# Bipolar - RF Transistor, NPN, 25 V, 650 MHz, 300 mW, 999 A, SOT-23

![Product image](https://novapart.co/image/farnell:2630338/)

**URL**: https://novapart.co/products/NSVMMBTH10LT1G/bipolar-rf-transistor-npn-25-v-650-mhz-300-mw-999
**SKU**: NSVMMBTH10LT1G
**Manufacturer**: ONSEMI
**Category**: Semiconductors - Discretes || Transistors || Bipolar Transistors || Single Bipolar Junction Transistors - BJT
**Price**: €0.0670
**Stock**: 1000+
**Lead Time**: 2 days (indicative)

## Description

Transistor Polarity:NPN; Collector Emitter Voltage V(br)ceo:25V; Transition Frequency ft:650MHz; Power Dissipation Pd:300mW; DC Collector Current:-; DC Current Gain hFE:60hFE; Tr

## Specifications

| Parameter | Value |
|---|---|
| Msl | MSL 1 - Unlimited |
| Svhc | No SVHC (25-Jun-2025) |
| No. Of Pins | 3Pins |
| Product Range | - |
| Qualification | AEC-Q101 |
| Power Dissipation | 300mW |
| Transistor Mounting | Surface Mount |
| Transistor Polarity | NPN |
| Transition Frequency | 650MHz |
| Transistor Case Style | SOT-23 |
| Dc Current Gain Hfe Min | 60hFE |
| Operating Temperature Max | 150°C |
| Continuous Collector Current | 999A |
| Collector Emitter Voltage Max | 25V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:2630338/)

## MMBTH10L, MMBTH10-4L, SMMBTH10-4L, NSVMMBTH10L 

## VHF/UHF Transistor **NPN Silicon** 

**www.onsemi.com** 

## **Features** 

- S and NSV Prefixes for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q101 Qualified and PPAP Capable 

**SOT−23 (TO−236)** Requiring Unique Site and Control Change Requirements; **CASE 318** AEC−Q101 Qualified and PPAP Capable **STYLE 6** • These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS COLLECTOR Compliant 3 1 **MAXIMUM RATINGS** BASE **Rating Symbol Value Unit** ~~&~~ Collector-Emitter Voltage VCEO 25 Vdc 2 EMITTER Collector-Base Voltage VCBO 30 Vdc **MARKING DIAGRAMS** Emitter-Base Voltage VEBO 3.0 Vdc **THERMAL CHARACTERISTICS** 3EM M 3E4 M **Characteristic Symbol Max Unit** Total Device Dissipation PD FR−5 Board (Note 1) TA = 25 ° C 225 mW MMBTH10LT1G, MMBTH10−04LT1G Derate above 25 ° C 1.8 mW/ ° C NSVMMBTH10LT1G Thermal Resistance, R θ JA 556 ° C/W 3EM, 3E4= Specific Device Code Junction to Ambient (Note 1) M = Date Code* Total Device Dissipation PD = Pb−Free Package Alumina Substrate (Note 2) (Note: Microdot may be in either location) TA = 25 ° C 300 mW *Date Code orientation and/or overbar may Derate above 25 ° C 2.4 mW/ ° C vary depending upon manufacturing location. Thermal Resistance, R θ JA 417 ° C/W Junction to Ambient (Note 2) **ORDERING INFORMATION** Junction and Storage TJ, Tstg −55 to ° C **Device Package Shipping**[†] Temperature Range +150 ~~=~~ MMBTH10LT1G SOT−23 3,000 / Stresses exceeding those listed in the Maximum Ratings table may damage the (Pb−Free) Tape & Reel device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. NSVMMBTH10LT1G SOT−23 3,000 / 1. FR−5 = 1.0 x 0.75 x 0.062 in. (Pb−Free) Tape & Reel 2. Alumina = 0.4 x 0.3 x 0.024 in. 99.5% alumina MMBTH10−4LT1G SOT−23 3,000 / (Pb−Free) Tape & Reel MMBTH10LT3G, SOT−23 10,000 / SMMBTH10−4LT3G (Pb−Free) Tape & Reel ~~==~~ †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. 

Publication Order Number: 

**1** 

© Semiconductor Components Industries, LLC, 1994 **October, 2016 − Rev. 6** 

**MMBTH10LT1/D** 

**MMBTH10L, MMBTH10−4L, SMMBTH10−4L, NSVMMBTH10L** 

## **ELECTRICAL CHARACTERISTICS** (TA = 25 ° C unless otherwise noted) 

|**ELECTRICAL CHARACTERISTICS**(TA= 25°C unless otherwise|noted)|||||
|---|---|---|---|---|---|
|**Characteristic**|**Symbol**|**Min**|**Typ**|**Max**|**Unit**|
|**OFF CHARACTERISTICS**||||||
|Collector−Emitter Breakdown Voltage<br>(IC= 1.0 mAdc, IB= 0)|V(BR)CEO|25|−|−|Vdc|
|Collector−Base Breakdown Voltage<br>(IC= 100μAdc, IE= 0)|V(BR)CBO|30|−|−|Vdc|
|Emitter−Base Breakdown Voltage<br>(IE= 10μAdc, IC= 0)|V(BR)EBO|3.0|−|−|Vdc|
|Collector Cutoff Current<br>(VCB= 25 Vdc, IE= 0)|ICBO|−|−|100|nAdc|
|Emitter Cutoff Current<br>(VEB= 2.0 Vdc, IC= 0)|IEBO|−|−|100|nAdc|
|**ON CHARACTERISTICS**||||||
|DC Current Gain<br>(IC= 4.0 mAdc, VCE= 10 Vdc)<br>MMBTH10LT1G, NSVMMBTH10LT1G<br>MMBTH10−4LT1G, SMMBTH10−4LT3G|hFE|60<br>120|−<br>−|−<br>240|−|
|Collector−Emitter Saturation Voltage<br>(IC= 4.0 mAdc, IB= 0.4 mAdc)|VCE(sat)|−|−|0.5|Vdc|
|Base−Emitter On Voltage<br>(IC= 4.0 mAdc, VCE= 10 Vdc)|VBE|−|−|0.95|Vdc|
|**SMALL−SIGNAL CHARACTERISTICS**||||||
|Current−Gain − Bandwidth Product<br>(IC= 4.0 mAdc, VCE= 10 Vdc, f = 100 Mhz)<br>MMBTH10LT1G, NSVMMBTH10LT1G<br>MMBTH10−4LT1G, SMMBTH10−4LT3G|fT|650<br>800|−<br>−|−<br>−|MHz|
|Collector−Base Capacitance<br>(VCB= 10 Vdc, IE= 0, f = 1.0 MHz)|Ccb|−|−|0.7|pF|
|Common−Base Feedback Capacitance<br>(VCB= 10 Vdc, IE= 0, f = 1.0 MHz)|Crb|−|−|0.65|pF|
|Collector Base Time Constant<br>(IC= 4.0 mAdc, VCB= 10 Vdc, f = 31.8 MHz)|rb′Cc|−|−|9.0|ps|



Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. 

**www.onsemi.com** 

**2** 

**MMBTH10L, MMBTH10−4L, SMMBTH10−4L, NSVMMBTH10L** 

## **TYPICAL CHARACTERISTICS** 

## **COMMON−BASE y PARAMETERS versus FREQUENCY** 

(VCB = 10 Vdc, IC = 4.0 mAdc, TA = 25 ° C) 

## **yib, INPUT ADMITTANCE** 

**==> picture [485 x 382] intentionally omitted <==**

**----- Start of picture text -----**<br>
80 0<br>70 gib -�10<br>60<br>-�20<br>50<br>-�bib 1000 MHz<br>40 -�30<br>30 700<br>-�40<br>20 400<br>200 100<br>-�50<br>10<br>0 -�60<br>100 200 300 400 500 700 1000 0 10 20 30 40 50 60 70 80<br>f, FREQUENCY (MHz) gib (mmhos)<br>Figure 1. Rectangular Form Figure 2. Polar Form<br>yfb, FORWARD TRANSFER ADMITTANCE<br>70 60<br>60 bfb 200 400<br>50 50 600<br>100<br>40<br>700<br>30 -�gfb 40<br>20<br>10 30<br>1000 MHz<br>0<br>-�10 20<br>-�20<br>-�30 10<br>100 200 300 400 500 700 1000 70 60 50 40 30 20 10 0 -�10 -�20 -�30<br>f, FREQUENCY (MHz) gfb (mmhos)<br>ib<br>jb    (mmhos)<br>, INPUT ADMITTANCE (mmhos)<br>ib<br>y<br>fb<br>jb    (mmhos)<br>, FORWARD TRANSFER ADMITTANCE (mmhos)<br>ib<br>y<br>**----- End of picture text -----**<br>


**Figure 3. Rectangular Form** 

**Figure 4. Polar Form** 

**www.onsemi.com** 

**3** 

**MMBTH10L, MMBTH10−4L, SMMBTH10−4L, NSVMMBTH10L** 

## **TYPICAL CHARACTERISTICS** 

**COMMON−BASE y PARAMETERS versus FREQUENCY** (VCB = 10 Vdc, IC = 4.0 mAdc, TA = 25 ° C) 

## **yrb, REVERSE TRANSFER ADMITTANCE** 

**==> picture [485 x 402] intentionally omitted <==**

**----- Start of picture text -----**<br>
5.0 0<br>100<br>4.0 -�1.0 200<br>MPS H11<br>3.0 -�2.0 400<br>-brb<br>2.0 -brb -�3.0<br>700<br>MPS H10<br>1.0 -�4.0<br>-grb 1000 MHz<br>0 -�5.0<br>100 200 300 400 500 700 1000 -2.0 -1.8 -1.2 -0.8 -0.4 0 0.4 0.8 1.2 1.6 2.0<br>f, FREQUENCY (MHz) grb (mmhos)<br>Figure 5. Rectangular Form Figure 6. Polar Form<br>yob, OUTPUT ADMITTANCE<br>10 10<br>1000 MHz<br>9.0<br>8.0 8.0<br>7.0<br>700<br>6.0 6.0<br>5.0<br>bob<br>4.0 4.0 400<br>3.0<br>200<br>2.0 2.0<br>1.0 gob 100<br>0 0<br>100 200 300 400 500 700 1000 0 2.0 4.0 6.0 8.0 10<br>f, FREQUENCY (MHz) gob (mmhos)<br>rb<br>jb    (mmhos)<br>, REVERSE TRANSFER ADMITTANCE (mmhos)<br>rb<br>y<br>ob<br>jb    (mmhos)<br>, OUTPUT ADMITTANCE (mmhos)<br>ob<br>y<br>**----- End of picture text -----**<br>


**Figure 7. Rectangular Form** 

**Figure 8. Polar Form** 

**www.onsemi.com** 

**4** 

**MMBTH10L, MMBTH10−4L, SMMBTH10−4L, NSVMMBTH10L** 

## **PACKAGE DIMENSIONS** 

**SOT−23 (TO−236)** CASE 318−08 ISSUE AR 

**==> picture [462 x 328] intentionally omitted <==**

**----- Start of picture text -----**<br>
D NOTES:<br>1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.<br>2. CONTROLLING DIMENSION: MILLIMETERS.<br>3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH.<br>0.25 MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF<br>a 3 = THE BASE MATERIAL.<br>| E HE T 4. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH,PROTRUSIONS, OR GATE BURRS.<br>1 2<br>MILLIMETERS INCHES<br>DIM MIN NOM MAX MIN NOM MAX<br>L A 0.89 1.00 1.11 0.035 0.039 0.044<br>3X b L1 A1b 0.010.37 0.060.44 0.100.50 0.0000.015 0.0020.017 0.0040.020<br>e VIEW C c 0.08 0.14 0.20 0.003 0.006 0.008<br>TOP VIEW D 2.80 2.90 3.04 0.110 0.114 0.120<br>E 1.20 1.30 1.40 0.047 0.051 0.055<br>e 1.78 1.90 2.04 0.070 0.075 0.080<br>L 0.30 0.43 0.55 0.012 0.017 0.022<br>A L1 0.35 0.54 0.69 0.014 0.021 0.027<br>H E 2.10 2.40 2.64 0.083 0.094 0.104<br>T 0 ° −−− 10 ° 0 ° −−− 10 °<br>A1 SIDE VIEW SEE VIEW C c STYLE 6:<br>PIN 1. BASE<br>END VIEW 2. EMITTER<br>3. COLLECTOR<br>RECOMMENDED<br>SOLDERING FOOTPRINT*<br>3X<br>2.90 _ 0.90<br>Lo | cr<br>3X 0.80 | LL L 0.95<br>PITCH<br>DIMENSIONS: MILLIMETERS<br>**----- End of picture text -----**<br>


*For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. 

ON Semiconductor and      are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. 

## **PUBLICATION ORDERING INFORMATION** 

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