# Small Signal Diode, Single, 100 V, 200 mA, 1 V, 4 ns, 500 mA

![Product image](https://novapart.co/image/farnell:2774569/)

**URL**: https://novapart.co/products/NSD914F3T5G/small-signal-diode-single-100-v-200-ma-1-4-ns-500
**SKU**: NSD914F3T5G
**Manufacturer**: ONSEMI
**Category**: Semiconductors - Discretes || Diodes & Rectifiers || Small Signal Diodes
**Price**: €0.3110
**Stock**: 10+

## Specifications

| Parameter | Value |
|---|---|
| No. Of Pins | 3Pins |
| Qualification | AEC-Q101 |
| Diode Mounting | Surface Mount |
| Diode Case Style | SOT-1123 |
| Diode Configuration | Single |
| Forward Voltage Max | 1V |
| Forward Surge Current | 500mA |
| Reverse Recovery Time | 4ns |
| Average Forward Current | 200mA |
| Operating Temperature Max | 150°C |
| Repetitive Peak Reverse Voltage | 100V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:2774569/)

## NSD914F3T5G 

## High-Speed Switching Diode 

The NSD914F3T5G device is a spin−off of our popular SOT−23 three−leaded device. It is designed for high speed switching applications and is housed in the SOT−1123 surface mount package. This device is ideal for low−power surface mount applications where board space is at a premium. 

## **Features** 

- Reduces Board Space 

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http://onsemi.com<br>3 1<br>CATHODE [©] ANODE<br>**----- End of picture text -----**<br>


- This is a Halide−Free Device 

- This is a Pb−Free Device 

**NSD914F3T5G** 

## **MAXIMUM RATINGS** 

3 **Rating Symbol Value Unit** Reverse Voltage VR 100 Vdc **1** 2 Forward Current IF 200 mAdc **SOT−1123 CASE 524AA** ~~—=5~~ Peak Forward Surge Current IFM(surge) 500 mAdc °* **STYLE 2 THERMAL CHARACTERISTICS Characteristic Symbol Max Unit MARKING DIAGRAM** Total Device Dissipation, TA = 25 ° C PD 290 mW Derate above 25 ° C (Note 1) 2.3 mW/ ° C ~~ee~~ R M Thermal Resistance, R JA 432 ° C/W Junction−to−Ambient (Note 1) ~~ee~~ Total Device Dissipation, TDerate above 25 ° C A = 25 ° C (Note 2)PD 3472.8 mW/mW ° C RM = Device Code= Date Code ~~a~~ Thermal Resistance, R JA 360 ° C/W Junction−to−Ambient (Note 2) **ORDERING INFORMATION** Thermal Resistance, R JL 143 ° C/W Junction−to−Lead 3 (Note 2) **Device Package Shipping**[†] Junction and Storage Temperature Range TJ, Tstg −55 to ° C NSD914F3T5G SOT−1123 8000/Tape & Reel +150 (Pb−Free) ~~FE~~ Stresses exceeding Maximum Ratings may damage the device. Maximum †For information on tape and reel specifications, Ratings are stress ratings only. Functional operation above the Recommended including part orientation and tape sizes, please Operating Conditions is not implied. Extended exposure to stresses above the refer to our Tape and Reel Packaging Specifications Recommended Operating Conditions may affect device reliability. 

†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. 

1. 100 mm[2] 1 oz, copper traces. 

2. 500 mm[2] 1 oz, copper traces. 

Publication Order Number: **NSD914F3/D** 

**1** 

© Semiconductor Components Industries, LLC, 2009 **January, 2009 − Rev. 0** 

**NSD914F3T5G** 

## **ELECTRICAL CHARACTERISTICS** (TA = 25 ° C unless otherwise noted) 

|**ELECTRICAL CHARACTERISTICS**(TA= 25°C unless otherwise noted)||||||
|---|---|---|---|---|---|
|**Characteristic**|**Symbol**|**Min**|**Typ**|**Max**|**Unit**|
|**OFF CHARACTERISTICS**||||||
|Reverse Breakdown Voltage<br>(IR= 100�Adc)|V(BR)|100|−|−|Vdc|
|Reverse Voltage Leakage Current<br>(VR= 20 Vdc)<br>(VR= 75 Vdc)|IR|−<br>−|−<br>−|25<br>5.0|nAdc<br>�Adc|
|Diode Capacitance<br>(VR= 0, f = 1.0 MHz)|CT|−|−|4.0|pF|
|Forward Voltage<br>(IF= 10 mAdc)|VF|−|−|1.0|Vdc|
|Reverse Recovery Time<br>(IF= IR= 10 mAdc) (Figure 1)|trr|−|−|4.0|ns|



1. FR−5 = 1.0 � 0.75 � 0.062 in. 

2. Alumina = 0.4 � 0.3 � 0.024 in. 99.5% alumina. 

**http://onsemi.com** 

**2** 

**NSD914F3T5G** 

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820 �<br>IF<br>+10 V 2.0 k 0.1 �F tr t p t<br>100 �H IF 10% t rr t<br>0.1 �F<br>DUT 90%<br>50 � OUTPUT 50 � INPUT iR(REC) = 1.0 mA<br>IR<br>PULSE SAMPLING VR OUTPUT PULSE<br>GENERATOR OSCILLOSCOPE INPUT SIGNAL<br>(IF = IR = 10 mA; MEASURED<br>at iR(REC) = 1.0 mA)<br>**----- End of picture text -----**<br>


Notes: 1. A 2.0 k � variable resistor adjusted for a Forward Current (IF) of 10 mA. Notes: 2. Input pulse is adjusted so IR(peak) is equal to 10 mA. Notes: 3. tp » trr 

**Figure 1. Recovery Time Equivalent Test Circuit** 

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**----- Start of picture text -----**<br>
100 10<br>TA = 150°C<br>TA = 85°C TA = -40°C 1.0 TA = 125°C<br>10<br>TA = 85°C<br>TA = 25°C 0.1<br>1.0 TA = 55°C<br>0.01<br>TA = 25°C<br>0.1 0.001<br>0.2 0.4 0.6 0.8 1.0 1.2 0 10 20 30 40 50<br>VF, FORWARD VOLTAGE (VOLTS) VR, REVERSE VOLTAGE (VOLTS)<br>�<br>, FORWARD CURRENT (mA)IF , REVERSE CURRENT (   A)IR<br>**----- End of picture text -----**<br>


**Figure 2. Forward Voltage** 

**Figure 3. Leakage Current** 

**==> picture [241 x 171] intentionally omitted <==**

**----- Start of picture text -----**<br>
0.68<br>0.64<br>0.60<br>0.56<br>0.52<br>0 2.0 4.0 6.0 8.0<br>VR, REVERSE VOLTAGE (VOLTS)<br>, DIODE CAPACITANCE (pF)<br>D<br>C<br>**----- End of picture text -----**<br>


**Figure 4. Capacitance** 

**http://onsemi.com** 

**3** 

**NSD914F3T5G** 

## **PACKAGE DIMENSIONS** 

**SOT−1123** CASE 524AA−01 ISSUE A 

**==> picture [393 x 272] intentionally omitted <==**

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b1 D −X− NOTES:<br>1. DIMENSIONING AND TOLERANCING PER ANSI<br>Pe −Y− Y14.5M, 1982.<br>2. CONTROLLING DIMENSION: MILLIMETERS.<br>1 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD<br>3 E FINISH THICKNESS. MINIMUM LEAD<br>2 THICKNESS IS THE MINIMUM THICKNESS OF<br>BASE MATERIAL.<br>e b<br>0.08 (0.0032) X Y DIM MINMILLIMETERSNOM MAX MIN INCHESNOM MAX<br>=== A 0.34 0.37 0.40 0.013 0.015 0.016<br>b 0.15 0.20 0.25 0.006 0.008 0.010<br>A b1 0.10 0.15 0.20 0.004 0.006 0.008<br>c 0.07 0.12 0.17 0.003 0.005 0.007<br>D 0.75 0.80 0.85 0.030 0.031 0.033<br>E 0.55 0.60 0.65 0.022 0.024 0.026<br>e 0.35 0.014<br>c L HLE 0.950.05 1.000.10 1.050.15 0.0370.002 0.0390.004 0.0410.006<br>el HE a STYLE 2:<br>PIN 1. ANODE<br> 2. N/C<br>SOLDERING FOOTPRINT*  3. CATHODE<br>0.35<br>0.30<br>Ar<br>0.25 ta CcoO O yt ;w 4 0.40<br>0.90<br>DIMENSIONS: MILLIMETERS<br>**----- End of picture text -----**<br>


*For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. 

**ON Semiconductor** and          are registered trademarks of Semiconductor Components Industries, LLC (SCILLC).  SCILLC reserves the right to make changes without further notice to any products herein.  SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time.  All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts.  SCILLC does not convey any license under its patent rights nor the rights of others.  SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur.  Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part.  SCILLC is an Equal Opportunity/Affirmative Action Employer.  This literature is subject to all applicable copyright laws and is not for resale in any manner. 

## **PUBLICATION ORDERING INFORMATION** 

**LITERATURE FULFILLMENT** : **N. American Technical Support** : 800−282−9855 Toll Free **ON Semiconductor Website** : **www.onsemi.com** Literature Distribution Center for ON Semiconductor USA/Canada P.O. Box 5163, Denver, Colorado 80217 USA **Europe, Middle East and Africa Technical Support: Order Literature** : http://www.onsemi.com/orderlit **Phone** : 303−675−2175 or 800−344−3860 Toll Free USA/Canada Phone: 421 33 790 2910 **Fax** : 303−675−2176 or 800−344−3867 Toll Free USA/Canada **Japan Customer Focus Center** For additional information, please contact your local **Email** : orderlit@onsemi.com Phone: 81−3−5773−3850 Sales Representative 

## **LITERATURE FULFILLMENT** : 

**NSD914F3/D** 

**http://onsemi.com 4** 



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---

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