# Bipolar Transistor Array, Dual NPN, 45 V, 500 mA, 500 µW

![Product image](https://novapart.co/image/farnell:2452045RL/)

**URL**: https://novapart.co/products/NSM4002MR6T1G/bipolar-transistor-array-dual-npn-45-v-500-ma-w
**SKU**: NSM4002MR6T1G
**Manufacturer**: ONSEMI
**Category**: Semiconductors - Discretes || Transistors || Bipolar Transistors || Bipolar Junction Transistor Arrays - BJT
**Price**: €0.0960
**Stock**: 1000+
**Lead Time**: 78 days (indicative)

## Description

Transistor Polarity:Dual NPN; Collector Emitter Voltage V(br)ceo:45V; Power Dissipation Pd:500µW; DC Collector Current:500mA; DC Current Gain hFE:40hFE; Transistor Case Style:SC-74; No. of Pins:6Pin

## Specifications

| Parameter | Value |
|---|---|
| Msl | MSL 1 - Unlimited |
| Svhc | No SVHC (25-Jun-2025) |
| No. Of Pins | 6Pins |
| Product Range | - |
| Qualification | - |
| Transistor Mounting | Surface Mount |
| Transistor Polarity | Dual NPN |
| Power Dissipation Npn | 500µW |
| Power Dissipation Pnp | - |
| Transistor Case Style | SC-74 |
| Transition Frequency Npn | 300MHz |
| Transition Frequency Pnp | - |
| Operating Temperature Max | 150°C |
| Dc Current Gain Hfe Min Npn | 40hFE |
| Dc Current Gain Hfe Min Pnp | - |
| Continuous Collector Current Npn | 500mA |
| Continuous Collector Current Pnp | - |
| Collector Emitter Voltage Max Npn | 45V |
| Collector Emitter Voltage Max Pnp | - |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:2452045RL/)

## NSM4002MR6 

## Dual NPN Transistors for Driving LEDs 

NSM4002MR6 contains a single two NPN transistors. The base of the Q2 NPN transistor is internally connected to the collector of the Q1 NPN transistor. This device is designed to replace a discrete solution that is common for providing a constant current by integrating these two components into a single device. NSM4002MR6 is housed in a SC−74 package which is ideal for surface mount applications in space constrained applications. 

## **Features** 

- Simplifies Circuit Design 

**www.onsemi.com** 

## **Dual NPN Transistors for Driving LEDs** 

- Reduces Board Space 

- Reduces Component Count 

- These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS Compliant 

## **Typical Applications** 

- LED Lighting 

- Driver Circuits 

## **MAXIMUM RATINGS Q1** (TA = 25 ° C) 

||**MAXIMUM RATINGS Q11 **(TA = 25A = 25= 25°C)|||
|---|---|---|---|
||**Rating**|**Symbol**<br>**Value**|**Unit**|
||Collector−Emitter Voltage<br>Collector−Base Voltage|VCEO<br>40<br>VCBO<br>60|Vdc<br>Vdc|
||Emitter−Base Voltage|VEBO<br>6.0|Vdc|
||Collector Current − Continuous|IC<br>200|mAdc|
||**MAXIMUM RATINGS Q2 **(TA= 25°C)|||
|**Rating**<br>**Symbol**<br>**Value**<br>**Unit**<br>Collector−Emitter Voltage<br>VCEO<br>45<br>Vdc<br>Collector−Base Voltage<br>VCBO<br>50<br>Vdc<br>Emitter−Base Voltage<br>VEBO<br>5.0<br>Vdc<br>Collector Current − Continuous<br>IC<br>500<br>mAdc<br>~~SEE~~||||
|Stresses exceeding those listed in the Maximum Ratings table may damage the<br>device. If any of these limits are exceeded, device functionality should not be||||
|assumed, damage may occur and reliability may be affected.||||



**THERMAL CHARACTERISTICS** 

|**THERMAL CHARACTERISTICS**||||
|---|---|---|---|
|**Rating**<br>~~FE~~|**Symbol**<br>~~FE~~|**Max**<br>~~FE~~|**Unit**<br>~~FE~~|
|Total Device Dissipation<br>TA= 25°C<br>Derate above 25°C<br>~~FE~~|PD<br>(Note 1)<br>~~FE~~|260<br>2.08<br>~~FE~~|mW<br>mW/°C<br>~~FE ~~|
|Thermal Resistance,<br>Junction−to−Ambient<br>|R JA<br>(Note 1)<br>|480<br>|°C/W<br>|
|Total Device Dissipation<br>TA= 25°C<br>Derate above 25°C<br>|PD<br>(Note 2)<br>|300<br>2.4<br>|mW<br>mW/°C<br>|
|Thermal Resistance,<br>Junction−to−Ambient<br>~~ee~~|R JA<br>(Note 2)|416<br>~~ee~~|°C/W<br>~~ee~~|
|Junction and Storage<br>Temperature Range<br>~~ee~~|TJ, Tstg|−55 to +150<br>~~ee~~|°C<br>~~ee~~|



**==> picture [174 x 150] intentionally omitted <==**

**----- Start of picture text -----**<br>
6 5 4 6, 5 4<br>Q2 Q2<br>Q1 Q1<br>=<br>1 2 3<br>1 2 3<br>6 5 4<br>SC−74<br>3 CASE 318F<br>1 [2]<br>**----- End of picture text -----**<br>


## **MARKING DIAGRAM** 

**==> picture [104 x 69] intentionally omitted <==**

**----- Start of picture text -----**<br>
1AM M<br>1AM = Device Code<br>M = Date Code*<br>= Pb−Free Package<br>**----- End of picture text -----**<br>


(Note: Microdot may be in either location) *Date Code orientation may vary depending upon manufacturing location. 

**ORDERING INFORMATION** 

**Device Package Shipping**[†] NSM4002MR6T1G SC−74 3000 / (Pb−Free) Tape & Reel ~~7~~ †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D. 

2. FR−4, 500 mm[2] , 2 oz. Cu. 

Publication Order Number: **NSM4002MR6/D** 

**1** 

© Semiconductor Components Industries, LLC, 2015 **May, 2015 − Rev. 1** 

## **NSM4002MR6** 

**Table 1. ELECTRICAL CHARACTERISTICS Q1** (TA = 25 ° 

|**abe 1. CC CCSCS Q1 **(TA= 25C, unless other|ise noted)||||
|---|---|---|---|---|
|**Characteristic**|**Symbol**|**Min**|**Max**|**Unit**|
|**OFF CHARACTERISTICS**|||||
|Collector−Emitter Breakdown Voltage  (IC= 1.0 mAdc, IB= 0)|V(BR)CEO|40|−|Vdc|
|Collector−Base Breakdown Voltage  (IC= 10�Adc, IE= 0)|V(BR)CBO|60|−|Vdc|
|Emitter−Base Breakdown Voltage  (IE= 10�Adc, IC= 0)|V(BR)EBO|6.0|−|Vdc|
|Collector Cutoff Current  (VCE= 30 Vdc, VEB(OFF)= 3.0 Vdc)|ICEX|−|50|nAdc|
|Base Cutoff Current  (VCE= 30 Vdc, VEB(OFF)= 3.0 Vdc)|IBL|−|50|nAdc|
|**ON CHARACTERISTICS**|||||
|DC Current Gain (Note 3)<br>(IC= 100�A, VCE= 1.0 V)<br>(IC= 1.0 mA, VCE= 1.0 V)<br>(IC= 10 mA, VCE= 1.0 V)<br>(IC= 50 mA, VCE= 1.0 V)<br>(IC= 100 mA, VCE= 1.0 V)|hFE|40<br>70<br>100<br>60<br>30|−<br>−<br>300<br>−<br>−||
|Collector−Emitter Saturation Voltage (Note 3)<br>(IC= 10 mA, IB= 1.0 mA)<br>(IC= 50 mA, IB= 5.0 mA)|VCE(sat)|−<br>−|0.20<br>0.30|V|
|Base−Emitter Saturation Voltage (Note 3)<br>(IC= 10 mA, IB= 1.0 mA)<br>(IC= 50 mA, IB= 5.0 mA)|VBE(sat)|0.65<br>−|0.85<br>0.95|V|
|Cutoff Frequency  (IC= 10 mA, VCE= 20 V, f = 100 MHz)|fT|300|−|MHz|
|Output Capacitance  (VCB= 5.0 V, f = 1.0 MHz)|Cobo|−|4.0|pF|
|Input Capacitance  (VEB= 0.5 V, f = 1.0 MHz)|Cobo|−|8.0|pF|



**Table 2. ELECTRICAL CHARACTERISTICS Q2** (TA = 25 ° C, unless otherwise noted) 

|**abe . CC CCSCS Q2 **(TA= 25C, unless other|ise noted)|||||
|---|---|---|---|---|---|
|**Characteristic**|**Symbol**|**Min**|**Typ**|**Max**|**Unit**|
|**OFF CHARACTERISTICS**||||||
|Collector−Emitter Breakdown Voltage  (IC= 10 mAdc, IB= 0)|V(BR)CEO|45|−|−|Vdc|
|Collector−Base Breakdown Voltage  (IC= 10�Adc, IE= 0)|V(BR)CBO|50|−|−|Vdc|
|Emitter−Base Breakdown Voltage  (IE= 1.0�Adc, IC= 0)|V(BR)EBO|5.0|−|−|Vdc|
|Collector Cutoff Current  (VCB= 20 Vdc, IE= 0)|ICBO|−|−|0.1|�Adc|
|**ON CHARACTERISTICS**||||||
|DC Current Gain (Note 3)<br>(IC= 100 mA, VCE= 1.0 V)<br>(IC= 500 mA, VCE= 1.0 V)|hFE|250<br>40|−<br>−|600<br>−||
|Collector�Emitter Saturation Voltage (Note 3)<br>(IC= 500 mA, IB= 50 mA)|VCE(sat)|−|−|0.7|V|
|Base�Emitter Turn−on Voltage (Note 3)<br>(IC= 500 mA, VCE= 1.0 V)|VBE(on)|−|−|1.2|V|
|Cutoff Frequency  (IC= 10 mA, VCE= 5.0 V, f = 100 MHz|fT|100|−|−|MHz|
|Output Capacitance  (VCB= 10 V, f = 1.0 MHz|Cobo|−|10|−|pF|



Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. 3. Pulsed Condition: Pulse Width = 300 msec, Duty Cycle � 2%. 

**www.onsemi.com** 

**2** 

**NSM4002MR6** 

## **Application Section** 

## **Introduction** 

The NSM4002MR6 is designed to be used as a constant current driver for LEDs. The two resistors in Figure 1 are external from the NSM4002MR6 to allow for customization. Rset controls the current through the load, and R1 controls the bias current. 

based on the biasing current. To determine the Rset value simply divide the VBE voltage by the desired driving current. 

## **Selecting R1** 

The R1 resistor is used to set the biasing current. The biasing current is split between the base of Q2 and the collector of Q1. When desiring the lowest overhead voltage R1 should be set as high as possible. It is important to ensure it is not set too high so that Q2 falls out of saturation. However, a lower R1 value will drive more current through Q1. This will reduce the change in the driving current as temperature is increased. It will also allow a higher driving current to be achieved while maintaining good current regulation. The side affect of a lower R1 value is that it reduces the overall efficiency because more power is being used in the driving circuit. 

## **Input Votlage, Vs** 

The maximum input voltage, Vs, is determined by the load. No more than 45 V can be applied across Q2. This leads to: 

**==> picture [162 x 12] intentionally omitted <==**

**Figure 1. Typical Application Schematic** 

## **Selecting Rset** 

The Rset resistor is used to set the driving current of the load. It is connected across the Base−Emitter junction of Q1. This VBE voltage is what sets up the constant voltage across the Rset resistor. Figure 5 gives the typical values of VBE 

## **Overhead Voltage** 

The overhead voltage of this device to reach full current regulation is the combination of the VBE voltages of the two transistors. Under typical conditions this overhead voltage will typically be 1.4 V. 

**www.onsemi.com** 

**3** 

**NSM4002MR6** 

## **TYPICAL CHARACTERISTICS − Q1** 

**==> picture [487 x 375] intentionally omitted <==**

**----- Start of picture text -----**<br>
1000<br>TJ = +150°C VCE = 1.0 V<br>+25°C<br>100 -�55°C<br>10<br>1<br>0.1 1.0 10 100 1000<br>IC, COLLECTOR CURRENT (mA)<br>Figure 2. DC Current Gain<br>1.0<br>T J  = 25°C<br>0.8<br>IC = 1.0 mA 10 mA 30 mA 100 mA<br>0.6<br>0.4<br>0.2<br>0<br>0.01 0.02 0.03 0.05 0.07 0.1 0.2 0.3 0.5 0.7 1.0 2.0 3.0 5.0 7.0 10<br>IB, BASE CURRENT (mA)<br>FE<br>h     , DC CURRENT GAIN<br>CE<br>V     , COLLECTOR EMITTER VOLTAGE (VOLTS)<br>**----- End of picture text -----**<br>


**Figure 3. Collector Saturation Region** 

**www.onsemi.com** 

**4** 

**NSM4002MR6** 

## **TYPICAL CHARACTERISTICS − Q1** 

**==> picture [492 x 382] intentionally omitted <==**

**----- Start of picture text -----**<br>
0.8 1.4<br>IC/IB = 10<br>0.7 IC/IB = 10<br>° 1.2<br>150 C<br>0.6<br>25 ° C<br>1.0<br>0.5<br>−55 ° C −55 ° C<br>0.4 0.8<br>25 ° C<br>0.3<br>0.6<br>0.2<br>150 ° C<br>0.4<br>0.1<br>0 0.2<br>0.001 0.01 0.1 1 0.0001 0.001 0.01 0.1 1<br>IC, COLLECTOR CURRENT (A) IC, COLLECTOR CURRENT (A)<br>Figure 4. Collector Emitter Saturation Voltage Figure 5. Base Emitter Saturation Voltage vs.<br>vs. Collector Current Collector Current<br>1.4 1.0<br>1.2 VCE = 1 V 0.5 +25°C TO +125°C<br>�VC FOR VCE(sat)<br>1.0 0 -�55°C TO +25°C<br>−55 ° C<br>0.8 -�0.5<br>25 ° C -�55°C TO +25°C<br>0.6 -�1.0<br>+25°C TO +125°C<br>0.4 150 ° C -�1.5 �VB FOR VBE(sat)<br>0.2 -�2.0<br>0.0001 0.001 0.01 0.1 1 0 20 40 60 80 100 120 140 160 180 200<br>IC, COLLECTOR CURRENT (A) IC, COLLECTOR CURRENT (mA)<br>, BASE−EMITTER<br>, COLLECTOR−EMITTER<br>BE(sat)<br>V<br>SATURATION VOLTAGE (V) SATURATION VOLTAGE (V)<br>CE(sat)<br>V<br>°<br>COEFFICIENT (mV/  C)<br>, BASE−EMITTER VOLTAGE (V)<br>BE(on)<br>V<br>**----- End of picture text -----**<br>


**Figure 6. Base Emitter Voltage vs. Collector Current** 

**Figure 7. Temperature Coefficients** 

**www.onsemi.com** 

**5** 

**NSM4002MR6** 

## **TYPICAL CHARACTERISTICS − Q2** 

**==> picture [490 x 173] intentionally omitted <==**

**----- Start of picture text -----**<br>
300 1<br>150 ° C VCE = 1 V IC/IB = 10<br>200 25 ° C 150 ° C<br>25 ° C<br>0.1 −55 ° C<br>−55 ° C<br>100<br>0 0.01<br>0.001 0.01 0.1 1 0.001 0.01 0.1 1<br>IC, COLLECTOR CURRENT (A) IC, COLLECTOR CURRENT (A)<br>, DC CURRENT GAIN , COLLECTOR−EMITTER<br>FE<br>h<br>SATURATION VOLTAGE (V)<br>CE(sat)<br>V<br>**----- End of picture text -----**<br>


**Figure 8. DC Current Gain vs. Collector Current** 

**Figure 9. Collector Emitter Saturation Voltage vs. Collector Current** 

**==> picture [490 x 173] intentionally omitted <==**

**----- Start of picture text -----**<br>
1.1 1.2<br>1.0 IC/IB = 10 −55 ° C 1.1 VCE = 5 V<br>1.0<br>0.9 25 ° C 0.9 −55 ° C<br>0.8<br>0.7 150 ° C 0.8 25 ° C<br>0.7<br>0.6<br>0.6<br>0.5 0.5 150 ° C<br>0.4 0.4<br>0.3 0.3<br>0.2 0.2<br>0.0001 0.001 0.01 0.1 1 0.0001 0.001 0.01 0.1 1<br>IC, COLLECTOR CURRENT (A) IC, COLLECTOR CURRENT (A)<br>, BASE−EMITTER<br>BE(sat)<br>V , BASE−EMITTER VOLTAGE (V)<br>SATURATION VOLTAGE (V)<br>BE(on)<br>V<br>**----- End of picture text -----**<br>


**Figure 10. Base Emitter Saturation Voltage vs. Collector Current** 

**Figure 11. Base Emitter Voltage vs. Collector Current** 

**==> picture [238 x 171] intentionally omitted <==**

**----- Start of picture text -----**<br>
1.0<br>TJ = 25°C<br>0.8<br>0.6<br>IC = 10 mA 100 mA 300 mA 500 mA<br>0.4<br>0.2<br>0<br>0.01 0.1 1 10 100<br>IB, BASE CURRENT (mA)<br>VCE, COLLECTOR-EMITTER VOLTAGE (VOLTS)<br>**----- End of picture text -----**<br>


**Figure 12. Saturation Region** 

**www.onsemi.com** 

**6** 

**NSM4002MR6** 

## **PACKAGE DIMENSIONS** 

## **SC−74** 

CASE 318F−05 ISSUE N 

**==> picture [475 x 336] intentionally omitted <==**

**----- Start of picture text -----**<br>
D NOTES:<br>1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.<br>2. CONTROLLING DIMENSION: INCH.<br>3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH<br>r al 4 THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM<br>6 5 4 THICKNESS OF BASE MATERIAL.<br>HE E 4. 318F−01, −02, −03 OBSOLETE. NEW STANDARD 318F−04.<br>1 2 3<br>MILLIMETERS INCHES<br>DIM MIN NOM MAX MIN NOM MAX<br>A 0.90 1.00 1.10 0.035 0.039 0.043<br>is b Ppp A1 0.01 0.06 0.10 fe 0.001 0.002 0.004<br>b 0.25 0.37 0.50 0.010 0.015 0.020<br>e : c 0.10 0.18 0.26 0.004 0.007 0.010<br>D 2.90 3.00 3.10 0.114 0.118 0.122<br>E 1.30 1.50 1.70 0.051 0.059 0.067<br>e 0.85 0.95 1.05 0.034 0.037 0.041<br>C L 0.20 0.40 0.60 0.008 0.016 0.024<br>0.05 (0.002) A H E 2.50 2.75− 3.00 0.099 0.108− 0.118<br>L<br>A1<br>sym, 3) SSSSSS= 0 ° 10 ° 0 ° 10 °<br>SOLDERING FOOTPRINT*<br>2.4<br>0.094<br>0.95<br>1.9 0.037<br>0.074<br>0.95<br>0.7 0.037<br>0.028<br>1.0<br>— 0.039 SCALE 10:1 (—) inchesmm<br>**----- End of picture text -----**<br>


*For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. 

ON Semiconductor and the         are registered trademarks of Semiconductor Components Industries, LLC (SCILLC) or its subsidiaries in the United States and/or other countries. SCILLC owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf.  SCILLC reserves the right to make changes without further notice to any products herein.  SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.  “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time.  All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts.  SCILLC does not convey any license under its patent rights nor the rights of others.  SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur.  Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part.  SCILLC is an Equal Opportunity/Affirmative Action Employer.  This literature is subject to all applicable copyright laws and is not for resale in any manner. 

## **PUBLICATION ORDERING INFORMATION** 

**LITERATURE FULFILLMENT** : **N. American Technical Support** : 800−282−9855 Toll Free **ON Semiconductor Website** : **www.onsemi.com** Literature Distribution Center for ON Semiconductor USA/Canada P.O. Box 5163, Denver, Colorado 80217 USA **Europe, Middle East and Africa Technical Support: Order Literature** : http://www.onsemi.com/orderlit **Phone** : 303−675−2175 or 800−344−3860 Toll Free USA/Canada Phone: 421 33 790 2910 **Fax** : 303−675−2176 or 800−344−3867 Toll Free USA/Canada **Japan Customer Focus Center** For additional information, please contact your local **Email** : orderlit@onsemi.com Phone: 81−3−5817−1050 Sales Representative 

## **LITERATURE FULFILLMENT** : 

**www.onsemi.com** 

**NSM4002MR6/D** 

**7** 



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