# Power MOSFET, N Channel, 40 V, 313 A, 650 µohm, PQFN, Surface Mount

![Product image](https://novapart.co/image/farnell:3265480RL/)

**URL**: https://novapart.co/products/NTMFSC0D9N04CL/power-mosfet-n-channel-40-v-313-a-650-ohm-pqfn
**SKU**: NTMFSC0D9N04CL
**Manufacturer**: ONSEMI
**Category**: Semiconductors - Discretes || FETs || Single MOSFETs
**Price**: €0.5910
**Stock**: 50+
**Lead Time**: 2 days (indicative)

## Specifications

| Parameter | Value |
|---|---|
| Msl | MSL 1 - Unlimited |
| Svhc | Lead (25-Jun-2025) |
| No. Of Pins | 8Pins |
| Channel Type | N Channel |
| Product Range | DUAL COOL |
| Qualification | - |
| Power Dissipation | 167W |
| Transistor Mounting | Surface Mount |
| Transistor Polarity | N Channel |
| Power Dissipation Pd | 167W |
| Rds(On) Test Voltage | 10V |
| On Resistance Rds(On) | 650µohm |
| Transistor Case Style | PQFN |
| Drain Source Voltage Vds | 40V |
| Operating Temperature Max | 150°C |
| Continuous Drain Current Id | 313A |
| Drain Source On State Resistance | 650µohm |
| Automotive Qualification Standard | - |
| Gate Source Threshold Voltage Max | 2V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:3265480RL/)

# **DATA SHEET www.onsemi.com** 

# MOSFET - Power, Single N-Channel, DUAL COOL , DFN8 5x6 40 V, 0.85 m 313 A 

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VSSS RSS(ON) MAX ID MAX<br>0.85 m  @ 10 V<br>40 V 313 A<br>1.3 m  @ 4.5 V<br>**----- End of picture text -----**<br>


# NTMFSC0D9N04CL 

## **Features** 

- Advanced Dual−Sided Cooled Packaging 

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DFN8 5x6<br>CASE 506EG<br>**----- End of picture text -----**<br>


- Ultra Low RDS(on) to Minimize Conduction Losses 

- MSL1 Robust Packaging Design 

- These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS Compliant 

## **MARKING DIAGRAM** 

## **Typical Applications** 

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3KAYWZ<br>• Orring FET/Load Switching ÉÉÉÉ<br>• Synchronous Rectifier<br>ÉÉÉÉ<br>• DC−DC Conversion ÉÉÉÉ<br>MAXIMUM RATINGS  (TJ = 25 ° C, Unless otherwise specified) ÉÉÉÉ<br>Parameter Symbol Value Unit 3K = Specific Device Code<br>A = Assembly Location<br>Drain−to−Source Voltage VDSS 40 V Y = Year<br>Gate−to−Source Voltage VGS ± 20 V W = Work Week<br>Z = Assembly Lot Code<br>**----- End of picture text -----**<br>


|**MAXIMUM RATINGS**(TJ = 25J = 25= 25°C, Unless otherwise specified)|**MAXIMUM RATINGS**(TJ = 25J = 25= 25°C, Unless otherwise specified)|**MAXIMUM RATINGS**(TJ = 25J = 25= 25°C, Unless otherwise specified)|C, Unless otherwise specified)|C, Unless otherwise specified)||
|---|---|---|---|---|---|
|**Parameter**|||**Symbol**|**Value**|**Unit**|
|Drain−to−Source Voltage|||VDSSDSS|40|V|
|Gate−to−Source Voltage|||VGSGS|±20|V|
|Continuous Drain<br>Current R JC<br>(Note 2)|Steady<br>State|TC= 25°C|ID|313|A|
|Power Dissipation<br>R JC(Note 2)|||PD|167|W|
|Continuous Drain<br>Current R JA<br>(Note 1, 2)|Steady<br>State|TA= 25°C|ID|49.5|A|
|Power Dissipation<br>R JA(Note 1, 2)|||PD|3.8|W|
|Pulsed Drain Current|TA= 25°C, tp= 10 s||IDM|900|A|
|Operating Junction and Storage Temperature<br>Range|||TJ, Tstg|−55 to<br>+175|°C|
|Source Current (Body Diode)|||IS|169|A|
|Single Pulse Drain−to−Source Avalanche<br>Energy (IL(pk)= 29 A)|||EAS|706|mJ|
|Lead Temperature Soldering Reflow for Sol-<br>dering Purposes (1/8″from case for 10 s)|||TL|300|°C|



## **N−Channel MOSFET** 

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S 1 8 D<br>S 2 7 D<br>S 3 6 D<br>G 4 5 D<br>**----- End of picture text -----**<br>


## **ORDERING INFORMATION** 

See detailed ordering and shipping information on page 5 of this data sheet. 

Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 

1. Surface−mounted on FR4 board using 1 in[2] pad size, 1 oz Cu pad. 

2. The entire application environment impacts the thermal resistance values shown, they are not constants and are only valid for the particular conditions noted. 

# © Semiconductor Components Industries, LLC, 2018 **1 February, 2023 − Rev. 7** 

# Publication Order Number: **NTMFSC0D9N04CL/D** 

**NTMFSC0D9N04CL** 

## **THERMAL CHARACTERISTICS** 

|**Symbol**|**Parameter**|**Max**|**Unit**|
|---|---|---|---|
|R�JC|Junction−to−Case (Bottom) – Steady State (Note 3)|0.9|°C/W|
|R�JC|Junction−to−Case (Top) – Steady State (Note 3)|1.4||
|R�JA|Junction−to−Ambient – Steady State (Note 3)|39||



3. The entire application environment impacts the thermal resistance values shown, they are not constants and are only valid for the particular conditions noted. 

## **ELECTRICAL CHARACTERISTICS** (TJ = 25 ° C unless otherwise noted) 

|**ELECTRICAL CHARACTERISTICS**|(TJ= 25°C un|less otherwise noted)|less otherwise noted)|||||
|---|---|---|---|---|---|---|---|
|**Parameter**|**Symbol**|**Test Conditions**||**Min**|**Typ**|**Max**|**Unit**|
|**OFF CHARACTERISTICS**||||||||
|Drain�to�Source Breakdown Voltage|V(BR)DSS|VGS= 0 V, ID= 250�A||40|||V|
|Drain�to�Source Breakdown Voltage<br>Temperature Coefficient|V(BR)DSS/ TJ|ID= 250�A, ref to 25°C|||21.2||mV/°C|
|Zero Gate Voltage Drain Current|IDSS|VGS  = 0 V,VDS= 40 V|TJ= 25°C|||10|�A|
||||TJ= 125°C|||100||
|Gate�to�Source Leakage Current|IGSS|VDS= 0 V, VGS=|20 V|||100|nA|
|**ON CHARACTERISTICS**(Note 4)||||||||
|Gate Threshold Voltage|VGS(TH)|VGS= VDS, ID= 250�A||1.2||2.0|V|
|Negative Threshold Temperature<br>Coefficient|VGS(TH) / TJ|ID= 250�A, ref to 25°C|||−5.8||mV/°C|
|Drain�to�Source On Resistance|RDS(on)|VGS= 10 V, ID= 50 A|||0.65|0.85|m�|
|||VGS= 4.5 V, ID= 50 A|||1|1.3||
|Gate−Resistance|RG|TA= 25°C|||1.8||�|
|**CHARGES & CAPACITANCES**||||||||
|Input Capacitance|CISS|VGS= 0 V, f = 1 MHz,|VDS= 20 V||8500||pF|
|Output Capacitance|COSS||||3400|||
|Reverse Transfer Capacitance|CRSS||||110|||
|Total Gate Charge|QG(TOT)|VGS= 4.5 V, VDS= 20|V, ID= 50 A||61||nC|
|Total Gate Charge|QG(TOT)|VGS= 10 V, VDS= 20|V, ID= 50 A||143|||
|Gate−to−Source Charge|QGS||||27|||
|Gate−to−Drain Charge|QGD||||19|||
|Plateau Voltage|VGP||||2.7||V|
|**SWITCHING CHARACTERISTICS**(Note 4)||||||||
|Turn�On Delay Time|td(ON)|VGS= 4.5 V, VDS <br>ID= 50 A, RG=|= 32 V,<br>2.5�||20.2||ns|
|Rise Time|tr||||94.6|||
|Turn�Off Delay Time|td(OFF)||||77.8|||
|Fall Time|tf||||111|||
|**DRAIN−SOURCE DIODE CHARACTERISTICS**||||||||
|Forward Diode Voltage|VSD|VGS= 0 V, IS= 50 A|TJ= 25°C||0.75|1.2|V|
||||TJ= 125°C||0.6|||
|Reverse Recovery Time|tRR|VGS= 0 V, dIS/dt = 100 A/�s,<br>IS= 50 A|||92||ns|
|Reverse Recovery Charge|QRR||||170||nC|



Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. 4. Switching characteristics are independent of operating junction temperatures. 

**www.onsemi.com** 

**2** 

**NTMFSC0D9N04CL** 

## **TYPICAL CHARACTERISTICS** 

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200 180<br>10 V to 3.2 V<br>180 3.0 V 160<br>160<br>140<br>140<br>120<br>120 2.8 V<br>100<br>100<br>80<br>80 TJ = 25 ° C<br>60<br>60<br>40 40<br>20 20 TJ = 125 ° C<br>0 0 TJ = −55 ° C<br>0 0.5 1.0 1.5 2.0 2.5 3.0 0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0<br>VDS, DRAIN−TO−SOURCE VOLTAGE (V) VGS, GATE−TO−SOURCE VOLTAGE (V)<br>Figure 1. On−Region Characteristics Figure 2. Transfer Characteristics<br>0.0013 0.0012<br>0.0012 0.0011 TJ = 25 ° C<br>VGS = 4.5 V<br>0.0011 T J = 25 ° C 0.0010<br>ID = 50 A<br>0.0009<br>0.0010<br>0.0008<br>0.0009<br>0.0007 VGS = 10 V<br>0.0008<br>0.0006<br>0.0007<br>0.0005<br>0.0006 0.0004<br>3 4 5 6 7 8 9 10 10 20 30 40 50 60<br>VGS, GATE VOLTAGE (V) ID, DRAIN CURRENT (A)<br>Figure 3. On−Resistance vs. Gate−to−Source Figure 4. On−Resistance vs. Drain Current and<br>Voltage Gate Voltage<br>1.9 1M<br>V GS  = 10 V<br>1.7 ID = 40 A 100k TJ = 150 ° C<br>1.5 TJ = 125 ° C<br>10k<br>1.3 TJ = 85 ° C<br>1k<br>1.1<br>100<br>0.9<br>0.7 10<br>−50 −25 0 25 50 75 100 125 150 175 5 10 15 20 25 30 35 40<br>TJ, JUNCTION TEMPERATURE ( ° C) VDS, DRAIN−TO−SOURCE VOLTAGE (V)<br>, DRAIN CURRENT (A) , DRAIN CURRENT (A)<br>ID ID<br>)<br>) �<br>� , DRAIN−TO−SOURCE RESISTANCE (<br>, DRAIN−TO−SOURCE RESISTANCE (<br>DS(on)<br>DS(on) R<br>R<br>, LEAKAGE (nA)<br>, NORMALIZED DRAIN−TO− IDSS<br>SOURCE RESISTANCE<br>DS(on)<br>R<br>**----- End of picture text -----**<br>


**Figure 5. On−Resistance Variation with Temperature** 

**Figure 6. Drain−to−Source Leakage Current vs. Voltage** 

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**3** 

**NTMFSC0D9N04CL** 

## **TYPICAL CHARACTERISTICS** 

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11k 10 30<br>QT<br>10k<br>9k C ISS 8 25<br>8k<br>7k C OSS V GS = 0 V 6 20<br>6k TJ = 25 ° C<br>f = 1 MHz 15<br>5k<br>4k 4 QGS Q GD<br>V DS  = 20 V 10<br>3k TJ = 25 ° C<br>2k 2 I D  = 50 A 5<br>1k C RSS<br>0 0 0<br>0 5 10 15 20 25 30 35 40 0 20 40 60 80 100 120 140<br>VDS, DRAIN−TO−SOURCE VOLTAGE (V) QG, TOTAL GATE CHARGE (nC)<br>Figure 7. Capacitance Variation Figure 8. Gate−to−Source and<br>Drain−to−Source Voltage vs. Total Charge<br>10,00<br>td(off) 46<br>tf<br>t r 41<br>td(on) 36<br>100<br>31<br>26 T J  = 125 ° C<br>21<br>10<br>16<br>V V GSDD = 4.5 V  = 20 V 11 TJ = 150 ° C<br>ID = 50 A 6 TJ = 25 ° C TJ = −55 ° C<br>1 1<br>1 10 100 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0<br>RG, GATE RESISTANCE ( � ) VSD, SOURCE−TO−DRAIN VOLTAGE (V)<br>Figure 9. Resistive Switching Time Variation Figure 10. Diode Forward Voltage vs. Current<br>vs. Gate Resistance<br>1000 1000<br>100<br>100<br>10  � s TJ(initial) = 25 ° C<br>10 TC = 25 ° C<br>Single Pulse 0.5 ms TJ(initial) = 100 ° C<br>VGS ≤  10 V 1 ms 10<br>10 ms<br>1<br>RDS(on) Limit<br>Thermal Limit<br>Package Limit<br>0.1 1<br>0.1 1 10 100 1000 1E−04 1E−03 1E−02<br>VDS, DRAIN−TO−SOURCE VOLTAGE(V) TIME IN AVALANCHE (s)<br>C, CAPACITANCE (pF)<br>, GATE−TO−SOURCE VOLTAGE (V) , DRAIN−TO−SOURCE VOLTAGE (V)<br>GS DS<br>V V<br>t, TIME (ns)<br>, SOURCE CURRENT (A)<br>IS<br> (A)<br>IPEAK<br>, DRAIN CURRENT(A)<br>ID<br>**----- End of picture text -----**<br>


**Figure 11. Safe Operating Area** 

**Figure 12. IPEAK vs. Time in Avalanche** 

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**4** 

**NTMFSC0D9N04CL** 

## **TYPICAL CHARACTERISTICS** 

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100<br>50% Duty Cycle<br>10 20%<br>10%<br>5%<br>1 2%<br>1%<br>0.1<br>0.01<br>0.001<br>Single Pulse<br>0.0001<br>0.0000001 0.000001 0.00001 0.0001 0.001 0.01 0.1 1 10 100 1000<br>PULSE TIME (sec)<br>C/W)<br>°<br>R(t) (<br>**----- End of picture text -----**<br>


� **Figure 13. Thermal Characteristics − R � JA(t) ( C/W)** 

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10<br>1<br>50% Duty Cycle<br>20%<br>10%<br>0.1<br>5%<br>2%<br>0.01 1%<br>Single Pulse TC = 25 ° C<br>0.001<br>0.000001 0.00001 0.0001 0.001 0.01 0.1 1<br>PULSE TIME (sec)<br>C/W)<br>°<br>(t) (<br>JC<br>�<br>R<br>**----- End of picture text -----**<br>


� **Figure 14. Thermal Characteristics − R � JC(t) ( C/W)** 

## **ORDERING INFORMATION** 

|**ORDERING INFORMATION**||||
|---|---|---|---|
|**Device**|**Device Marking**|**Package**|**Shipping**†|
|NTMFSC0D9N04CL|3K|DFN8 5x6<br>(Pb−Free/Halogen Free)|3000 / Tape & Reel|



†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. 

DUAL COOL is a registered trademark of Semiconductor Components Industries, LLC (SCILLC) or its subsidiaries in the United States and/or other countries. 

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**5** 

# MECHANICAL CASE OUTLINE **PACKAGE DIMENSIONS** 

# **DFN8 5x6.15, 1.27P, DUAL COOL** CASE 506EG ISSUE D 

DATE 25 AUG 2020 

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GENERIC PLEASE DOWNLOAD THE ON SEMICONDUCTOR<br>SOLDERING AND MOUNTING TECHNIQUES<br>MARKING DIAGRAM* REFERENCE MANUAL, SOLDERRM/D .<br>AYWWZZ<br>XXXXXX<br>XXXX = Specific Device Code<br>ÉÉÉ *This information is generic. Please refer to<br>A = Assembly Location device data sheet for actual part marking.<br>ÉÉÉ Y = Year Pb−Free indicator, “G” or microdot “ ”, may<br>WW = Work Week or may not be present. Some products may<br>ÉÉÉ<br>ÉÉÉ ZZ = Assembly Lot Code not follow the Generic Marking.<br>Electronic versions are uncontrolled except when accessed directly from the Document Repository.<br>DOCUMENT NUMBER: 98AON84257G Printed  versions are uncontrolled  except when stamped  “CONTROLLED COPY” in red.<br>DESCRIPTION: DFN8 5x6.15, 1.27P, DUAL COOL PAGE 1 OF 1<br>**----- End of picture text -----**<br>


**onsemi** and                     are trademarks of Semiconductor Components Industries, LLC dba **onsemi** or its subsidiaries in the United States and/or other countries. **onsemi** reserves the right to make changes without further notice to any products herein. **onsemi** makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does **onsemi** assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. **onsemi** does not convey any license under its patent rights nor the rights of others. 

# © Semiconductor Components Industries, LLC, 2018 www.onsemi.com 

**onsemi** , , and other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “ **onsemi** ” or its affiliates and/or subsidiaries in the United States and/or other countries. **onsemi** owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of **onsemi** ’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. **onsemi** reserves the right to make changes at any time to any products or information herein, without notice. The information herein is provided “as−is” and **onsemi** makes no warranty, representation or guarantee regarding the accuracy of the information, product features, availability, functionality, or suitability of its products for any particular purpose, nor does **onsemi** assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using **onsemi** products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by **onsemi** . “Typical” parameters which may be provided in **onsemi** data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. **onsemi** does not convey any license under any of its intellectual property rights nor the rights of others. **onsemi** products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use **onsemi** products for any such unintended or unauthorized application, Buyer shall indemnify and hold **onsemi** and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that **onsemi** was negligent regarding the design or manufacture of the part. **onsemi** is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. 

## **ADDITIONAL INFORMATION** 

**TECHNICAL PUBLICATIONS** : **ONLINE SUPPORT** : www.onsemi.com/support **Technical Library:** www.onsemi.com/design/resources/technical−documentation **For additional information, please contact your local Sales Representative at onsemi Website:** www.onsemi.com www.onsemi.com/support/sales 

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