# Power MOSFET, N Channel, 20 V, 890 mA, 0.35 ohm, SOT-723, Surface Mount

![Product image](https://novapart.co/image/farnell:2724412RL/)

**URL**: https://novapart.co/products/NTK3134NT5G/power-mosfet-n-channel-20-v-890-ma-035-ohm-sot-723
**SKU**: NTK3134NT5G
**Manufacturer**: ONSEMI
**Category**: Semiconductors - Discretes || FETs || Single MOSFETs
**Price**: €0.0390
**Stock**: 1000+
**Lead Time**: 2 days (indicative)

## Description

Transistor Polarity:N Channel; Continuous Drain Current Id:890mA; Drain Source Voltage Vds:20V; On Resistance Rds(on):0.2ohm; Rds(on) Test Voltage Vgs:4.5V; Threshold Voltage Vgs:1.2V;

## Specifications

| Parameter | Value |
|---|---|
| Msl | MSL 1 - Unlimited |
| Svhc | No SVHC (25-Jun-2025) |
| No. Of Pins | 3Pins |
| Channel Type | N Channel |
| Product Range | - |
| Qualification | - |
| Power Dissipation | 450mW |
| Transistor Mounting | Surface Mount |
| Rds(On) Test Voltage | 4.5V |
| Transistor Case Style | SOT-723 |
| Drain Source Voltage Vds | 20V |
| Operating Temperature Max | 150°C |
| Continuous Drain Current Id | 890mA |
| Drain Source On State Resistance | 0.35ohm |
| Gate Source Threshold Voltage Max | 1.2V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:2724412RL/)

NTK3134N 

## MOSFET – Power, Single, N-Channel with ESD Protection, SOT-723 

## 20 V, 890 mA 

**www.onsemi.com** 

## **Features** 

- N−Channel Switch with Low R DS(on) 

- 44% Smaller Footprint and 38% Thinner than SC89 

- Low Threshold Levels Allowing 1.5 V RDS(on) Rating 

- Operated at Low Logic Level Gate Drive 

- These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS Compliant 

|**V(BR)DSS**<br>~~==~~|**RDS(on) TYP**<br>~~==~~|**ID Max**<br>~~==~~|
|---|---|---|
|20 V<br>~~==~~|0.20  @ 4.5 V<br>~~==~~|890 mA<br>~~==~~|
||0.26  @ 2.5 V<br>~~==~~|790 mA<br>~~==~~|
||0.43  @ 1.8 V<br>~~==~~|700 mA<br>~~==~~|
||0.56  @ 1.5 V|200 mA|



## **SOT−723 (3−LEAD)** 

## **Applications** 

- Load/Power Switching 

- Interface Switching 

- Logic Level Shift 

- Battery Management for Ultra Small Portable Electronics 

**MAXIMUM RATINGS** (TJ = 25 ° C unless otherwise stated) 

|**MAXIMUM RATINGS**(TJ = 25J = 25= 25°C unless otherwise stated)|**MAXIMUM RATINGS**(TJ = 25J = 25= 25°C unless otherwise stated)|**MAXIMUM RATINGS**(TJ = 25J = 25= 25°C unless otherwise stated)|C unless otherwise stated)|C unless otherwise stated)||
|---|---|---|---|---|---|
|**Parameter**|||**Symbol**|**Value**|**Unit**|
|Drain−to−Source Voltage|||VDSS|20|V|
|Gate−to−Source Voltage|||VGS|±8|V|
|Continuous Drain<br>Current (Note 1)<br>~~ES~~|Steady<br>State<br>~~ES~~|TA= 25°C<br>~~ES~~|ID<br>~~ES~~|890<br>~~ES~~|mA<br>~~ES~~|
|||TA= 85°C<br>~~ES~~||640<br>~~ES~~||
||t≤5 s<br>~~ES~~|TA= 25°C<br>~~ES~~||990<br>~~ES~~||
|Power Dissipation<br>(Note 1)<br>~~ES~~<br>~~pT~~|Steady<br>State<br>~~ES~~<br>~~pT~~|TA= 25°C<br>~~ES~~<br>~~pT~~|PD<br>~~ES~~<br>~~pT~~|450<br>~~ES~~<br>~~pT~~|mW<br>~~ES~~<br>~~pT~~|
||t≤5 s<br>~~pT~~|||550<br>~~pT~~||
|Continuous Drain<br>Current (Note 2)<br>~~oe~~|Steady<br>State<br>~~oe~~<br>~~EE~~|TA= 25°C<br>~~oe~~|ID<br>~~oe~~|750<br>~~oe~~|mA<br>~~oe~~|
|||TA= 85°C<br>~~oe~~||540<br>~~oe~~||
|Power Dissipation<br>(Note 2)<br>~~oe~~<br>~~EE~~||TA= 25°C<br>~~oe~~<br>~~EE~~|PD<br>~~oe~~<br>~~EE~~|310<br>~~oe~~<br>~~EE~~|mW<br>~~oe~~<br>~~EE~~|
|Pulsed Drain<br>Current<br>~~oe~~<br>~~EE~~|tp= 10 s<br>~~oe~~<br>~~EE~~||IDM<br>~~oe~~<br>~~EE~~|1.8<br>~~oe~~<br>~~EE~~|A<br>~~oe~~<br>~~EE~~|
|Operating Junction and Storage<br>Temperature<br>~~EE~~<br>~~ee~~|||TJ, TSTG<br>~~EE~~<br>~~ee~~|−55 to<br>150<br>~~EE~~<br>~~ee~~|°C<br>~~EE ~~<br>~~ee~~|
|Lead Temperature for Soldering Purposes<br>(1/8” from case for 10 s)<br>~~ee~~|||TL<br>~~ee~~|260<br>~~ee~~|°C<br>~~ee~~|



Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 

**==> picture [192 x 354] intentionally omitted <==**

**----- Start of picture text -----**<br>
3<br>1 2<br>1 − Gate<br>2 − Source<br>Top View<br>3 − Drain<br>MARKING DIAGRAM<br>KF M<br>SOT−723 Se |<br>CASE 631AA 1<br>STYLE 5<br>KF = Specific Device Code<br>M = Date Code<br>ORDERING INFORMATION<br>Device Package Shipping [†]<br>NTK3134NT1G SOT−723 4000 / Tape & Reel<br>NTK3134NT5G SOT−723 8000 / Tape & Reel<br>SS<br>†For information on tape and reel specifications,<br>including part orientation and tape sizes, please<br>refer to our Tape and Reel Packaging Specification<br>Brochure, BRD8011/D.<br>**----- End of picture text -----**<br>


1. Surface mounted on FR4 board using 1 in sq pad size (Cu area = 1.127 in sq [1 oz] including traces) 

2. Surface mounted on FR4 board using the minimum recommended pad size 

Publication Order Number: **NTK3134N/D** 

**1** 

© Semiconductor Components Industries, LLC, 2014 **May, 2019 − Rev. 4** 

**NTK3134N** 

## **THERMAL RESISTANCE RATINGS** 

|**THERMAL RESISTANCE RATINGS**||||
|---|---|---|---|
|**Parameter**|**Symbol**|**Max**|**Unit**|
|Junction−to−Ambient – Steady State(Note 3)|R�JA|280|°C/W|
|Junction−to−Ambient – t = 5 s(Note 3)|R�JA|228||
|Junction−to−Ambient – Steady State Minimum Pad(Note 4)|R�JA|400||



3. Surface mounted on FR4 board using 1 in sq pad size (Cu area = 1.127 in sq [1 oz] including traces) 

4. Surface mounted on FR4 board using the minimum recommended pad size 

**MOSFET ELECTRICAL CHARACTERISTICS** (TJ = 25 ° C unless otherwise specified) 

|**Parameter**|**Symbol**|**Test Condition**|**Test Condition**|**Min**|**Typ**|**Max**|**Unit**|
|---|---|---|---|---|---|---|---|
|**OFF CHARACTERISTICS**||||||||
|Drain−to−Source Breakdown<br>Voltage|V(BR)DSS|VGS= 0 V, ID= 250�A||20|||V|
|Drain−to−Source Breakdown<br>Voltage Temperature Coefficient|V(BR)DSS/TJ|ID= 250�A, Reference to 25°C|||18||mV/°C|
|Zero Gate Voltage Drain Current|IDSS|VGS= 0 V,<br>VDS= 16 V|TJ= 25°C|||1.0|�A|
||||TJ= 125°C|||2.0||
|Gate−to−Source Leakage Current|IGSS|VDS= 0 V, VGS=±4.5 V||||±0.5|�A|
|**ON CHARACTERISTICS**(Note 5)||||||||
|Gate Threshold Voltage|VGS(TH)|VGS= VDS, ID= 250�A||0.45||1.2|V|
|Negative Threshold Temperature<br>Coefficient|VGS(TH)/TJ||||2.4||mV/°C|
|Drain−to−Source On Resistance|RDS(on)|VGS= 4.5 V, ID= 890 mA|||0.20|0.35|�|
|||VGS= 2.5 V, ID= 780 mA|||0.26|0.45||
|||VGS= 1.8 V, ID= 700 mA|||0.43|0.65||
|||VGS= 1.5 V, ID= 200 mA|||0.56|1.2||
|Forward Transconductance|gFS|VDS= 10 V, ID= 800 mA|||1.6||S|
|**CHARGES, CAPACITANCES AND GATE RESISTANCE**||||||||
|Input Capacitance|CISS|VGS= 0 V, f = 1 MHz, VDS= 16 V|||79|120|pF|
|Output Capacitance|COSS||||13|20||
|Reverse Transfer Capacitance|CRSS||||9.0|15||
|**SWITCHING CHARACTERISTICS, VGS = 4.5 V**(Note 6)||||||||
|Turn On Delay Time|td(ON)|VGS= 4.5 V, VDS= 10 V, ID= 500 mA,<br>RG= 10�|||6.7||ns|
|Rise Time|tr||||4.8|||
|TurnOff Delay Time|td(OFF)||||17.3|||
|Fall Time|tf||||7.4|||
|**DRAIN SOURCE DIODE CHARACTERISTICS**||||||||
|Forward Diode Voltage|VSD|VGS= 0 V, IS= 350 mA|TJ= 25°C||0.75|1.2|V|
|Reverse Recovery Time|tRR|VGS= 0 V, dISD/dt= 100 A/�s,<br>IS= 1.0 A, VDD= 20 V|||8.1||ns|
|Charge Time|ta||||6.4|||
|Discharge Time|tb||||1.7|||
|Reverse Recovery Charge|QRR||||3.0||nC|



Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. 5. Pulse Test: pulse width = 300 � s, duty cycle = 2% 6. Switching characteristics are independent of operating junction temperatures 

**www.onsemi.com** 

**2** 

**NTK3134N** 

## **TYPICAL CHARACTERISTICS** 

**==> picture [491 x 591] intentionally omitted <==**

**----- Start of picture text -----**<br>
2.0 2.0<br>2.0 V<br>V DS ≥  5 V<br>VGS = 4.5 V to 2.2 V<br>1.5 1.5<br>1.8 V<br>1.0 T J  = 25 ° C 1.0<br>1.6 V T J  = 25 ° C<br>0.5 1.5 V 0.5<br>TJ = 125 ° C<br>1.4 V<br>TJ = −55 ° C<br>0 0<br>0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5 6 0.75 1.0 1.25 1.5 1.75 2.0<br>VDS, DRAIN−TO−SOURCE VOLTAGE (V) VGS, GATE−TO−SOURCE VOLTAGE (V)<br>Figure 1. On−Region Characteristics Figure 2. Transfer Characteristics<br>1.50 0.30<br>TJ = 25 ° C<br>1.25 ITDJ = 0.89 A = 25 ° C 0.28<br>1.00 0.25 VGS = 2.5 V<br>0.75 0.23<br>0.50 0.20<br>0.25 0.18 VGS = 4.5 V<br>0 0.15<br>1 1.5 2 2.5 3 3.5 4 4.5 5 5.5 6 0.3 0.6 0.8 1.1 1.3 1.6 1.8<br>VGS, GATE VOLTAGE (V) ID, DRAIN CURRENT (A)<br>Figure 3. On−Resistance vs. Gate−to−Source Figure 4. On−Resistance vs. Drain Current and<br>Voltage Gate Voltage<br>10,000<br>0.6 V GS  = 1.5 V, I D  = 200 mA VGS = 0 V<br>0.5<br>V GS = 1.8 V, I D = 710 mA 1000 TJ = 150 ° C<br>0.4<br>TJ = 125 ° C<br>0.3 VGS = 2.5 V, ID = 710 mA<br>100<br>0.2<br>V GS  = 4.5 V, I D  = 1 A<br>0.1 10<br>−60 −35 −10 15 40 65 90 115 140 5.0 10 15 20<br>TJ, JUNCTION TEMPERATURE ( ° C) VDS, DRAIN−TO−SOURCE VOLTAGE (V)<br>, DRAIN CURRENT (A) , DRAIN CURRENT (A)<br>ID ID<br>) � ) �<br>, DRAIN−TO−SOURCE RESISTANCE ( , DRAIN−TO−SOURCE RESISTANCE (<br>DS(on) DS(on)<br>R R<br>) �<br>, LEAKAGE (nA)<br>IDSS<br>, DRAIN−TO−SOURCE RESISTANCE (<br>DS(on)<br>R<br>**----- End of picture text -----**<br>


**Figure 5. On−Resistance Variation with Temperature** 

**==> picture [187 x 20] intentionally omitted <==**

**----- Start of picture text -----**<br>
Figure 6. Drain−to−Source Leakage Current<br>vs. Voltage<br>**----- End of picture text -----**<br>


**www.onsemi.com** 

**3** 

**NTK3134N** 

## **TYPICAL CHARACTERISTICS** 

**==> picture [491 x 173] intentionally omitted <==**

**----- Start of picture text -----**<br>
140 100<br>V GS  = 0 V VDD = 10 V<br>120 TJ = 25 ° C ID = 500 mA<br>VGS = 4.5 V<br>100 C iss<br>80 td(off)<br>10<br>60 tf<br>td(on)<br>40 tr<br>Coss<br>20<br>Crss<br>0 1<br>0 2 4 6 8 10 12 14 16 18 20 1 10 100<br>DRAIN−TO−SOURCE VOLTAGE (V) RG, GATE RESISTANCE ( � )<br>t, TIME (ns)<br>C, CAPACITANCE (pF)<br>**----- End of picture text -----**<br>


**Figure 7. Capacitance Variation** 

**Figure 8. Resistive Switching Time Variation vs. Gate Resistance** 

**==> picture [242 x 172] intentionally omitted <==**

**----- Start of picture text -----**<br>
1.0<br>150 ° C 125 ° C<br>0.9 VGS = 0 V<br>0.8 25 ° C<br>0.7<br>0.6<br>0.5<br>0.4<br>0.3 TJ = −55 ° C<br>0.2<br>0.1<br>0<br>0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0<br>VSD, SOURCE−TO−DRAIN VOLTAGE (V)<br>, SOURCE CURRENT (A)<br>IS<br>**----- End of picture text -----**<br>


**Figure 9. Diode Forward Voltage vs. Current** 

**www.onsemi.com** 

**4** 

MECHANICAL CASE OUTLINE **PACKAGE DIMENSIONS** 

**SOT−723** CASE 631AA−01 ISSUE D 

DATE 10 AUG 2009 

**SCALE 4:1** 

**==> picture [451 x 252] intentionally omitted <==**

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−X− NOTES:<br>1. DIMENSIONING AND TOLERANCING PER ASME<br>D Y14.5M, 1994.<br>b1 A 2. CONTROLLING DIMENSION: MILLIMETERS.<br>3 −Y− 3. MAXIMUM LEAD THICKNESS INCLUDES LEADFINISH. MINIMUM LEAD THICKNESS IS THE MINIMUMFINISH. MINIMUM LEAD THICKNESS IS THE MINIMUM<br>THICKNESS OF BASE MATERIAL.<br>E H E 4. DIMENSIONS D AND E DO NOT INCLUDE MOLD<br>FLASH, PROTRUSIONS OR GATE BURRS.<br>1 2<br>Go 2X b tf MILLIMETERS<br>C DIM MIN NOM MAX<br>2X e 0.08 X Y A 0.45 0.50 0.55<br>SIDE VIEW b 0.15 0.21 0.27<br>TOP VIEW b1 0.25 0.31 0.37<br>C 0.07 0.12 0.17<br>3X L D 1.15 1.20 1.25<br>1 E 0.75 0.80 0.85<br>e 0.40 BSC<br>H E 1.15 1.20 1.25<br>L 0.29 REF<br>L2 0.15 0.20 0.25<br>3X L2 |CU E GENERIC<br>BOTTOM VIEW MARKING DIAGRAM*<br>STYLE 1: STYLE 2: STYLE 3: STYLE 4: STYLE 5:<br>PIN 1. BASE PIN 1. ANODE PIN 1. ANODE PIN 1. CATHODE PIN 1. GATE XX M<br> 2. EMITTER  2. N/C  2. ANODE  2. CATHODE  2. SOURCE<br> 3. COLLECTOR  3. CATHODE  3. CATHODE  3. ANODE  3. DRAIN<br>=<br>1<br>XX = Specific Device Code<br>RECOMMENDED<br>M = Date Code<br>**----- End of picture text -----**<br>


1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 

3. MAXIMUM LEAD THICKNESS INCLUDES LEADFINISH. MINIMUM LEAD THICKNESS IS THE MINIMUMFINISH. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL. 

**==> picture [177 x 173] intentionally omitted <==**

**----- Start of picture text -----**<br>
RECOMMENDED<br>SOLDERING FOOTPRINT*<br>2X<br>0.40<br>2X 0.27<br>“Ar<br>PACKAGE<br>OUTLINE<br>SAE]<br>1.50<br>3X 0.52 aoe 0.36<br>DIMENSIONS: MILLIMETERS<br>**----- End of picture text -----**<br>


*This information is generic. Please refer to device data sheet for actual part marking. Pb−Free indicator, “G”, may or not be present. 

*For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. 

Electronic versions are uncontrolled except when accessed directly from the Document Repository. **DOCUMENT NUMBER: 98AON12989D** Printed  versions are uncontrolled  except when stamped  “CONTROLLED COPY” in red. **DESCRIPTION: SOT−723 PAGE 1 OF 1** ~~SE~~ ON Semiconductor and          are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the rights of others. 

www.onsemi.com 

© Semiconductor Components Industries, LLC, 2019 

**onsemi** , , and other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “ **onsemi** ” or its affiliates and/or subsidiaries in the United States and/or other countries. **onsemi** owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of **onsemi** ’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. **onsemi** reserves the right to make changes at any time to any products or information herein, without notice. The information herein is provided “as−is” and **onsemi** makes no warranty, representation or guarantee regarding the accuracy of the information, product features, availability, functionality, or suitability of its products for any particular purpose, nor does **onsemi** assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using **onsemi** products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by **onsemi** . “Typical” parameters which may be provided in **onsemi** data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. **onsemi** does not convey any license under any of its intellectual property rights nor the rights of others. **onsemi** products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use **onsemi** products for any such unintended or unauthorized application, Buyer shall indemnify and hold **onsemi** and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that **onsemi** was negligent regarding the design or manufacture of the part. **onsemi** is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. 

## **PUBLICATION ORDERING INFORMATION** 

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◊ 

**==> picture [232 x 43] intentionally omitted <==**



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