# Power MOSFET, N Channel, 60 V, 262 A, 1070 µohm, LFPAK, Surface Mount

![Product image](https://novapart.co/image/farnell:3367858RL/)

**URL**: https://novapart.co/products/NTMJS1D4N06CLTWG/power-mosfet-n-channel-60-v-262-a-1070-ohm-lfpak
**SKU**: NTMJS1D4N06CLTWG
**Manufacturer**: ONSEMI
**Category**: Semiconductors - Discretes || FETs || Single MOSFETs
**Price**: €1.0900
**Stock**: 1000+
**Lead Time**: 141 days (indicative)

## Specifications

| Parameter | Value |
|---|---|
| Msl | MSL 1 - Unlimited |
| Svhc | No SVHC (25-Jun-2025) |
| No. Of Pins | 8Pins |
| Channel Type | N Channel |
| Product Range | - |
| Qualification | - |
| Power Dissipation | 180W |
| Transistor Mounting | Surface Mount |
| Rds(On) Test Voltage | 10V |
| Transistor Case Style | LFPAK |
| Drain Source Voltage Vds | 60V |
| Operating Temperature Max | 175°C |
| Continuous Drain Current Id | 262A |
| Drain Source On State Resistance | 1070µohm |
| Gate Source Threshold Voltage Max | 2V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:3367858RL/)

**DATA SHEET www.onsemi.com** 

## MOSFET ~~—~~ – Power, Single N-Channel 

## 60 V, 1.3 m 262 A 

## NTMJS1D4N06CL 

## **Features** 

- Small Footprint (5x6 mm) for Compact Design 

- Low R to Minimize Conduction Losses DS(on) 

- Low QG and Capacitance to Minimize Driver Losses 

- LFPAK8 Package, Industry Standard 

- These Devices are Pb−Free and are RoHS Compliant 

**==> picture [190 x 158] intentionally omitted <==**

**----- Start of picture text -----**<br>
V(BR)DSS RDS(ON) MAX ID MAX<br>1.3 m  @ 10 V<br>60 V 262 A<br>1.8 m  @ 4.5 V<br>oe<br>D (5,8)<br>G (4)<br>S (1,2,3)<br>**----- End of picture text -----**<br>


**==> picture [86 x 7] intentionally omitted <==**

**----- Start of picture text -----**<br>
N−CHANNEL MOSFET<br>**----- End of picture text -----**<br>


**MAXIMUM RATINGS** (TJ = 25 ° C unless otherwise noted) 

|**Parameter**<br>**Symbol**<br>**Value**<br>**Unit**<br>**MARKING**<br>**DIAGRAM**<br>~~es~~<br>~~Ge De ee~~|**Parameter**<br>**Symbol**<br>**Value**<br>**Unit**<br>**MARKING**<br>**DIAGRAM**<br>~~es~~<br>~~Ge De ee~~|**Parameter**<br>**Symbol**<br>**Value**<br>**Unit**<br>**MARKING**<br>**DIAGRAM**<br>~~es~~<br>~~Ge De ee~~|
|---|---|---|
|Drain−to−Source Voltage<br>VDSS<br>60<br>V|D<br>D<br>D<br>D||
|Gate−to−Source Voltage<br>VGS<br>20<br>V<br>Continuous Drain<br>Current R JC<br>(Notes 1, 3)<br>Steady<br>State<br>TC= 25°C<br>ID<br>262<br>A<br>TC= 100°C<br>185<br>Power Dissipation<br>R JC(Note 1)<br>TC= 25°C<br>PD<br>180<br>W<br>TC= 100°C<br>90<br>Continuous Drain<br>Current R JA<br>(Notes 1, 2, 3)<br>Steady<br>State<br>TA= 25°C<br>ID<br>39<br>A<br>TA= 100°C<br>28<br>Power Dissipation<br>R JA(Notes 1 & 2)<br>TA= 25°C<br>PD<br>4.0<br>W<br>TA= 100°C<br>2.0<br>Pulsed Drain Current<br>TA= 25°C, tp= 10 s<br>IDM<br>900<br>A<br>Operating Junction and Storage Temperature<br>TJ, Tstg<br>−55 to<br>+ 175<br>°C<br>Source Current (Body Diode)<br>IS<br>150<br>A<br>Single Pulse Drain−to−Source Avalanche<br>Energy (IL(pk)= 18.7 A)<br>EAS<br>1376<br>mJ<br>**LFPAK8**<br>**CASE 760AA**<br>See detailed ordering, marking and shipping information on<br>page 5 of this data sheet.<br>**ORDERING INFORMATION**<br>1D4N06CL = Specific Device Code<br>A<br>= Assembly Location<br>LL<br>= Wafer Lot<br>Y<br>= Year<br>W<br>= Work Week<br>1D4N06<br>CL<br>ALLYW<br>G<br>S<br>S<br>S<br>1<br>~~Fer~~<br>~~oe~~<br>~~Per~~<br>~~a~~<br>~~ee ee~~<br>~~Pe~~<br>~~ff~~<br>~~OO~~<br>~~OO~~<br>~~rms~~<br>~~Po~~<br>~~es~~<br>~~es GE~~<br>~~Po~~|||
|Lead Temperature for Soldering Purposes<br>(1/8″from case for 10 s)<br>TL<br>260<br>°C<br>~~Po~~|||



See detailed ordering, marking and shipping information on page 5 of this data sheet. 

Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 

## **THERMAL RESISTANCE MAXIMUM RATINGS** 

||~~es~~|~~es~~||
|---|---|---|---|
|**Parameter**<br>~~es~~|**Symbol**<br>~~es~~<br>~~es~~|**Value**<br>~~es~~<br>~~es~~|**Unit**<br>~~es~~|
|Junction−to−Case − Steady State|R JC<br>~~es ~~|0.83<br> ~~es~~|°C/W|
|Junction−to−Ambient − SteadyState(Note 2)|R JA|37.8||



1. The entire application environment impacts the thermal resistance values shown, they are not constants and are only valid for the particular conditions noted. 

2. Surface−mounted on FR4 board using a 650 mm[2] , 2 oz. Cu pad. 

3. Maximum current for pulses as long as 1 second is higher but is dependent on pulse duration and duty cycle. 

Publication Order Number: **NTMJS1D4N06CL/D** 

**1** 

© Semiconductor Components Industries, LLC, 2018 **September, 2023 − Rev. 1** 

## **NTMJS1D4N06CL** 

## **ELECTRICAL CHARACTERISTICS** (TJ = 25 ° C unless otherwise specified) 

|**ELECTRICAL CHARACTERISTICS**(TJ=|25°C unless|otherwise specified)|otherwise specified)|||||
|---|---|---|---|---|---|---|---|
|**Parameter**|**Symbol**|**Test Condition**||**Min**|**Typ**|**Max**|**Unit**|
|**OFF CHARACTERISTICS**||||||||
|Drain−to−Source Breakdown Voltage|V(BR)DSS|VGS= 0 V, ID=|250�A|60|||V|
|Drain−to−Source Breakdown Voltage<br>Temperature Coefficient|V(BR)DSS/<br>TJ||||25||mV/°C|
|Zero Gate Voltage Drain Current|IDSS|VGS= 0 V,<br>VDS= 60 V|TJ= 25°C|||10|�A|
||||TJ= 125°C|||250||
|Gate−to−Source Leakage Current|IGSS|VDS= 0 V, VGS= 20 V||||100|nA|
|**ON CHARACTERISTICS**(Note 4)||||||||
|Gate Threshold Voltage|VGS(TH)|VGS= VDS, ID= 280�A||1.2||2.0|V|
|Threshold Temperature Coefficient|VGS(TH)/TJ||||5.3||mV/°C|
|Drain−to−Source On Resistance|RDS(on)|VGS= 4.5 V|ID= 50 A||1.45|1.8|m�|
|||VGS= 10 V|ID= 50 A||1.07|1.3||
|Forward Transconductance|gFS|VDS=15 V, ID= 50 A|||244||S|
|**CHARGES, CAPACITANCES & GATE RESISTANCE**||||||||
|Input Capacitance|CISS|VGS= 0 V, f = 1 MHz, VDS= 30 V|||7430||pF|
|Output Capacitance|COSS||||3500|||
|Reverse Transfer Capacitance|CRSS||||57|||
|Total Gate Charge|QG(TOT)|VGS= 4.5 V, VDS= 48 V; ID= 50 A|||47||nC|
|Total Gate Charge|QG(TOT)|VGS= 10 V, VDS= 48 V; ID= 50 A|||103|||
|Threshold Gate Charge|QG(TH)|VGS= 4.5 V, VDS= 48 V; ID= 50 A|||10|||
|Gate−to−Source Charge|QGS||||17|||
|Gate−to−Drain Charge|QGD||||11|||
|Plateau Voltage|VGP||||2.6||V|
|**SWITCHING CHARACTERISTICS**(Note 5)||||||||
|Turn−On Delay Time|td(ON)|VGS= 4.5 V, VDS= 48 V,<br>ID= 50 A, RG= 2.5�|||29||ns|
|Rise Time|tr||||21|||
|Turn−Off Delay Time|td(OFF)||||52|||
|Fall Time|tf||||19|||
|**DRAIN−SOURCE DIODE CHARACTERISTICS**||||||||
|Forward Diode Voltage|VSD|VGS= 0 V,<br>IS= 50 A|TJ= 25°C||0.78|1.2|V|
||||TJ= 125°C||0.66|||
|Reverse Recovery Time|tRR|VGS= 0 V, dIs/dt = 100 A/�s,<br>IS= 50 A|||86||ns|
|Charge Time|ta||||58|||
|Discharge Time|tb||||28|||
|Reverse Recovery Charge|QRR||||175||nC|



Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. 4. Pulse Test: pulse width � 300 � s, duty cycle � 2%. 

5. Switching characteristics are independent of operating junction temperatures. 

**www.onsemi.com** 

**2** 

**NTMJS1D4N06CL** 

## **TYPICAL CHARACTERISTICS** 

**==> picture [242 x 157] intentionally omitted <==**

**----- Start of picture text -----**<br>
360<br>340 VGS = 10 V to 3.6 V<br>320<br>300 3.2 V<br>280<br>260<br>240<br>220<br>200<br>180<br>160<br>140 2.8 V<br>120<br>100<br>80<br>60 2.6 V<br>40<br>2.4 V<br>20<br>0<br>0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0<br>, DRAIN CURRENT (A)<br>ID<br>**----- End of picture text -----**<br>


VDS, DRAIN−TO−SOURCE VOLTAGE (V) 

**Figure 1. On−Region Characteristics** 

**==> picture [240 x 157] intentionally omitted <==**

**----- Start of picture text -----**<br>
360<br>340 V DS  = 10 V<br>320<br>300<br>280<br>260<br>240<br>220<br>200<br>180<br>160<br>140<br>120<br>10080 T J  = 25 ° C<br>60<br>4020 T J  = 125 ° C TJ = −55 ° C<br>0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0<br>, DRAIN CURRENT (A)<br>ID<br>**----- End of picture text -----**<br>


VGS, GATE−TO−SOURCE VOLTAGE (V) 

**Figure 2. Transfer Characteristics** 

**==> picture [492 x 401] intentionally omitted <==**

**----- Start of picture text -----**<br>
20 3.0<br>18 TJ = 25 ° C 2.8 T J = 25 ° C<br>ID = 50 A<br>2.6<br>16<br>2.4<br>14<br>2.2<br>12<br>2.0<br>10<br>1.8<br>8 1.6 VGS = 4.5 V<br>6<br>1.4<br>4 1.2 VGS = 10 V<br>2 1.0<br>0 0.8<br>2.0 3.0 4.0 5.0 6.0 7.0 8.0 9.0 10 20 60 100 140 180 220 260 300<br>VGS, GATE−TO−SOURCE VOLTAGE (V) ID, DRAIN CURRENT (A)<br>Figure 3. On−Resistance vs. Gate−to−Source Figure 4. On−Resistance vs. Drain Current and<br>Voltage Gate Voltage<br>2.1 1M<br>VGS = 10 V TJ = 175 ° C<br>1.9 ID = 50 A 100K TJ = 150 ° C<br>1.7<br>10K TJ = 125 ° C<br>1.5<br>1000<br>1.3 TJ = 85 ° C<br>100<br>1.1<br>TJ = 25 ° C<br>10<br>0.9<br>0.7 1<br>−50 −25 0 25 50 75 100 125 150 175 5 15 25 35 45 55 60<br>TJ, JUNCTION TEMPERATURE ( ° C) VDS, DRAIN−TO−SOURCE VOLTAGE (V)<br>) � ) �<br>, DRAIN−TO−SOURCE RESISTANCE (m , DRAIN−TO−SOURCE RESISTANCE (m<br>DS(on) DS(on)<br>R R<br>, LEAKAGE (nA)<br>, NORMALIZED DRAIN−TO− IDSS<br>SOURCE RESISTANCE<br>DS(on)<br>R<br>**----- End of picture text -----**<br>


**Figure 5. On−Resistance Variation with Temperature** 

**Figure 6. Drain−to−Source Leakage Current vs. Voltage** 

**www.onsemi.com** 

**3** 

**NTMJS1D4N06CL** 

## **TYPICAL CHARACTERISTICS** 

**==> picture [240 x 382] intentionally omitted <==**

**----- Start of picture text -----**<br>
10K<br>CISS<br>COSS<br>1K<br>100<br>VGS = 0 V CRSS<br>TJ = 25 ° C<br>f = 1 MHz<br>10<br>0 10 20 30 40 50 60<br>VDS, DRAIN−TO−SOURCE VOLTAGE (V)<br>Figure 7. Capacitance Variation<br>1000<br>td(off)<br>tr<br>tf<br>100<br>td(on)<br>10<br>VGS = 4.5 V<br>VDS = 48 V<br>ID = 50 A<br>1<br>0 10 20 30 40 50 60<br>RG, GATE RESISTANCE ( � )<br>C, CAPACITANCE (pF)<br>t, TIME (ns)<br>**----- End of picture text -----**<br>


**Figure 9. Resistive Switching Time Variation vs. Gate Resistance** 

**==> picture [245 x 173] intentionally omitted <==**

**----- Start of picture text -----**<br>
1000<br>100<br>10 10  � s<br>Single Pulse<br>TC = 25 ° C 0.5 ms<br>1 V GS ≤  10 V 1 ms<br>RDS(on) Limit 10 ms<br>Thermal Limit<br>Package Limit<br>0.1<br>0.1 1 10 100 1000<br>VDS, DRAIN−TO−SOURCE VOLTAGE (V)<br>, DRAIN CURRENT (A)<br>ID<br>**----- End of picture text -----**<br>


**Figure 11. Maximum Rated Forward Biased Safe Operating Area** 

**==> picture [233 x 173] intentionally omitted <==**

**----- Start of picture text -----**<br>
10<br>9<br>8<br>7<br>6<br>5<br>4 Q GS Q GD<br>3<br>2 VDS = 48 V<br>ID = 50 A<br>1 TJ = 25 ° C<br>0<br>0 10 20 30 40 50 60 70 80 90 100<br>QG, TOTAL GATE CHARGE (nC)<br>, GATE−TO−SOURCE VOLTAGE (V)<br>GS<br>V<br>**----- End of picture text -----**<br>


**Figure 8. Gate−to−Source Voltage vs. Total Charge** 

**==> picture [243 x 384] intentionally omitted <==**

**----- Start of picture text -----**<br>
1000<br>VGS = 0 V<br>100<br>10<br>1<br>0.1<br>TJ = 25 ° C<br>0.01 TJ = 125 ° C<br>TJ = −55 ° C<br>0.001<br>0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2<br>VSD, SOURCE−TO−DRAIN VOLTAGE (V)<br>Figure 10. Diode Forward Voltage vs. Current<br>1000<br>100<br>T J(initial)  = 25 ° C<br>10 TJ(initial) = 100 ° C<br>1<br>0.0001 0.001 0.01<br>TIME IN AVALANCHE (s)<br>, SOURCE CURRENT (A)<br>IS<br> (A)<br>IPEAK<br>**----- End of picture text -----**<br>


**Figure 12. IPEAK vs. Time in Avalanche** 

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**4** 

**NTMJS1D4N06CL** 

## **TYPICAL CHARACTERISTICS** 

**==> picture [493 x 388] intentionally omitted <==**

**----- Start of picture text -----**<br>
100<br>50% Duty Cycle<br>10 20%<br>10%<br>5%<br>1 2%<br>1%<br>0.1<br>0.01<br>0.001<br>Single Pulse TA = 25 ° C<br>0.0001<br>0.000001 0.00001 0.0001 0.001 0.01 0.1 1 10 100 1000<br>t, RECTANGULAR PULSE DURATION (s)<br>Figure 13. Thermal Response<br>1<br>50% Duty Cycle<br>20%<br>0.1<br>10%<br>5%<br>2%<br>0.01<br>1%<br>0.001<br>Single Pulse<br>TC = 25 ° C<br>0.0001<br>0.000001 0.00001 0.0001 0.001 0.01 0.1 1<br>t, RECTANGULAR PULSE DURATION (s)<br>C/W)<br>°<br>(t) TRANSIENT THERMAL IMPEDANCE (<br>JA<br>�<br>R<br>C/W)<br>°<br>(t) TRANSIENT THERMAL IMPEDANCE (<br>JC<br>�<br>R<br>**----- End of picture text -----**<br>


**Figure 14. Thermal Response** 

## **DEVICE ORDERING INFORMATION** 

|**Device**|**Marking**|**Package**|**Shipping**†|
|---|---|---|---|
|NTMJS1D4N06CLTWG|1D4N06CL|LFPAK8<br>(Pb−Free)|3000 / Tape & Reel|



†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. 

**www.onsemi.com** 

**5** 

MECHANICAL CASE OUTLINE **PACKAGE DIMENSIONS** 

## **LFPAK8 5x6** CASE 760AA ISSUE C 

## DATE 13 AUG 2019 

**GENERIC** XXXXXX = Specific Device Code **MARKING DIAGRAM*** A = Assembly Location WL = Wafer Lot Y = Year XXXXXX W = Work Week XXXXXX AWLYW *This information is generic. Please refer to device data sheet for actual part o marking. Some products may not follow the Generic Marking. 

## **DOCUMENT NUMBER:** 

**DESCRIPTION:** 

## **98AON82475G** 

**LFPAK8 5x6** 

Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed  versions are uncontrolled  except when stamped  “CONTROLLED COPY” in red. 

**PAGE 1 OF 1** 

ON Semiconductor and          are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the rights of others. 

www.onsemi.com 

© Semiconductor Components Industries, LLC, 2018 

**onsemi** , , and other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “ **onsemi** ” or its affiliates and/or subsidiaries in the United States and/or other countries. **onsemi** owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of **onsemi** ’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. **onsemi** reserves the right to make changes at any time to any products or information herein, without notice. The information herein is provided “as−is” and **onsemi** makes no warranty, representation or guarantee regarding the accuracy of the information, product features, availability, functionality, or suitability of its products for any particular purpose, nor does **onsemi** assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using **onsemi** products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by **onsemi** . “Typical” parameters which may be provided in **onsemi** data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. **onsemi** does not convey any license under any of its intellectual property rights nor the rights of others. **onsemi** products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use **onsemi** products for any such unintended or unauthorized application, Buyer shall indemnify and hold **onsemi** and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that **onsemi** was negligent regarding the design or manufacture of the part. **onsemi** is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. 

## **ADDITIONAL INFORMATION** 

**TECHNICAL PUBLICATIONS** : **ONLINE SUPPORT** : www.onsemi.com/support **Technical Library:** www.onsemi.com/design/resources/technical−documentation **For additional information, please contact your local Sales Representative at onsemi Website:** www.onsemi.com www.onsemi.com/support/sales 

**==> picture [232 x 43] intentionally omitted <==**

 



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