05<br>0<br>0 20 40 60 80 100<br>ID, DRAIN CURRENT (A)<br>Figure 3. On−Resistance Variation vs.<br>Drain Current and Gate Voltage<br>10 [6]<br>VGS = 0 V Ciss = Cgs + Cgd (Cds = shorted)<br>10 [5] f = 250 KHz Coss = Cds + Cgd<br>Crss = Cgd<br>10 [4]<br>Ciss<br>10 [3]<br>10 [2] Coss<br>10 [1] Crss<br>10 [0]<br>10 [−1]<br>0 100 200 300 400 500 600<br>VDS, DRAIN−TO−SOURCE VOLTAGE (V)<br>, DRAIN CURRENT (A)<br>ID<br>, DRAIN−SOURCE ON−RESISTANCE<br>DS(on)<br>R<br>CAPACITANCE (pF)<br>**----- End of picture text -----**<br>


**Figure 5. Capacitance Characteristics** 

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100<br>250  � s Pulse Test<br>VDS = 20 V<br>10<br>TJ = 25 ° C<br>1 TJ = 150 ° C TJ = −55 ° C<br>2 3 4 5 6<br>VGS, GATE−TO−SOURCE VOLTAGE (V)<br>Figure 2. Transfer Characteristics<br>100<br>VGS = 0 V<br>250  � s Pulse Test<br>10<br>1<br>0.1 TJ = 150 ° C TJ = 25 ° C TJ = −55 ° C<br>0 0.2 0.4 0.6 0.8 1.0 1.2<br>VSD, BODY DIODE FORWARD VOLTAGE (V)<br>Figure 4. Body Diode Forward Voltage<br>Variation vs. Source Current and Temperature<br>10<br>VDS = 130 V<br>I D  = 15 A<br>8<br>V DS = 400 V<br>6<br>4<br>2<br>0<br>0 10 20 30 40 50 60<br>Qg, TOTAL GATE CHARGE (nC)<br>, DRAIN CURRENT (A)<br>ID<br>, REVERSE DRAIN CURRENT (A)<br>IS<br>, GATE−SOURCE VOLTAGE (V)<br>GS<br>V<br>**----- End of picture text -----**<br>


**Figure 6. Gate Charge Characteristics** 

**www.onsemi.com** 

**4** 

**NTMT095N65S3H** 

## **TYPICAL CHARACTERISTICS** (TC = 25 ° C unless otherwise noted) 

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1.2 3.0<br>VGS = 0 V V GS  = 10 V<br>ID = 10 mA 2.5 ID = 15 A<br>1.1<br>2.0<br>1.0 1.5<br>1.0<br>0.9<br>0.5<br>0.8 0<br>−75 −50 −25 0 25 50 75 100 125 150 175 −75 −50 −25 0 25 50 75 100 125 150 175<br>TJ, JUNCTION TEMPERATURE ( ° C) TJ, JUNCTION TEMPERATURE ( ° C)<br>Figure 7. Breakdown Voltage Variation Figure 8. On−Resistance Variation<br>vs. Temperature vs. Temperature<br>100 40<br>10  � s 30<br>10 100  � s<br>Operation in this<br>20<br>Area is Limited 1 ms<br>by RDS(on)<br>1<br>10<br>T C  = 25 ° C 10 ms<br>T J = 150 ° C DC<br>Single Pulse<br>0.1 0<br>1 10 100 1000 25 50 75 100 125 150<br>VDS, DRAIN−SOURCE VOLTAGE (V) TC, CASE TEMPERATURE ( ° C)<br>, NORMALIZED DRAIN−<br>, NORMALIZED DRAIN−TO−<br>DSS DS(ON) SOURCE ON−RESISTANCE<br>R<br>BV SOURCE BREAKDOWN VOLTAGE<br>, DRAIN CURRENT (A) , DRAIN CURRENT (A)<br>ID ID<br>**----- End of picture text -----**<br>


**Figure 9. Maximum Safe Operating Area** 

**Figure 10. Maximum Drain Current vs. Case Temperature** 

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10<br>8<br>6<br>4<br>2<br>0<br>0 100 200 300 400 500 600<br>VDS, DRAIN−TO−SOURCE VOLTAGE (V)<br>J)<br>�<br> (<br>OSS<br>E<br>**----- End of picture text -----**<br>


**Figure 11. EOSS vs. Drain to Source Voltage** 

**www.onsemi.com** 

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**NTMT095N65S3H** 

## **TYPICAL CHARACTERISTICS** (TC = 25 ° C unless otherwise noted) 

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1<br>Duty Cycle = 0.5<br>0.2<br>0.1<br>0.1 0.05<br>0.02<br>0.01 P DM ZR �� JCJC(t) = r(t) x R = 0.60 ° C/W � JC<br>Single Pulse t 1 Peak T J = P DM  x Z � JC (t) + T C<br>t2 Duty Cycle, D = t1/t2<br>0.01<br>0.00001 0.0001 0.001 0.01 0.1 1<br>t, RECTANGULAR PULSE DURATION (sec)<br>SIENT THERMAL RESISTANCE<br>r(t), NORMALIZED EFFECTIVE TRAN-<br>**----- End of picture text -----**<br>


**Figure 12. Transient Thermal Impedance** 

**www.onsemi.com** 

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VGS<br>RL Qg<br>VGS VDS Qgs Qgd<br>DUT<br>IG = Const.<br>Charge<br>**----- End of picture text -----**<br>


**Figure 13. Gate Charge Test Circuit & Waveform** 

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VDS RL VDS 90% 90% 90%<br>VGS VDD<br>RG<br>10% 10%<br>DUT VGS<br>VGS<br>td(on) tr td(off) tf<br>ton toff<br>**----- End of picture text -----**<br>


**Figure 14. Resistive Switching Test Circuit & Waveforms** 

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L<br>VDS EAS  � [1] 2 � LIAS2<br>BVDSS<br>ID<br>IAS<br>RG VDD ID(t)<br>VGS DUT VDD VDS(t)<br>t<br>p Time<br>t<br>p<br>**----- End of picture text -----**<br>


**Figure 15. Unclamped Inductive Switching Test Circuit & Waveforms** 

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**----- Start of picture text -----**<br>
+<br>DUT<br>VDS<br>−<br>ISD<br>L<br>Driver<br>RG<br>Same Type<br>as DUT<br>VDD<br>VGS<br>− dv/dt controlled by RG<br>− ISD controlled by pulse period<br>Gate Pulse Width<br>D  �<br>Gate Pulse Period<br>VGS 10 V<br>(Driver)<br>IFM, Body Diode Forward Current<br>ISD di/dt<br>(DUT)<br>IRM<br>Body Diode Reverse Current<br>Body Diode Recovery dv/dt<br>VDS<br>(DUT) VSD VDD<br>Body Diode<br>Forward Voltage Drop<br>**----- End of picture text -----**<br>


**Figure 16. Peak Diode Recovery dv/dt Test Circuit & Waveforms** 

SUPERFET is a registered trademark of Semiconductor Components Industries, LLC. 

**www.onsemi.com** 

**8** 

**NTMT095N65S3H** 

## **PACKAGE DIMENSIONS** 

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TDFN4 8x8, 2P<br>CASE 520AB<br>ISSUE O<br>**----- End of picture text -----**<br>


ON Semiconductor and      are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. 

## **PUBLICATION ORDERING INFORMATION** 

**LITERATURE FULFILLMENT** : **TECHNICAL SUPPORT Email Requests to:** orderlit@onsemi.com **North American Technical Support:** Voice Mail: 1 800−282−9855 Toll Free USA/Canada **ON Semiconductor Website:** www.onsemi.com Phone: 011 421 33 790 2910 

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**9** 



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