# Power MOSFET, N Channel, 80 V, 166 A, 2200 µohm, Power 56, Surface Mount

![Product image](https://novapart.co/image/farnell:2768336/)

**URL**: https://novapart.co/products/NTMFS08N2D5C/power-mosfet-n-channel-80-v-166-a-2200-ohm-56
**SKU**: NTMFS08N2D5C
**Manufacturer**: ONSEMI
**Category**: Semiconductors - Discretes || FETs || Single MOSFETs
**Price**: €4.0800
**Stock**: 500+
**Lead Time**: 190 days (indicative)

## Description

Transistor Polarity:N Channel; Continuous Drain Current Id:166A; Drain Source Voltage Vds:80V; On Resistance Rds(on):0.0022ohm; Rds(on) Test Voltage Vgs:10V; Threshold Voltage Vgs:2.9V;

## Specifications

| Parameter | Value |
|---|---|
| Msl | MSL 1 - Unlimited |
| Svhc | Lead (25-Jun-2025) |
| No. Of Pins | 5Pins |
| Channel Type | N Channel |
| Product Range | PowerTrench |
| Qualification | - |
| Power Dissipation | 138W |
| Transistor Mounting | Surface Mount |
| Rds(On) Test Voltage | 10V |
| Transistor Case Style | Power 56 |
| Drain Source Voltage Vds | 80V |
| Operating Temperature Max | 150°C |
| Continuous Drain Current Id | 166A |
| Drain Source On State Resistance | 2200µohm |
| Gate Source Threshold Voltage Max | 2.9V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:2768336/)

## **Is Now Part of** 

**To learn more about ON Semiconductor, please visit our website at www.onsemi.com** 

ON Semiconductor and the ON Semiconductor logo are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent-Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. 

## **www.onsemi.com** 

## **NTMFS08N2D5C** 

**N-Channel Shielded Gate PowerTrench[®] MOSFET 80 V, 166 A, 2.7 m** Ω 

## **Features** 

Shielded Gate MOSFET Technology 

Max rDS(on) = 2.7 mΩ at  VGS = 10 V, ID = 68 A Max rDS(on) = 6.7 mΩ at  VGS = 6 V, ID = 34 A 50% lower Qrr than other MOSFET suppliers 

Lowers switching noise/EMI MSL1 robust package design 100% UIL tested 

## **General Description** 

This N-Channel MV MOSFET is produced using ON Semiconductor’s advanced PowerTrench **[®]** process that incorporates Shielded Gate technology. This process has been optimized to minimise on-state resistance and yet maintain superior switching performance with best in class soft body diode. 

## **Applications** 

Primary DC-DC MOSFET 

Z RoHS Compliant i| Synchronous Rectifier in DC-DC and AC-DC i| Motor Drive 

Solar 

|**Top**<br>**Pin 1**|**D D D**|**D D D**|**Bottom**<br>**S**<br>**D**|**Pin 1**<br>**G**<br>**S**<br>**S**<br><_|**Pin 1**<br>**G**<br>**S**<br>**S**<br><_|**S**<br>**S**<br>**S**<br>**G**<br>1}<br>2<br>3}<br>4}|**S**<br>**S**<br>**S**<br>**G**<br>1}<br>2<br>3}<br>4}||18<br>(7<br>16<br>i|**D**<br>**D**<br>**D**<br>**D**|**D**<br>**D**<br>**D**<br>**D**||
|---|---|---|---|---|---|---|---|---|---|---|---|---|
|**Power 56**|||||||||||||
|**MOSFET Maximum Ratings  **|TA|A= 25 °C unless otherwise noted|= 25 °C unless otherwise noted||||||||||
|**Symbol**||**Parameter**||||||**Ratings**||||**Units**|
|VDS<br>Drain to Source Voltage||||||||80||||V|
|VGS<br>Gate to Source Voltage|e|e|e|e|e|e||±20||||V|
|Drain Current   -Continuous                                    T||Drain Current   -Continuous                                    T|Drain Current   -Continuous                                    T|Drain Current   -Continuous                                    TC|= 25 °C|= 25 °C(Note 5)||166|||||
|ID<br>-Continuous                                    T<br>-Continuous                                        T||-Continuous                                    T<br>-Continuous                                        T|-Continuous                                    T<br>-Continuous                                        T|-Continuous                                    TC <br>-Continuous                                        TA|= 100 °C<br>A= 25 °C|= 100 °C(Note 5)<br>= 25 °C(Note 1a)||105<br>24||||A|
|-Pulsed|-Pulsed|-Pulsed|-Pulsed|-Pulsed|-Pulsed|-Pulsed(Note 4)||823|||||
|EAS<br>Single Pulse Avalanche Energy||||||(Note 3)||600||||mJ|
|PD<br>Power Dissipation                                                   T<br>Power Dissipation                                                      T|Power Dissipation                                                   T<br>Power Dissipation                                                      T|Power Dissipation                                                   T<br>Power Dissipation                                                      T|Power Dissipation                                                   T<br>Power Dissipation                                                      T|Power Dissipation                                                   TC= 25 °C<br>Power Dissipation                                                      TA= 25 °C|= 25 °C<br>= 25 °C|= 25 °C(Note 1a)||138<br>2.7||||W|
|TJ, TSTG<br>Operatingand Storage Junction Temperature Range||||||||-55 to +150||||°C|
|**Thermal Characteristics**|||||||||||||
|RθJC<br>Thermal Resistance, Junction to Case||Thermal Resistance, Junction to Case||||||0.9||||°C/W|
|RθJA<br>Thermal Resistance, Junction to Ambient||Thermal Resistance, Junction to Ambient||Thermal Resistance, Junction to Ambient|Thermal Resistance, Junction to Ambient|Thermal Resistance, Junction to Ambient(Note 1a)||45|||||



**MOSFET Maximum Ratings** TA = 25 °C unless otherwise noted 

## **Thermal Characteristics** 

## **Package Marking and Ordering Information** 

|**Device Marking**|**Device**|**Package**|**Reel Size**|**Tape Width**|**Quantity**|
|---|---|---|---|---|---|
|NTMFS08N2D5C|NTMFS08N2D5C|Power 56|13 ’’|12 mm|3000 units|



Publication Order Number: NTMFS08N2D5C/D 

Semiconductor Components Industries, LLC, 2017 March, 2017, Rev. 1.0 

**1** 

## **Electrical Characteristics** TJ = 25 °C unless otherwise noted 

|**Off Characteristics**<br>**On Characteristics**<br>**Dynamic Characteristics**<br>**Switching Characteristics**<br>**Symbol**<br>**Parameter**<br>**Test Conditions**<br>**Min**<br>**Typ**<br>**Max**<br>**Units**<br>BVDSS<br>Drain to Source Breakdown Voltage<br>ID= 250μA, VGS= 0 V<br>80<br>V<br>ΔBVDSS<br>ΔTJ<br>Breakdown Voltage Temperature<br>Coefficient<br>ID= 250μA, referenced to 25 °C<br>62<br>mV/°C<br>IDSS<br>Zero Gate Voltage Drain Current<br>VDS= 64 V, VGS= 0 V<br>1<br>μA<br>IGSS<br>Gate to Source Leakage Current<br>VGS= ±20 V, VDS= 0 V<br>100<br>nA<br>VGS(th)<br>Gate to Source Threshold Voltage<br>VGS= VDS, ID= 380μA<br>2.0<br>2.9<br>4.0<br>V<br>ΔVGS(th)<br>ΔTJ<br>Gate to Source Threshold Voltage<br>Temperature Coefficient<br>ID= 380μA, referenced to 25 °C<br>-8.3<br>mV/°C<br>rDS(on)<br>Static Drain to Source On Resistance<br>VGS= 10 V, ID= 68 A<br>2.2<br>2.7<br>mΩ<br>VGS= 6 V, ID= 34 A<br>3.3<br>6.7<br>VGS= 10 V, ID= 68 A, TJ = 125 °C<br>3.7<br>4.5<br>gFS<br>Forward Transconductance<br>VDS= 5 V, ID= 68 A<br>148<br>S<br>Ciss<br>Input Capacitance<br>VDS= 40 V, VGS= 0 V,<br>f = 1 MHz<br>4455<br>6240<br>pF<br>Coss<br>Output Capacitance<br>1480<br>2070<br>pF<br>Crss<br>Reverse Transfer Capacitance<br>59<br>85<br>pF<br>Rg<br>Gate Resistance<br>0.8<br>1.6<br>Ω<br>td(on)<br>Turn-On DelayTime<br>VDD= 40 V, ID= 68 A,<br>VGS= 10 V, RGEN= 6Ω<br>21<br>34<br>ns<br>tr<br>Rise Time<br>11<br>20<br>ns<br>td(off)<br>Turn-Off DelayTime<br>29<br>47<br>ns<br>tf<br>Fall Time<br>7<br>13<br>ns<br>Qg<br>Total Gate Charge<br>VGS= 0 V to 10 V<br>VDD= 40 V,<br>ID= 68 A<br>60<br>84<br>nC<br>Qg<br>Total Gate Charge<br>VGS= 0 V to 6 V<br>38<br>54<br>nC<br>Qgs<br>Gate to Source Charge<br>19<br>nC<br>Qgd<br>Gate to Drain “Miller” Charge<br>12<br>nC<br>Qoss<br>Output Charge<br>VDD= 40 V, VGS= 0 V<br>84<br>Qsync<br>Total Gate Charge Sync<br>VDS= 0 V, ID= 68 A<br>51<br>nC<br>~~Se eeaae~~<br>~~===~~<br>~~BEES~~<br>~~EEE~~|
|---|
|**Drain-Source Diode Characteristics**|
|VSD<br>Source to Drain Diode  Forward Voltage<br>VGS= 0 V, IS= 2.2 A(Note 2)<br>0.7<br>1.2<br>V<br>VGS= 0 V, IS= 68 A(Note 2)<br>0.8<br>1.3<br>trr<br>Reverse RecoveryTime<br>IF= 34 A, di/dt = 300 A/μs<br>30<br>48<br>ns<br>Qrr<br>Reverse RecoveryCharge<br>55<br>88<br>nC<br>trr<br>Reverse RecoveryTime<br>IF= 34 A, di/dt = 1000 A/μs<br>24<br>39<br>ns<br>Qrr<br>Reverse RecoveryCharge<br>139<br>222<br>nC<br>~~tees~~|
|Notes**:**|
|1. RθJAis determined with the device mounted on a 1 in2pad 2 oz copper pad on a 1.5 x 1.5 in. board of FR-4 material. RθCAis determined by  the user's board design.|
|a. 45 °C/W when mounted  on a<br>b. 115 °C/W when mounted on  a|
|1 in2pad of  2 oz  copper.<br>minimum pad of 2 oz copper.|
|**G**<br>**DF**<br>**DS**<br>**SF**<br>**SS**<br>**G**<br>**DF**<br>**DS**<br>**SF**<br>**SS**|



2. Pulse Test: Pulse Width < 30 0 μs, Duty cycle < 2.0%. 

3. EAS of 600 mJ is based on starting TJ = 25 °C; N-ch: L = 3 mH, IAS = 20 A, VDD = 80 V, VGS =10 V. 100% test at L = 0.1 mH, IAS = 63 A. 

4. Pulsed Id please refer to Fig 11 SOA graph for more details. 

5. Computed continuous current limited to Max Junction Temperature only, actual continuous current will be limited by thermal & electro-mechanical application board design. 

www.onsemi.com 

**2** 

**Typical Characteristics** TJ = 25 °C unless otherwise noted. 

**==> picture [452 x 583] intentionally omitted <==**

**----- Start of picture text -----**<br>
300 6<br>VGS = 10 V<br>250 VGS = 7 V 5 VGS = 4.5 V PULSE DURATION = 80 DUTY CYCLE = 0.5% MAX  μ s<br>VGS = 6 V<br>VGS = 5 V<br>200 4<br>VGS = 5.5 V VGS = 5.5 V<br>150 3<br>100 PULSE DURATION = 80  μ s 2 V GS  = 6 V<br>VGS = 5 V DUTY CYCLE = 0.5% MAX<br>50 1<br>VGS = 7 V VGS = 10 V<br>VGS = 4.5 V<br>0 0<br>0 1 2 3 4 5 0 50 100 150 200 250 300<br>VDS, DRAIN TO SOURCE VOLTAGE (V) ID, DRAIN CURRENT (A)<br>Figure 1.  On Region Characteristics Figure 2.  Normalized On-Resistance<br>vs. Drain Current and Gate Voltage<br>2.0 20<br>PULSE DURATION = 80  μ s<br>1.8 ID = 68 A DUTY CYCLE = 0.5% MAX<br>VGS = 10 V ID = 68 A<br>15<br>1.6<br>1.4<br>10<br>1.2<br>1.0 TJ = 125  [o] C<br>5<br>0.8<br>TJ = 25  [o] C<br>0.6 0<br>-75 -50 -25 0 25 50 75 100 125 150 4 5 6 7 8 9 10<br>TJ, JUNCTION TEMPERATURE ( [o] C) VGS, GATE TO SOURCE VOLTAGE (V)<br>Figure 3.  Normalized  On  Resistance                                         Figure 4.   On-Resistance vs.  Gate to<br>vs. Junction Temperature Source Voltage<br>300 300<br>PULSE DURATION = 80  μ s 100 V GS  = 0 V<br>DUTY CYCLE = 0.5% MAX<br>250<br>VDS = 5 V<br>10<br>200<br>T J  = 150  [o] C<br>1<br>150<br>TJ = 150  [o] C TJ = 25 [ o] C<br>0.1<br>100<br>50 TJ = 25  [o] C 0.01<br>TJ = -55  [o] C<br>TJ = -55  [o] C<br>0 0.001<br>2 3 4 5 6 7 0.0 0.2 0.4 0.6 0.8 1.0 1.2<br>VGS, GATE TO SOURCE VOLTAGE (V) VSD, BODY DIODE FORWARD VOLTAGE (V)<br>NORMALIZED<br>, DRAIN CURRENT (A)<br>ID<br>DRAIN TO SOURCE ON-RESISTANCE<br>) Ω<br>(m<br>DRAIN TO<br>NORMALIZED rDS(on),<br>SOURCE ON-RESISTANCE<br> DRAIN TO SOURCE ON-RESISTANCE<br>, DRAIN CURRENT (A)<br>ID<br>, REVERSE DRAIN CURRENT (A)<br>IS<br>**----- End of picture text -----**<br>


**Figure 5.  Transfer Characteristics** 

**Figure 6.    Source to Drain  Diode Forward Voltage vs. Source Current** 

www.onsemi.com 

**3** 

**Typical Characteristics** TJ = 25 °C unless otherwise noted. 

**==> picture [455 x 606] intentionally omitted <==**

**----- Start of picture text -----**<br>
10 10000<br>ID = 68 A<br>VDD = 30 V C iss<br>8<br>VDD = 40 V 1000 Coss<br>6<br>VDD = 50 V 100<br>4<br>Crss<br>10<br>2<br>f = 1 MHz<br>VGS = 0 V<br>0 1<br>0 10 20 30 40 50 60 70 0.1 1 10 80<br>Qg, GATE CHARGE (nC) VDS, DRAIN TO SOURCE VOLTAGE (V)<br>Figure 7.  Gate Charge Characteristics Figure 8. Capacitance vs. Drain<br>to Source Voltage<br>100 180<br>R θ JC = 0.9  [o] C/W<br>150<br>T J  = 25 [ o] C VGS = 10 V<br>120<br>10 T J  = 100  [o] C 90<br>60 V GS  = 6 V<br>T J  = 125 [ o] C<br>30<br>1 0<br>0.001 0.01 0.1 1 10 100 1000 25 50 75 100 125 150<br>tAV, TIME IN AVALANCHE (ms) TC, CASE TEMPERATURE (oC)<br>Figure 9. Unclamped Inductive                                  Figure 10.  Maximum Continuous Drain<br>Switching Capability Current  vs. Case Temperature<br>1000 100000<br>SINGLE PULSE<br>10  μ s R θ JC = 0.9  [o] C/W<br>100 10000 TC = 25  [o] C<br>10 THIS AREA IS  100  μ s 1000<br>LIMITED BY r<br>DS(on)<br>SINGLE PULSE 1 ms<br>1 TJ = MAX RATED 10 ms 100<br>R θ JC = 0.9  [o] C/W CURVE BENT TO  100 ms/DC<br>T C = 25  [o] C MEASURED DATA<br>0.1 10<br>0.1 1 10 100 500 10-5 10-4 10-3 10-2 10-1 1<br>VDS, DRAIN to SOURCE VOLTAGE (V) t, PULSE WIDTH (sec)<br>Figure 11.  Forward Bias Safe                                      Figure 12.  Single  Pulse Maximum<br>Operating Area  Power  Dissipation<br>CAPACITANCE (pF)<br>, GATE TO SOURCE VOLTAGE (V)<br>GS<br>V<br>DRAIN CURRENT (A)<br>,<br>ID<br>, AVALANCHE CURRENT (A)<br>IAS<br>, DRAIN CURRENT (A)<br>ID<br>PEAK TRANSIENT POWER (W)<br>,<br>(PK)<br>P<br>**----- End of picture text -----**<br>


www.onsemi.com 

**4** 

**==> picture [457 x 208] intentionally omitted <==**

**----- Start of picture text -----**<br>
Typical Characteristics  TJ = 25 °C unless otherwise noted.<br>2<br>DUTY CYCLE-DESCENDING ORDER<br>1<br>D = 0.5<br>      0.2 PDM<br>0.1       0.1<br>      0.05<br>      0.02 t1<br>      0.01<br>t 2<br>0.01 SINGLE PULSE NOTES:<br>Z θ JC(t) = r(t) x R θ JC<br>R θ JC = 0.9  [o] C/W<br>Peak TJ = PDM x Z θ JC(t) + TC<br>Duty Cycle, D = t1 / t2<br>0.001<br>10-5 10-4 10-3 10-2 10-1 1<br>t, RECTANGULAR PULSE DURATION (sec)<br>Figure 13.  Junction-to-Case Transient Thermal Response Curve<br>THERMAL RESISTANCE<br>r(t), NORMALIZED EFFECTIVE TRANSIENT<br>**----- End of picture text -----**<br>


www.onsemi.com 

**5** 

**==> picture [534 x 601] intentionally omitted <==**

**----- Start of picture text -----**<br>
(4.42)<br>0.10 C 5.00 A<br>3.81<br>2X<br>PKG 8 7 6 5<br>CL B<br>8 5<br>(1.14)<br>KEEP OUT<br>(4.63) AREA<br>(3.49)<br>(6.61)<br>PKG CL 6.00<br>4X (1.27)<br>PIN #1 1 4 0.10 C 1 2 3 4<br>IDICATOR TOP VIEW 2X 1.27 (0.61) 8X<br>(5.10)<br>SEE LAND PATTERN<br>DETAIL A RECOMMENDATION<br>0.10 C<br>SIDE VIEW 1.10<br>0.90<br>0.08 C<br>C<br>3.81 0.05<br>0.10 C A B (0.20) 0.00<br>4X 1.27 0.05 C PLANE<br>(0.38) 0 .42±0.05  8X<br>1 4 SCALE: 2:1<br>0.57±0.05<br>4X NOTES: UNLESS OTHERWISE SPECIFIED<br>   A)  PACKAGE STANDARD REFERENCE:<br>        JEDEC MO-240, ISSUE A, VAR. AA,<br>(0.35)    B)  ALL DIMENSIONS ARE IN MILLIMETERS.<br>6.00±0.10<br>2X    C)  DIMENSIONS DO NOT INCLUDE BURRS<br>4.33±0.10        OR MOLD FLASH. MOLD FLASH OR<br>       BURRS DOES NOT EXCEED 0.10MM.<br>   D)  DIMENSIONING AND TOLERANCING PER<br>0.65±0.10        ASME Y14.5M-2009.<br>3X 8 5    E)  IT IS RECOMMENDED TO HAVE NO TRACES<br>OR VIAS WITHIN THE KEEP OUT AREA.<br>4 .23±0.10<br>   F)  DRAWING FILE NAME: PQFN08TREV1.<br>5 .00±0.10<br>BOTTOM VIEW<br>**----- End of picture text -----**<br>


**==> picture [234 x 125] intentionally omitted <==**

**----- Start of picture text -----**<br>
0.10 C<br>1.10<br>0.90<br>0.08 C<br>C<br>0.05<br>(0.20) 0.00 SEATING<br>PLANE<br>SCALE: 2:1<br>**----- End of picture text -----**<br>


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