# Bipolar (BJT) Single Transistor, NPN, 65 V, 100 mA, 265 mW, SOT-723, Surface Mount

![Product image](https://novapart.co/image/farnell:2724373/)

**URL**: https://novapart.co/products/NSVBC846BM3T5G/bipolar-bjt-single-transistor-npn-65-v-100-ma-265
**SKU**: NSVBC846BM3T5G
**Manufacturer**: ONSEMI
**Category**: Semiconductors - Discretes || Transistors || Bipolar Transistors || Single Bipolar Junction Transistors - BJT
**Price**: €0.0520
**Stock**: 1000+
**Lead Time**: 2 days (indicative)

## Description

Transistor Polarity:NPN; Collector Emitter Voltage V(br)ceo:65V; Transition Frequency ft:100MHz; Power Dissipation Pd:265mW; DC Collector Current:100mA; DC Current Gain hFE:200hFE

## Specifications

| Parameter | Value |
|---|---|
| Msl | MSL 1 - Unlimited |
| Svhc | No SVHC (25-Jun-2025) |
| No. Of Pins | 3Pins |
| Product Range | - |
| Qualification | AEC-Q101 |
| Power Dissipation | 265mW |
| Transistor Mounting | Surface Mount |
| Transistor Polarity | NPN |
| Transition Frequency | 100MHz |
| Transistor Case Style | SOT-723 |
| Dc Current Gain Hfe Min | 200hFE |
| Operating Temperature Max | 150°C |
| Continuous Collector Current | 100mA |
| Collector Emitter Voltage Max | 65V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:2724373/)

## General Purpose Transistor **NPN Silicon** 

## BC846BM3T5G, NSVBC846BM3T5G 

## **Features** 

- Moisture Sensitivity Level: 1 

**www.onsemi.com** 

- ESD Rating: Human Body Model: >4000 V 

COLLECTOR Machine Model: >400 V 3 • NSV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q101 1 BASE Qualified and PPAP Capable • This is a Pb−Free Device ~~4~~ ) 2 EMITTER **MAXIMUM RATINGS MARKING Rating Symbol Value Unit DIAGRAM** Collector−Emitter Voltage VCEO 65 Vdc 3 **SOT−723** Collector−Base Voltage VCBO 80 Vdc **CASE 631AA** 1B M Emitter−Base Voltage VEBO 6.0 Vdc 2 **STYLE 1** 1 Collector Current − Continuous IC 100 mAdc ~~fe «~~ **THERMAL CHARACTERISTICS** 1B = Specific Device Code M = Date Code **Characteristic Symbol Max Unit** Total Device Dissipation FR−5 Board PD 265 mW (Note 1)TA = 25 ° C **ORDERING INFORMATION** Derate above 25 ° C 2.1 mW/ ° C **Device Package Shipping**[†] Thermal Resistance, R JA 470 ° C/W BC846BM3T5G SOT−723 8000 / Tape & Junction to Ambient (Note 1) (Pb−Free) Reel Total Device Dissipation PD 640 mW NSVBC846BM3T5G SOT−723 8000 / Tape & (Pb−Free) Reel Alumina Substrate (Note 2) TA = 25 ° C †For information on tape and reel specifications, ~~=~~ Derate above 25 ° C 5.1 mW/ ° C including part orientation and tape sizes, please Thermal Resistance, R JA 195 ° C/W refer to our Tape and Reel Packaging SpecificationsBrochure, BRD8011/D. Junction to Ambient (Note 2) Junction and Storage TJ, Tstg −55 to ° C Temperature Range +150 ~~ee~~ Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 

1. FR−5 = 1.0 0.75 0.062 in. 

2. Alumina = 0.4 0.3 0.024 in. 99.5% alumina. 

Publication Order Number: 

**1** 

© Semiconductor Components Industries, LLC, 2014 **July, 2021 − Rev. 4** 

**BC846BM3/D** 

## **BC846BM3T5G, NSVBC846BM3T5G** 

## **ELECTRICAL CHARACTERISTICS** (TA = 25 ° C unless otherwise noted) 

|**ELECTRICAL CHARACTERISTICS**(TA= 25°C unless otherwise noted)||||||
|---|---|---|---|---|---|
|**Characteristic**|**Symbol**|**Min**|**Typ**|**Max**|**Unit**|
|**OFF CHARACTERISTICS**||||||
|Collector−Emitter Breakdown Voltage<br>(IC= 10 mA)|V(BR)CEO|65|−|−|V|
|Collector−Emitter Breakdown Voltage<br>(IC= 10�A, VEB= 0)|V(BR)CES|80|−|−|V|
|Collector−Base Breakdown Voltage<br>(IC= 10�A)|V(BR)CBO|80|−|−|V|
|Emitter−Base Breakdown Voltage<br>(IE= 1.0�A)|V(BR)EBO|6.0|−|−|V|
|Collector Cutoff Current<br>(VCB= 30 V)<br>(VCB= 30 V, TA= 150°C)|ICBO|−<br>−|−<br>−|15<br>5.0|nA<br>�A|
|Base Peak Current<br>(t≤1 s)|IBM|−|−|200|mA|
|**ON CHARACTERISTICS**||||||
|DC Current Gain<br>(IC= 10�A, VCE= 5.0 V)<br>(IC= 2.0 mA, VCE= 5.0 V)|hFE|−<br>200|150<br>290|−<br>450|−|
|Collector−Emitter Saturation Voltage (IC= 10 mA, IB= 0.5 mA)<br>Collector−Emitter Saturation Voltage(IC= 100 mA, IB= 5.0 mA)|VCE(sat)|−<br>−|−<br>−|0.25<br>0.6|V|
|Base−Emitter Saturation Voltage (IC= 10 mA, IB= 0.5 mA)<br>Base−Emitter Saturation Voltage(IC= 100 mA, IB= 5.0 mA)|VBE(sat)|−<br>−|0.7<br>0.9|−<br>−|V|
|Base−Emitter Voltage (IC= 1.0 mA, VCE= 5.0 V)<br>Base−Emitter Voltage(IC= 2.0 mA, VCE= 5.0 V)<br>Base−Emitter Voltage(IC= 10 mA, VCE= 5.0 V)|VBE(on)|550<br>580<br>−|645<br>660<br>−|700<br>700<br>770|mV|
|**SMALL−SIGNAL CHARACTERISTICS**||||||
|Current−Gain − Bandwidth Product<br>(IC= 10 mA, VCE= 5.0 Vdc, f = 100 MHz)|fT|100|−|−|MHz|
|Output Capacitance<br>(VCB= 10 V, f = 1.0 MHz)|Cobo|−|−|4.5|pF|
|Noise Figure<br>(IC= 0.2 mA, VCE= 5.0 Vdc, RS= 2.0 k�, f = 1.0 kHz, BW = 200 Hz)|NF|−|−|10|dB|



Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. 

**www.onsemi.com** 

**2** 

**BC846BM3T5G, NSVBC846BM3T5G** 

## **TYPICAL CHARACTERISTICS** 

**==> picture [491 x 382] intentionally omitted <==**

**----- Start of picture text -----**<br>
1,000 0.4<br>150 ° C V CE = 5 V<br>25 ° C IC/IB = 20<br>−55 ° C 0.3<br>150 ° C<br>100 0.2<br>25 ° C<br>0.1<br>−55 ° C<br>10 0<br>0.1 1 10 100 1,000 0.1 1 10 100<br>IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)<br>Figure 1. DC Current Gain Figure 2. Collector−Emitter Saturation Voltage<br>1.2 1.2<br>1.0 1.0<br>−55 ° C −55 ° C<br>0.8 0.8<br>25 ° C 25 ° C<br>0.6 0.6<br>150 ° C 150 ° C<br>0.4 0.4<br>0.2 IC/IB = 20 0.2 VCE = 5 V<br>0 0<br>0.1 1 10 100 1,000 0.1 1 10 100 1,000<br>IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)<br>, DC CURRENT VOLTAGE (V)<br>FE<br>h , COLL−EMIT SATURATION<br>CE(sat)<br>V<br>VOLTAGE (V)<br>, BASE−EMIT SATURATION<br>, BASE−EMITTER ON VOLTAGE (V)<br>BE(sat)<br>V<br>BE(on)<br>V<br>**----- End of picture text -----**<br>


**Figure 3. Base−Emitter Saturation Voltage** 

**Figure 4. Base−Emitter “On” Voltage** 

**==> picture [491 x 178] intentionally omitted <==**

**----- Start of picture text -----**<br>
−0.2 2.0<br>T A = 25 ° C<br>−0.6 VCE = 5 V<br>1.6 10 mA 20 mA 50 mA 100 mA IC = 200 mA<br>−1.0<br>1.2<br>−1.4<br>−1.8 � VB , for V BE 0.8<br>−2.2<br>0.4<br>−2.6<br>−55 ° C to 150 ° C<br>−3.0 0<br>0.1 1 10 100 1,000 0.01 0.1 1 10 100<br>IC, COLLECTOR CURRENT (mA) IB, BASE CURRENT (mA)<br>, TEMPERATURE COEFFICIENT (mV) , COLLECTOR−EMITTER VOLTAGE (V)<br>� VB VCE<br>**----- End of picture text -----**<br>


**Figure 5. Base−Emitter Temperature Coefficient** 

**Figure 6. Collector Saturation Region** 

**www.onsemi.com** 

**3** 

**BC846BM3T5G, NSVBC846BM3T5G** 

## **TYPICAL CHARACTERISTICS** 

**==> picture [490 x 173] intentionally omitted <==**

**----- Start of picture text -----**<br>
10 1,000<br>VCE = 5 V<br>Cib<br>Cob<br>1 100<br>0.1 10<br>0.1 1 10 100 1 10 100<br>VR, REVERSE VOLTAGE (V) IC, COLLECTOR CURRENT (mA)<br>PRODUCT (MHz)<br>C, CAPACITANCE (pF)<br>, CURRENT−GAIN−BANDWIDTH<br>fT<br>**----- End of picture text -----**<br>


**==> picture [99 x 10] intentionally omitted <==**

**----- Start of picture text -----**<br>
Figure 7. Capacitances<br>**----- End of picture text -----**<br>


**Figure 8. Current−Gain−Bandwidth Product** 

**www.onsemi.com** 

**4** 

MECHANICAL CASE OUTLINE **PACKAGE DIMENSIONS** 

**SOT−723** CASE 631AA−01 ISSUE D 

DATE 10 AUG 2009 

**SCALE 4:1** 

**==> picture [451 x 252] intentionally omitted <==**

**----- Start of picture text -----**<br>
−X− NOTES:<br>1. DIMENSIONING AND TOLERANCING PER ASME<br>D Y14.5M, 1994.<br>b1 A 2. CONTROLLING DIMENSION: MILLIMETERS.<br>3 −Y− 3. MAXIMUM LEAD THICKNESS INCLUDES LEADFINISH. MINIMUM LEAD THICKNESS IS THE MINIMUMFINISH. MINIMUM LEAD THICKNESS IS THE MINIMUM<br>THICKNESS OF BASE MATERIAL.<br>E H E 4. DIMENSIONS D AND E DO NOT INCLUDE MOLD<br>FLASH, PROTRUSIONS OR GATE BURRS.<br>1 2<br>Go 2X b tf MILLIMETERS<br>C DIM MIN NOM MAX<br>2X e 0.08 X Y A 0.45 0.50 0.55<br>SIDE VIEW b 0.15 0.21 0.27<br>TOP VIEW b1 0.25 0.31 0.37<br>C 0.07 0.12 0.17<br>3X L D 1.15 1.20 1.25<br>1 E 0.75 0.80 0.85<br>e 0.40 BSC<br>H E 1.15 1.20 1.25<br>L 0.29 REF<br>L2 0.15 0.20 0.25<br>3X L2 |CU E GENERIC<br>BOTTOM VIEW MARKING DIAGRAM*<br>STYLE 1: STYLE 2: STYLE 3: STYLE 4: STYLE 5:<br>PIN 1. BASE PIN 1. ANODE PIN 1. ANODE PIN 1. CATHODE PIN 1. GATE XX M<br> 2. EMITTER  2. N/C  2. ANODE  2. CATHODE  2. SOURCE<br> 3. COLLECTOR  3. CATHODE  3. CATHODE  3. ANODE  3. DRAIN<br>=<br>1<br>XX = Specific Device Code<br>RECOMMENDED<br>M = Date Code<br>**----- End of picture text -----**<br>


1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 

3. MAXIMUM LEAD THICKNESS INCLUDES LEADFINISH. MINIMUM LEAD THICKNESS IS THE MINIMUMFINISH. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL. 

**==> picture [177 x 173] intentionally omitted <==**

**----- Start of picture text -----**<br>
RECOMMENDED<br>SOLDERING FOOTPRINT*<br>2X<br>0.40<br>2X 0.27<br>“Ar<br>PACKAGE<br>OUTLINE<br>SAE]<br>1.50<br>3X 0.52 aoe 0.36<br>DIMENSIONS: MILLIMETERS<br>**----- End of picture text -----**<br>


*This information is generic. Please refer to device data sheet for actual part marking. Pb−Free indicator, “G”, may or not be present. 

*For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. 

Electronic versions are uncontrolled except when accessed directly from the Document Repository. **DOCUMENT NUMBER: 98AON12989D** Printed  versions are uncontrolled  except when stamped  “CONTROLLED COPY” in red. **DESCRIPTION: SOT−723 PAGE 1 OF 1** ~~SE~~ ON Semiconductor and          are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the rights of others. 

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© Semiconductor Components Industries, LLC, 2019 

**onsemi** , , and other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “ **onsemi** ” or its affiliates and/or subsidiaries in the United States and/or other countries. **onsemi** owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of **onsemi’s** product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. **onsemi** reserves the right to make changes at any time to any products or information herein, without notice. The information herein is provided “as−is” and **onsemi** makes no warranty, representation or guarantee regarding the accuracy of the information, product features, availability, functionality, or suitability of its products for any particular purpose, nor does **onsemi** assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using **onsemi** products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by **onsemi** . “Typical” parameters which may be provided in **onsemi** data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. **onsemi** does not convey any license under any of its intellectual property rights nor the rights of others. **onsemi** products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use **onsemi** products for any such unintended or unauthorized application, Buyer shall indemnify and hold **onsemi** and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that **onsemi** was negligent regarding the design or manufacture of the part. **onsemi** is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. 

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