# Power MOSFET, N Channel, 80 V, 203 A, 1290 µohm, TO-LL, Surface Mount

![Product image](https://novapart.co/image/farnell:3766200/)

**URL**: https://novapart.co/products/NTBLS1D7N08H/power-mosfet-n-channel-80-v-203-a-1290-ohm-to-ll
**SKU**: NTBLS1D7N08H
**Manufacturer**: ONSEMI
**Category**: Semiconductors - Discretes || FETs || Single MOSFETs
**Price**: €3.0500
**Stock**: 500+
**Lead Time**: 141 days (indicative)

## Specifications

| Parameter | Value |
|---|---|
| Msl | MSL 1 - Unlimited |
| Svhc | No SVHC (25-Jun-2025) |
| No. Of Pins | 8Pins |
| Channel Type | N Channel |
| Product Range | - |
| Qualification | - |
| Power Dissipation | 167W |
| Transistor Mounting | Surface Mount |
| Rds(On) Test Voltage | 10V |
| Transistor Case Style | TO-LL |
| Drain Source Voltage Vds | 80V |
| Operating Temperature Max | 175°C |
| Continuous Drain Current Id | 203A |
| Drain Source On State Resistance | 1290µohm |
| Gate Source Threshold Voltage Max | 2.9V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:3766200/)

## MOSFET - Power, Single N-Channel, TOLL 

## 80 V, 1.7 m 203 A 

## NTBLS1D7N08H 

## **Features** 

- Low R to Minimize Conduction Losses DS(on) 

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- Low QG and Capacitance to Minimize Driver Losses 

- Lowers Switching Noise/EMI 

- These Devices are Pb−Free and are RoHS Compliant 

## **Typical Applications** 

- Power Tools, Battery Operated Vacuums 

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V(BR)DSS RDS(ON) MAX ID MAX<br>80 V 1.7 m  @ 10 V 203 A<br>eeee ee<br>**----- End of picture text -----**<br>


- UAV/Drones, Material Handling 

- BMS/Storage, Home Automation 

**MAXIMUM RATINGS** (TJ = 25 ° C unless otherwise noted) 

~~ee~~ **Parameter Symbol** ~~ee~~ **Value Unit** Drain−to−Source Voltage VDSS 80 V ~~eeee ee~~ Gate−to−Source Voltage VGS ± 20 V ~~ee~~ Continuous Drain TC = 25 ° C ID 203 A ~~ee~~ Current R(Notes 1, 3)JC Steady ~~e~~ TC = 100 ° C e **e** 143 ~~ee~~ Power Dissipation State TC = 25 ° C PD 167 W R JC (Note 1) TC = 100 ° C 83 ~~a |ee|~~ Continuous Drain TA = 25 ° C ID 29 A ~~po~~ Current R(Notes 1, 2, 3)JA Steady ~~|~~ TA = 100 ° C ~~Se~~ 21 Power Dissipation ~~|~~ State ~~ES~~ TA = 25 ° C PD 3.5 W R JA (Notes 1, 2) TA = 100 ° C 1.7 Pulsed Drain Current TC = 25 ° ~~|~~ C, tp = 100 s IDM ~~|~~ 1173 A Operating Junction and Storage Temperature TJ, Tstg −55 to ° C Range +175 ~~ee Oe~~ Source Current (Body Diode) IS 139 A Single Pulse Drain−to−Source Avalanche EAS 1093.5 mJ Energy (IL(pk) = 27 A) Lead Temperature for Soldering Purposes TL 260 ° C (1/8 ″ from case for 10 s) 

Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 

## **THERMAL RESISTANCE MAXIMUM RATINGS** 

~~ee~~ Junction−to−Case − Steady State (Note 1) **Parameter Symbol** R ~~ee~~ JC **Value** ~~ee~~ 0.9 ° **Unit** C/W Junction−to−Ambient − Steady State R JA 43 (Notes 1, 2) ~~ae~~ 1. The entire application environment impacts the thermal resistance values shown, they are not constants and are only valid for the particular conditions noted. 

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D<br>G<br>S<br>N−CHANNEL MOSFET<br>**----- End of picture text -----**<br>


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TOLL<br>CASE 100CU<br>**----- End of picture text -----**<br>


## **MARKING DIAGRAM** 

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AYWWZZ<br>1D7N08H<br>**----- End of picture text -----**<br>


1D7N08H = Specific Device Code A = Assembly Location Y = Year WW = Work Week ZZ = Lot Traceability 

## **ORDERING INFORMATION** 

See detailed ordering, marking and shipping information in the package dimensions section on page 5 of this data sheet. 

2. Surface−mounted on FR4 board using a 650 mm[2] , 2 oz. Cu pad. 

3. Maximum current for pulses as long as 1 second is higher but is dependent on pulse duration and duty cycle. 

Publication Order Number: **NTBLS1D7N08H/D** 

**1** 

© Semiconductor Components Industries, LLC, 2019 **January, 2021 − Rev. 2** 

## **NTBLS1D7N08H** 

**ELECTRICAL CHARACTERISTICS** (TJ = 25 ° C unless otherwise noted) 

|**ELECTRICAL CHARACTERISTICS**(TJ=|25°C unless|otherwise noted)|otherwise noted)|||||
|---|---|---|---|---|---|---|---|
|**Parameter**|**Symbol**|**Test Condition**||**Min**|**Typ**|**Max**|**Unit**|
|**OFF CHARACTERISTICS**||||||||
|Drain−to−Source Breakdown Voltage|V(BR)DSS|VGS= 0 V, ID=|250�A|80|||V|
|Drain−to−Source Breakdown Voltage<br>Temperature Coefficient|V(BR)DSS/<br>TJ||||57||mV/°C|
|Zero Gate Voltage Drain Current|IDSS|VGS= 0 V,<br>VDS= 80 V|TJ= 25°C|||10|�A|
||||TJ= 125°C|||250||
|Gate−to−Source Leakage Current|IGSS|VDS= 0 V, VGS= 20 V||||100|nA|
|**ON CHARACTERISTICS**||||||||
|Gate Threshold Voltage|VGS(TH)|VGS= VDS, ID= 479�A||2.0|2.9|4.0|V|
|Threshold Temperature Coefficient|VGS(TH)/TJ|ID= 479�A, ref to 25°C|||−7.3||mV/°C|
|Drain−to−Source On Resistance|RDS(on)|VGS= 10 V|ID= 80 A||1.29|1.7|m�|
|||VGS= 6 V|ID= 43 A||1.76|2.6||
|Forward Transconductance|gFS|VDS= 5 V, ID= 80 A|||271||S|
|**CHARGES, CAPACITANCES & GATE RESISTANCE**||||||||
|Input Capacitance|CISS|VGS= 0 V, f = 1 MHz, VDS= 40 V|||7675||pF|
|Output Capacitance|COSS||||1059|||
|Reverse Transfer Capacitance|CRSS||||41|||
|Gate−Resistance|RG||||0.6|||
|Total Gate Charge|QG(TOT)|VGS= 10 V, VDS= 40 V; ID= 80 A|||121||nC|
|Threshold Gate Charge|QG(TH)||||19|||
|Gate−to−Source Charge|QGS||||32|||
|Gate−to−Drain Charge|QGD||||29|||
|Plateau Voltage|VGP||||4.5||V|
|Output Charge|QOSS|VGS= 0 V, VDD= 40 V|||149||nC|
|**SWITCHING CHARACTERISTICS**(Note 4)||||||||
|Turn−On Delay Time|td(ON)|VGS= 10 V, VDS= 40 V,<br>ID= 80 A, RG= 6�|||29||ns|
|Rise Time|tr||||25|||
|Turn−Off Delay Time|td(OFF)||||89|||
|Fall Time|tf||||35|||
|**DRAIN−SOURCE DIODE CHARACTERISTICS**||||||||
|Forward Diode Voltage|VSD|VGS= 0 V,<br>IS= 80 A|TJ= 25°C||0.82|1.2|V|
||||TJ= 125°C||0.69|||
|Reverse Recovery Time|tRR|VGS= 0 V, dIS/dt = 100 A/�s,<br>IS= 43 A|||73||ns|
|Reverse Recovery Charge|QRR||||138||nC|



Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. 4. Switching characteristics are independent of operating junction temperatures. 

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**NTBLS1D7N08H** 

## **TYPICAL CHARACTERISTICS** 

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250 30<br>10 V 5.0 V VGS = 4.5 V Pulse Duration = 250  � s<br>8.0 V Duty Cycle = 0.5% Max<br>200 24<br>6.0 V<br>150 18<br>4.5 V<br>100 12<br>5.0 V<br>50 6<br>10 V<br>VGS = 4.0 V 6 V 8 V<br>0 0<br>0 1 2 3 4 5 0 50 100 150 200 250<br>VDS, DRAIN−TO−SOURCE VOLTAGE (V) ID, DRAIN CURRENT (A)<br>Figure 1. On−Region Characteristics Figure 2. Normalized On−Resistance vs. Drain<br>Current and Gate Voltage<br>2.4 50<br>2.2 ID = 80 A ID = 80 A<br>VGS = 10 V<br>2.0 40<br>1.8<br>30<br>1.6<br>1.4<br>20<br>1.2<br>TJ = 25 ° C<br>1.0<br>10<br>0.8 TJ = 150 ° C<br>0.6 0<br>−75 −50 −25 0 25 50 75 100 125 150 175 3 4 5 6 7 8 9 10<br>TJ, JUNCTION TEMPERATURE ( ° C) VGS, GATE−TO−SOURCE VOLTAGE (V)<br>Figure 3. Normalized On−Resistance vs. Figure 4. On−Resistance vs. Gate−to−Source<br>Junction Temperature Voltage<br>250 250<br>VDS = 5 V VGS = 0 V<br>200 200<br>150 150<br>TJ = 25 ° C TJ = 25 ° C<br>100 100<br>50 50<br>TJ = 175 ° C TJ = −55 ° C TJ = 175 ° C TJ = −55 ° C<br>0 0<br>2 3 4 5 6 0 0.2 0.4 0.6 0.8 1.0 1.2<br>VGS, GATE−TO−SOURCE VOLTAGE (V) VSD, BODY DIODE FORWARD VOLTAGE (V)<br>, DRAIN CURRENT (A) , NORMALIZED DRAIN−TO−<br>ID<br>SOURCE ON−RESISTANCE<br>DS(on)<br>R<br>) �<br>, NORMALIZED DRAIN−TO− , ON−RESISTANCE (m<br>SOURCE ON−RESISTANCE<br>DS(on) DS(on)<br>R R<br>, DRAIN CURRENT (A)<br>ID<br>, REVERSE DRAIN CURRENT (A)<br>IS<br>**----- End of picture text -----**<br>


**Figure 5. Transfer Characteristics** 

**Figure 6. Source−to−Drain Diode Forward Voltage vs. Source Current** 

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**3** 

**NTBLS1D7N08H** 

## **TYPICAL CHARACTERISTICS** 

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10 100K<br>ID = 80 A VDD = 30 V<br>8 VDD = 40 V VDD = 50 V 10K C ISS<br>6 1K<br>COSS<br>4 100<br>CRSS<br>2 10<br>f = 1 MHz<br>VGS = 0 V<br>0 1<br>0 26 52 78 104 130 0.1 1 10 80<br>Qg, GATE CHARGE (nC) VDS, DRAIN−TO−SOURCE VOLTAGE (V)<br>Figure 7. Gate Charge Characteristics Figure 8. Capacitance vs. Drain−to−Source<br>Voltage<br>250 100K<br>VGS = 10 V<br>200<br>10K<br>150<br>VGS = 6 V<br>1K<br>100<br>100<br>50<br>R � JC = 0.9 ° C/W<br>0 10<br>25 50 75 100 125 150 175 0.00001 0.0001 0.001 0.01 0.1 1<br>TC, CASE TEMPERATURE ( ° C) t, PULSE WIDTH (s)<br>Figure 9. Drain Current vs. Case Temperature Figure 10. Peak Power<br>1000 2000<br>1000 10  � s<br>100 100  � s<br>100 TJ(initial) = 25 ° C<br>T J(initial)  = 100 ° C 10 TC = 25 ° C 1 ms<br>T J(initial)  = 150 ° C Single Pulse 10 ms<br>10 1 R � JC = 0.9 ° C/W<br>100 ms/DC<br>0.1 R DS(on)  Limit<br>Thermal Limit<br>Package Limit<br>1 0.01<br>0.001 0.01 0.1 1 10 100 1000 0.1 1 10 100<br>tAV, TIME IN AVALANCHE (mS) VDS, DRAIN−TO−SOURCE VOLTAGE (V)<br>CAPACITANCE (pF)<br>, GATE−TO−SOURCE VOLTAGE (V)<br>GS<br>V<br>, DRAIN CURRENT (A)<br>ID<br>PEAK TRANSIENT POWER (W)<br>, DRAIN CURRENT (A)<br>, AVALANCHE CURRENT(A) ID<br>IAS<br>**----- End of picture text -----**<br>


**Figure 11. Unclamped Inductive Switching Capability** 

**Figure 12. Forward Bias Safe Operating Area** 

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**4** 

**NTBLS1D7N08H** 

## **TYPICAL CHARACTERISTICS** 

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10<br>1<br>Duty Cycle = 0.5<br>0.2<br>0.1<br>0.1<br>0.05<br>0.02 P DM Notes:<br>R � JC = 0.9 ° C/W<br>0.01 0.01 Peak TJ = PDM x Z � JC (t) + TC<br>Single Pulse t1 Duty Cycle, D = t1/t2<br>t 2<br>0.001<br>0.00001 0.0001 0.001 0.01 0.1 1<br>t, RECTANGULAR PULSE DURATION (sec)<br>C/W)<br>°<br>, EFFECTIVE TRANSIENT<br>JC<br>�<br>Z THERMAL RESISTANCE (<br>**----- End of picture text -----**<br>


**Figure 13. Transient Thermal Impedance** 

## **DEVICE ORDERING INFORMATION** 

|**Device**|**Marking**|**Package**|**Shipping**†|
|---|---|---|---|
|NTBLS1D7N08H|1D7N08H|M0−299A<br>(Pb−Free)|2000 / Tape & Reel|



†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. 

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**5** 

**NTBLS1D7N08H** 

## **PACKAGE DIMENSIONS** 

**H−PSOF8L 11.68x9.80** CASE 100CU ISSUE A 

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**6** 

**NTBLS1D7N08H** 

ON Semiconductor and      are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. 

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**7** 



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