# BIPOLAR TRANSISTOR, PNP, -100V, SOT-23-3

![Product image](https://novapart.co/image/farnell:2808747/)

**URL**: https://novapart.co/products/NSV1C200LT1G/bipolar-transistor-pnp-100v-sot-23-3
**SKU**: NSV1C200LT1G
**Manufacturer**: ONSEMI
**Category**: Semiconductors - Discretes || Transistors || Bipolar Transistors || Single Bipolar Junction Transistors - BJT
**Price**: €0.2390
**Stock**: 10+

## Specifications

| Parameter | Value |
|---|---|
| No. Of Pins | 3Pins |
| Qualification | AEC-Q101 |
| Power Dissipation | 490mW |
| Dc Current Gain Hfe | 50hFE |
| Transistor Mounting | Surface Mount |
| Transistor Polarity | PNP |
| Transition Frequency | 120MHz |
| Transistor Case Style | SOT-23 |
| Dc Current Gain Hfe Min | 50hFE |
| Operating Temperature Max | 150°C |
| Continuous Collector Current | 2A |
| Collector Emitter Voltage Max | 100V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:2808747/)

## NSS1C200L, NSV1C200L 

## 100 V, 2.0 A, Low VCE(sat) PNP Transistor 

ON Semiconductor’s e[2] PowerEdge family of low VCE(sat) transistors are miniature surface mount devices featuring ultra low saturation voltage (VCE(sat)) and high current gain capability. These are designed for use in low voltage, high speed switching applications where affordable efficient energy control is important. 

Typical applications are DC−DC converters and power management in portable and battery powered products such as cellular and cordless phones, PDAs, computers, printers, digital cameras and MP3 players. Other applications are low voltage motor controls in mass storage products such as disc drives and tape drives. In the automotive industry they can be used in air bag deployment and in the instrument cluster. The high current gain allows e[2] PowerEdge devices to be driven directly from PMU’s control outputs, and the Linear Gain (Beta) makes them ideal components in analog amplifiers. 

## **Features** 

- NSV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q101 Qualified and PPAP Capable 

- These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS Compliant 

## **MAXIMUM RATINGS** (TA = 25 ° C) 

|**MAXIMUM RATINGS**(TA = 25A = 25= 25°C)||||
|---|---|---|---|
|**Rating**|**Symbol**|**Max**|**Unit**|
|Collector-Emitter Voltage|VCEO|−100|Vdc|
|Collector-Base Voltage|VCBO|−140|Vdc|
|Emitter-Base Voltage|VEBO|−7.0|Vdc|
|Collector Current − Continuous|IC|−2.0|A|
|Collector Current − Peak|ICM|−3.0|A|



## **THERMAL CHARACTERISTICS** 

**Characteristic Symbol Max Unit** Total Device Dissipation PD (Note 1) 490 mW TA = 25 ° C Derate above 25 ° C 3.7 mW/ ° C Thermal Resistance, R JA (Note 1) 255 ° C/W Junction−to−Ambient Total Device Dissipation PD (Note 2) 710 mW TA = 25 ° C Derate above 25 ° C 4.3 mW/ ° C ~~ee~~ Thermal Resistance, R JA (Note 2) 176 ° C/W Junction−to−Ambient Junction and Storage TJ, Tstg −55 to ° C Temperature Range +150 ~~ee~~ Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. FR−4 @ 100 mm[2] , 1 oz. copper traces. 2. FR−4 @ 500 mm[2] , 1 oz. copper traces. 

**www.onsemi.com** 

## **−100 VOLTS, 2.0 AMPS PNP LOW V TRANSISTOR CE(sat)** 

**==> picture [162 x 344] intentionally omitted <==**

**----- Start of picture text -----**<br>
COLLECTOR<br>3<br>1<br>BASE<br>& )<br>2<br>EMITTER<br>3<br>1<br>><br>2<br>SOT−23 (TO−236)<br>CASE 318<br>STYLE 6<br>MARKING DIAGRAM<br>VL M<br>1 .<br>VL = Specific Device Code<br>M = Date Code*<br>= Pb−Free Package<br>(Note: Microdot may be in either location)<br>*Date Code orientation and/or overbar may<br>vary depending upon manufacturing location.<br>**----- End of picture text -----**<br>


## **ORDERING INFORMATION** 

|**Device**|**Package**|**Package**<br>**Shipping**†|
|---|---|---|
|NSS1C200LT1G,<br>NSV1C200LT1G|SOT−23<br>(Pb−Free)|SOT−23<br>(Pb−Free)<br>3000/Tape & Reel|



- †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D. 

Publication Order Number: 

**1** 

© Semiconductor Components Industries, LLC, 2007 **October, 2016 − Rev. 6** 

**NSS1C200L/D** 

## **NSS1C200L, NSV1C200L** 

## **ELECTRICAL CHARACTERISTICS** (TA = 25 ° C unless otherwise noted) 

|**ELECTRICAL CHARACTERISTICS**(TA= 25°C unless otherwise n|oted)|||||
|---|---|---|---|---|---|
|**Characteristic**|**Symbol**|**Min**|**Typ**|**Max**|**Unit**|
|**OFF CHARACTERISTICS**||||||
|Collector−Emitter Breakdown Voltage<br>(IC= −10 mAdc, IB= 0)|V(BR)CEO|−100|||Vdc|
|Collector−Base Breakdown Voltage<br>(IC= −0.1 mAdc, IE= 0)|V(BR)CBO|−140|||Vdc|
|Emitter−Base Breakdown Voltage<br>(IE= −0.1 mAdc, IC= 0)|V(BR)EBO|−7.0|||Vdc|
|Collector Cutoff Current<br>(VCB= −140 Vdc, IE= 0)|ICBO|||−100|nAdc|
|Emitter Cutoff Current<br>(VEB= −6.0 Vdc)|IEBO|||−50|nAdc|
|**ON CHARACTERISTICS**||||||
|DC Current Gain (Note 3)<br>(IC= −10 mA, VCE= −2.0 V)<br>(IC= −500 mA, VCE= −2.0 V)<br>(IC= −1.0 A, VCE= −2.0 V)<br>(IC= −2.0 A, VCE= −2.0 V)|hFE|150<br>120<br>80<br>50|240|360||
|Collector−Emitter Saturation Voltage (Note 3)<br>(IC= −0.1 A, IB= −0.01 A)<br>(IC= −0.5 A, IB= −0.05 A)<br>(IC= −1.0 A, IB= −0.100 A)<br>(IC= −2.0 A, IB= −0.200 A)|VCE(sat)|||−0.040<br>−0.080<br>−0.115<br>−0.250|V|
|Base−Emitter Saturation Voltage (Note 3)<br>(IC= −1.0 A, IB= −0.100 A)|VBE(sat)|||−0.950|V|
|Base−Emitter Turn−on Voltage (Note 3)<br>(IC= −1.0 A, VCE= −2.0 V)|VBE(on)|||−0.850|V|
|Cutoff Frequency<br>(IC= −100 mA, VCE= −5.0 V, f = 100 MHz)|fT||120||MHz|
|Input Capacitance (VEB= 2.0 V, f = 1.0 MHz)|Cibo||200||pF|
|Output Capacitance (VCB= 10 V, f = 1.0 MHz)|Cobo||22||pF|



Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. 3. Pulsed Condition: Pulse Width = 300 msec, Duty Cycle ≤ 2%. 

**==> picture [253 x 175] intentionally omitted <==**

**----- Start of picture text -----**<br>
0.60<br>0.50<br>Note 2<br>0.40<br>0.30 Note 1<br>0.20<br>0.10<br>0<br>0 20 40 60 80 100 120 140 160<br>TA, AMBIENT TEMPERATURE ( ° C)<br>, POWER DISSIPATION (W)<br>D<br>P<br>**----- End of picture text -----**<br>


**Figure 1. Power Derating** 

**www.onsemi.com** 

**2** 

**NSS1C200L, NSV1C200L** 

**==> picture [490 x 606] intentionally omitted <==**

**----- Start of picture text -----**<br>
500 500<br>VCE = 2 V VCE = 4 V<br>150 ° C 150 ° C<br>400 400<br>300 25 ° C 300 25 ° C<br>200 200<br>−55 ° C −55 ° C<br>100 100<br>0 0<br>0.001 0.01 0.1 1 10 0.001 0.01 0.1 1 10<br>IC, COLLECTOR CURRENT (A) IC, COLLECTOR CURRENT (A)<br>Figure 2. DC Current Gain Figure 3. DC Current Gain<br>1 1<br>150 ° C<br>0.1 0.1<br>150 ° C 25 ° C<br>25 ° C −55 ° C<br>−55 ° C<br>IC/IB = 10 IC/IB = 50<br>0.01 0.01<br>0.001 0.01 0.1 1 10 0.001 0.01 0.1 1 10<br>IC, COLLECTOR CURRENT (A) IC, COLLECTOR CURRENT (A)<br>Figure 4. Collector−Emitter Saturation Voltage Figure 5. Collector−Emitter Saturation Voltage<br>1.2 1.2<br>1.0 1.0<br>−55 ° C −55 ° C<br>0.8 25 ° C 0.8 25 ° C<br>0.6 0.6<br>150 ° C 150 ° C<br>0.4 0.4<br>0.2 0.2<br>IC/IB = 10 IC/IB = 50<br>0 0<br>0.001 0.01 0.1 1 10 0.001 0.01 0.1 1 10<br>IC, COLLECTOR CURRENT (A) IC, COLLECTOR CURRENT (A)<br>DC, CURRENT GAIN DC, CURRENT GAIN<br>, COLLECTOR−EMITTER VOLTAGE (V) , COLLECTOR−EMITTER VOLTAGE (V)<br>CE(sat) CE(sat)<br>V V<br>, BASE−EMITTER VOLTAGE (V) , BASE−EMITTER VOLTAGE (V)<br>BE(sat) BE(sat)<br>V V<br>**----- End of picture text -----**<br>


**Figure 6. Base−Emitter Saturation Voltage** 

**Figure 7. Base−Emitter Saturation Voltage** 

**www.onsemi.com** 

**3** 

**NSS1C200L, NSV1C200L** 

**==> picture [493 x 177] intentionally omitted <==**

**----- Start of picture text -----**<br>
1.0 1.00<br>TJ = 25 ° C<br>−55 ° C<br>0.8 3 A<br>25 ° C 2 A<br>1 A<br>0.6<br>0.10<br>150 ° C<br>0.4 0.5 A<br>0.2 IC = 0.1 A<br>VCE = 2 V<br>0 0.01<br>0.001 0.01 0.1 1 10 1.0E−04 1.0E−03 1.0E−02 1.0E−01 1.0E+00<br>IC, COLLECTOR CURRENT (A) IB, BASE CURRENT (A)<br>, BASE−EMITTER VOLTAGE (V)<br>, COLLECTOR−EMITTER VOLTAGE (V)<br>BE(on)<br>V<br>CE(sat)<br>V<br>**----- End of picture text -----**<br>


**Figure 8. Base−Emitter Saturation Voltage** 

**Figure 9. Collector Saturation Region** 

**==> picture [493 x 394] intentionally omitted <==**

**----- Start of picture text -----**<br>
400 80<br>TJ = 25 ° C TJ = 25 ° C<br>70<br>f TEST  = 1 MHz f TEST  = 1 MHz<br>300 60<br>50<br>200 40<br>30<br>100 20<br>10<br>0 0<br>0 1 2 3 4 5 6 7 8 0 10 20 30 40 50 60 70 80 90 100<br>VCE, EMITTER BASE VOLTAGE (V) VCB, COLLECTOR BASE VOLTAGE (V)<br>Figure 10. Input Capacitance Figure 11. Output Capacitance<br>140 10<br>TJ = 25 ° C<br>120 fTEST = 1 MHz 10 ms<br>VCE = 10 V<br>100 1 ms<br>1<br>100 ms<br>80<br>60<br>Thermal Limit<br>0.1<br>40<br>20<br>0 0.01<br>0.001 0.01 0.1 1 0.1 1 10 100<br>IC, COLLECTOR CURRENT (A) VCE, COLLECTOR EMITTER VOLTAGE (V)<br>, INPUT CAPACITANCE (pF) , OUTPUT CAPACITANCE (pF)<br>IBO<br>C OBO<br>C<br>(MHz)<br>, COLLECTOR CURRENT (A)<br>IC<br>, CURRENT−GAIN BANDWIDTH PRODUCT<br>fTau<br>**----- End of picture text -----**<br>


**Figure 12. Current−Gain Bandwidth Product** 

**Figure 13.** 

**www.onsemi.com** 

**4** 

**NSS1C200L, NSV1C200L** 

**==> picture [491 x 175] intentionally omitted <==**

**----- Start of picture text -----**<br>
1000<br>D = 0.5<br>100 D = 0.2<br>D = 0.1<br>D = 0.05<br>10 D = 0.02<br>D = 0.01<br>1<br>Single Pulse<br>0.1<br>0.000001 0.00001 0.0001 0.001 0.01 0.1 1.0 10 100 1000<br>t, PULSE TIME (s)<br>C/W)<br>°<br>R(t), (<br>**----- End of picture text -----**<br>


**Figure 14. Transient Thermal Resistnce** 

**www.onsemi.com** 

**5** 

**NSS1C200L, NSV1C200L** 

## **PACKAGE DIMENSIONS** 

**SOT−23 (TO−236)** CASE 318−08 ISSUE AR 

**==> picture [463 x 183] intentionally omitted <==**

**----- Start of picture text -----**<br>
D NOTES:<br>1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.<br>2. CONTROLLING DIMENSION: MILLIMETERS.<br>3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH.<br>0.25 MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF<br>a 3 t = THE BASE MATERIAL.<br>E HE T 4. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH,PROTRUSIONS, OR GATE BURRS.<br>1 2<br>MILLIMETERS INCHES<br>DIM MIN NOM MAX MIN NOM MAX<br>L A 0.89 1.00 1.11 0.035 0.039 0.044<br>3X b L1 A1b 0.010.37 0.060.44 0.100.50 0.0000.015 0.0020.017 0.0040.020<br>: e : VIEW C 7 c 0.08 0.14 0.20 0.003 0.006 0.008<br>TOP VIEW D 2.80 2.90 3.04 0.110 0.114 0.120<br>E 1.20 1.30 1.40 0.047 0.051 0.055<br>e 1.78 1.90 2.04 0.070 0.075 0.080<br>L 0.30 0.43 0.55 0.012 0.017 0.022<br>A L1 0.35 0.54 0.69 0.014 0.021 0.027<br>H E 2.10 2.40 2.64 0.083 0.094 0.104<br>T 0 −−− 10 0 −−− 10<br>Get A1 SIDE VIEW SEE VIEW C RY c STYLE 6:<br>END VIEW PIN 1. BASE<br>2. EMITTER<br>3. COLLECTOR<br>**----- End of picture text -----**<br>


**==> picture [142 x 135] intentionally omitted <==**

**----- Start of picture text -----**<br>
RECOMMENDED<br>SOLDERING FOOTPRINT*<br>3X<br>2.90 r u 0.90<br>L G) crt<br>3X 0.80 | LL 0.95<br>PITCH<br>DIMENSIONS: MILLIMETERS<br>**----- End of picture text -----**<br>


*For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. 

ON Semiconductor and      are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. 

## **PUBLICATION ORDERING INFORMATION** 

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## **LITERATURE FULFILLMENT** : 

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**NSS1C200L/D** 

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