# Bipolar (BJT) Single Transistor, PNP, 60 V, 600 mA, 640 mW, SOT-723, Surface Mount

![Product image](https://novapart.co/image/farnell:3368657/)

**URL**: https://novapart.co/products/NSVMMBT2907AM3T5G/bipolar-bjt-single-transistor-pnp-60-v-600-ma-640
**SKU**: NSVMMBT2907AM3T5G
**Manufacturer**: ONSEMI
**Category**: Semiconductors - Discretes || Transistors || Bipolar Transistors || Single Bipolar Junction Transistors - BJT
**Price**: €0.0640
**Stock**: 1000+
**Lead Time**: 2 days (indicative)

## Specifications

| Parameter | Value |
|---|---|
| Msl | MSL 1 - Unlimited |
| Svhc | No SVHC (25-Jun-2025) |
| No. Of Pins | 3Pins |
| Product Range | - |
| Qualification | AEC-Q101 |
| Power Dissipation | 640mW |
| Transistor Mounting | Surface Mount |
| Transistor Polarity | PNP |
| Transition Frequency | 200MHz |
| Transistor Case Style | SOT-723 |
| Dc Current Gain Hfe Min | 50hFE |
| Operating Temperature Max | 150°C |
| Continuous Collector Current | 600mA |
| Collector Emitter Voltage Max | 60V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:3368657/)

## MMBT2907AM3T5G 

## PNP General Purpose Transistor 

The MMBT2907AM3T5G device is a spin−off of our popular SOT−23 three−leaded device. It is designed for general purpose amplifier applications and is housed in the SOT−723 surface mount package. This device is ideal for low−power surface mount applications where board space is at a premium. 

**www.onsemi.com** 

## **Features** 

**==> picture [430 x 88] intentionally omitted <==**

**----- Start of picture text -----**<br>
COLLECTOR<br>• Reduces Board Space 3<br>• NSV Prefix for Automotive and Other Applications Requiring<br>Unique Site and Control Change Requirements; AEC−Q101 1<br>BASE<br>Qualified and PPAP Capable<br>• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS ©<br>Compliant 2<br>EMITTER<br>**----- End of picture text -----**<br>


**MAXIMUM RATINGS** 

**Rating Symbol Value Unit** Collector−Emitter Voltage VCEO −60 Vdc **MARKING DIAGRAM** Collector−Base Voltage VCBO −60 Vdc 3 Emitter−Base Voltage VEBO −5.0 Vdc **SOT−723** AC M **CASE 631AA** Collector Current − Continuous IC −600 mAdc 2 **STYLE 1** ~~ee~~ 1 **THERMAL CHARACTERISTICS Characteristic Symbol Max Unit** AC = Specific Device Code M = Date Code Total Device Dissipation PD mW FR−5 Board (Note 1) 265 TA = 25 ° C mW/ ° C Derate above 25 ° C 2.1 Thermal Resistance, R JA 470 ° C/W **ORDERING INFORMATION** Junction−to−Ambient ~~tT~~ **Device Package Shipping**[†] Total Device Dissipation PD 640 mW ° MMBT2907AM3T5G SOT−723 8000/Tape & Alumina Substrate, (Note 2) TA = 25 C Derate above 25 ° C 5.1 mW/ ° C (Pb−Free) Reel Thermal Resistance, R JA 195 ° C/W NSVMMBT2907AM3T5G SOT−723 8000/Tape & Junction−to−Ambient (Pb−Free) Reel Junction and Storage Temperature TJ, Tstg −55 to ° C †For information on tape and reel specifications, +150 including part orientation and tape sizes, please ~~Be~~ refer to our Tape and Reel Packaging Specifications Stresses exceeding those listed in the Maximum Ratings table may damage the Brochure, BRD8011/D. device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 

1. FR−5 = 1.0 0.75 0.062 in. 

2. Alumina = 0.4 0.3 0.024 in. 99.5% alumina. 

Publication Order Number: **MMBT2907AM3/D** 

**1** 

© Semiconductor Components Industries, LLC, 2009 **March, 2017 − Rev. 1** 

## **MMBT2907AM3T5G** 

## **ELECTRICAL CHARACTERISTICS** (TA = 25 ° C unless otherwise noted) 

|**ELECTRICAL CHARACTERISTICS**(TA= 25°C unless otherwise noted)|**ELECTRICAL CHARACTERISTICS**(TA= 25°C unless otherwise noted)|||||
|---|---|---|---|---|---|
|**Characteristic**||**Symbol**|**Min**|**Max**|**Unit**|
|**OFF CHARACTERISTICS**||||||
|Collector−Emitter Breakdown Voltage  (Note 3)<br>(IC= −10 mAdc, IB= 0)||V(BR)CEO|−60|−|Vdc|
|Collector−Base Breakdown Voltage<br>(IC= −10�Adc, IE= 0)||V(BR)CBO|−60|−|Vdc|
|Emitter−Base Breakdown Voltage<br>(IE= −10�Adc, IC= 0)||V(BR)EBO|−5.0|−|Vdc|
|Collector Cutoff Current<br>(VCE= −30 Vdc, VEB(off)= −0.5 Vdc)||ICEX|−|−50|nAdc|
|Collector Cutoff Current<br>(VCB= −50 Vdc, IE= 0)<br>(VCB= −50 Vdc, IE= 0, TA= 125°C)||ICBO|−<br>−|−0.010<br>−10|�Adc|
|Base Cutoff Current<br>(VCE= −30 Vdc, VEB(off)= −0.5 Vdc)||IBL|−|−50|nAdc|
|**ON CHARACTERISTICS**||||||
|DC Current Gain<br>(IC= −0.1 mAdc, VCE= −10 Vdc)<br>(IC= −1.0 mAdc, VCE= −10 Vdc)<br>(IC= −10 mAdc, VCE= −10 Vdc)<br>(IC= −150 mAdc, VCE= −10 Vdc)<br>(IC= −500 mAdc, VCE= −10 Vdc) (Note 3)||hFE|75<br>100<br>100<br>100<br>50|-<br>-<br>-<br>300<br>-|-|
|Collector−Emitter Saturation Voltage (Note 3)<br>(IC= −150 mAdc, IB= −15 mAdc) (Note 3)<br>(IC= −500 mAdc, IB= −50 mAdc)||VCE(sat)|-<br>-|-0.4<br>-1.6|Vdc|
|Base−Emitter Saturation Voltage (Note 3)<br>(IC= −150 mAdc, IB= −15 mAdc)<br>(IC= −500 mAdc, IB= −50 mAdc)||VBE(sat)|-<br>-|-1.3<br>-2.6|Vdc|
|**SMALL−SIGNAL CHARACTERISTICS**||||||
|Current−Gain − Bandwidth Product (Notes 3, 4)<br>(IC= −50 mAdc, VCE= −20 Vdc, f = 100 MHz)||fT|200|−|MHz|
|Output Capacitance<br>(VCB= −10 Vdc, IE= 0, f = 1.0 MHz)||Cobo|−|8.0|pF|
|Input Capacitance<br>(VEB= −2.0 Vdc, IC= 0, f = 1.0 MHz)||Cibo|−|30||
|**SWITCHING CHARACTERISTICS**||||||
|Turn−On Time|(VCC= −30 Vdc, IC= −150 mAdc,<br>IB1= −15 mAdc)|ton|−|45|ns|
|Delay Time||td|−|10||
|Rise Time||tr|−|40||
|Turn−Off Time|**(VCC = −6.0 Vdc, IC = −150 mAdc,**<br>**IB1 = IB2 = −15 mAdc)**|toff|−|100||
|Storage Time||ts|−|80||
|Fall Time||tf|−|30||



3. Pulse Test: Pulse Width � 300 � s, Duty Cycle � 2.0%. 

4. fT is defined as the frequency at which |hfe| extrapolates to unity. 

**www.onsemi.com** 

**2** 

**MMBT2907AM3T5G** 

**==> picture [203 x 107] intentionally omitted <==**

**----- Start of picture text -----**<br>
INPUT<br>Zo = 50 � -30 V<br>PRF = 150 PPS<br>200<br>RISE TIME ≤ 2.0 ns<br>P.W. < 200 ns<br>1.0 k<br>0 TO OSCILLOSCOPE<br>RISE TIME ≤ 5.0 ns<br>-16 V 50<br>200 ns<br>**----- End of picture text -----**<br>


**Figure 1. Delay and Rise Time Test Circuit** 

**==> picture [211 x 107] intentionally omitted <==**

**----- Start of picture text -----**<br>
INPUT<br>Zo = 50 � +15 V -6.0 V<br>PRF = 150 PPS<br>RISE TIME ≤ 2.0 ns 1.0 k 37<br>P.W. < 200 ns<br>1.0 k<br>0 TO OSCILLOSCOPE<br>RISE TIME ≤ 5.0 ns<br>-30 V 50 1N916<br>200 ns<br>**----- End of picture text -----**<br>


**Figure 2. Storage and Fall Time Test Circuit** 

**www.onsemi.com** 

**3** 

**MMBT2907AM3T5G** 

## **TYPICAL CHARACTERISTICS** 

**==> picture [487 x 603] intentionally omitted <==**

**----- Start of picture text -----**<br>
3.0<br>V CE  = -1.0 V<br>2.0 VCE = -10 V T J  = 125°C<br>25°C<br>1.0<br>0.7 -�55°C<br>0.5<br>0.3<br>0.2<br>-0.1 -0.2 -0.3 -0.5 -0.7 -1.0 -2.0 -3.0 -5.0 -7.0 -10 -20 -30 -50 -70 -100 -200 -300 -500<br>IC, COLLECTOR CURRENT (mA)<br>Figure 3. DC Current Gain<br>-1.0<br>-0.8<br>IC = -1.0 mA -10 mA -100 mA -500 mA<br>-0.6<br>-0.4<br>-0.2<br>0<br>-0.005 -0.01 -0.02 -0.03 -0.05 -0.07 -0.1 -0.2 -0.3 -0.5 -0.7 -1.0 -2.0 -3.0 -5.0 -7.0 -10 -20 -30 -50<br>IB, BASE CURRENT (mA)<br>Figure 4. Collector Saturation Region<br>300 500<br>200 VCC = -30 V 300 VCC = -30 V<br>100 tr TICJ/I = 25B = 10°C 200 tf IICB1/I = IB = 10B2<br>70 100 TJ = 25°C<br>50<br>70<br>30 50<br>20 30 t′s = ts - 1/8 tf<br>td @ VBE(off) = 0 V<br>20<br>10<br>7.0 10<br>5.0 2.0 V<br>7.0<br>3.0 5.0<br>-5.0 -7.0 -10 -20 -30 -50 -70 -100 -200 -300 -500 -5.0 -7.0 -10 -20 -30 -50 -70 -100 -200 -300 -500<br>IC, COLLECTOR CURRENT IC, COLLECTOR CURRENT (mA)<br>hFE, NORMALIZED CURRENT GAIN<br>CE<br>V     , COLLECTOR-EMITTER VOLTAGE (VOLTS)<br>t, TIME (ns) t, TIME (ns)<br>**----- End of picture text -----**<br>


**Figure 5. Turn−On Time** 

**Figure 6. Turn−Off Time** 

**www.onsemi.com** 

**4** 

**MMBT2907AM3T5G** 

## **TYPICAL SMALL−SIGNAL Characteristics NOISE FIGURE** 

VCE = 10 Vdc, TA = 25 ° C 

**==> picture [487 x 597] intentionally omitted <==**

**----- Start of picture text -----**<br>
10 10<br>f = 1.0 kHz<br>8.0 8.0<br>6.0 -500 IC = -1.0 mA, R�A, Rs = 560s = 430  � � 6.0 -100 IC = -50 �A �A<br>-50 �A, Rs = 2.7 k� -500 �A<br>4.0 -100 �A, Rs = 1.6 k� 4.0 -1.0 mA<br>2.0 Rs = OPTIMUM SOURCE RESISTANCE 2.0<br>0 0<br>0.01 0.02 0.05 0.1 0.2 0.5 1.0 2.0 5.0 10 20 50 100 50 100 200 500 1.0 k 2.0 k 5.0 k 10 k 20 k 50 k<br>f, FREQUENCY (kHz) Rs, SOURCE RESISTANCE (OHMS)<br>Figure 7. Frequency Effects Figure 8. Source Resistance Effects<br>30 400<br>300<br>20 Ceb<br>200<br>10<br>100<br>7.0 80 VCE = -20 V<br>5.0 Ccb 60 TJ = 25°C<br>40<br>3.0 30<br>2.0 20<br>-0.1 -0.2 -0.3 -0.5 -1.0 -2.0 -3.0 -5.0 -10 -20 -30 -1.0 -2.0 -5.0 -10 -20 -50 -100 -200 -500 -1000<br>REVERSE VOLTAGE (VOLTS) IC, COLLECTOR CURRENT (mA)<br>Figure 9. Capacitances Figure 10. Current−Gain − Bandwidth Product<br>-1.0 +0.5<br>TJ = 25°C<br>0<br>-0.8 VBE(sat) @ IC/IB = 10 R�VC for VCE(sat)<br>-0.5<br>VBE(on) @ V [CE]  = -10 V<br>-0.6<br>-1.0<br>-0.4<br>-1.5<br>-0.2<br>-2.0 R�VB for VBE<br>VCE(sat) @ IC/IB = 10<br>0 -2.5<br>-0.1 -0.2 -0.5 -1.0 -2.0 -5.0 -10 -20 -50 -100 -200 -500 -0.1 -0.2 -0.5 -1.0 -2.0 -5.0 -10 -20 -50 -100 -200 -500<br>IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)<br>NF, NOISE FIGURE (dB) NF, NOISE FIGURE (dB)<br>C, CAPACITANCE (pF)<br>fT, CURRENT-GAIN — BANDWIDTH PRODUCT (MHz)<br>C)<br> °<br>V, VOLTAGE (VOLTS) COEFFICIENT (mV/<br>**----- End of picture text -----**<br>


**Figure 11. “On” Voltage** 

**Figure 12. Temperature Coefficients** 

**www.onsemi.com** 

**5** 

**MMBT2907AM3T5G** 

## **PACKAGE DIMENSIONS** 

**SOT−723** CASE 631AA ISSUE D 

**==> picture [432 x 337] intentionally omitted <==**

**----- Start of picture text -----**<br>
−X− NOTES:<br>1. DIMENSIONING AND TOLERANCING PER ASME<br>D Y14.5M, 1994.<br>b1 A 2. CONTROLLING DIMENSION: MILLIMETERS.<br>3 −Y− 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD<br>FINISH. MINIMUM LEAD THICKNESS IS THE MINIMUM<br>THICKNESS OF BASE MATERIAL.<br>E H E 4. DIMENSIONS D AND E DO NOT INCLUDE MOLD<br>FLASH, PROTRUSIONS OR GATE BURRS.<br>1 2<br>Ge 2X b i MILLIMETERS<br>C DIM MIN NOM MAX<br>2X e 0.08 X Y A 0.45 0.50 0.55<br>SIDE VIEW b 0.15 0.21 0.27<br>TOP VIEW b1 0.25 0.31 0.37<br>C 0.07 0.12 0.17<br>3X L D 1.15 1.20 1.25<br>1 E 0.75 0.80 0.85<br>e 0.40 BSC STYLE 1:<br>H E 1.15 1.20 1.25<br>PIN 1. BASE<br>L 0.29 REF  2. EMITTER<br>L2 0.15 0.20 0.25  3. COLLECTOR<br>3X L2 of RECOMMENDED |CUE<br>BOTTOM VIEW SOLDERING FOOTPRINT*<br>2X<br>0.40<br>2X 0.27<br>“At<br>PACKAGE<br>OUTLINE<br>SAE]<br>1.50<br>3X 0.52 ae 0.36<br>DIMENSIONS: MILLIMETERS<br>**----- End of picture text -----**<br>


*For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. 

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## **PUBLICATION ORDERING INFORMATION** 

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