# Power MOSFET, P Channel, 12 V, 2.7 A, 0.06 ohm, SC-88, Surface Mount

![Product image](https://novapart.co/image/farnell:2845379/)

**URL**: https://novapart.co/products/NTJS3151PT1G/power-mosfet-p-channel-12-v-27-a-006-ohm-sc-88
**SKU**: NTJS3151PT1G
**Manufacturer**: ONSEMI
**Category**: Semiconductors - Discretes || FETs || Single MOSFETs
**Price**: €0.1110
**Stock**: 1000+
**Lead Time**: 2 days (indicative)

## Description

Transistor Polarity:P Channel; Continuous Drain Current Id:-2.7A; Drain Source Voltage Vds:-12V; On Resistance Rds(on):0.045ohm; Rds(on) Test Voltage Vgs:-4.5V; Threshold Voltage Vgs:-1.

## Specifications

| Parameter | Value |
|---|---|
| Msl | MSL 1 - Unlimited |
| Svhc | No SVHC (25-Jun-2025) |
| No. Of Pins | 6Pins |
| Channel Type | P Channel |
| Product Range | - |
| Qualification | - |
| Power Dissipation | 625mW |
| Transistor Mounting | Surface Mount |
| Rds(On) Test Voltage | 4.5V |
| Transistor Case Style | SC-88 |
| Drain Source Voltage Vds | 12V |
| Operating Temperature Max | 150°C |
| Continuous Drain Current Id | 2.7A |
| Drain Source On State Resistance | 0.06ohm |
| Gate Source Threshold Voltage Max | 1.2V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:2845379/)

## NTJS3151P, NVJS3151P 

## Trench Power MOSFET 

## **12 V, 3.3 A, Single P−Channel, ESD Protected SC−88** 

## **Features** 

## **www.onsemi.com** 

- Leading Trench Technology for Low RDS(ON) Extending Battery Life 

• SC−88 Small Outline (2x2 mm, SC70−6 Equivalent) **V(BR)DSS RDS(on) Typ ID Max** ~~eseeee~~ • Gate Diodes for ESD Protection 45 m @ −4.5 V • NV Prefix for Automotive and Other Applications Requiring Unique −12 V 67 m @ −2.5 V −3.3 A Site and Control Change Requirements; AEC−Q101 Qualified and PPAP Capable 133 m @ −1.8 V • These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS Compliant **SC−88 (SOT−363) Applications** • High Side Load Switch D 1 6 D • Cell Phones, Computing, Digital Cameras, MP3s and PDAs D 2 5 D **MAXIMUM RATINGS** (TJ = 25 ° C unless otherwise stated) ~~a~~ **Parameter Symbol Value Units** G 3 4 S Drain−to−Source Voltage VDSS −12 V ~~a~~ Gate−to−Source Voltage VGS ± 12 V ~~a~~ Top View D Continuous Drain Steady TA = 25 ° C ID −2.7 A Current (Note 1) State TA = 85 ° C −2.0 ~~aa~~ t ≤ 5 s TA = 25 ° C −3.3 G 3 k ; Power Dissipation Steady TA = 25 ° C PD 0.625 W (Note 1) State ~~Poer~~ Pulsed Drain Current ~~tT |~~ tp = 10 s IDM −8.0 A Operating Junction and Storage Temperature TJ, −55 to ° C S TSTG 150 Source Current (Body Diode) IS −0.8 A **MARKING DIAGRAM &** ~~SEs~~ Lead Temperature for Soldering Purposes TL 260 ° C **PIN ASSIGNMENT** (1/8” from case for 10 s) D D S ~~re~~ ¢ 6 **THERMAL RESISTANCE RATINGS** (Note 1) “ 1 ~~nfo~~ XXX M **Parameter Symbol Max Units SC−88/SOT−363** ~~a~~ Junction−to−Ambient – Steady State R JA 200 ° C/W **CASE 419BSTYLE 28STYLE 28** ~~a Oe~~ 1 ~~rt~~ Junction−to−Ambient − t ≤ 5 s R JA 141 D D G ~~a~~ Junction−to−Lead – Steady State R JL 102 

- SC−88 Small Outline (2x2 mm, SC70−6 Equivalent) 

- Gate Diodes for ESD Protection 

- NV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q101 Qualified and PPAP Capable 

- These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS Compliant 

## **Applications** 

- High Side Load Switch 

- Cell Phones, Computing, Digital Cameras, MP3s and PDAs 

**==> picture [166 x 146] intentionally omitted <==**

**----- Start of picture text -----**<br>
MARKING DIAGRAM &<br>PIN ASSIGNMENT<br>D D S<br>¢ 6<br>“ 1 nfo<br>XXX M<br>SC−88/SOT−363<br>a<br>CASE 419BSTYLE 28STYLE 28<br>1 rt<br>D D G<br>XXX = Device Code<br>M = Date Code<br>= Pb−Free Package<br>**----- End of picture text -----**<br>


Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 

1. Surface mounted on FR4 board using 1 in sq pad size (Cu area = 1.127 in sq [1 oz] including traces). 

(Note: Microdot may be in either location) 

## **ORDERING INFORMATION** 

See detailed ordering and shipping information in the package dimensions section on page 4 of this data sheet. 

Publication Order Number: **NTJS3151/D** 

**1** 

© Semiconductor Components Industries, LLC, 2016 **June, 2016 − Rev. 4** 

## **NTJS3151P, NVJS3151P** 

## **ELECTRICAL CHARACTERISTICS** (TJ=25 ° C unless otherwise stated) 

|**ELECTRICAL CHARACTERISTICS**|(TJ=25°C unle|ss otherwise stated)|ss otherwise stated)|||||
|---|---|---|---|---|---|---|---|
|**Parameter**|**Symbol**|**Test Condition**||**Min**|**Typ**|**Max**|**Unit**|
|**OFF CHARACTERISTICS**||||||||
|Drain−to−Source Breakdown Voltage|V(BR)DSS|VGS= 0 V, ID=|−250�A|−12|||V|
|Drain−to−Source Breakdown Voltage<br>Temperature Coefficient|V(BR)DSS/TJ||||10||mV/°C|
|Zero Gate Voltage Drain Current|IDSS|VGS= −9.6 V,<br>VDS= 0 V|TJ= 25°C|||−1.0|�A|
||||TJ= 125°C||−2.5|||
|Gate−to−Source Leakage Current|IGSS|VDS= 0 V, VGS=±4.5 V||||±1.5|�A|
|||VDS= 0 V, VGS=±12 V||||±10|mA|
|**ON CHARACTERISTICS**(Note 2)||||||||
|Gate Threshold Voltage|VGS(TH)|VGS= VDS, ID= 100�A||−0.40||−1.2|V|
|Negative Threshold Temperature<br>Coefficient|VGS(TH)/TJ||||3.4||mV/°C|
|Drain−to−Source On Resistance|RDS(on)|VGS= −4.5 V, ID= −3.3 A|||45|60|m�|
|||VGS= −2.5 V, ID= −2.9 A|||67|90||
|||VGS= −1.8 V, ID= −1.0 A|||133|160||
|Forward Transconductance|gFS|VGS= −10 V, ID= −3.3 A|||15||S|
|**CHARGES AND CAPACITANCES**||||||||
|Input Capacitance|CISS|VGS= 0 V, f = 1.0 MHz,<br>VDS= −12 V|||850||pF|
|Output Capacitance|COSS||||170|||
|Reverse Transfer Capacitance|CRSS||||110|||
|Total Gate Charge|QG(TOT)|VGS= −4.5 V, VDS= −5.0 V,<br>ID= −3.3 A|||8.6||nC|
|Gate−to−Source Charge|QGS||||1.3|||
|Gate−to−Drain Charge|QGD||||2.2|||
|Gate Resistance|RG||||3000||�|
|**SWITCHING CHARACTERISTICS**(Note 3)||||||||
|Turn−On Delay Time|td(ON)|VGS= −4.5 V, VDD= −6.0 V,<br>ID= −1.0 A, RG= 6.0�|||0.86||�s|
|Rise Time|tr||||1.5|||
|Turn−Off Delay Time|td(OFF)||||3.5|||
|Fall Time|tf||||3.9|||
|**DRAIN−SOURCE DIODE CHARACTERISTICS**(Note||2)||||||
|Forward Diode Voltage|VSD|VGS= 0 V,<br>IS= −3.3 A|TJ= 25°C||−0.85|−1.2|V|
||||TJ= 125°C||−0.7|||



Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. 

2. Pulse Test: pulse width ≤ 300 � s, duty cycle ≤ 2%. 

3. Switching characteristics are independent of operating junction temperatures. 

**www.onsemi.com** 

**2** 

**NTJS3151P, NVJS3151P** 

## **TYPICAL PERFORMANCE CURVES** (TJ = 25 ° C unless otherwise noted) 

**==> picture [489 x 604] intentionally omitted <==**

**----- Start of picture text -----**<br>
8 8<br>VGS = −4.5 V TJ = 25 ° C VDSDS ≤  −12 V<br>VGS = −3.4 V<br>6 −2 V 6<br>−2.4 V<br>4 4<br>125 ° C<br>2 −1.6 V 2<br>−1.4 V 25 ° C<br>−1.2 V TJ = −55J = −55 = −55 ° C<br>0 0<br>0 1 2 3 4 5 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5<br>−VDS, DRAIN−TO−SOURCE VOLTAGE (VOLTS) −VGS, GATE−TO−SOURCE VOLTAGE (VOLTS)GS, GATE−TO−SOURCE VOLTAGE (VOLTS), GATE−TO−SOURCE VOLTAGE (VOLTS)<br>Figure 1. On−Region Characteristics Figure 2. Transfer Characteristics<br>0.1 0.5<br>VGS = −4.5 V VGS = −1.8 V TJ = 25 ° C<br>0.4<br>0.075<br>T J  = 125 ° C 0.3<br>0.05 TJ = 25 ° C<br>0.2<br>0.025 T J  = −55 ° C<br>0.1 VGS = −2.5 V<br>0 0 VGS = −4.5 V<br>0.5 1.5 2.5 3.5 4.5 5.5 6.5 7.5 0.5 1.5 2.5 3.5 4.5 5.5 6.5 7.5<br>−ID, DRAIN CURRENT (AMPS) −ID, DRAIN CURRENT (AMPS)<br>Figure 3. On−Resistance vs. Drain Current and Figure 4. On−Resistance vs. Drain Current and<br>Temperature Gate Voltage<br>2.0 100000<br>ID = −3.3 A VGS = 0 V<br>1.8<br>VGS = −4.5 V<br>1.6<br>1.4 10000 TJ = 150 ° C<br>1.2<br>1.0<br>0.8<br>1000 TJ = 125 ° C<br>0.6<br>0.4<br>0.2<br>0 100<br>−50 −25 0 25 50 75 100 125 150 0 2 4 6 8 10 12<br>TJ, JUNCTION TEMPERATURE ( ° C) −VDS, DRAIN−TO−SOURCE VOLTAGE (VOLTS)<br>DRAIN CURRENT (AMPS) DRAIN CURRENT (AMPS)<br>D,  D,<br>−I −I<br>) � ) �<br>DRAIN−TO−SOURCE RESISTANCE ( DRAIN−TO−SOURCE RESISTANCE (<br>DS(on),  DS(on),<br>R R<br>DRAIN−TO−SOURCE LEAKAGE CURRENT (nA)<br>DS(on),<br>R RESISTANCE (NORMALIZED) DSS,<br>−I<br>**----- End of picture text -----**<br>


**==> picture [237 x 172] intentionally omitted <==**

**----- Start of picture text -----**<br>
8<br>VDSDS ≤  −12 V<br>6<br>4<br>125 ° C<br>2<br>25 ° C<br>TJ = −55J = −55 = −55 ° C<br>0<br>0 0.5 1 1.5 2 2.5 3 3.5 4 4.5<br>−VGS, GATE−TO−SOURCE VOLTAGE (VOLTS)GS, GATE−TO−SOURCE VOLTAGE (VOLTS), GATE−TO−SOURCE VOLTAGE (VOLTS)<br>DRAIN CURRENT (AMPS)<br>D,<br>−I<br>**----- End of picture text -----**<br>


**Figure 5. On−Resistance Variation with Temperature** 

**Figure 6. Drain−to−Source Leakage Current vs. Voltage** 

**www.onsemi.com** 

**3** 

**NTJS3151P, NVJS3151P** 

## **TYPICAL PERFORMANCE CURVES** (TJ = 25 ° C unless otherwise noted) 

**==> picture [248 x 398] intentionally omitted <==**

**----- Start of picture text -----**<br>
1600<br>TJ = 25 ° C<br>1400 VGS = 0 V<br>1200<br>1000<br>Ciss<br>800<br>600<br>400<br>200 Coss<br>Crss<br>0<br>0 2 4 6 8 10 12<br>GATE−TO−SOURCE OR DRAIN−TO−SOURCE VOLTAGE (VOLTS)<br>Figure 7. Capacitance Variation<br>10000<br>tf<br>td(off)<br>tr<br>1000<br>td(on)<br>VDD = −6.0 V<br>ID = −1.0 A<br>VGS = −4.5 V<br>100<br>1 10 100<br>RG, GATE RESISTANCE (OHMS)<br>C, CAPACITANCE (pF)<br>t, TIME (ns)<br>**----- End of picture text -----**<br>


**Figure 9. Resistive Switching Time Variation vs. Gate Resistance** 

**==> picture [236 x 406] intentionally omitted <==**

**----- Start of picture text -----**<br>
4.5<br>QT<br>4<br>3.5<br>3<br>2.5<br>2 Q1 Q2<br>1.5<br>1<br>0.5 I D  = −3.3 A<br>TJ = 25 ° C<br>0<br>0 2 4 6 8 10<br>Qg, TOTAL GATE CHARGE (nC)<br>Figure 8. Gate−to−Source Voltage vs. Total<br>Gate Charge<br>4<br>VGS = 0 V<br>T J  = 25 ° C<br>3<br>2<br>1<br>0<br>0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9<br>−VSD, SOURCE−TO−DRAIN VOLTAGE (VOLTS)<br>GATE−TO−SOURCE VOLTAGE (VOLTS)<br>GS,<br>−V<br>, SOURCE CURRENT (AMPS)<br>S<br>−I<br>**----- End of picture text -----**<br>


**Figure 10. Diode Forward Voltage vs. Current** 

## **ORDERING INFORMATION** 

|**ORDERING INFORMATION**||||
|---|---|---|---|
|**Device**|**Marking**|**Package**|**Shipping**†|
|NTJS3151PT1G|TJ|SC−88<br>(Pb−Free)|3000 / Tape & Reel|
|NTJS3151PT2G|TJ|||
|NVJS3151PT1G*|VTJ|||



†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. 

*NV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q101 Qualified and PPAP Capable. 

**www.onsemi.com** 

**4** 

**NTJS3151P, NVJS3151P** 

## **PACKAGE DIMENSIONS** 

## **SC−88/SC70−6/SOT−363** 

CASE 419B−02 ISSUE Y 

**==> picture [482 x 399] intentionally omitted <==**

**----- Start of picture text -----**<br>
2X<br>aaa H D<br>- D H NOTES:1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.<br>2. CONTROLLING DIMENSION: MILLIMETERS.<br>A 3. DIMENSIONS D AND E1 DO NOT INCLUDE MOLD FLASH,<br>D GAGE PROTRUSIONS, OR GATE BURRS. MOLD FLASH, PROTRU-<br>PLANE SIONS, OR GATE BURRS SHALL NOT EXCEED 0.20 PER END.<br>4. DIMENSIONS D AND E1 AT THE OUTERMOST EXTREMES OF<br>6 5 4 THE PLASTIC BODY AND DATUM H.<br>L2 L 5. DATUMS A AND B ARE DETERMINED AT DATUM H.<br>E E1 DETAIL A 6. LEAD BETWEEN 0.08 AND 0.15 FROM THE TIP.DIMENSIONS b AND c APPLY TO THE FLAT SECTION OF THE<br>7. DIMENSION b DOES NOT INCLUDE DAMBAR PROTRUSION.<br>1 2 3<br>ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 TOTAL IN<br>EXCESS OF DIMENSION b AT MAXIMUM  MATERIAL CONDI-<br>2X aaa C TION. THE DAMBAR CANNOT BE LOCATED ON THE LOWER<br>bbb H D 2X 3 TIPS RADIUS OF THE FOOT.<br>e MILLIMETERS INCHES<br>DIM MIN NOM MAX MIN NOM MAX<br>IS} | | | T B o 6X b - A −−− −−− 1.10 −−− −−− 0.043<br>ddd M C A-B D A1 0.00 −−− 0.10 0.000 −−− 0.004<br>TOP VIEW A2 0.70 0.90 1.00 0.027 0.035 0.039<br>b 0.15 0.20 0.25 0.006 0.008 0.010<br>C 0.08 0.15 0.22 0.003 0.006 0.009<br>A2 DETAIL A D 1.80 2.00 2.20 0.070 0.078 0.086<br>A E 2.00 2.10 2.20 0.078 0.082 0.086<br>E1 1.15 1.25 1.35 0.045 0.049 0.053<br>e 0.65 BSC 0.026 BSC<br>S em GEES L 0.26 0.36 0.46 0.010 0.014 0.018<br>L2 0.15 BSC 0.006 BSC<br>aaa 0.15 0.006<br>bbb 0.30 0.012<br>6X ccc C ccc 0.10 0.004<br>A1 C SEATINGPLANE c ddd 0.10 0.004<br>SIDE VIEW END VIEW STYLE 28:<br>PIN 1. DRAIN<br>RECOMMENDED  2. DRAIN<br>SOLDERING FOOTPRINT*  3. 4. GATESOURCE<br> 5. DRAIN<br>6X 6X  6. DRAIN<br>0.30 0.66<br>Boo st 2.50<br>0.65 pan<br>PITCH<br>DIMENSIONS: MILLIMETERS<br>**----- End of picture text -----**<br>


1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 

*For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. 

ON Semiconductor and      are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. 

## **PUBLICATION ORDERING INFORMATION** 

**LITERATURE FULFILLMENT** : **N. American Technical Support** : 800−282−9855 Toll Free **ON Semiconductor Website** : **www.onsemi.com** Literature Distribution Center for ON Semiconductor USA/Canada 19521 E. 32nd Pkwy, Aurora, Colorado 80011 USA **Europe, Middle East and Africa Technical Support: Order Literature** : http://www.onsemi.com/orderlit **Phone** : 303−675−2175 or 800−344−3860 Toll Free USA/Canada Phone: 421 33 790 2910 **Fax** : 303−675−2176 or 800−344−3867 Toll Free USA/Canada **Japan Customer Focus Center** For additional information, please contact your local **Email** : orderlit@onsemi.com Phone: 81−3−5817−1050 Sales Representative 

## **LITERATURE FULFILLMENT** : 

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**NTJS3151P/D** 

**5** 



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