# Power MOSFET, N Channel, 150 V, 78 A, 9000 µohm, PQFN, Surface Mount

![Product image](https://novapart.co/image/farnell:3528504/)

**URL**: https://novapart.co/products/NTMFS011N15MC/power-mosfet-n-channel-150-v-78-a-9000-ohm-pqfn
**SKU**: NTMFS011N15MC
**Manufacturer**: ONSEMI
**Category**: Semiconductors - Discretes || FETs || Single MOSFETs
**Price**: €5.7900
**Stock**: 1000+
**Lead Time**: 2 days (indicative)

## Specifications

| Parameter | Value |
|---|---|
| Msl | MSL 1 - Unlimited |
| Svhc | Lead (25-Jun-2025) |
| No. Of Pins | 8Pins |
| Channel Type | N Channel |
| Product Range | - |
| Qualification | - |
| Power Dissipation | 147W |
| Transistor Mounting | Surface Mount |
| Rds(On) Test Voltage | 10V |
| Transistor Case Style | PQFN |
| Drain Source Voltage Vds | 150V |
| Operating Temperature Max | 150°C |
| Continuous Drain Current Id | 78A |
| Drain Source On State Resistance | 9000µohm |
| Gate Source Threshold Voltage Max | 3.35V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:3528504/)

## MOSFET - Power, Single N-Channel, PQFN8 5x6 150 V, 11.5 m 78 A ~~—~~ NTMFS011N15MC 

**Features www.onsemi.com** • Small Footprint (5 x 6 mm) for Compact Design • Low R to Minimize Conduction Losses DS(on) • Low QG and Capacitance to Minimize Driver LossesG and Capacitance to Minimize Driver Losses and Capacitance to Minimize Driver Losses ~~——~~ **V(BR)DSS RDS(ON) MAX ID MAX** • These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS 150 V 11.5 m @ 10 V 35 A Compliant 13.2 m @ 8 V 18 A **Typical Applications N−Channel MOSFET** • Synchronous Rectification • AC−DC and DC−DC Power Supplies S 1 8 D • AC−DC Adapters (USB PD) SR S 2 7 D • Load Switch S 3 6 D **MAXIMUM RATINGS** (TJ = 25 ° C, Unless otherwise specified) G 4 5 D ~~ee~~ Drain−to−Source Breakdown Voltage **Parameter** V **Symbol** (BR)DSS ~~ee~~ **Value** 150 **Unit** V Gate−to−Source Voltage VGS ± 20 V D D D Continuous Drain Steady TC = 25 ° C ID 78 A D Current R JC (Note State 2) G S S Power Dissipation PD 147 W S R JC (Note 2) Pin 1 ~~lo~~ OY Continuous Drain Steady TA = 25 ° C ID 10.7 A Top Bottom Current R JA (Note State **PQFN8 5x6** 1, 2) **(Power 56)** Power Dissipation PD 2.7 W **CASE 483AE** R JA (Note 1, 2) ~~—} } Ett pe~~ Pulsed Drain CurTA = 25 ° C, tp = 250 ~~pf~~ IDM 259 ~~fe~~ A **MARKING DIAGRAM** rent s ~~poe~~ Operating Junction and Storage TemperaTJ, Tstg −55 to ° C ~~—~~ ture +150 XXXXXX AYWZZ Source Current (Body Diode) IS 133 A Single Pulse Drain−to−Source Avalanche EAS 76.1 mJ Energy (IAV = 39 A, L = 0.1 mH) ~~——aae~~ Lead Temperature Soldering Reflow for SolTL 300 ° C A = Assembly Location Y = Year dering Purposes (1/8” from case for 10 s) ~~ee~~ 

## **Features** 

- Small Footprint (5 x 6 mm) for Compact Design 

- Low R to Minimize Conduction Losses DS(on) 

- Low QG and Capacitance to Minimize Driver LossesG and Capacitance to Minimize Driver Losses and Capacitance to Minimize Driver Losses 

- These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS Compliant 

## **Typical Applications** 

- Synchronous Rectification 

- AC−DC and DC−DC Power Supplies 

- AC−DC Adapters (USB PD) SR 

- Load Switch 

**==> picture [106 x 128] intentionally omitted <==**

**----- Start of picture text -----**<br>
MARKING DIAGRAM<br>—<br>XXXXXX<br>AYWZZ<br>A = Assembly Location<br>Y = Year<br>W = Work Week<br>ZZ = Lot Traceability<br>**----- End of picture text -----**<br>


Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 

1. Surface−mounted on FR4 board using 1 in[2] pad size, 1 oz Cu pad. 

## **ORDERING INFORMATION** 

2. The entire application environment impacts the thermal resistance values shown, they are not constants and are only valid for the particular conditions noted. 

See detailed ordering and shipping information on page 2 of this data sheet. 

Publication Order Number: **NTMFS011N15MC/D** 

**1** 

© Semiconductor Components Industries, LLC, 2013 **March, 2020 − Rev. 1** 

**NTMFS011N15MC** 

## **THERMAL CHARACTERISTICS** 

|**Symbol**|**Parameter**|**Max**|**Unit**|
|---|---|---|---|
|R�JC|Junction−to−Case – Steady State (Note 5)|0.85|°C/W|
|R�JA|Junction−to−Ambient – Steady State (Note 5)|46||



## **ORDERING INFORMATION** 

|**ORDERING INFORMATION**||||
|---|---|---|---|
|**Device**|**Device Marking**|**Package**|**Shipping (Qty / Packing)**†|
|NTMFS011N15MC|NTMFS011N15MC|PQFN8 5x6 (Power 56)<br>(Pb−Free/Halogen Free)|3000 / Tape & Reel|



†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. 

**ELECTRICAL CHARACTERISTICS** (TJ = 25 ° C unless otherwise noted) 

|**ELECTRICA**|**L CHARACTERISTICS**(TJ= 25°C unl|ess otherwise noted)|ess otherwise noted)|||||
|---|---|---|---|---|---|---|---|
|**Symbol**|**Parameter**|**Test Conditions**||**Min**|**Typ**|**Max**|**Unit**|
|**OFF CHARACTERISTICS**||||||||
|V(BR)DSS|Drain�to�Source Breakdown Voltage|VGS= 0 V, ID= 250�A||150|||V|
|V(BR)DSS/ TJ|Drain�to�Source Breakdown Voltage<br>Temperature Coefficient|ID= 250�A, ref to 25°C|||85||mV/°C|
|IDSS|Zero Gate Voltage Drain Current|VGS  = 0 V,VDS= 120 V|TJ= 25°C|||1|�A|
||||TJ= 125°C|||100||
|IGSS|Gate�to�Source Leakage Current|VDS= 0 V, VGS=±20 V||||±100|nA|
|**ON CHARACTERISTICS**(Note 3)||||||||
|VGS(TH)|Gate Threshold Voltage|VGS= VDS, ID= 194�A||2.5|3.35|4.5|V|
|VGS(TH) / TJ|Negative Threshold Temperature<br>Coefficient|ID= 250�A, ref to 25°C|||−7.2||mV/°C|
|RDS(on)|Drain�to�Source On Resistance|VGS= 10 V, ID= 35 A|||9.0|11.5|m�|
|||VGS= 8 V, ID= 18 A|||9.7|13.2||
|gFS|Forward Transconductance|VDS= 10 V, ID= 18 A|||96|116|S|
|RG|Gate−Resistance|TA= 25°C|||0.9|1.1|�|
|**CHARGES & CAPACITANCES**||||||||
|CISS|Input Capacitance|VGS= 0 V, f = 1 MHz, VDS= 75 V|||2478|3592|pF|
|COSS|Output Capacitance||||728|1092||
|CRSS|Reverse Transfer Capacitance||||7.9|15||
|QG(TOT)|Total Gate Charge|VGS= 8 V, VDS= 75 V, ID= 35 A|||30.6|46|nC|
|QG(TOT)|Total Gate Charge|VGS= 10 V, VDS= 75 V, ID= 35 A|||30.7|46||
|QGS|Gate−to−Source Charge||||12.8|||
|QSW|Switching Charge||||9.4|||
|QGD|Gate−to−Drain Charge||||4.5|||
|QOSS|Output Charge|VGS= 0 V, VDD= 75 V|||95|||
|VGP|Plateau Voltage|VGS= 10 V, VDS= 75 V, ID= 35 A|||5.1||V|
|**SWITCHING CHARACTERISTICS**(Note 3)||||||||
|td(ON)|Turn�On Delay Time|VGS= 10 V, VDS= 75 V,ID= 35 A,<br>RG= 6�|||19.8||ns|
|tr|Rise Time||||4.7|||
|td(OFF)|Turn�Off Delay Time||||25.5|||
|tf|Fall Time||||4.0|||



**www.onsemi.com** 

**2** 

**NTMFS011N15MC** 

**ELECTRICAL CHARACTERISTICS** (TJ = 25 ° C unless otherwise noted) (continued) 

|VSD<br>~~ee~~|Forward Diode Voltage<br>~~ee~~|VGS= 0 V, IS= 35 A<br>~~ee~~<br>~~ee~~|TJ= 25°C<br>~~ee~~<br>~~a~~|~~ee~~<br>~~ee~~|0.869<br>~~ee~~<br>~~ee~~|~~ee~~<br>~~ee~~|V<br>~~ee~~|
|---|---|---|---|---|---|---|---|
||||TJ= 125°C<br>~~ee~~<br>~~a~~|~~ee~~<br>~~ee~~|0.725<br>~~ee~~<br>~~ee~~|~~ee~~<br>~~ee~~||
|tRR<br>~~ee~~<br>~~rs~~|Reverse Recovery Time<br>~~ee~~<br>~~ee~~|VGS= 0 V, dIS/dt = 300 A/ s,<br>IS= 35 A<br>~~eea~~<br>~~ee~~<br>~~ee~~||~~ee ~~<br>~~ee~~<br>~~a~~|48.8<br> ~~ee ~~<br>~~ee~~<br>~~a~~|~~ee~~<br>~~ee~~<br>~~ee~~|ns<br>~~ee~~|
|QRR<br>~~ee~~<br>~~rs~~|Reverse Recovery Charge<br>~~ee~~<br>~~ee~~|||~~ee~~<br>~~a~~|227<br>~~ee~~<br>~~a~~|~~ee~~<br>~~ee~~|nC<br>~~ee~~|
|tRR<br>~~rs~~<br>~~J~~|Reverse Recovery Time<br>~~ee~~<br>~~J~~|VGS= 0 V, dIS/dt = 1000 A/ s,<br>IS= 35 A<br>~~ee~~||~~a ~~<br>~~es~~|36.4<br> ~~a~~<br>~~ee~~|~~ee~~<br>~~ee~~|ns|
|QRR<br>~~a~~|Reverse Recovery Charge<br>~~a~~|||~~es~~|407<br>~~ee~~|~~ee~~|nC|



3. Switching characteristics are independent of operating junction temperatures. 

## NOTES: 

4. R JA is determined with the device mounted on a 1 in[2] pad 2 oz copper pad on a 1.5 x 1.5 in. board of FR−4 material. R CA is determined by the user’s board design. 

a) 46 ° C/W when mounted on b) 116 ° C/W when mounted on a 1 in[2] pad of 2 oz copper. a minimum pad of 2 oz copper. 

5. Pulse Test: Pulse Width < 300 s, Duty cycle < 2.0%. wu 

6. EAS of 196 mJ is based on starting TJ = 25 C; L = 3 mH, IAS = 12.7 A, VDD = 100 V, VGS = 15 V. 100% tested at L = 0.1 mH, IAS = 41 A. 

7. Pulsed ID please refer to Fig 11 SOA graph for more details. 

8. Computed continuous current limited to Max Junction Temperature only, actual continuous current will be limited by thermal & electro−mechanical application board design. 

**www.onsemi.com** 

**3** 

**NTMFS011N15MC** 

## **TYPICAL CHARACTERISTICS** (TJ = 25 ° C unless otherwise noted.) 

**==> picture [491 x 593] intentionally omitted <==**

**----- Start of picture text -----**<br>
200 6<br>180 Pulse Duration = 250  � s VGS = 10 V 8 V VGS = 5 V VGS = 6 V VGS = 7 V VGS =<br>Duty Cycle = 0.5% Max 8 V<br>5<br>160<br>7 V<br>140<br>4<br>120<br>100 3<br>80 VGS = 10 V<br>6 V 2<br>60<br>40<br>1<br>20 5 V Pulse Duration = 250  � s<br>Duty Cycle = 0.5% Max<br>0 0<br>0 1 2 3 4 5 0 60 120 180 240 300<br>VDS, DRAIN−TO−SOURCE VOLTAGE (V) ID, DRAIN CURRENT (A)<br>Figure 1. On−Region Characteristics Figure 2. Normalized On−Resistance vs. Drain<br>Current and Gate Voltage<br>2.2 50<br>2.0 VIDGS= 35 A = 10 V 4045 Pulse Duration = 250 Duty Cycle = 0.5% Max � s<br>1.8 ID = 35 A<br>35<br>1.6 30<br>1.4 25<br>20 TJ = 125 ° C<br>1.2<br>15<br>1.0 TJ = 25 ° C<br>10<br>0.8<br>5<br>0.6 0<br>−25 0 25 50 75 100 125 150 4 5 6 7 8 9 10<br>TJ, JUNCTION TEMPERATURE ( ° C) VGS, GATE−TO−SOURCE VOLTAGE (V)<br>Figure 3. Normalized On−Resistance vs. Figure 4. On−Resistance vs. Gate−to−Source<br>Junction Temperature Voltage<br>200<br>Pulse Duration = 250  � s VGS = 0 V<br>175 Duty Cycle = 0.5% Max<br>VDS = 10 V 100<br>150<br>125<br>100 TJ = 150 ° C<br>10<br>75 TJ = 25 ° C<br>50<br>25 TJ = 150 ° C TJ = −55 ° C TJ = 25 ° C TJ = −55 ° C<br>0 1<br>2 3 4 5 6 7 8 0.2 0.4 0.6 0.8 1.0 1.2<br>VGS, GATE−TO−SOURCE VOLTAGE (V) VSD, BODY DIODE FORWARD VOLTAGE (V)<br>ON−RESISTANCE<br>, DRAIN CURRENT (A)<br>ID<br>NORMALIZED DRAIN−TO−SOURCE<br>) �<br>ON−RESISTANCE , DRAIN−TO−SOURCE<br>ON−RESISTANCE (m<br>rDS(on)<br>NORMALIZED DRAIN−TO−SOURCE<br>, DRAIN CURRENT (A)<br>ID<br>, REVERSE DRAIN CURRENT (A)<br>IS<br>**----- End of picture text -----**<br>


**Figure 5. Transfer Characteristics** 

**Figure 6. Source−to−Drain Diode Forward Voltage vs. Source Current** 

**www.onsemi.com** 

**4** 

**NTMFS011N15MC** 

## **TYPICAL CHARACTERISTICS** (TJ = 25 ° C unless otherwise noted.) 

**==> picture [485 x 593] intentionally omitted <==**

**----- Start of picture text -----**<br>
10 10K<br>VDS = 75 V VDD = 25 V Ciss<br>8 T IDJ = 35 A  = 25 ° C VDD = 50 V VDD = 75 V 1K Coss<br>6<br>100<br>4<br>C rss<br>10 VGS = 0 V<br>2 TJ = 25 ° C<br>f = 1 MHz<br>0 1<br>0 5 10 15 20 25 30 35 0.1 1 10 100<br>Qg, GATE CHARGE (nC) VDS, DRAIN−TO−SOURCE VOLTAGE (V)<br>Figure 7. Gate Charge Characteristics Figure 8. Capacitance vs. Drain−to−Source<br>Voltage<br>100 100<br>90<br>80<br>70<br>VGS = 10 VGS = 10 V = 10 V<br>60<br>10 50 V GS  = 8 V<br>40<br>TJ = 100 ° C 30<br>TJ = 25 ° C 20<br>1 TJ = 125 ° C 1000 R � JC = 0.85 = 0.85 ° C/W<br>0.001 0.01 0.1 1 10 100 25 50 75 100 125<br>tAV, TIME IN AVALANCHE (ms) TC, CASE TEMPERATURE (C, CASE TEMPERATURE (, CASE TEMPERATURE ( ° C)<br>Figure 9. Unclamped Inductive Switching Figure 10. Maximum Continuous Drain<br>Capability Current vs. Case Temperature<br>1K 100K<br>Single Pulse<br>10  � s R � JC  = 0.85 ° C/W/WW<br>100 100  � s 10K TC = 25C = 25 = 25 ° C<br>1 ms<br>10 ms<br>10 1K<br>Single Pulse<br>R � JC = 0.85 ° C/W<br>1 TC = 25 ° C 100 ms/DC 100<br>RDS(on) Limit<br>Thermal Limit<br>Package Limit<br>0.1 10<br>0.1 1 10 100 0.00001 0.0001 0.001 0.01 0.1<br>VDS, DRAIN−TO−SOURCE VOLTAGE (V) t, PULSE WIDTH (sec)<br>CAPACITANCE (pF)<br>, GATE−TO−SOURCE VOLTAGE (V)<br>GS<br>V<br>, DRAIN CURRENT (A)<br>, AVALANCHE CURRENT (A) IDD<br>IAS<br>, DRAIN CURRENT (A)<br>ID<br>, PEAK TRANSIENT POWER (W)<br>(PK)<br>P<br>**----- End of picture text -----**<br>


**==> picture [239 x 381] intentionally omitted <==**

**----- Start of picture text -----**<br>
100<br>90<br>80<br>70<br>VGS = 10 VGS = 10 V = 10 V<br>60<br>50 V GS  = 8 V<br>40<br>30<br>20<br>R � JC = 0.85 = 0.85 ° C/W<br>1000<br>25 50 75 100 125 150<br>TC, CASE TEMPERATURE (C, CASE TEMPERATURE (, CASE TEMPERATURE ( ° C)<br>Figure 10. Maximum Continuous Drain<br>Current vs. Case Temperature<br>100K<br>Single Pulse<br>R � JC  = 0.85 ° C/W/WW<br>TC = 25C = 25 = 25 ° C<br>10K<br>1K<br>100<br>10<br>0.00001 0.0001 0.001 0.01 0.1 1<br>t, PULSE WIDTH (sec)<br>, DRAIN CURRENT (A)<br>IDD<br>, PEAK TRANSIENT POWER (W)<br>(PK)<br>P<br>**----- End of picture text -----**<br>


**Figure 11. Forward Bias Safe Operating Area** 

**Figure 12. Single Pulse Maximum Power Dissipation** 

**www.onsemi.com** 

**5** 

**NTMFS011N15MC** 

## **TYPICAL CHARACTERISTICS** (TJ = 25 ° C unless otherwise noted.) 

**==> picture [492 x 175] intentionally omitted <==**

**----- Start of picture text -----**<br>
1<br>50% Duty Cycle<br>20%<br>10%<br>0.1<br>5%<br>PDM<br>2%<br>t 1<br>0.01 1% NOTES: t 2<br>Z � JC(t) = r(t) x R � JC<br>Single Pulse R � JC = 0.85 ° C/W<br>Peak TJ = PDM x Z � JC(t) + TC<br>Duty Cycle, D = t1/t2<br>0.001<br>0.00001 0.0001 0.001 0.01 0.1 1<br>t, RECTANGULAR PULSE DURATION (sec)<br>SIENT THERMAL RESISTANCE<br>r(t), NORMALIZED EFFECTIVE TRAN-<br>**----- End of picture text -----**<br>


**Figure 13. Junction−to−Case Transient Thermal Response Curve** 

**www.onsemi.com** 

**6** 

**NTMFS011N15MC** 

## **PACKAGE DIMENSIONS** 

**PQFN8 5X6, 1.27P** CASE 483AE ISSUE A 

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**www.onsemi.com** 

**7** 

**NTMFS011N15MC** 

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**8** 



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