# Schottky Rectifier, 45 V, 2 A, Single, SOD-123FL, 2 Pins, 650 mV

![Product image](https://novapart.co/image/farnell:3003750/)

**URL**: https://novapart.co/products/NRVTS245ESFT3G/schottky-rectifier-45-v-2-a-single-sod-123fl-pins
**SKU**: NRVTS245ESFT3G
**Manufacturer**: ONSEMI
**Category**: Semiconductors - Discretes || Diodes & Rectifiers || Schottky Diodes || Schottky Rectifier Diodes
**Price**: €0.5220
**Stock**: 10+
**Lead Time**: 281 days (indicative)

## Description

Repetitive Reverse Voltage Vrrm Max:45V; Forward Current If(AV):2A; Diode Configuration:Single; Diode Case Style:SOD-123F; Available until stocks are exhausted Alternative available

## Specifications

| Parameter | Value |
|---|---|
| Svhc | No SVHC (15-Jan-2018) |
| No. Of Pins | 2Pins |
| Product Range | - |
| Qualification | AEC-Q101 |
| Diode Mounting | Surface Mount |
| Diode Case Style | SOD-123FL |
| Diode Configuration | Single |
| Forward Voltage Max | 650mV |
| Forward Surge Current | 50A |
| Average Forward Current | 2A |
| Operating Temperature Max | 175°C |
| Repetitive Peak Reverse Voltage | 45V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:3003750/)

## NRVTS245ESF 

## Very Low Forward Voltage Trench-based Schottky Rectifier 

## **Features** 

- Fine Lithography Trench−based Schottky Technology for Very Low Forward Voltage and Low Leakage 

- Fast Switching with Exceptional Temperature Stability 

- Low Power Loss and Lower Operating Temperature 

- Higher Efficiency for Achieving Regulatory Compliance 

- Low Thermal Resistance 

## **http://onsemi.com** 

**TRENCH SCHOTTKY RECTIFIER 2.0 AMPERES 45 VOLTS** 

- High Surge Capability 

- NRV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q101 Qualified and PPAP Capable 

- These are Pb−Free and Halide−Free Devices 

## **Mechanical Characteristics:** 

- Case: Molded Epoxy 

**SOD−123FL CASE 498 PLASTIC** 

- Epoxy Meets UL 94 V−0 @ 0.125 in 

- Weight: 11.7 mg (Approximately) 

- Lead and Mounting Surface Temperature for Soldering Purposes: 260°C Maximum for 10 Seconds 

- MSL 1 

## **Typical Applications** 

- Switching Power Supplies including Compact Adapters and Flat Panel Display 

- High Frequency and DC−DC Converters 

- Freewheeling and OR−ing diodes 

## **MARKING DIAGRAM** 

2AEM ql. 2AE = Specific Device Code M = Date Code = Pb−Free Package 

(Note: Microdot may be in either location) 

- Reverse Battery Protection 

- Instrumentation 

- Automotive LED Lighting 

**ORDERING INFORMATION** 

**Device Package Shipping**[†] NRVTS245ESFT1G SOD−123 3,000/ (Pb−Free) Tape & Reel NRVTS245ESFT3G SOD−123 10,000/ (Pb−Free) Tape & Reel ~~I~~ †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D. 

Publication Order Number: **NRVTS245ESF/D** 

**1** 

© Semiconductor Components Industries, LLC, 2014 **September, 2014 − Rev. 0** 

**NRVTS245ESF** 

## **MAXIMUM RATINGS** 

|**MAXIMUM RATINGS**||||
|---|---|---|---|
|**Rating**|**Symbol**|**Value**|**Unit**|
|Peak Repetitive Reverse Voltage<br>Working Peak Reverse Voltage<br>DC Blocking Voltage|VRRM<br>VRWM<br>VR|45|V|
|Average Rectified Forward Current<br>(TL= 148°C)|IO|2.0|A|
|Peak Repetitive Forward Current<br>(Square Wave, 20 kHz, TL= 143°C)|IFRM|4.0|A|
|Non−Repetitive Peak Surge Current<br>(Surge Applied at Rated Load Conditions Halfwave, Single Phase, 60 Hz)|IFSM|50|A|
|Storage and Operating Junction Temperature Range (Note 1)|Tstg, TJ|−65 to +175|°C|



Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 

1. The heat generated must be less than the thermal conductivity from Junction−to−Ambient: dPD/dTJ < 1/R � JA. 

## **THERMAL CHARACTERISTICS** 

|**THERMAL CHARACTERISTICS**||||
|---|---|---|---|
|**Characteristic**|**Symbol**|**Value**|**Unit**|
|Thermal Resistance, Junction−to−Lead (Note 2)|�JCL|23|°C/W|
|Thermal Resistance, Junction−to−Ambient (Note 2)|R�JA|85|°C/W|
|Thermal Resistance, Junction−to−Ambient (Note 3)|R�JA|330|°C/W|
|**ELECTRICAL CHARACTERISTICS**||||
|**Characteristic**|**Symbol**|**Value**|**Unit**|
|Maximum Instantaneous Forward Voltage (Note 4)<br>(IF= 2.0 A, TJ= 25°C)<br>(IF= 2.0 A, TJ= 125°C)|VF|0.65<br>0.58|V|
|Maximum Instantaneous Reverse Current (Note 4)<br>(Rated dc Voltage, TJ= 25°C)<br>(Rated dc Voltage, TJ= 125°C)|IR|75<br>3|�A<br>mA|



Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. 

2. Mounted with 700 mm[2] copper pad size (Approximately 1 in[2] ) 1 oz FR4 Board. 

3. Mounted with pad size approximately 20 mm[2] copper, 1 oz FR4 Board. 

4. Pulse Test: Pulse Width ≤ 380 � s, Duty Cycle ≤ 2.0%. 

**http://onsemi.com** 

**2** 

**NRVTS245ESF** 

## **TYPICAL CHARACTERISTICS** 

**==> picture [490 x 591] intentionally omitted <==**

**----- Start of picture text -----**<br>
100 100<br>TA = 150 ° C TA = 175 ° C T A  = 175 ° C<br>10 10 T A  = 150 ° C<br>TA = 125 ° C<br>T A  = 125 ° C<br>1 1<br>TA = 25 ° C TA = 25 ° C<br>TA = −55 ° C TA = −55 ° C<br>0.1 0.1<br>0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8<br>VF, INSTANTANEOUS FORWARD VOLTAGE (V) VF, INSTANTANEOUS FORWARD VOLTAGE (V)<br>Figure 1. Typical Instantaneous Forward Figure 2. Maximum Instantaneous Forward<br>Characteristics Characteristics<br>1.E−02 1.E−01<br>TA = 175 ° C TA = 175 ° C<br>1.E−03 TA = 150 ° C 1.E−02 TA = 150 ° C<br>TA = 125 ° C<br>1.E−04 1.E−03 TA = 125 ° C<br>TA = 90 ° C<br>T A  = 90 ° C<br>1.E−05 1.E−04<br>TA = 25 ° C TA = 25 ° C<br>1.E−06 1.E−05<br>1.E−07 1.E−06<br>5 15 25 35 45 5 15 25 35 45<br>VR, INSTANTANEOUS REVERSE VOLTAGE (V) VR, INSTANTANEOUS REVERSE VOLTAGE (V)<br>Figure 3. Typical Reverse Characteristics Figure 4. Maximum Reverse Characteristics<br>1000 4<br>TJ = 25 ° C<br>DC<br>3<br>Square Wave<br>100 2<br>1<br>R � JL = 24.4 ° C/W<br>10 0<br>0.1 1 10 10 30 50 70 90 110 130 150 170<br>VR, REVERSE VOLTAGE (V) TC, CASE TEMPERATURE ( ° C)<br>CURRENT (A) CURRENT (A)<br>, INSTANTANEOUS FORWARD , INSTANTANEOUS FORWARD<br>iF iF<br>, INSTANTANEOUS REVERSE CURRENT (A) , INSTANTANEOUS REVERSE CURRENT (A)<br>IR IR<br>, AVERAGE FORWARD CURRENT (A)<br>C, JUNCTION CAPACITANCE (pF)<br>IF(AV)<br>**----- End of picture text -----**<br>


**Figure 5. Typical Junction Capacitance** 

**Figure 6. Current Derating** 

**http://onsemi.com** 

**3** 

**NRVTS245ESF** 

## **TYPICAL CHARACTERISTICS** 

**==> picture [243 x 174] intentionally omitted <==**

**----- Start of picture text -----**<br>
4<br>IPK/IAV IPK/IAV = 10<br>= 20<br>3<br>IPK/IAV = 5<br>2<br>Square Wave<br>1 DC<br>0<br>0 0.5 1.0 1.5 2.0 2.5<br>IF(AV), AVERAGE FORWARD CURRENT (A)<br>, AVERAGE FORWARD<br>F(AV) POWER DISSIPATION (W)<br>P<br>**----- End of picture text -----**<br>


**Figure 7. Forward Power Dissipation** 

**==> picture [490 x 173] intentionally omitted <==**

**----- Start of picture text -----**<br>
100<br>50% Duty Cycle<br>20%<br>10%<br>10<br>5%<br>2%<br>1%<br>1<br>0.1<br>0.000001 0.00001 0.0001 0.001 0.01 0.1 1 10 100 1000<br>t, PULSE TIME (s)<br>C/W)<br>°<br>R(t) (<br>**----- End of picture text -----**<br>


**Figure 8. Thermal Characteristics** 

**http://onsemi.com** 

**4** 

**NRVTS245ESF** 

## **PACKAGE DIMENSIONS** 

## **SOD−123FL** 

CASE 498 ISSUE D 

**==> picture [240 x 249] intentionally omitted <==**

**----- Start of picture text -----**<br>
E<br>ar ;<br>D<br>1 2<br>A1<br>POLARITY INDICATOR<br>Ae OPTIONAL AS NEEDED E ‘——— A<br>TOP VIEW END VIEW<br>i HE —+|4 c<br>SIDE VIEW<br>2X L<br>. -<br>2X b<br>2X 1.22<br>BOTTOM VIEW<br>‘ a k<br>**----- End of picture text -----**<br>


|**DIM**<br>~~—_~~<br>—————_——_|**MILLIMETERS**<br>~~—_~~|**MILLIMETERS**<br>~~—_~~|**MILLIMETERS**<br>~~—_~~|**INCHES**|**INCHES**|**INCHES**|
|---|---|---|---|---|---|---|
||**MIN**<br>~~—_~~<br>—————_——_|**NOM**<br>~~—_~~<br>—————_——_|**MAX**<br>~~—_~~<br>—————_——_|**MIN**<br>—————_——_|**NOM**<br>—————_——_|**MAX**<br>—————_——_~~—~~|
|**A**<br>**A1**<br>~~—_~~<br>—————_——_|0.90<br>0.00<br>~~—_~~<br>—————_——_|**NOM**<br>0.95<br>0.05<br>~~—_~~<br>—————_——_|0.98<br>0.10<br>~~—_~~<br>—————_——_|0.035<br>0.000<br>—————_——_|0.037<br>0.002<br>**NOM**<br>—————_——_|0.039<br>0.004<br>—————_——_~~—~~|
|**A1**<br>~~—_~~<br>—————_——_|0.00<br>~~—_~~<br>—————_——_|0.05<br>~~—_~~<br>—————_——_|0.10<br>~~—_~~<br>—————_——_|0.000<br>—————_——_|0.002<br>—————_——_|0.004<br>—————_——_~~—~~|
|**b**<br> ~~—_~~<br>—————_——_|0.70<br>~~—_~~<br>—————_——_|0.90<br>~~—_~~<br>—————_——_|1.10<br>~~—_~~<br>—————_——_|0.028<br>—————_——_|0.035<br>—————_——_|0.043<br>—————_——_~~—~~|
|**c**|0.10|0.15|0.20|0.004|0.006|0.008|
|**D**|1.50|1.65|1.80|0.059|0.065|0.071|
|**E**|2.50|2.70|2.90|0.098|0.106|0.114|
|**L**|0.55|0.75|0.95|0.022|0.030|0.037|
|**HE**|3.40|3.60|3.80|0.134|0.142|0.150|
||0°|−|8°|0°|−|8°|



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RECOMMENDED<br>SOLDERING FOOTPRINT*<br>4.20<br>2X<br>1.25<br>rp<br>ÉÉÉ ÉÉÉ<br>2X 1.22 ÉÉÉ ÉÉÉ<br>1_ ÉÉÉ aea ÉÉÉ o<br>ÉÉÉ ÉÉÉ<br>DIMENSIONS: MILLIMETERS<br>*For additional information on our Pb−Free strategy and soldering<br>details, please download the ON Semiconductor Soldering and<br>Mounting Techniques Reference Manual, SOLDERRM/D.<br>**----- End of picture text -----**<br>


ON Semiconductor and the         are registered trademarks of Semiconductor Components Industries, LLC (SCILLC) or its subsidiaries in the United States and/or other countries. SCILLC owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf.  SCILLC reserves the right to make changes without further notice to any products herein.  SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.  “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time.  All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts.  SCILLC does not convey any license under its patent rights nor the rights of others.  SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur.  Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part.  SCILLC is an Equal Opportunity/Affirmative Action Employer.  This literature is subject to all applicable copyright laws and is not for resale in any manner. 

## **PUBLICATION ORDERING INFORMATION** 

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## **LITERATURE FULFILLMENT** : 

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**NRVTS245ESF/D** 

**5** 



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