# Power MOSFET, N Channel, 40 V, 61 A, 7600 µohm, DFN, Surface Mount

![Product image](https://novapart.co/image/farnell:3766213/)

**URL**: https://novapart.co/products/NTMFSC010N08M7/power-mosfet-n-channel-40-v-61-a-7600-ohm-dfn
**SKU**: NTMFSC010N08M7
**Manufacturer**: ONSEMI
**Category**: Semiconductors - Discretes || FETs || Single MOSFETs
**Price**: €0.5540
**Stock**: 1000+
**Lead Time**: 2 days (indicative)

## Specifications

| Parameter | Value |
|---|---|
| Msl | MSL 1 - Unlimited |
| Svhc | Lead (25-Jun-2025) |
| No. Of Pins | 8Pins |
| Channel Type | N Channel |
| Product Range | - |
| Qualification | - |
| Power Dissipation | 78.1W |
| Transistor Mounting | Surface Mount |
| Rds(On) Test Voltage | 10V |
| Transistor Case Style | DFN |
| Drain Source Voltage Vds | 40V |
| Operating Temperature Max | 150°C |
| Continuous Drain Current Id | 61A |
| Drain Source On State Resistance | 7600µohm |
| Gate Source Threshold Voltage Max | 3.3V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:3766213/)

MOSFET - Power, Single N-Channel 

## 80 V, 10 m 61 A 

## NTMFSC010N08M7 

## **Features** 

- DUAL COOL Top Side Cooling PQFN Package 

**www.onsemi.com** 

- Max rDS(on) = 10 m Q at VGS = 10 V, ID = 10 A 

- High Performance Technology for Extremely Low rDS(on) 

- 100% UIL Tested 

- These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS Compliant 

**MAXIMUM RATINGS** (TJ = 25 ° C unless otherwise noted) 

||||~~es~~|~~ee~~||
|---|---|---|---|---|---|
|**Parameter**<br>~~es~~|||**Symbol**<br>~~es~~<br>~~es~~<br>~~es~~|**Value**<br>~~es~~<br>~~ee~~<br>~~es~~|**Unit**<br>~~es~~|
|Drain−to−Source Voltage<br>~~es~~|||VDSS<br>~~es~~<br>~~es~~<br>~~es~~|40<br>~~ee~~<br>~~es~~<br>~~es~~|V<br>~~es~~|
|Gate−to−Source Voltage<br>~~es~~<br>~~es~~<br>~~aee~~|||VGS<br>~~es~~<br>~~es~~<br>~~es~~<br>es<br>~~ee~~|±20<br>~~es~~<br>~~es~~<br>~~es~~<br>~~es~~<br>~~ee~~|V<br>~~es~~<br>~~es~~<br>~~ee~~|
|Continuous Drain<br>Current R JC<br>(Notes 1, 3)<br>~~a ~~<br>~~a~~|Steady<br>State<br> <br>~~ee~~|TC= 25°C<br>~~ee~~|ID<br>es <br>~~ee~~<br>~~ee~~|61<br>~~es~~<br>~~ee~~|A<br>~~ee~~<br>~~ee~~|
|||TC= 100°C<br> ~~ee~~<br>~~|~~<br>~~ee~~||38.6<br> ~~es~~<br>~~ee~~<br>~~||~~<br>~~ee~~||
|Power Dissipation<br>R JC(Note 1)<br> <br>~~a~~||TC= 25°C<br> ~~ee ~~<br>~~ee~~|PD<br> ~~ee~~<br>~~ee~~<br>~~||~~|78.1<br>~~ee~~<br>~~ee~~|W<br>~~ee~~<br>~~ee~~|
|||TC= 100°C<br>~~ee~~<br>~~|~~<br>~~|~~||31.2<br>~~ee~~<br>~~Pe~~<br>~~||~~||
|Continuous Drain<br>Current R JA<br>(Notes 1, 2, 3)<br>~~a ~~|Steady<br>State<br> ~~ee ~~|TA= 25°C<br> ~~ee~~<br>~~|~~<br>~~|~~|ID<br>~~ee~~<br>~~||~~<br>~~||~~|12.5<br>~~ee~~<br>~~||~~<br>~~||~~|A<br>~~ee~~|
|||TA= 100°C<br>~~|~~<br>~~|~~||7.9<br>~~||~~<br>~~||~~||
|Power Dissipation<br>R JA(Notes 1, 2)<br>~~ee~~||TA= 25°C<br>~~|~~|PD<br>~~||~~|3.3<br>~~||~~|W|
|||TA= 100°C||1.3||
|Pulsed Drain Current<br>~~ee~~|TA= 25°C, tp= 10 s||IDM|180|A|
|Operating Junction and Storage Temperature<br>Range<br>~~ee~~|||TJ, Tstg<br>~~ee~~|−55 to<br>+150<br>~~es~~|°C|
|Source Current (Body Diode)<br>~~es~~|||IS<br>~~es~~<br>~~ee~~|61<br>~~es~~<br>~~es~~|A<br>~~es~~|
|Single Pulse Drain−to−Source Avalanche<br>Energy (IL(pk)= 3.9 A)|||EAS<br>~~ee~~|640<br>~~es~~|mJ|
|Lead Temperature for Soldering Purposes<br>(1/8″from case for 10 s)|||TL|260|°C|



**V(BR)DSS RDS(ON) MAX ID MAX** 80 V 10 m @ 10 V 61 A ~~_a~~ 

## **N−Channel MOSFET** 

**==> picture [100 x 208] intentionally omitted <==**

**----- Start of picture text -----**<br>
D (5−8)<br>G (1)<br>S (2−4)<br>ep DFN8 5x6 Ss<br>(Dual Cool 56)<br>CASE 506EG<br>**----- End of picture text -----**<br>


## **MARKING DIAGRAM** 

Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 

1. The entire application environment impacts the thermal resistance values shown, they are not constants and are only valid for the particular conditions noted. 

2. Surface−mounted on FR4 board using a 1 in[2] pad size, 1 oz Cu pad. 

3. Maximum current for pulses as long as 1 second is higher but is dependent on pulse duration and duty cycle. 

XXXXXX = Specific Device Code A = Assembly Location Y = Year W = Work Week ZZ = Lot Traceability 

## **ORDERING INFORMATION** 

|**Device**|**Package**|**Shipping**|
|---|---|---|
|NTMFSC010N08M7|POWER 56 DC<br>(Pb−Free)|3000 / Tape<br>& Reel|



Publication Order Number: **NTMFSC010N08M7/D** 

**1** 

© Semiconductor Components Industries, LLC, 2021 **January, 2021 − Rev. P0** 

## **NTMFSC010N08M7** 

**ELECTRICAL CHARACTERISTICS** (TJ = 25[°] C unless otherwise noted) 

|**ELECTRICAL CHARACTERISTICS **|(TJ= 25°C unless|otherwise noted)|otherwise noted)|||||
|---|---|---|---|---|---|---|---|
|**Parameter**|**Symbol**|**Test Condition**||**Min**|**Typ**|**Max**|**Unit**|
|**OFF CHARACTERISTICS**||||||||
|Drain to Source Breakdown Voltage|V(BR)DSS|VGS= 0 V, ID= 250�A||80|||V|
|Drain−to−Source Breakdown Voltage<br>Temperature Coefficient|V(BR)DSS/TJ||||49||mV/°C|
|Zero Gate Voltage Drain Current|IDSS|VGS= 0 V, VDS= 80 V|TJ= 25°C|||1|�A|
|Zero Gate Voltage Drain Current|IGSS|VDS= 0 V, VGS=±20 V||||±100|nA|
|**ON CHARACTERISTICS**(Note 4)||||||||
|Gate Threshold Voltage|VGS(TH)|VGS= VDS,ID= 120�A||2.5|3.3|4.5|V|
|Threshold Temperature Coefficient|VGS(TH)/TJ||||−9||mV/°C|
|Drain−to−Source On Resistance|RDS(on)|VGS= 10 V|ID= 10 A||7.6|10|m�|
|Forward Transconductance|gFS|VDS= 5 V|ID= 10 A||21.5|40|S|
|**CHARGES, CAPACITANCES & GATE RESISTANCE**||||||||
|Input Capacitance|Ciss|VGS= 0 V, f = 1 MHz|VDS= 0 V||2373||pF|
||Ciss||VDS= 40 V||2080|2700||
|Output Capacitance|Coss||||286|430||
|Reverse Transfer Capacitance|Crss||||11|17||
|Diode Capacitance|Cdiode||||275|||
|Gate Resistance|Rg|VGS= 0.5 V, f = 1MHz|||0.6|4|�|
|Gate Charge (1V)|QG(1V)|VGS= 0 to 1 V|VDS= 40 V;<br>ID= 10 A||2.1||nC|
|Threshold Gate Charge|Qg(th)|VGS= 0 to 2 V|||4.3|||
|Gate Charge (3V)|QG(3V)|VGS= 0 to 3 V|||6.4|||
|Gate Charge (4V)|QG(4V)|VGS= 0 to 4 V|||8.6|||
|Gate Charge (5V)|QG(5V)|VGS= 0 to 5 V|||9.6|||
|Gate Charge (6V)|QG(6V)|VGS= 0 to 6 V|||18.7|||
|Gate Charge (7V)|QG(7V)|VGS= 0 to 7 V|||21.3|||
|Gate Charge (8V)|QG(8V)|VGS= 0 to 8 V|||24|||
|Gate Charge (9V)|QG(9V)|VGS= 0 to 9 V|||26.6|||
|Total Gate Charge|QG(TOT)|VGS= 0 to 10 V|||29.3|38||
|Gate to Source Gate Charge|Qgs|VDS= 40 V,ID= 10 A|||11.8|||
|Gate to Drain “Miller” Charge|Qgd||||4.3|||
|Switching Charge|Qsw||||13.1|||
|Plateau Voltage|VGP||||5.5||V|
|Output Charge|Qoss|VDS= 40 V,VGS= 0 V|||26||nC|
|**SWITCHING CHARACTERISTICS**(Note 5)||||||||
|Turn−On Delay Time|td(ON)|VDD= 40 V, ID= 10 A,<br>VGS= 10 V, RGEN= 6�|||14||ns|
|Turn−On Rise Time|tr||||6||ns|
|Turn−Off Delay Time|td(OFF)||||27||ns|
|Turn−Off Fall Time|tf||||6||ns|
|**DRAIN – SOURCE DIODE CHARACTERISTICS**||||||||
|Source to Drain Diode Voltage|VSD|ISD= 10 A, VGS= 0 V|||0.82|1.2|V|



4. Pulse Test: pulse width ≤ 300 � s, duty cycle ≤ 2%. 

5. Switching characteristics are independent of operating junction temperatures. 

**www.onsemi.com** 

**2** 

**NTMFSC010N08M7** 

**ELECTRICAL CHARACTERISTICS** (TJ = 25[°] C unless otherwise noted) 

|Reverse Recovery Time|TRR|VGS= 0 V, dISD/dt = 100 A/ s,<br>IS= 10 A||41|50|ns|
|---|---|---|---|---|---|---|
|Charge Time|ta|||24.6|||
|Discharge Time|tb|||16.1|||
|Reverse Recovery Charge|QRR|||45|58|nC|



4. Pulse Test: pulse width ≤ 300 s, duty cycle ≤ 2%. 

5. Switching characteristics are independent of operating junction temperatures. 

Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. 

## **THERMAL CHARACTERISTICS** 

|**Symbol**|**Symbol**||**Parameter**|**Parameter**|**Parameter**|**Parameter**||**Value**|**Unit**|
|---|---|---|---|---|---|---|---|---|---|
|RθJC|||Thermal Resistance, Junction to Case||||(Top Source)|1.6||
|RθJC|||Thermal Resistance, Junction to Case||||(Bottom Drain)|3.0||
|RθJA|||Thermal Resistance, Junction to Ambient||||(Note 1a)|38||
|RθJA|||Thermal Resistance, Junction to Ambient||||(Note 1b)|81||
|RθJA|||Thermal Resistance, Junction to Ambient||||(Note 1c)|27||
|RθJA|||Thermal Resistance, Junction to Ambient||||(Note 1d)|34||
|RθJA|||Thermal Resistance, Junction to Ambient||||(Note 1e)|16||
||||||||||°C/W|
|RθJA|||Thermal Resistance, Junction to Ambient||||(Note 1f)|19||
|RθJA|||Thermal Resistance, Junction to Ambient||||(Note 1g)|26||
|RθJA|||Thermal Resistance, Junction to Ambient||||(Note 1h)|61||
|RθJA|||Thermal Resistance, Junction to Ambient||||(Note 1i)|16||
|RθJA|||Thermal Resistance, Junction to Ambient||||(Note 1j)|23||
|RθJA|||Thermal Resistance, Junction to Ambient||||(Note 1k)|11||
|RθJA|||Thermal Resistance, Junction to Ambient||||(Note 1l)|13||
|RθJAis determined with the device mounted on a FR−4 board using a specified pad of 2 oz copper as shown below. R||||||||is determined with the device mounted on a FR−4 board using a specified pad of 2 oz copper as shown below. RθJAis guaranteed by|is guaranteed by|
|design while R_CAis determined by the user’s board design.||||||||||
||||a) 38°C/W when mounted on||||b) 81°C/W when mounted on|||
||||a 1 in2pad of 2 oz copper.||||a minimum pad of 2 oz copper.|||
|DS<br>DF<br>G|SF|SS|G|DF|DS|SF|SS|||



6. R θ JA is determined with the device mounted on a FR−4 board using a specified pad of 2 oz copper as shown below. R θ JA is guaranteed by design while R _ CA is determined by the user’s board design. 

- c) Still air, 20.9 ⋅ 10.4 ⋅ 12.7 mm Aluminum Heat Sink, 1 in2 pad of 2 oz copper 

- d) Still air, 20.9 ⋅ 10.4 ⋅ 12.7 mm Aluminum Heat Sink, minimum pad of 2 oz copper 

- e) Still air, 45.2 ⋅ 41.4 ⋅ 11.7 mm Aavid Thermalloy Part # 10−L41B−11 Heat Sink, 1 in2 pad of 2 oz copper 

- f) Still air, 45.2 ⋅ 41.4 ⋅ 11.7 mm Aavid Thermalloy Part # 10−L41B−11 Heat Sink, minimum pad of 2 oz copper 

- g) .200FPM Airflow, No Heat Sink, 1 in2 pad of 2 oz copper 

- h) .200FPM Airflow, No Heat Sink, minimum pad of 2 oz copper 

- i) .200FPM Airflow, 20.9 ⋅ 10.4 ⋅ 12.7 mm Aluminum Heat Sink, 1 in2 pad of 2 oz copper 

- j) .200FPM Airflow, 20.9 ⋅ 10.4 ⋅ 12.7 mm Aluminum Heat Sink, minimum pad of 2 oz copper 

- k) .200FPM Airflow, 45.2 ⋅ 41.4 ⋅ 11.7 mm Aavid Thermalloy Part # 10 L41B 11 Heat Sink, 1 in2 pad of 2 oz copper l) .200FPM Airflow, 45.2 ⋅ 41.4 ⋅ 11.7 mm Aavid Thermalloy Part # 10 L41B 11 Heat Sink, minimum pad of 2 oz copper 

7. Pulse Test: Pulse Width < 300 _ s, Duty cycle < 2.0%. 

**www.onsemi.com** 

**3** 

**NTMFSC010N08M7** 

## **TYPICAL CHARACTERISTICS** 

**==> picture [490 x 174] intentionally omitted <==**

**----- Start of picture text -----**<br>
150 150<br>VGS = 10 V 9 V VDS = 5 V<br>8 V<br>120 120<br>90 90<br>7 V<br>60 60<br>6 V TJ = 25 ° C<br>30 30<br>0 5 V 0 TJ = 150 ° C TJ = −55 ° C<br>0 0.5 1.0 1.5 2.0 2.5 3.0 2 4 6 8 10<br>VDS, DRAIN−TO−SOURCE VOLTAGE (V) VGS, GATE−TO−SOURCE VOLTAGE (V)<br>, DRAIN CURRENT (A) , DRAIN CURRENT (A)<br>ID ID<br>**----- End of picture text -----**<br>


**Figure 1. On−Region Characteristics** 

**Figure 2. Transfer Characteristics** 

**==> picture [490 x 392] intentionally omitted <==**

**----- Start of picture text -----**<br>
18 9.0<br>TJ = 25 ° C TJ = 25 ° C<br>16 ID = 10 A<br>8.5 V GS  = 10 V<br>14<br>12 8.0<br>10<br>7.5<br>8<br>6 7.0<br>6 7 8 9 10 0 10 20 30 40 50 60 70 80 90 100<br>VGS, GATE−TO−SOURCE VOLTAGE (V) ID, DRAIN CURRENT (A)<br>Figure 3. On−Resistance vs. Gate−to−Source Figure 4. On−Resistance vs. Drain Current and<br>Voltage Gate Voltage<br>2.0 10<br>1.8 VGS = 10 V TJ = 150 ° C<br>ID = 10 A<br>1.6 1 TJ = 125 ° C<br>1.4 T J  = 100 ° C<br>1.2 0.1 TJ = 85 ° C<br>1.0<br>0.01<br>0.8<br>VGS = 0 V<br>0.6 0.001<br>−100 −50 0 50 100 150 200 0 10 20 30 40 50 60 70 80<br>TJ, JUNCTION TEMPERATURE ( ° C) VDS, DRAIN−TO−SOURCE VOLTAGE (V)<br>) �<br>) �<br>, DRAIN−TO−SOURCE ON− RESISTANCE (m<br>DS(on)<br>R<br>, DRAIN−TO−SOURCE RESISTANCE (m<br>DS(on)<br>R<br>A)<br>�<br>CURRENT (<br>, REVERSE LEAKAGE<br>, NORMALIZED DRAIN−TO−<br>SOURCE ON−RESISTANCE IDSS<br>DS(on)<br>R<br>**----- End of picture text -----**<br>


**Figure 5. On−Resistance Variation with Temperature** 

**Figure 6. Drain−to−Source Leakage Current vs. Voltage** 

**www.onsemi.com** 

**4** 

**NTMFSC010N08M7** 

## **TYPICAL CHARACTERISTICS** 

**==> picture [241 x 157] intentionally omitted <==**

**----- Start of picture text -----**<br>
10K<br>CISS<br>1K<br>COSS<br>100<br>10 CRSS<br>VGS = 0 V<br>TJ = 25 ° C<br>f = 1 MHz<br>1<br>0 20 40 60 80<br>C, CAPACITANCE (pF)<br>**----- End of picture text -----**<br>


**==> picture [150 x 9] intentionally omitted <==**

**----- Start of picture text -----**<br>
VDS, DRAIN−TO−SOURCE VOLTAGE (V)<br>**----- End of picture text -----**<br>


**Figure 7. Capacitance Variation** 

**==> picture [243 x 157] intentionally omitted <==**

**----- Start of picture text -----**<br>
1000<br>100<br>td(off)<br>td(on)<br>10<br>tr VGS = 10 V<br>VDS = 40 V<br>t f I D  = 10 A<br>1<br>1 10 100<br>t, SWITCHING TIME (ns)<br>**----- End of picture text -----**<br>


**==> picture [104 x 8] intentionally omitted <==**

**----- Start of picture text -----**<br>
RG, GATE RESISTANCE ( � )<br>**----- End of picture text -----**<br>


**Figure 9. Resistive Switching Time Variation vs. Gate Resistance** 

**==> picture [237 x 173] intentionally omitted <==**

**----- Start of picture text -----**<br>
10<br>9 QG(TOT)<br>8<br>7 QGS Q GD<br>6<br>5<br>4<br>3<br>2 VDS = 40 V<br>ID = 10 A<br>1 T J  = 25 ° C<br>0<br>0 5 10 15 20 25 30<br>QG, TOTAL GATE CHARGE (nC)<br>, GATE−TO−SOURCE VOLTAGE (V)<br>GS<br>V<br>**----- End of picture text -----**<br>


**Figure 8. Gate−to−Source and Drain−to−Source Voltage vs. Total Charge** 

**==> picture [239 x 171] intentionally omitted <==**

**----- Start of picture text -----**<br>
1000<br>VGS = 0 V<br>100<br>10<br>1<br>0.1<br>TJ = 150 ° C<br>0.01<br>0.001 TJ = 25 ° C TJ = −55 ° C<br>0 0.2 0.4 0.6 0.8 1.0 1.2<br>VSD, BODY DIODE FORWARD VOLTAGE (V)<br>, REVERSE DRAIN CURRENT (A)<br>IS<br>**----- End of picture text -----**<br>


**Figure 10. Diode Forward Voltage vs. Current** 

**==> picture [490 x 176] intentionally omitted <==**

**----- Start of picture text -----**<br>
1000 100<br>TC = 25 ° C<br>Single Pulse<br>VGS ≤  10 V<br>100 T J(initial)  = 25 ° C<br>10  � s<br>10 100  � s 10 TJ(initial) = 125 ° C<br>1 0.5 ms<br>RDS(on) Limit 1 ms<br>Thermal Limit<br>Package Limit 10 ms<br>0.1 1<br>0.1 1 10 100 0.001 0.01 0.1 1 10<br>VDS, DRAIN−TO−SOURCE VOLTAGE (V) tAV, TIME IN AVALANCHE (mS)<br>, DRAIN CURRENT (A)<br>ID , AVALANCHE CURRENT (A)<br>IAS<br>**----- End of picture text -----**<br>


**Figure 11. Safe Operating Area** 

**Figure 12. IPEAK vs. Time in Avalanche** 

**www.onsemi.com** 

**5** 

**NTMFSC010N08M7** 

## **TYPICAL CHARACTERISTICS** 

**==> picture [491 x 189] intentionally omitted <==**

**----- Start of picture text -----**<br>
2<br>1 50% Duty Cycle<br>20%<br>10%<br>5%<br>2%<br>0.1 1%<br>Single Pulse<br>0.01<br>0.000001 0.00001 0.0001 0.001 0.01 0.1 1 10 100<br>t, RECTANGULAR PULSE DURATION (s)<br>Figure 13. Thermal Response<br>C/W)<br>°<br>, EFFECTIVE TRANSIENT<br>JC<br>�<br>R THERMAL RESISTANCE (<br>**----- End of picture text -----**<br>


DUAL COOL is a registered trademark of Semiconductor Components Industries, LLC (SCILLC) or its subsidiaries in the United States and/or other countries. 

**www.onsemi.com** 

**6** 

**NTMFSC010N08M7** 

## **PACKAGE DIMENSIONS** 

## **DFN8 5.1x6.15, 1.27P, DUAL COOL** 

## CASE 506EG ISSUE D 

ON Semiconductor and      are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. 

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