# Power MOSFET, N Channel, 150 V, 61 A, 0.014 ohm, PQFN, Surface Mount

![Product image](https://novapart.co/image/farnell:3528506/)

**URL**: https://novapart.co/products/NTMFS015N15MC/power-mosfet-n-channel-150-v-61-a-0014-ohm-pqfn
**SKU**: NTMFS015N15MC
**Manufacturer**: ONSEMI
**Category**: Semiconductors - Discretes || FETs || Single MOSFETs
**Price**: €1.4600
**Stock**: 1000+
**Lead Time**: 190 days (indicative)

## Specifications

| Parameter | Value |
|---|---|
| Msl | MSL 1 - Unlimited |
| Svhc | Lead (25-Jun-2025) |
| No. Of Pins | 8Pins |
| Channel Type | N Channel |
| Product Range | PowerTrench |
| Qualification | - |
| Power Dissipation | 108.7W |
| Transistor Mounting | Surface Mount |
| Rds(On) Test Voltage | 10V |
| Transistor Case Style | PQFN |
| Drain Source Voltage Vds | 150V |
| Operating Temperature Max | 150°C |
| Continuous Drain Current Id | 61A |
| Drain Source On State Resistance | 0.014ohm |
| Gate Source Threshold Voltage Max | 4.5V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:3528506/)

## MOSFET - N-Channel Shielded Gate PowerTrench 150 V, 14 m 61 A 

## NTMFS015N15MC 

## **Features** 

- Small Footprint (5 x 6 mm) for Compact Design 

## **www.onsemi.com** 

- Low R to Minimize Conduction Losses DS(on) 

- Low QG and Capacitance to Minimize Driver Losses 

- 100% UIL Tested 

|**V(BR)DSS**|**RDS(ON) MAX**|**ID MAX**|
|---|---|---|
|150 V|14 m @ 10 V|61 A|



- These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS Compliant 

**==> picture [69 x 85] intentionally omitted <==**

**----- Start of picture text -----**<br>
D<br>G<br>S<br>**----- End of picture text -----**<br>


## **Typical Applications** 

- Synchronous Rectification 

- AC−DC and DC−DC Power Supplies 

- AC−DC Adapters (USB PD) SR 

- Load Switch 

## **MAXIMUM RATINGS** (TJ = 25 ° C unless otherwise noted) 

**N−CHANNEL MOSFET** 

|||**N−CHANNEL MOSFET**|
|---|---|---|
|**Parameter**<br>**Symbol**<br>**Value**<br>**Unit**||**N−CHANNEL MOSFET**|
|Drain−to−Source Voltage<br>VDSS<br>150<br>V|||
|Gate−to−Source Voltage<br>VGS<br>±20<br>V<br>Continuous Drain<br>Current R JC(Note 2)<br>Steady<br>State<br>TC= 25°C<br>ID<br>61<br>A<br>Power Dissipation<br>R JC(Note 2)<br>PD<br>108.7<br>W<br>Continuous Drain<br>Current R JA<br>(Notes 1, 2)<br>Steady<br>State<br>TA= 25°C<br>ID<br>9.2<br>A<br>Power Dissipation<br>R JA(Notes 1, 2)<br>PD<br>2.5<br>W<br>Pulsed Drain Current<br>TC= 25°C, tp= 100 s<br>IDM<br>302<br>A<br>Operating Junction and Storage Temperature<br>Range<br>TJ, Tstg<br>−55 to<br>+150<br>°C<br>Single Pulse Drain−to−Source Avalanche<br>Energy (IL= 10 Apk, L = 3 mH)<br>EAS<br>150<br>mJ<br>~~“TTA ~~<br>~~—~~<br>~~|} {tt~~<br>~~ae eee~~<br>~~ee~~<br>~~le~~||**Power 56**<br>**(PQFN8)**<br>**CASE 483AE**<br>Pin 1<br>Top<br>Bottom<br>**MARKING DIAGRAM**<br>1515MC<br>AYWZZ<br>D<br>D<br>D<br>D<br>S<br>S<br>S<br>G<br> ee<br>|||
|Lead Temperature for Soldering Purposes<br>(1/8″from case for 10 s)<br>TL<br>260<br>°C<br>~~EEE~~||1515MC = Specific Device Code<br>A<br>= Assembly Location<br>Y<br>= Year|



|S<br>S<br>S<br>G|**MARKING DIAGRAM**<br>1515MC<br>AYWZZ<br>|||**MARKING DIAGRAM**<br>1515MC<br>AYWZZ<br>|||**MARKING DIAGRAM**<br>1515MC<br>AYWZZ<br>|||D<br>D<br>D<br>D|
|---|---|---|---|---|
|1515MC = Specific Device Code|||||
|A|= Assembly Location||||
|Y<br>W<br>ZZ|= Year<br>= Work Week<br>= Lot Traceability||||



Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 

1. Surface−mounted on FR4 board using a 1 in[2] , 2 oz. Cu pad. 

2. The entire application environment impacts the thermal resistance values shown, they are not constants and are only valid for the particular conditions noted. 

**ORDERING INFORMATION** 

**Device Package Shipping**[†] NTMFS015N15MC Power 56 3000 / Tape (Pb−Free/Halogen Free) (PQFN8) & Reel ~~oT~~ †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. 

Publication Order Number: **NTMFS015N15MC/D** 

**1** 

© Semiconductor Components Industries, LLC, 2020 **May, 2020 − Rev. 1** 

**NTMFS015N15MC** 

## **THERMAL RESISTANCE MAXIMUM RATINGS** 

|**THERMAL RESISTANCE MAXIMUM RATINGS**||||
|---|---|---|---|
|**Parameter**|**Symbol**|**Value**|**Unit**|
|Junction−to−Case − Steady State (Note 2)|R�JC|1.15|°C/W|
|Junction−to−Ambient − Steady State (Notes 1, 2)|R�JA|50||



## **ELECTRICAL CHARACTERISTICS** (TJ = 25 ° C unless otherwise specified) 

|**ELECTRICAL CHARACTERISTICS**(TJ=|25°C unless|otherwise specified)|otherwise specified)|||||
|---|---|---|---|---|---|---|---|
|**Parameter**|**Symbol**|**Test Condition**||**Min**|**Typ**|**Max**|**Unit**|
|**OFF CHARACTERISTICS**||||||||
|Drain−to−Source Breakdown Voltage|V(BR)DSS|VGS= 0 V, ID= 250�A||150|||V|
|Drain−to−Source Breakdown Voltage<br>Temperature Coefficient|V(BR)DSS/<br>TJ|ID= 250�A, ref to 25°C|||109||mV/°C|
|Zero Gate Voltage Drain Current|IDSS|VGS= 0 V,<br>VDS= 120 V|TJ= 25°C|||1.0|�A|
|Gate−to−Source Leakage Current|IGSS|VDS= 0 V, VGS=±20 V||||±100|nA|
|**ON CHARACTERISTICS**||||||||
|Gate Threshold Voltage|VGS(TH)|VGS= VDS, ID= 162�A||2.5||4.5|V|
|Negative Threshold Temperature Coefficient|VGS(TH)/TJ|ID= 162�A, ref to 25°C|||−7.6||mV/°C|
|Drain−to−Source On Resistance|RDS(on)|VGS= 10 V, ID= 29 A|||10.2|14|m�|
|Drain−to−Source On Resistance|RDS(on)|VGS= 8 V, ID= 15 A|||11.1|16.2|m�|
|Forward Transconductance|gFS|VDS= 10 V, ID= 29 A|||56||S|
|**CHARGES, CAPACITANCES & GATE RESISTANCE**||||||||
|Input Capacitance|CISS|VGS= 0 V, f = 1 MHz, VDS= 75 V|||2120||pF|
|Output Capacitance|COSS||||595|||
|Reverse Transfer Capacitance|CRSS||||10.5|||
|Gate−Resistance|RG||||0.6|1.2|�|
|Total Gate Charge|QG(TOT)|VGS= 10 V, VDS= 75 V; ID= 29 A|||27||nC|
|Threshold Gate Charge|QG(TH)||||7|||
|Gate−to−Source Charge|QGS||||11|||
|Gate−to−Drain Charge|QGD||||4|||
|Plateau Voltage|VGP||||5.5||V|
|Output Charge|QOSS|VDD= 75 V, VGS= 0 V|||66||nC|
|**SWITCHING CHARACTERISTICS**(Note 3)||||||||
|Turn−On Delay Time|td(ON)|VGS= 10 V, VDD= 75 V,<br>ID= 29 A, RG= 6�|||16||ns|
|Rise Time|tr||||5|||
|Turn−Off Delay Time|td(OFF)||||21|||
|Fall Time|tf||||4|||
|**DRAIN−SOURCE DIODE CHARACTERISTICS**||||||||
|Forward Diode Voltage|VSD|VGS= 0 V,<br>IS= 29 A|TJ= 25°C||0.86|1.2|V|
|Reverse Recovery Time|tRR|VGS= 0 V, VDD= 75 V<br>dIS/dt = 300 A/�s, IS= 29 A|||49||ns|
|Reverse Recovery Charge|QRR||||197||nC|
|Reverse Recovery Time|tRR|VGS= 0 V, VDD= 75 V<br>dIS/dt = 1000 A/�s, IS= 29 A|||34||ns|
|Reverse Recovery Charge|QRR||||345||nC|



Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. 

**www.onsemi.com** 

**2** 

**NTMFS015N15MC** 

## NOTES: 

3. Switching characteristics are independent of operating junction temperatures. 

4. R 0 JA is determined with the device mounted on a 1 in[2] pad 2 oz copper pad on a 1.5 × 1.5 in. board of FR−4 material. R ) CA is determined by the user’s board design. 

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a) 50 ° C/W when mounted on  b) 125 ° C/W when mounted on<br>a 1 in [2]  pad of 2 oz copper. a minimum pad of 2 oz copper.<br>00000 G DF DS SF SS 00000 G DF DS SF SS<br>**----- End of picture text -----**<br>


**www.onsemi.com** 

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**NTMFS015N15MC** 

## **TYPICAL CHARACTERISTICS** 

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160 6<br>10 V 8.0 V 5.5 V VGS = 6.0 V<br>7.0 V<br>5<br>Pulse Duration = 250  � s<br>120<br>Duty Cycle = 0.5% Max<br>4<br>7 V<br>80 6.0 V 3<br>8 V<br>2<br>40 VGS = 5.5 V<br>1 10 V<br>0 0<br>0 1 2 3 4 5 6 7 8 9 10 0 40 80 120 160<br>VDS, DRAIN−TO−SOURCE VOLTAGE (V) ID, DRAIN CURRENT (A)<br>, DRAIN CURRENT (A) , NORMALIZED DRAIN−TO−<br>ID<br>SOURCE ON−RESISTANCE<br>DS(on)<br>R<br>**----- End of picture text -----**<br>


**Figure 1. On−Region Characteristics** 

**Figure 2. Normalized On−Resistance vs. Drain Current and Gate Voltage** 

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**----- Start of picture text -----**<br>
2.2 80<br>2.0 ID = 29 A ID = 29 A<br>VGS = 10 V<br>1.8 60<br>1.6<br>1.4 40<br>1.2<br>TJ = 125 ° C<br>1.0 20<br>0.8 TJ = 25 ° C<br>0.6 0<br>−75 −50 −25 0 25 50 75 100 125 150 4 5 6 7 8 9 10<br>TJ, JUNCTION TEMPERATURE ( ° C) VGS, GATE−TO−SOURCE VOLTAGE (V)<br>Figure 3. Normalized On−Resistance vs. Figure 4. On−Resistance vs. Gate−to−Source<br>Junction Temperature Voltage<br>160 200<br>VDS = 10 V 100 VGS = 0 V<br>120 10<br>1<br>80<br>TJ = 25 ° C 0.1<br>40<br>0.01 TJ = 150 ° C<br>TJ = 150 ° C TJ = −55 ° C TJ = 25 ° C TJ = −55 ° C<br>0 0.001<br>2 3 4 5 6 7 8 0 0.2 0.4 0.6 0.8 1.0 1.2<br>VGS, GATE−TO−SOURCE VOLTAGE (V) VSD, BODY DIODE FORWARD VOLTAGE (V)<br>) �<br>, NORMALIZED DRAIN−TO− , ON−RESISTANCE (m<br>SOURCE ON−RESISTANCE<br>DS(on) DS(on)<br>R R<br>, DRAIN CURRENT (A)<br>ID<br>, REVERSE DRAIN CURRENT (A)<br>IS<br>**----- End of picture text -----**<br>


**Figure 5. Transfer Characteristics** 

**Figure 6. Source−to−Drain Diode Forward Voltage vs. Source Current** 

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**NTMFS015N15MC** 

## **TYPICAL CHARACTERISTICS** 

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**----- Start of picture text -----**<br>
10 10K<br>ID = 29 A VDD = 25 V<br>CISS<br>8 V DD  = 50 V V DD  = 75 V<br>1K COSS<br>6<br>100<br>4<br>C RSS<br>10<br>2 f = 1 MHz<br>VGS = 0 V<br>0 1<br>0 6 12 18 24 30 0.1 1 10 100 150<br>Qg, GATE CHARGE (nC) VDS, DRAIN−TO−SOURCE VOLTAGE (V)<br>CAPACITANCE (pF)<br>, GATE−TO−SOURCE VOLTAGE (V)<br>GS<br>V<br>**----- End of picture text -----**<br>


**Figure 7. Gate Charge Characteristics** 

**Figure 8. Capacitance vs. Drain−to−Source Voltage** 

**==> picture [491 x 383] intentionally omitted <==**

**----- Start of picture text -----**<br>
70 100K<br>60 V GS  = 10 V<br>10K<br>50<br>VGS = 8 V<br>40<br>1K<br>30<br>20<br>100<br>10<br>R � JC = 1.15 ° C/W<br>0 10<br>25 50 75 100 125 150 0.00001 0.0001 0.001 0.01 0.1 1<br>TC, CASE TEMPERATURE ( ° C) t, PULSE WIDTH (s)<br>Figure 9. Drain Current vs. Case Temperature Figure 10. Peak Power<br>100 1000<br>TC = 25 ° C<br>Single Pulse<br>100 R � JC = 1.15 ° C/W 10  � s<br>TJ(initial) = 25 ° C 100  � s<br>10 10<br>TJ(initial) = 100 ° C<br>T J(initial) = 150 ° C 10 ms 1 ms<br>1<br>RDS(on) Limit<br>Thermal Limit<br>Package Limit 100 ms/DC<br>1 0.1<br>0.001 0.01 0.1 1 10 100 0.1 1 10 100 200<br>tAV, TIME IN AVALANCHE (mS) VDS, DRAIN−TO−SOURCE VOLTAGE (V)<br>, DRAIN CURRENT (A)<br>ID<br>PEAK TRANSIENT POWER (W)<br>, DRAIN CURRENT (A)<br>, AVALANCHE CURRENT(A) ID<br>IAS<br>**----- End of picture text -----**<br>


**Figure 11. Unclamped Inductive Switching Capability** 

**Figure 12. Forward Bias Safe Operating Area** 

**www.onsemi.com** 

**5** 

**NTMFS015N15MC** 

## **TYPICAL CHARACTERISTICS** 

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**----- Start of picture text -----**<br>
10<br>1 Duty Cycle = 0.5<br>0.2<br>0.1<br>0.1 0.05<br>0.02<br>P DM Notes:<br>0.01 R � JC = 1.15 ° C/W<br>0.01 Peak TJ = PDM x Z � JC (t) + TC<br>Single Pulse t1 Duty Cycle, D = t1/t2<br>t 2<br>0.001<br>0.00001 0.0001 0.001 0.01 0.1 1<br>t, RECTANGULAR PULSE DURATION (sec)<br>C/W)<br>°<br>, EFFECTIVE TRANSIENT<br>JC<br>�<br>Z THERMAL RESISTANCE (<br>**----- End of picture text -----**<br>


**Figure 13. Transient Thermal Impedance** 

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**6** 

**NTMFS015N15MC** 

## **PACKAGE DIMENSIONS** 

**PQFN8 5X6, 1.27P** CASE 483AE ISSUE A 

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**7** 

**NTMFS015N15MC** 

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**8** 



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