# Bipolar (BJT) Single Transistor, PNP, 40 V, 200 mA, 290 mW, SOT-1123, Surface Mount

![Product image](https://novapart.co/image/farnell:2533340/)

**URL**: https://novapart.co/products/NST3906F3T5G/bipolar-bjt-single-transistor-pnp-40-v-200-ma-290
**SKU**: NST3906F3T5G
**Manufacturer**: ONSEMI
**Category**: Semiconductors - Discretes || Transistors || Bipolar Transistors || Single Bipolar Junction Transistors - BJT
**Price**: €0.0550
**Stock**: 1000+
**Lead Time**: 2 days (indicative)

## Description

Transistor Polarity:PNP; Collector Emitter Voltage V(br)ceo:-40V; Transition Frequency ft:250MHz; Power Dissipation Pd:290mW; DC Collector Current:-200mA; DC Current Gain hFE:30hFE; Transist

## Specifications

| Parameter | Value |
|---|---|
| Msl | - |
| Svhc | No SVHC (25-Jun-2025) |
| No. Of Pins | 3Pins |
| Product Range | - |
| Qualification | AEC-Q101 |
| Power Dissipation | 290mW |
| Transistor Mounting | Surface Mount |
| Transistor Polarity | PNP |
| Transition Frequency | 250MHz |
| Transistor Case Style | SOT-1123 |
| Dc Current Gain Hfe Min | 30hFE |
| Operating Temperature Max | 150°C |
| Continuous Collector Current | 200mA |
| Collector Emitter Voltage Max | 40V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:2533340/)

**DATA SHEET www.onsemi.com** 

## PNP General Purpose Transistor 

## NST3906F3T5G 

The NST3906F3T5G device is a spin−off of our popular SOT−23/SOT−323/SOT−563/SOT−963 three−leaded device. It is designed for general purpose amplifier applications and is housed in the SOT−1123 surface mount package. This device is ideal for low−power surface mount applications where board space is at a premium. 

## **Features** 

- hFE, 100−300 

- Low VCE(sat), ≤ 0.4 V 

- Reduces Board Space 

- This is a Pb−Free Device 

## **MAXIMUM RATINGS** 

|**MAXIMUM RATINGS**||||
|---|---|---|---|
|**Rating**|**Symbol**|**Value**|**Unit**|
|Collector−Emitter Voltage|VCEO|−40|Vdc|
|Collector−Base Voltage|VCBO|−40|Vdc|
|Emitter−Base Voltage|VEBO|−5.0|Vdc|
|Collector Current − Continuous|IC|−200|mAdc|



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COLLECTOR<br>3<br>1<br>BASE<br>2<br>EMITTER<br>NST3906F3T5G<br>3<br>2<br>1<br>**----- End of picture text -----**<br>


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SOT−1123<br>CASE 524AA<br>STYLE 1<br>**----- End of picture text -----**<br>


## **MARKING DIAGRAM** 

3 M 

3 = Device Code M = Date Code 

## **THERMAL CHARACTERISTICS** 

|**THERMAL CHARACTERISTICS**||||
|---|---|---|---|
|**Characteristic**|**Symbol**|**Max**|**Unit**|
|Total Device Dissipation, TA= 25°C<br>Derate above 25°C|PD<br>(Note 1)|290<br>2.3|mW<br>mW/°C|
|Thermal Resistance,<br>Junction−to−Ambient|R�JA<br>(Note 1)|432|°C/W|
|Total Device Dissipation, TA= 25°C<br>Derate above 25°C|PD<br>(Note 2)|347<br>2.8|mW<br>mW/°C|
|Thermal Resistance,<br>Junction−to−Ambient|R�JA<br>(Note 2)|360|°C/W|
|Thermal Resistance,<br>Junction−to−Lead 3|R�JL<br>(Note 2)|143|°C/W|
|Junction and Storage Temperature Range|TJ, Tstg|−55 to<br>+150|°C|



## **ORDERING INFORMATION** 

|**Device**|**Package**|**Shipping**†|
|---|---|---|
|NST3906F3T5G|SOT−1123<br>(Pb−Free)|8000/Tape & Reel|



- †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. 

Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 

1. 100 mm[2] 1 oz, copper traces. 

2. 500 mm[2] 1 oz, copper traces. 

Publication Order Number: **NST3906F3/D** 

**1** 

© Semiconductor Components Industries, LLC, 2012 **October, 2021 − Rev. 2** 

**NST3906F3T5G** 

## **ELECTRICAL CHARACTERISTICS** (TA = 25 ° C unless otherwise noted) 

|**ELECTRICAL CHARACTERISTICS**(TA= 25°C unless otherwise noted)|**ELECTRICAL CHARACTERISTICS**(TA= 25°C unless otherwise noted)|||||
|---|---|---|---|---|---|
|**Characteristic**||**Symbol**|**Min**|**Max**|**Unit**|
|**OFF CHARACTERISTICS**||||||
|Collector−Emitter Breakdown Voltage (Note 3) (IC= 1.0 mAdc, IB= 0)||V(BR)CEO|−40|−|Vdc|
|Collector−Base Breakdown Voltage (IC= 10�Adc, IE= 0)||V(BR)CBO|−40|−|Vdc|
|Emitter−Base Breakdown Voltage (IE= 10�Adc, IC= 0)||V(BR)EBO|−5.0|−|Vdc|
|Collector Cutoff Current (VCE= 30 Vdc, VBE= 3.0 Vdc)||ICEX|−|−50|nAdc|
|**ON CHARACTERISTICS**(Note 3)||||||
|DC Current Gain<br>(IC= −0.1 mAdc, VCE= −1.0 Vdc)<br>(IC= −1.0 mAdc, VCE= −1.0 Vdc)<br>(IC= −10 mAdc, VCE= −1.0 Vdc)<br>(IC= −50 mAdc, VCE= −1.0 Vdc)<br>(IC= −100 mAdc, VCE= −1.0 Vdc)||hFE|60<br>80<br>100<br>60<br>30|−<br>−<br>300<br>−<br>−|−|
|Collector−Emitter Saturation Voltage<br>(IC= −10 mAdc, IB= −1.0 mAdc)<br>(IC= −50 mAdc, IB= −5.0 mAdc)||VCE(sat)|−<br>−|−0.25<br>−0.4|Vdc|
|Base−Emitter Saturation Voltage<br>(IC= −10 mAdc, IB= −1.0 mAdc)<br>(IC= −50 mAdc, IB= −5.0 mAdc)||VBE(sat)|−0.65<br>−|−0.85<br>−0.95|Vdc|
|**SMALL−SIGNAL CHARACTERISTICS**||||||
|Current−Gain − Bandwidth Product (IC= 10 mAdc, VCE= 20 Vdc, f = 100 MHz)||fT|250|−|MHz|
|Output Capacitance (VCB= −5.0 V, IE= 0 mA, f = 1.0 MHz)||Cobo|−|4.5|pF|
|Input Capacitance (VEB= −0.5 V, IE= 0 mA, f = 1.0 MHz)||Cibo|−|10.0|pF|
|Noise Figure<br>(VCE= −5.0 Vdc, IC= −100�Adc, RS= 1.0 k�, f = 1.0 kHz)||NF|−|4.0|dB|
|**SWITCHING CHARACTERISTICS**||||||
|Delay Time|(VCC= −3.0 Vdc, VBE= 0.5 Vdc)|td|−|35|ns|
|Rise Time|(IC= −10 mAdc, IB1= −1.0 mAdc)|tr|−|35||
|Storage Time|(VCC= −3.0 Vdc, IC= −10 mAdc)|ts|−|250|ns|
|Fall Time|(IB1= IB2= −1.0 mAdc)|tf|−|50||



3. Pulse Test: Pulse Width ≤ 300 � s; Duty Cycle ≤ 2.0%. 

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0.40 350<br>150 ° C (5.0 V)<br>0.350.30 IC/IB = 10 VCE(sat) = 150 ° C 300 150 ° C (1.0 V)<br>250<br>0.25<br>200 25 ° C (5.0 V)<br>0.20<br>25 ° C 150 25 ° C (1.0 V)<br>0.15<br>−55 ° C (5.0 V)<br>100<br>0.10<br>−55 ° C −55 ° C (1.0 V)<br>50<br>0.05<br>0 0<br>0.0001 0.001 0.01 0.1 1 0.0001 0.001 0.01 0.1 1<br>IC, COLLECTOR CURRENT (A) IC, COLLECTOR CURRENT (A)<br>, COLLECTOR−EMITTER<br>, DC CURRENT GAIN (V)<br>FE<br>CE(sat) SATURATION VOLTAGE (V) h<br>V<br>**----- End of picture text -----**<br>


**Figure 1. Collector Emitter Saturation Voltage vs. Collector Current** 

**Figure 2. DC Current Gain vs. Collector Current** 

**www.onsemi.com** 

**2** 

**NST3906F3T5G** 

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1.1 1.1<br>IC/IB = 10 VCE = 2.0 V<br>1.0 1.0<br>0.9 −55 ° C 0.9 −55 ° C<br>0.8 0.8<br>0.7 25 ° C 0.7 25 ° C<br>0.6 0.6<br>0.5 0.5<br>0.4 150 ° C 0.4 150 ° C<br>0.3 0.3<br>0.0001 0.001 0.01 0.1 1 0.0001 0.001 0.01 0.1 1<br>IC, COLLECTOR CURRENT (A) IC, COLLECTOR CURRENT (A)<br>Figure 3. Base Emitter Saturation Voltage vs. Figure 4. Base Emitter Turn−On Voltage vs.<br>Collector Current Collector Current<br>1.0 9.0<br>100 mA<br>0.9<br>8.0<br>0.8<br>80 mA<br>0.7<br>60 mA 7.0<br>0.6<br>40 mA<br>0.5 6.0<br>0.4 Cib<br>5.0<br>0.3<br>20 mA<br>0.2<br>4.0<br>0.1<br>0 IC = 10 mA 3.0<br>0.0001 0.001 0.01 0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0<br>Ib, BASE CURRENT (A) Veb, EMITTER BASE VOLTAGE (V)<br>, BASE−EMITTER<br>VOLTAGE (V)<br>BE(sat) , BASE−EMITTER TURN−ON<br>V<br>SATURATION VOLTAGE (V)<br>BE(on)<br>V<br>, COLLECTOR−EMITTER , INPUT CAPACITANCE (pF)<br>CE(sat) SATURATION VOLTAGE (V) ibo<br>V C<br>**----- End of picture text -----**<br>


**Figure 5. Saturation Region** 

**Figure 6. Input Capacitance** 

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6.0<br>5.5<br>5.0<br>4.5<br>4.0<br>3.5<br>3.0<br>2.5<br>2.0<br>Cob<br>1.5<br>1.0<br>0 5.0 10 15 20 25 30<br>Vcb, COLLECTOR BASE VOLTAGE (V)<br>, OUTPUT CAPACITANCE (pF)<br>obo<br>C<br>**----- End of picture text -----**<br>


**Figure 7. Output Capacitance** 

**www.onsemi.com** 

**3** 

MECHANICAL CASE OUTLINE **PACKAGE DIMENSIONS** 

**SOT−1123** CASE 524AA ISSUE C 

## DATE  29 NOV 2011 

**SCALE 8:1** 

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D −X− NOTES:<br>1. DIMENSIONING AND TOLERANCING PER ASME<br>OR −Y− Y14.5M, 1994.<br>2. CONTROLLING DIMENSION: MILLIMETERS.<br>1 3 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD<br>E FINISH. MINIMUM LEAD THICKNESS IS THE<br>2 MINIMUM THICKNESS OF BASE MATERIAL.<br>coe 4. DIMENSIONS D AND E DO NOT INCLUDE MOLD<br>FLASH, PROTRUSIONS, OR GATE BURRS.<br>TOP VIEW<br>MILLIMETERS<br>A DIM MIN MAX<br>A 0.34 0.40<br>b 0.15 0.28<br>b1 0.10 0.20<br>c 0.07 0.17<br>D 0.75 0.85<br>c Ph HE E 0.55 0.65<br>e 0.35 0.40<br>SIDE VIEW HE 0.95 1.05<br>L 0.185 REF<br>foi O L2 0.05 o 0.15<br>3X L2 b GENERIC<br>0.08 X Y<br>y “Efe MARKING DIAGRAM*<br>e<br>X M<br>3X L<br>ee 2X b1<br>BOTTOM VIEW X = Specific Device Code<br>M = Date Code<br>SOLDERING FOOTPRINT* *This information is generic. Please refer<br>**----- End of picture text -----**<br>


1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 

2. CONTROLLING DIMENSION: MILLIMETERS. 

3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL. 

4. DIMENSIONS D AND E DO NOT INCLUDE MOLD 

*This information is generic. Please refer to device data sheet for actual part marking. Pb−Free indicator, “G” or microdot “ ”, may or may not be present. 

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1.20<br>3X 0.34<br>0.26<br>1<br>al:<br>0.38 2X<br>aan 0.20 S PACKAGE s<br>OUTLINE<br>DIMENSIONS: MILLIMETERS<br>**----- End of picture text -----**<br>


- *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. 

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STYLE 1: STYLE 2: STYLE 3: STYLE 4: STYLE 5:<br>PIN 1. BASE PIN 1. ANODE PIN 1. ANODE PIN 1. CATHODE PIN 1. GATE<br> 2. EMITTER  2. N/C  2. ANODE  2. CATHODE  2. SOURCE<br> 3. COLLECTOR  3. CATHODE  3. CATHODE  3. ANODE  3. DRAIN<br>**----- End of picture text -----**<br>


Electronic versions are uncontrolled except when accessed directly from the Document Repository. **DOCUMENT NUMBER: 98AON23134D** Printed  versions are uncontrolled  except when stamped  “CONTROLLED COPY” in red. **DESCRIPTION: SOT−1123, 3−LEAD, 1.0X0.6X0.37, 0.35P PAGE 1 OF 1** 

ON Semiconductor and          are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the rights of others. 

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© Semiconductor Components Industries, LLC, 2019 

**onsemi** , , and other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “ **onsemi** ” or its affiliates and/or subsidiaries in the United States and/or other countries. **onsemi** owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of **onsemi** ’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. **onsemi** reserves the right to make changes at any time to any products or information herein, without notice. The information herein is provided “as−is” and **onsemi** makes no warranty, representation or guarantee regarding the accuracy of the information, product features, availability, functionality, or suitability of its products for any particular purpose, nor does **onsemi** assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using **onsemi** products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by **onsemi** . “Typical” parameters which may be provided in **onsemi** data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. **onsemi** does not convey any license under any of its intellectual property rights nor the rights of others. **onsemi** products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use **onsemi** products for any such unintended or unauthorized application, Buyer shall indemnify and hold **onsemi** and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that **onsemi** was negligent regarding the design or manufacture of the part. **onsemi** is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. 

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