# Bipolar (BJT) Single Transistor, PNP, 20 V, 2 A, 710 mW, SOT-23, Surface Mount

![Product image](https://novapart.co/image/farnell:2464089/)

**URL**: https://novapart.co/products/NSS20200LT1G/bipolar-bjt-single-transistor-pnp-20-v-2-a-710-mw
**SKU**: NSS20200LT1G
**Manufacturer**: ONSEMI
**Category**: Semiconductors - Discretes || Transistors || Bipolar Transistors || Single Bipolar Junction Transistors - BJT
**Price**: €0.1080
**Stock**: 1000+
**Lead Time**: 2 days (indicative)

## Description

Transistor Polarity:PNP; Collector Emitter Voltage V(br)ceo:20V; Transition Frequency ft:100MHz; Power Dissipation Pd:710mW; DC Collector Current:-2A; DC Current Gain hFE:300hFE; Transisto

## Specifications

| Parameter | Value |
|---|---|
| Msl | MSL 1 - Unlimited |
| Svhc | No SVHC (25-Jun-2025) |
| No. Of Pins | 3Pins |
| Product Range | - |
| Qualification | - |
| Power Dissipation | 710mW |
| Transistor Mounting | Surface Mount |
| Transistor Polarity | PNP |
| Transition Frequency | 100MHz |
| Transistor Case Style | SOT-23 |
| Dc Current Gain Hfe Min | 300hFE |
| Operating Temperature Max | 150°C |
| Continuous Collector Current | 2A |
| Collector Emitter Voltage Max | 20V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:2464089/)

## NSS20200LT1G, NSV20200LT1G 

## 20 V, 4.0 A, Low VCE(sat) PNP Transistor 

ON Semiconductor’s e[2] PowerEdge family of low VCE(sat) transistors are miniature surface mount devices featuring ultra low saturation voltage (VCE(sat)) and high current gain capability. These are designed for use in low voltage, high speed switching applications where affordable efficient energy control is important. 

Typical applications are DC−DC converters and power management in portable and battery powered products such as cellular and cordless phones, PDAs, computers, printers, digital cameras and MP3 players. Other applications are low voltage motor controls in mass storage products such as disc drives and tape drives. In the automotive industry they can be used in air bag deployment and in the instrument cluster. The high current gain allows e[2] PowerEdge devices to be driven directly from PMU’s control outputs, and the Linear Gain (Beta) makes them ideal components in analog amplifiers. 

## **Features** 

- AEC−Q101 Qualified and PPAP Capable 

- NSV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements 

- These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS Compliant* 

**http://onsemi.com −20 VOLTS 4.0 AMPS PNP LOW V TRANSISTOR CE(sat) EQUIVALENT R 65 m DS(on)** ~~=~~ **SOT−23 (TO−236) CASE 318 STYLE 6** 

**==> picture [153 x 211] intentionally omitted <==**

**----- Start of picture text -----**<br>
COLLECTOR<br>3<br>1<br>BASE<br>&<br>2<br>EMITTER<br>MARKING DIAGRAM<br>VC M<br>1 oS<br>VC = Specific Device Code<br>M = Date Code*<br>= Pb−Free Package<br>**----- End of picture text -----**<br>


(Note: Microdot may be in either location) *Date Code orientation and/or overbar may vary depending upon manufacturing location. 

**ORDERING INFORMATION** 

> *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. 

**Device Package Shipping**[†] NSS20200LT1G SOT−23 3,000 / (Pb−Free) Tape & Reel NSV20200LT1G SOT−23 3,000 / (Pb−Free) Tape & Reel ~~===~~ †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D. 

Publication Order Number: **NSS20200L/D** 

**1** 

 Semiconductor Components Industries, LLC, 2011 **November, 2011 − Rev. 4** 

**NSS20200LT1G, NSV20200LT1G** 

## **MAXIMUM RATINGS** (TA = 25C) 

|**MAXIMUM RATINGS**(TA= 25C)||||
|---|---|---|---|
|**Rating**|**Symbol**|**Max**|**Unit**|
|Collector-Emitter Voltage|VCEO|−20|Vdc|
|Collector-Base Voltage|VCBO|−20|Vdc|
|Emitter-Base Voltage|VEBO|−7.0|Vdc|
|Collector Current − Continuous|IC|−2.0|A|
|Collector Current − Peak|ICM|−4.0|A|
|Electrostatic Discharge|ESD|HBM Class 3B<br>MM Class C||
|**THERMAL CHARACTERISTICS**||||
|**Characteristic**|**Symbol**|**Max**|**Unit**|
|Total Device Dissipation<br>TA= 25C<br>Derate above 25C|PD(Note 1)|460<br>3.7|mW<br>mW/C|
|Thermal Resistance,<br>Junction−to−Ambient|R�JA(Note 1)|270|C/W|
|Total Device Dissipation<br>TA= 25C<br>Derate above 25C|PD(Note 2)|540<br>4.3|mW<br>mW/C|
|Thermal Resistance,<br>Junction−to−Ambient|R�JA(Note 2)|230|C/W|
|Total Device Dissipation<br>(Single Pulse < 10 sec.)|PDsingle<br>(Note 3)|710|mW|
|Junction and Storage Temperature Range|TJ, Tstg|−55 to +150|C|



Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 

1. FR−4 @ 100 mm[2] , 1 oz. copper traces. 

2. FR−4 @ 500 mm[2] , 1 oz. copper traces. 

3. Thermal response. 

**http://onsemi.com** 

**2** 

## **NSS20200LT1G, NSV20200LT1G** 

**ELECTRICAL CHARACTERISTICS** (TA = 25C unless otherwise noted) 

|**ELECTRICAL CHARACTERISTICS**(TA= 25C unless otherwise|noted)|||||
|---|---|---|---|---|---|
|**Characteristic**|**Symbol**|**Min**|**Typ**|**Max**|**Unit**|
|**OFF CHARACTERISTICS**||||||
|Collector−Emitter Breakdown Voltage<br>(IC= −10 mAdc, IB= 0)|V(BR)CEO|−20|−|−|Vdc|
|Collector−Base Breakdown Voltage<br>(IC= −0.1 mAdc, IE= 0)|V(BR)CBO|−20|−|−|Vdc|
|Emitter−Base Breakdown Voltage<br>(IE= −0.1 mAdc, IC= 0)|V(BR)EBO|−7.0|−|−|Vdc|
|Collector Cutoff Current<br>(VCB= −20 Vdc, IE= 0)|ICBO|−|−|−0.1|�Adc|
|Emitter Cutoff Current<br>(VEB= −7.0 Vdc)|IEBO|−|−|−0.1|�Adc|
|**ON CHARACTERISTICS**||||||
|DC Current Gain (Note 4)<br>(IC= −10 mA, VCE= −2.0 V)<br>(IC= −500 mA, VCE= −2.0 V)<br>(IC= −1.0 A, VCE= −2.0 V)<br>(IC= −2.0 A, VCE= −2.0 V)|hFE|250<br>250<br>180<br>150|−<br>300<br>−<br>−|−<br>−<br>−<br>−||
|Collector−Emitter Saturation Voltage (Note 4)<br>(IC= −0.1 A, IB= −0.010 A) (Note 5)<br>(IC= −1.0 A, IB= −0.100 A)<br>(IC= −1.0 A, IB= −0.010 A)<br>(IC= −2.0 A, IB= −0.200 A)|VCE(sat)|−<br>−<br>−<br>−|−0.008<br>−0.065<br>−0.100<br>−0.130|−0.013<br>−0.090<br>−0.120<br>−0.180|V|
|Base−Emitter Saturation Voltage (Note 4)<br>(IC= −1.0 A, IB= −0.01 A)|VBE(sat)|−|−|−0.900|V|
|Base−Emitter Turn−on Voltage (Note 4)<br>(IC= −1.0 A, VCE= −2.0 V)|VBE(on)|−|−|−0.900|V|
|Cutoff Frequency<br>(IC= −100 mA, VCE= −5.0 V, f = 100 MHz)|fT|100|−|−|MHz|
|Input Capacitance (VEB= 0.5 V, f = 1.0 MHz)|Cibo|−|−|330|pF|
|Output Capacitance (VCB= 3.0 V, f = 1.0 MHz)|Cobo|−|−|100|pF|
|**SWITCHING CHARACTERISTICS**||||||
|Delay (VCC= −15 V, IC= 750 mA, IB1= 15 mA)|td|−|−|60|ns|
|Rise (VCC= −15 V, IC= 750 mA, IB1= 15 mA)|tr|−|−|120|ns|
|Storage (VCC= −15 V, IC= 750 mA, IB1= 15 mA)|ts|−|−|300|ns|
|Fall (VCC= −15 V, IC= 750 mA, IB1= 15 mA)|tf|−|−|130|ns|



4. Pulsed Condition: Pulse Width = 300 msec, Duty Cycle  2%. 

5. Guaranteed by design but not tested. 

**http://onsemi.com** 

**3** 

**NSS20200LT1G, NSV20200LT1G** 

**==> picture [491 x 592] intentionally omitted <==**

**----- Start of picture text -----**<br>
0.25 0.35<br>IC/IB = 10 VCE(sat) = 150C IC/IB = 100 VCE(sat) = 150C<br>0.3<br>0.2<br>25C 0.25<br>−55C 25C<br>0.15<br>0.2<br>−55C<br>0.15<br>0.1<br>0.1<br>0.05<br>0.05<br>0 0<br>0.001 0.01 0.1 1.0 10 0.001 0.01 0.1 1.0 10<br>IC, COLLECTOR CURRENT (A) IC, COLLECTOR CURRENT (A)<br>Figure 1. Collector Emitter Saturation Voltage Figure 2. Collector Emitter Saturation Voltage<br>vs. Collector Current vs. Collector Current<br>800 1.1<br>750 150C (5.0 V) IC/IB = 10<br>700 1.0<br>650 150C (2.0 V)<br>0.9<br>600 <br>−55 C<br>550 0.8<br>450500 25C (5.0 V) 0.7 25C<br>400 25C (2.0 V)<br>350 0.6<br>250300 −55C (5.0 V) 0.5 150C<br>200150 −55C (2.0 V) 0.4<br>100 0.3<br>0.001 0.01 0.1 1.0 10 0.001 0.01 0.1 1.0 10<br>IC, COLLECTOR CURRENT (A) IC, COLLECTOR CURRENT (A)<br>Figure 3. DC Current Gain vs. Collector Figure 4. Base Emitter Saturation Voltage vs.<br>Current Collector Current<br>1.0 1.0<br>VCE = −2.0 V 10 mA VCE (V) IC = 500 mA<br>0.9<br>−55C<br>0.8 0.8<br>100 mA 300 mA<br>0.7 25C<br>0.6<br>0.6<br>0.5<br>150C 0.4<br>0.4<br>0.3<br>0.2<br>0.2<br>0.1 0<br>0.001 0.01 0.1 1.0 10 0.01 0.1 1.0 10 100<br>IC, COLLECTOR CURRENT (A) IB, BASE CURRENT (mA)<br>, COLLECTOR EMITTER , COLLECTOR EMITTER<br>CE(sat) SATURATION VOLTAGE (V) CE(sat) SATURATION VOLTAGE (V)<br>V V<br>, DC CURRENT GAIN , BASE EMITTER<br>FE BE(sat)<br>h V<br>SATURATION VOLTAGE (V)<br>VOLTAGE (V) VOLTAGE (V)<br>, BASE EMITTER TURN−ON , COLLECTOR−EMITTER<br>CE<br>V<br>BE(on)<br>V<br>**----- End of picture text -----**<br>


**Figure 5. Base Emitter Turn−On Voltage vs. Collector Current** 

**Figure 6. Saturation Region** 

**http://onsemi.com** 

**4** 

## **NSS20200LT1G, NSV20200LT1G** 

**==> picture [491 x 382] intentionally omitted <==**

**----- Start of picture text -----**<br>
350 170<br>325 Cibo (pF) Cobo (pF)<br>150<br>300<br>275 130<br>250<br>110<br>225<br>200 90<br>175<br>70<br>150<br>125 50<br>0 1.0 2.0 3.0 4.0 5.0 6.0 0 2.0 4.0 6.0 8.0 10 12 14 16<br>VEB, EMITTER BASE VOLTAGE (V) VCB, COLLECTOR BASE VOLTAGE (V)<br>Figure 7. Input Capacitance Figure 8. Output Capacitance<br>10<br>1 ms<br>1.0<br>10 ms<br>100 ms<br>0.1<br>1 s<br>Thermal Limit<br>0.01<br>0.01 0.1 1.0 10 100<br>VCE (Vdc)<br>, INPUT CAPACITANCE (pF)<br>, OUTPUT CAPACITANCE (pF)<br>ibo<br>C obo<br>C<br> (A)<br>IC<br>**----- End of picture text -----**<br>


**Figure 9. Safe Operating Area** 

**http://onsemi.com** 

**5** 

**NSS20200LT1G, NSV20200LT1G** 

## **PACKAGE DIMENSIONS** 

**SOT−23 (TO−236)** CASE 318−08 ISSUE AP 

**==> picture [462 x 183] intentionally omitted <==**

**----- Start of picture text -----**<br>
||||||||||
|---|---|---|---|---|---|---|---|---|
|NOTES:|
|1.|DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.|
|D|2.|CONTROLLING DIMENSION: INCH.|
|3.|MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH|
|SEE VIEW C|THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM|
|3|THICKNESS OF BASE MATERIAL.|
|4.|DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH,|
|PROTRUSIONS, OR GATE BURRS.|
|E|HE|MILLIMETERS|INCHES|
|DIM|MIN|NOM|MAX|MIN|NOM|MAX|
|A|0.89|1.00|1.11|0.035|0.040|0.044|
|c|
|A1|0.01|0.06|0.10|0.001|0.002|0.004|
|1|2|
|b|0.37|0.44|0.50|0.015|0.018|0.020|
|b|c|0.09|0.13|0.18|0.003|0.005|0.007|
|e|0.25|D|2.80|2.90|3.04|0.110|0.114|0.120|
|E|1.20|1.30|1.40|0.047|0.051|0.055|
|e|1.78|1.90|2.04|0.070|0.075|0.081|
|L|0.10|0.20|0.30|0.004|0.008|0.012|
|L1|0.35|0.54|0.69|0.014|0.021|0.029|
|A|H|E|2.10|2.40|2.64|0.083|0.094|0.104|
|0|−−−|10|0|−−−|10|
|L|
|A1|STYLE 6:|
|L1|PIN 1.|BASE|
|2.|EMITTER|
|VIEW C|3.|COLLECTOR|

**----- End of picture text -----**<br>


## **SOLDERING FOOTPRINT** 

**==> picture [157 x 145] intentionally omitted <==**

**----- Start of picture text -----**<br>
0.95<br>0.037<br>0.95<br>0.037<br>2.0<br>0.079<br>0.9<br>0.035<br>SCALE 10:1 mm<br>= (— inches )<br>0.8<br>0.031 a<br>**----- End of picture text -----**<br>


**ON Semiconductor** and          are registered trademarks of Semiconductor Components Industries, LLC (SCILLC).  SCILLC reserves the right to make changes without further notice to any products herein.  SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time.  All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts.  SCILLC does not convey any license under its patent rights nor the rights of others.  SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur.  Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part.  SCILLC is an Equal Opportunity/Affirmative Action Employer.  This literature is subject to all applicable copyright laws and is not for resale in any manner. 

## **PUBLICATION ORDERING INFORMATION** 

**LITERATURE FULFILLMENT** : 

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**http://onsemi.com** 

**NSS20200L/D** 

**6** 



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