# Power MOSFET, N Channel, 30 V, 17.2 A, 4900 µohm, WDFN, Surface Mount

![Product image](https://novapart.co/image/farnell:3616364/)

**URL**: https://novapart.co/products/NTLJS3D9N03CTAG/power-mosfet-n-channel-30-v-172-a-4900-ohm-wdfn
**SKU**: NTLJS3D9N03CTAG
**Manufacturer**: ONSEMI
**Category**: Semiconductors - Discretes || FETs || Single MOSFETs
**Price**: €0.3390
**Stock**: 10+

## Specifications

| Parameter | Value |
|---|---|
| Msl | MSL 1 - Unlimited |
| Svhc | No SVHC (15-Jan-2018) |
| No. Of Pins | 6Pins |
| Channel Type | N Channel |
| Product Range | - |
| Qualification | - |
| Power Dissipation | 2.4W |
| Transistor Mounting | Surface Mount |
| Rds(On) Test Voltage | 4.5V |
| Transistor Case Style | WDFN |
| Drain Source Voltage Vds | 30V |
| Operating Temperature Max | 150°C |
| Continuous Drain Current Id | 17.2A |
| Drain Source On State Resistance | 4900µohm |
| Gate Source Threshold Voltage Max | 1.1V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:3616364/)

MOSFET - Power, Single N-Channel, WDFN6 

30 V, 4.9 - 18.9 m 17.2 A 

## NTLJS3D9N03C 

## **Features** 

- Small Footprint (4 mm[2] ) for Compact Design 

**www.onsemi.com** 

- Low R to Minimize Conduction Losses DS(on) 

- These Devices are Pb−Free, Halogen−Free/BFR−Free and are RoHS Compliant 

## **Applications** 

- Wireless Chargers 

- Power Load Switch 

- Power Management and Protection 

- Battery Management 

|**V(BR)DSS**|**RDS(on) MAX**|**ID MAX**|
|---|---|---|
|30 V|4.9 m @ 4.5 V|17.2 A|
||6.8 m @ 3.3 V||
||10 m @ 2.5 V||
||18.9 m @ 1.8 V||



## **MAXIMUM RATINGS** (TJ = 25 ° C unless otherwise noted) 

||||~~es~~|~~es~~||
|---|---|---|---|---|---|
|**Parameter**<br>~~es~~|||**Symbol**<br>~~es~~<br>~~es~~|**Value**<br>~~es~~<br>~~es~~|**Unit**<br>~~es~~|
|Drain−to−Source Voltage|||VDSS<br>~~es~~|30<br>~~es~~|V|
|Gate−to−Source Voltage|||VGS|±12|V|
|Continuous Drain Cur-<br>rent R JA(Notes 1, 3)|Steady<br>State|TA= 25°C|ID|17.2|A|
|||TA= 85°C||12.4||
|Power Dissipation<br>R JA(Notes 1, 3)<br>~~ee~~||TA= 25°C<br>~~ee~~|PD|2.40|W|
|Continuous Drain Cur-<br>rent R JA(Notes 2, 3)<br>~~ee~~|Steady<br>State<br>~~|~~|TA= 25°C<br>~~ee~~<br>~~|~~|ID|10.3<br>~~Pe~~|A|
|||TA= 85°C<br>~~ee~~<br>~~|~~||7.4<br>~~Pe~~||
|Power Dissipation<br>R JA(Notes 2, 3)<br>~~ee~~||TA= 25°C<br>~~ee~~<br>~~|~~|PD|0.86<br>~~Pe~~|W|
|Pulsed Drain Current|TA= 25°C, tp= 10 s||IDM|71|A|
|Operating Junction and Storage Temperature<br>Range|||TJ, Tstg|−55 to<br>+150|°C|
|Lead Temperature for Soldering Purposes<br>(1/8″from case for 10 s)|||TL|260|°C|



Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 

## **ELECTRICAL CONNECTION** 

**==> picture [93 x 101] intentionally omitted <==**

**----- Start of picture text -----**<br>
D<br>G<br>S<br>N−CHANNEL MOSFET<br>**----- End of picture text -----**<br>


## **MARKING DIAGRAM** 

YWZZ A3D9 

**==> picture [72 x 17] intentionally omitted <==**

**----- Start of picture text -----**<br>
WDFN6 (2.05x2.05)<br>CASE 483AV<br>**----- End of picture text -----**<br>


YW = Date Code ZZ = Assembly Lot Code A = Assembly Site Code A3D9 = Specific Device Code 

## **THERMAL RESISTANCE MAXIMUM RATINGS** (Note 1) 

~~es~~ **Parameter Symbol** ~~es~~ **Value** ~~ee~~ **Unit** Junction−to−Ambient − Steady State (Note 1) R JA 52 ° C/W ~~||ee~~ Junction−to−Ambient − Steady State (Note 2) ~~ee~~ R JA 145 _ 

1. Surface−mounted on FR4 board using 1 in[2] pad size, 2 oz. Cu pad. 

## **ORDERING INFORMATION** 

See detailed ordering, marking and shipping information in the package dimensions section on page 4 of this data sheet. 

2. Surface−mounted on FR4 board using minimum pad size, 2 oz. Cu pad. 

3. The entire application environment impacts the thermal resistance values shown, they are not constants and are only valid for the particular conditions noted. Actual continuous current will be limited by thermal & electro−mechanical application board design. R CA is determined by the user’s board design. 

Publication Order Number: **NTLJS3D9N03C/D** 

**1** 

© Semiconductor Components Industries, LLC, 2019 **March, 2020 − Rev. 0** 

## **NTLJS3D9N03C** 

## **ELECTRICAL CHARACTERISTICS** (TJ = 25 ° C unless otherwise noted) 

|**ELECTRICAL CHARACTERISTIC**|**S **(TJ= 25°C|unless otherwise noted)|unless otherwise noted)|||||
|---|---|---|---|---|---|---|---|
|**Parameter**|**Symbol**|**Test Condition**||**Min**|**Typ**|**Max**|**Unit**|
|**OFF CHARACTERISTICS**||||||||
|Drain−to−Source Breakdown Voltage|V(BR)DSS|VGS= 0 V, ID= 250�A||30|||V|
|Drain−to−Source Breakdown<br>Voltage Temperature Coefficient|V(BR)DSS/<br>TJ|ID= 250�A, ref to 25°C|||24.5||mV/°C|
|Zero Gate Voltage Drain Current|IDSS|VGS= 0 V,<br>VDS= 24 V|TJ= 25°C|||1|�A|
||||TJ= 125°C|||10||
|Gate−to−Source Leakage Current|IGSS|VDS= 0 V, VGS=±12 V||||±100|nA|
|**ON CHARACTERISTICS**(Note 4)||||||||
|Gate Threshold Voltage|VGS(TH)|VGS= VDS, ID= 250�A||0.6||1.1|V|
|Threshold Temperature Coefficient|VGS/TJ|ID= 250�A, ref to 25°C|||−3.83||mV/°C|
|Drain−to−Source On Resistance|RDS(on)|VGS= 4.5 V, ID= 10 A|||3.6|4.9|m�|
|||VGS= 3.3 V, ID= 5 A|||4.1|6.8||
|||VGS= 2.5 V, ID= 4 A|||5.4|10||
|||VGS= 1.8 V, ID= 2 A|||9.8|18.9||
|Forward Transconductance|gFS|VDS= 5 V, ID= 10 A|||69||S|
|Gate Resistance|RG|TA= 25°C|||1.65||�|
|**CHARGES AND CAPACITANCES**||||||||
|Input Capacitance|Ciss|VGS= 0 V, VDS= 15 V,<br>f = 1.0 MHz|||1565||pF|
|Output Capacitance|Coss||||677|||
|Reverse Transfer Capacitance|Crss||||54.8|||
|Total Gate Charge|QG(TOT)|VGS = 4.5 V, VDS = 15 V,<br>ID = 10 A|||14.7||nC|
|Threshold Gate Charge|QG(TH)||||1.17||nC|
|Gate−to−Source Charge|QGS||||2.31|||
|Gate−to−Drain Charge|QGD||||3.29|||
|**SWITCHING CHARACTERISTICS, VGS = 4.5 V**(Note 5)||||||||
|Turn−On Delay Time|td(on)|VGS= 4.5 V, VDD= 15 V,<br>ID= 10 A, RG= 6�|||10.1||ns|
|Rise Time|tr||||9.5|||
|Turn−Off Delay Time|td(off)||||40.6|||
|Fall Time|tf||||15.4|||
|**DRAIN−SOURCE DIODE CHARACTERISTICS**||||||||
|Forward Diode Voltage|VSD|VGS= 0 V,<br>IS= 10 A|TJ= 25°C||0.75|1.2|V|
||||TJ= 125°C||0.611|||
|Reverse Recovery Time|tRR|VGS= 0 V, dlS/dt<br>IS= 10|= 100 A/�s,<br>A||31.7||ns|
|Reverse Recovery Charge|QRR||||11.2||nC|



Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. 

4. Pulse Test: Pulse Width ≤ 300 � s, Duty Cycle ≤ 2%. 

5. Switching characteristics are independent of operating junction temperatures. 

**www.onsemi.com** 

**2** 

**NTLJS3D9N03C** 

## **TYPICAL CHARACTERISTICS** 

**==> picture [490 x 594] intentionally omitted <==**

**----- Start of picture text -----**<br>
100 100<br>VGS = 4.5 V to 1.8 V<br>90 90<br>80 1.6 V 80<br>70 70<br>60 60<br>50 50<br>40 40 TJ = 25 ° C<br>30 30<br>20 20<br>100 100 T J  = 125 ° C TJ = −55 ° C<br>0 1 2 3 4 5 0 1 2 3 4 5<br>VDS, DRAIN−TO−SOURCE VOLTAGE (V) VGS, GATE−TO−SOURCE VOLTAGE (V)<br>Figure 1. On−Region Characteristics Figure 2. Transfer Characteristics<br>40 20<br>35 T J = 25 ° C 18 T J  = 25 ° C<br>ID = 10 A<br>16<br>30<br>14<br>25<br>12<br>20 10<br>15 8 V GS  = 2.5 V<br>6<br>10 VGS = 3.3 V<br>4<br>5 VGS = 4.5 V<br>2<br>0 0<br>0 1 2 3 4 5 6 7 8 9 10 0 10 20 30 40 50 60 70 80 90 100<br>VGS, GATE−TO−SOURCE VOLTAGE (V) ID, DRAIN CURRENT (A)<br>Figure 3. On−Resistance vs. Gate−to−Source Figure 4. On−Resistance vs. Drain Current and<br>Voltage (V) Gate Voltage<br>2.0 100K<br>1.8 V I DGS  = 10 A  = 4.5 V TJ = 150 ° C<br>10K<br>1.6 TJ = 125 ° C<br>1K<br>1.4<br>TJ = 85 ° C<br>1.2 100<br>1.0<br>10<br>0.8 T J  = 25 ° C<br>1<br>0.6<br>0.4 0.1<br>−50 −25 0 25 50 75 100 125 150 5 9 13 17 21 25 29<br>TJ, JUNCTION TEMPERATURE ( ° C) VDS, DRAIN−TO−SOURCE VOLTAGE (V)<br>, DRAIN CURRENT (A)ID , DRAIN CURRENT (A)ID<br>) �<br>) �<br>, DRAIN−TO−SOURCE<br>RESISTANCE (m<br>DS(on)<br>R<br>, DRAIN−TO−SOURCE RESISTANCE (m<br>DS(on)<br>R<br>, LEAKAGE (nA)<br>, NORMALIZED DRAIN−TO− IDSS<br>SOURCE RESISTANCE<br>DS(on)<br>R<br>**----- End of picture text -----**<br>


**Figure 5. On−Resistance Variation with Temperature** 

**Figure 6. Drain−to−Source Leakage Current vs. Voltage** 

**www.onsemi.com** 

**3** 

**NTLJS3D9N03C** 

## **TYPICAL CHARACTERISTICS** 

**==> picture [491 x 384] intentionally omitted <==**

**----- Start of picture text -----**<br>
10K 10<br>9 V DS  = 15 V<br>C ISS ID = 10 A<br>1K COSS 87 T J  = 25 ° C<br>6<br>100 5<br>CRSS 4 QGS<br>10 3 QGD<br>f = 1 MHz 2<br>VT J GS = 25 = 0 V ° C 1<br>1 0<br>0 5 10 15 20 25 0 5 10 15 20 25 30 35<br>VDS, DRAIN−TO−SOURCE VOLTAGE (V) QG, TOTAL GATE CHARGE (nC)<br>Figure 7. Capacitance Variation Figure 8. Gate−to−Source vs. Total Charge<br>1K 10<br>VGS = 4.5 V V GS  = 0 V<br>V DS  = 15 V<br>I D = 10 A<br>t d(off)<br>100 tf<br>tr<br>t d(on)<br>10<br>TJ = 125 ° C TJ = 25 ° C TJ = −55 ° C<br>1 1<br>1 10 100 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0<br>RG, GATE RESISTANCE ( � ) VSD, SOURCE−TO−DRAIN VOLTAGE (V)<br>C, CAPACITANCE (pF)<br>, GATE−TO−SOURCE VOLTAGE (V)<br>GS<br>V<br>t, TIME (ns)<br>, SOURCE CURRENT (A)<br>IS<br>**----- End of picture text -----**<br>


**Figure 9. Resistive Switching Time Variation vs. Gate Resistance** 

**Figure 10. Diode Forward Voltage vs. Current** 

## **DEVICE ORDERING INFORMATION** 

|**DEVICE ORDERING INFORMATION**|||
|---|---|---|
|**Device**|**Package**|**Shipping**†|
|NTLJS3D9N03CTAG|WDFN6<br>(Pb−Free)|3000 / Tape & Reel|



†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. 

**www.onsemi.com** 

**4** 

MECHANICAL CASE OUTLINE **PACKAGE DIMENSIONS** 

**WDFN6 2.05X2.05, 0.65P** CASE 483AV ISSUE A 

## DATE 02 APR 2019 

## **DOCUMENT NUMBER:** 

**98AON13671G** 

**DESCRIPTION: WDFN6 2.05X2.05, 0.65P** 

Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed  versions are uncontrolled  except when stamped  “CONTROLLED COPY” in red. **PAGE 1 OF 1** 

**onsemi** and                     are trademarks of Semiconductor Components Industries, LLC dba **onsemi** or its subsidiaries in the United States and/or other countries. **onsemi** reserves the right to make changes without further notice to any products herein. **onsemi** makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does **onsemi** assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. **onsemi** does not convey any license under its patent rights nor the rights of others. 

www.onsemi.com 

© Semiconductor Components Industries, LLC, 2016 

**onsemi** , , and other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “ **onsemi** ” or its affiliates and/or subsidiaries in the United States and/or other countries. **onsemi** owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of **onsemi** ’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. **onsemi** reserves the right to make changes at any time to any products or information herein, without notice. The information herein is provided “as−is” and **onsemi** makes no warranty, representation or guarantee regarding the accuracy of the information, product features, availability, functionality, or suitability of its products for any particular purpose, nor does **onsemi** assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using **onsemi** products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by **onsemi** . “Typical” parameters which may be provided in **onsemi** data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. **onsemi** does not convey any license under any of its intellectual property rights nor the rights of others. **onsemi** products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use **onsemi** products for any such unintended or unauthorized application, Buyer shall indemnify and hold **onsemi** and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that **onsemi** was negligent regarding the design or manufacture of the part. **onsemi** is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. 

## **ADDITIONAL INFORMATION** 

**TECHNICAL PUBLICATIONS** : **ONLINE SUPPORT** : www.onsemi.com/support **Technical Library:** www.onsemi.com/design/resources/technical−documentation **For additional information, please contact your local Sales Representative at onsemi Website:** www.onsemi.com www.onsemi.com/support/sales 

**==> picture [232 x 43] intentionally omitted <==**

 



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