# Bipolar (BJT) Single Transistor, PNP, 12 V, 1 A, 1.1 W, WDFN, Surface Mount

![Product image](https://novapart.co/image/farnell:2845322/)

**URL**: https://novapart.co/products/NSS12100UW3TCG/bipolar-bjt-single-transistor-pnp-12-v-1-a-11-w
**SKU**: NSS12100UW3TCG
**Manufacturer**: ONSEMI
**Category**: Semiconductors - Discretes || Transistors || Bipolar Transistors || Single Bipolar Junction Transistors - BJT
**Price**: €0.1360
**Stock**: 10+

## Description

Transistor Polarity:PNP; Collector Emitter Voltage V(br)ceo:-12V; Transition Frequency ft:200MHz; Power Dissipation Pd:1.1W; DC Collector Current:-1A; DC Current Gain hFE:75hFE; Tra

## Specifications

| Parameter | Value |
|---|---|
| Msl | MSL 1 - Unlimited |
| Svhc | No SVHC (25-Jun-2025) |
| No. Of Pins | 3Pins |
| Product Range | - |
| Qualification | AEC-Q101 |
| Power Dissipation | 1.1W |
| Transistor Mounting | Surface Mount |
| Transistor Polarity | PNP |
| Transition Frequency | 200MHz |
| Transistor Case Style | WDFN |
| Dc Current Gain Hfe Min | 75hFE |
| Operating Temperature Max | 150°C |
| Continuous Collector Current | 1A |
| Collector Emitter Voltage Max | 12V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:2845322/)

## NSS12100UW3TCG 

## 12 V, 1 A, Low VCE(sat) PNP Transistor 

ON Semiconductor’s e[2] PowerEdge family of low VCE(sat) transistors are miniature surface mount devices featuring ultra low saturation voltage (VCE(sat)) and high current gain capability. These are designed for use in low voltage, high speed switching applications where affordable efficient energy control is important. 

Typical application are DC−DC converters and power management in portable and battery powered products such as cellular and cordless phones, PDAs, computers, printers, digital cameras and MP3 players. Other applications are low voltage motor controls in mass storage products such as disc drives and tape drives. In the automotive industry they can be used in air bag deployment and in the instrument cluster. The high current gain allows e[2] PowerEdge devices to be driven directly from PMU’s control outputs, and the Linear Gain (Beta) makes them ideal components in analog amplifiers. 

## **Features** 

- High Current Capability (1 A) 

- High Power Handling (Up to 740 mW) 

- Low VCE(s) (200 mV Typical @ 500 mA) 

- Small Size 

- Low Noise 

- NSV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q101 Qualified and PPAP Capable 

- These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS Compliant 

## **Benefits** 

- High Specific Current and Power Capability Reduces Required PCB Area 

- Reduced Parasitic Losses Increases Battery Life 

**http://onsemi.com** 

**12 VOLTS, 1.0 AMPS PNP LOW V TRANSISTOR CE(sat) EQUIVALENT R 400 m DS(on)** 

**==> picture [129 x 158] intentionally omitted <==**

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COLLECTOR<br>3<br>1<br>BASE<br>2<br>EMITTER<br>3<br>WDFN3<br>2 CASE 506AU<br>&<br>1<br>**----- End of picture text -----**<br>


## **MARKING DIAGRAM** 

VG M 1 VG = Specific Device Code M = Date Code = Pb−Free Package 

**MAXIMUM RATINGS** (TA = 25 ° C) **Rating Symbol Max Unit ORDERING INFORMATION** Collector-Emitter Voltage VCEO −12 Vdc Collector-Base Voltage VCBO −12 Vdc **Device Package Shipping**[†] Emitter-Base Voltage VEBO −5.0 Vdc NSS12100UW3TCG WDFN3 3000/ (Pb−Free) Tape & Reel Collector Current − Continuous IC −1.0 Adc Collector Current − Peak ICM −2.0 NSV12100UW3TCG WDFN3 3000/ (Pb−Free) Tape & Reel Electrostatic Discharge ESD HBM Class 3B MM Class C †For information on tape and reel specifications, including part orientation and tape sizes, please ~~==]~~ Stresses exceeding those listed in the Maximum Ratings table may damage the refer to our Tape and Reel Packaging Specifications ~~SE~~ device. If any of these limits are exceeded, device functionality should not be Brochure, BRD8011/D. assumed, damage may occur and reliability may be affected. 

Publication Order Number: **NSS12100UW3/D** 

**1** 

© Semiconductor Components Industries, LLC, 2014 **September, 2014 − Rev. 1** 

**NSS12100UW3TCG** 

## **THERMAL CHARACTERISTICS** 

|**THERMAL CHARACTERISTICS**||||
|---|---|---|---|
|**Characteristic**|**Symbol**|**Max**|**Unit**|
|Total Device Dissipation, TA= 25°C<br>Derate above 25°C|PD(Note 1)|740<br>6.0|mW<br>mW/°C|
|Thermal Resistance, Junction−to−Ambient|R�JA(Note 1)|169|°C/W|
|Total Device Dissipation, TA= 25°C<br>Derate above 25°C|PD(Note 2)|1.1<br>9.0|W<br>mW/°C|
|Thermal Resistance, Junction−to−Ambient|R�JA(Note 2)|110|°C/W|
|Thermal Resistance, Junction−to−Lead 6|R�JL(Note 2)|33|°C/W|
|Junction and Storage Temperature Range|TJ, Tstg|−55 to +150|°C|
|1. FR−4 @ 100 mm2, 1 oz copper traces.||||



2. FR−4 @ 500 mm[2] , 1 oz copper traces. 

## **ELECTRICAL CHARACTERISTICS** (TJ = 25 ° C unless otherwise noted) 

|**ELECTRICAL CHARACTERISTICS**(TJ= 25°C unless otherwise noted)||||||
|---|---|---|---|---|---|
|**Characteristic**|**Symbol**|**Min**|**Typ**|**Max**|**Unit**|
|**OFF CHARACTERISTICS**||||||
|Collector−Emitter Breakdown Voltage, (IC= −10 mAdc, IB= 0)|V(BR)CEO|−12|−|−|Vdc|
|Collector−Base Breakdown Voltage, (IC= −0.1 mAdc, IE= 0)|V(BR)CBO|−12|−|−|Vdc|
|Emitter−Base Breakdown Voltage, (IE= −0.1 mAdc, IC= 0)|V(BR)EBO|−5.0|−|−|Vdc|
|Collector Cutoff Current, (VCB= −12 Vdc, IE= 0)|ICBO|−|−0.02|−0.1|�Adc|
|Emitter Cutoff Current, (VCES= −5.0 Vdc, IE= 0)|IEBO|−|−0.03|−0.1|�Adc|
|**ON CHARACTERISTICS**||||||
|DC Current Gain (Note 3)<br>(IC= −10 mA, VCE= −2.0 V)<br>(IC= −500 mA, VCE= −2.0 V)<br>(IC= −1.0 A, VCE= −2.0 V)|hFE|200<br>100<br>75|−<br>−<br>−|400<br>250<br>−||
|Collector−Emitter Saturation Voltage (Note 3)<br>(IC= −0.05 A, IB= −0.005 A) (Note 4)<br>(IC= −0.1 A, IB= −0.002 A)<br>(IC= −0.1 A, IB= −0.010 A)<br>(IC= −0.5 A, IB= −0.050 A)<br>(IC= −1.0 A, IB= −0.100 A)|VCE(sat)|−<br>−<br>−<br>−<br>−|−0.030<br>−0.080<br>−0.050<br>−0.200<br>−0.400|−0.040<br>−0.100<br>−0.060<br>−0.225<br>−0.440|V|
|Base−Emitter Saturation Voltage (Note 3)<br>(IC= −1.0 A, IB= −0.01 A)|VBE(sat)|−|−0.95|−1.15|V|
|Base−Emitter Turn−on Voltage (Note 3)<br>(IC= −2.0 A, VCE= −1.0 V)|VBE(on)|−|−1.05|−1.20|V|
|Input Capacitance (VEB= −0.5 V, f = 1.0 MHz)|Cibo|−|40|50|pF|
|Output Capacitance (VCB= −3.0 V, f = 1.0 MHz)|Cobo|−|15|20|pF|
|**SWITCHING CHARACTERISTICS**||||||
|Delay (VCC= −10 V, IC= 750 mA, IB1= 15 mA)|td|−|−|20|ns|
|Rise (VCC= −10 V, IC= 750 mA, IB1= 15 mA)|tr|−|−|90|ns|
|Storage (VCC= −10 V, IC= 750 mA, IB1= 15 mA)|ts|−|−|140|ns|
|Fall (VCC= −10 V, IC= 750 mA, IB1= 15 mA)|tf|−|−|100|ns|
|**SMALL−SIGNAL CHARACTERISTICS**||||||
|Current−Gain − Bandwidth Product, (IC= −100 mA, VCE= −5 Vdc, f = 100 MHz)|fT|200|−|−|MHz|
|Noise Figure, (IC= −0.2 mA, VCE= −5 Vdc, RS= 2 k�, f = 1 kHz, BW = 200Hz)|NF|−|−|5.0|dB|



Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. 

3. Pulsed Condition: Pulse Width = 300 � sec, Duty Cycle ≤ 2%. 

4. Guaranteed by design but not tested. 

**http://onsemi.com** 

**2** 

**NSS12100UW3TCG** 

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1.0 3.0<br>0.9 IC/IB = 10 VCE(sat) = 150 ° C IC/IB = 100 VCE(sat) = −55 ° C 25 ° C<br>25 ° C 2.5<br>0.8<br>0.7<br>2.0<br>0.6 −55 ° C 150 ° C<br>0.5 1.5<br>0.4<br>1.0<br>0.3<br>0.2<br>0.5<br>0.1<br>0 0<br>0.001 0.01 0.1 1 10 0.001 0.01 0.1 1 10<br>IC, COLLECTOR CURRENT (A) IC, COLLECTOR CURRENT (A)<br>Figure 1. Collector Emitter Saturation Voltage vs. Figure 2. Collector Emitter Saturation Voltage vs.<br>Collector Current Collector Current<br>600 1.4<br>150 ° C (5.0 V) IC/IB = 10<br>1.2<br>500<br>150 ° C (2.0 V)<br>1.0<br>400 25 ° C (5.0 V) TA = −55 ° C<br>0.8<br>300 25 ° C (2.0 V) 0.6 25 ° C<br>−55 ° C (5.0 V)<br>200<br>−55 ° C (2.0 V) 0.4 150 ° C<br>100 0.2<br>0 0<br>0.001 0.01 0.1 1 10 0.001 0.01 0.1 1 10<br>IC, COLLECTOR CURRENT (A) IC, COLLECTOR CURRENT (A)<br>Figure 3. DC Current Gain vs. Collector Figure 4. Base Emitter Saturation Voltage vs.<br>Current Collector Current<br>1.4 1.0<br>VCE = −1.0 V 10 mA 100 mA 300 mA IC = 500 mA<br>1.2<br>0.8<br>1.0<br>TA = −55 ° C 0.6<br>0.8<br>0.6 25 ° C 0.4<br>0.4<br>150 ° C 0.2<br>0.2<br>0 0<br>0.001 0.01 0.1 1 10 0.01 0.1 1 10 100<br>IC, COLLECTOR CURRENT (A) IB, BASE CURRENT (mA)<br>, COLLECTOR EMITTER , COLLECTOR EMITTER<br>CE(sat) SATURATION VOLTAGE (V) CE(sat) SATURATION VOLTAGE (V)<br>V V<br>, DC CURRENT GAIN , BASE EMITTER<br>FE BE(sat)<br>h V<br>SATURATION VOLTAGE (V)<br>, BASE EMITTER TURN−ON VOLTAGE (V) , COLLECTOR−EMITTER VOLTAGE (V)<br>CE<br>V<br>BE(on)<br>V<br>**----- End of picture text -----**<br>


**Figure 5. Base Emitter Turn−On Voltage vs. Collector Current** 

**Figure 6. Saturation Region** 

**http://onsemi.com** 

**3** 

## **NSS12100UW3TCG** 

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50 30<br>45 25<br>Cobo(pF)<br>40 20<br>Cibo(pF)<br>35 15<br>30 10<br>25 5<br>20 0<br>0 1 2 3 4 5 0 1 2 3 4 5 6 7 8 9 10<br>VEB, EMITTER BASE VOLTAGE (V) VCB, COLLECTOR BASE VOLTAGE (V)<br>Figure 7. Input Capacitance Figure 8. Output Capacitance<br>, INPUT CAPACITANCE (pF)ibo , OUTPUT CAPACITANCE (pF)<br>C obo<br>C<br>**----- End of picture text -----**<br>


**http://onsemi.com** 

**4** 

**NSS12100UW3TCG** 

## **PACKAGE DIMENSIONS** 

**WDFN3** CASE 506AU ISSUE O 

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NOTES:<br>D A 1.2. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994 .CONTROLLING DIMENSION: MILLIMETERS.<br>B 3. DIMENSION b APPLIES TO PLATED TERMINAL AND ISMEASURED BETWEEN 0.25 AND 0.30 MM FROM TERMINAL.<br>4. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS<br>THE TERMINALS.<br>PIN ONE MILLIMETERS INCHES<br>REFERENCE<br>DIM MIN NOM MAX MIN NOM MAX<br>A 0.70 0.75 0.80 0.028 0.030 0.031<br>Tg A1 0.00 0.05 0.000 0.002<br>E A3 0.20 REF 0.008 REF<br>ÇÇÇÇ b 0.25 0.30 0.35 0.010 0.012 0.014<br>D 2.00 BSC 0.079 BSC<br>ÇÇÇÇ D2 1.40 1.50 1.60 0.055 0.059 0.063<br>2 X E 2.00 BSC 0.079 BSC<br>ÇÇÇÇ E2 0.90 1.00 1.10 0.035 0.039 0.043<br>0.10 C e 1.30 BSC 0.051 BSC<br>atl ———— K 0.35 REF 0.014 REF<br>2 X ÇÇÇÇ L 0.35 0.40 0.45 0.014 0.016 0.018<br>0.10 C TOP VIEW | se ae<br>eco (a e<br>SOLDERING FOOTPRINT*<br>0.10 C A 1.300<br>8 X 2X 0.400<br>0.08 C<br>A1 SIDE VIEW (A3) 0.600<br>SEATINGPLANE C<br>0.250<br>er archi<br>D2<br>e 1.100<br>e/2 0.300<br>1 2<br>2X L<br>K 0.400 0.275<br>1.600<br>E2 *For additional information on our Pb−Free strategy and soldering<br>details, please download the ON Semiconductor Soldering and<br>Mounting Techniques Reference Manual, SOLDERRM/D.<br>3 0.10 C A B<br>3X b<br>0.05 C NOTE 3<br>BOTTOM VIEW<br>**----- End of picture text -----**<br>


*For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. 

ON Semiconductor and the         are registered trademarks of Semiconductor Components Industries, LLC (SCILLC) or its subsidiaries in the United States and/or other countries. SCILLC owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf.  SCILLC reserves the right to make changes without further notice to any products herein.  SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.  “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time.  All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts.  SCILLC does not convey any license under its patent rights nor the rights of others.  SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur.  Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part.  SCILLC is an Equal Opportunity/Affirmative Action Employer.  This literature is subject to all applicable copyright laws and is not for resale in any manner. 

## **PUBLICATION ORDERING INFORMATION** 

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**NSS12100UW3/D** 

**5** 



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