# Schottky Rectifier, 20 V, 1 A, Single, Power Mite, 2 Pins, 595 mV

![Product image](https://novapart.co/image/farnell:3606506/)

**URL**: https://novapart.co/products/NRVBM120ET1G/schottky-rectifier-20-v-1-a-single-power-mite-2
**SKU**: NRVBM120ET1G
**Manufacturer**: ONSEMI
**Category**: Semiconductors - Discretes || Diodes & Rectifiers || Schottky Diodes || Schottky Rectifier Diodes
**Price**: €0.1800
**Stock**: 10+
**Lead Time**: 85 days (indicative)

## Specifications

| Parameter | Value |
|---|---|
| Svhc | No SVHC (25-Jun-2025) |
| No. Of Pins | 2Pins |
| Product Range | - |
| Qualification | AEC-Q101 |
| Diode Mounting | Surface Mount |
| Diode Case Style | Power Mite |
| Diode Configuration | Single |
| Forward Voltage Max | 595mV |
| Forward Surge Current | 50A |
| Average Forward Current | 1A |
| Operating Temperature Max | 150°C |
| Repetitive Peak Reverse Voltage | 20V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:3606506/)

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## Surface Mount Schottky Power Rectifier 

## POWERMITE[] Power Surface Mount Package 

## MBRM120ET1G, NRVBM120ET1G, MBRM120ET3G, NRVBM120ET3G 

The Schottky POWERMITE[] employs the Schottky Barrier principle with a barrier metal and epitaxial construction that produces optimal forward voltage drop−reverse current tradeoff. The advanced packaging techniques provide for a highly efficient micro miniature, space saving surface mount Rectifier. With its unique heatsink design, the POWERMITE[] has the same thermal performance as the SMA while being 50% smaller in footprint area, and delivering one of the lowest height profiles,  1.1 mm in the industry. Because of its small size, it is ideal for use in portable and battery powered products such as cellular and cordless phones, chargers, notebook computers, printers, PDAs and PCMCIA cards. Typical applications are AC−DC and DC−DC converters, reverse battery protection, and “Oring” of multiple supply voltages and any other application where performance and size are critical. 

## **Features** 

- Low Profile − Maximum Height of 1.1 mm 

- Small Footprint − Footprint Area of 8.45 mm2 

- Low VF Provides Higher Efficiency and Extends Battery Life 

- ESD Ratings: 

   - Machine Model = C (> 400 V) 

   - Human Body Model = 3B (> 16,000 V) 

- Supplied in 12 mm Tape and Reel 

- Low Thermal Resistance with Direct Thermal Path of Die on Exposed Cathode Heat Sink 

- AEC−Q101 Qualified and PPAP Capable 

- NRVB Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements 

- All Packages are Pb−Free* 

## **Mechanical Characteristics** 

- POWERMITE[] is JEDEC Registered as DO−216AA 

- Case: Molded Epoxy 

- Epoxy Meets UL 94 V−0 @ 0.125 in 

## **SCHOTTKY BARRIER RECTIFIER 1.0 AMPERES, 20 VOLTS** 

**==> picture [50 x 27] intentionally omitted <==**

**----- Start of picture text -----**<br>
POWERMITE<br>CASE 457<br>STYLE 1<br>**----- End of picture text -----**<br>


## **MARKING DIAGRAM** 

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M<br>1 2<br>BCV<br>a=<br>**----- End of picture text -----**<br>


BCV = Device Code M = Date Code = Pb−Free Package 

## **ORDERING INFORMATION** 

|**Device**|**Package**|**Shipping**†|
|---|---|---|
|MBRM120ET1G|POWERMITE<br>(Pb−Free)|3,000 /<br>Tape & Reel|
|NRVBM120ET1G|POWERMITE<br>(Pb−Free)|3,000 /<br>Tape & Reel|
|MBRM120ET3G|POWERMITE<br>(Pb−Free)|12,000 /<br>Tape & Reel|



**DISCONTINUED** (Note 1) 

   - NRVBM120ET3G POWERMITE 12,000 / (Pb−Free) Tape & Reel 

   - | ~~TT~~ †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D. 

   1. **DISCONTINUED:** These devices are not recommended for new design. Please contact your **onsemi** representative for information. The most current information on these devices may be available on www.onsemi.com. 

- Weight: 16.3 mg (approximately) 

- Lead and Mounting Surface Temperature for Soldering Purposes 260  C Maximum for 10 Seconds 

- *For additional information on our Pb−Free strategy and soldering details, please download the **onsemi** Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. 

Publication Order Number: **MBRM120E/D** 

**1** 

 Semiconductor Components Industries, LLC, 2012 **November, 2024 − Rev. 4** 

**MBRM120ET1G, NRVBM120ET1G, MBRM120ET3G, NRVBM120ET3G** 

## **MAXIMUM RATINGS** 

|**Symbol**<br>~~a~~<br>~~es~~|**Rating**|**Value**|**Unit**|
|---|---|---|---|
|VRRM<br>VRWM<br>VR<br>~~es~~|Peak Repetitive Reverse Voltage<br>Working Peak Reverse Voltage<br>DC Blocking Voltage|20|V|
|IO<br>~~es~~<br>~~a ee~~|Average Rectified Forward Current<br>(At Rated VR, TC= 130C)<br>~~ee~~|1.0<br>~~ee~~|A<br>~~ee~~|
|IFRM<br>~~a~~|Peak Repetitive Forward Current<br>(At Rated VR, Square Wave, 20 kHz, TC= 135C)|2.0|A|
|IFSM<br>~~a~~|Non−Repetitive Peak Surge Current<br>(Non−Repetitive peak surge current, halfwave, single phase, 60 Hz)|50|A|
|Tstg<br>~~a ee~~<br>~~ee~~|Storage Temperature<br>~~ee~~<br>|−65 to 150<br>~~ee~~<br>|C<br>~~ee~~<br>|
|TJ<br>~~ee~~<br>~~ee~~|Operating Junction Temperature<br>~~ee~~<br>~~a~~|−65 to 150<br>~~ee~~<br>~~a~~<br>~~ee~~|C<br>~~ee~~<br>~~a~~|
|dv/dt<br>~~ee~~<br>~~ee~~<br>~~a ee~~|Voltage Rate of Change<br>(Rated VR, TJ= 25C)<br>~~ee~~<br><br>~~ee~~|10,000<br>~~ee~~<br><br>~~ee~~<br>~~ee~~|V/ s<br>~~ee~~<br><br>~~ee~~|



## **THERMAL CHARACTERISTICS** 

|**Symbol**|**Characteristic**|**Value**|**Unit**|
|---|---|---|---|
|Rtjl<br>Rtjtab<br>Rtja|Thermal Resistance − Junction−to−Lead (Anode) (Note 1)<br>Thermal Resistance − Junction−to−Tab (Cathode) (Note 1)<br>Thermal Resistance − Junction−to−Ambient (Note 1)|35<br>23<br>277|C/W|



1. Mounted with minimum recommended pad size, PC Board FR4, See Figures 9 and 10. 

## **ELECTRICAL CHARACTERISTICS** 

|**Symbol**<br>~~es~~|**Characteristic**<br>~~ee~~|**Value**<br>~~ee~~|**Value**<br>~~ee~~|**Unit**<br>~~ee~~|
|---|---|---|---|---|
|VF<br>~~es~~|Maximum Instantaneous Forward Voltage (Note 2), See Figure 2<br>(IF= 0.1 A)<br>(IF= 1.0 A)<br>(IF= 2.0 A)<br>~~ee~~<br>~~ee ee~~|**TJ = 25****C**<br>~~ee~~|**TJ = 100****C**<br>~~ee~~|V<br>~~ee~~<br>~~ee~~|
|||0.455<br>0.530<br>0.595<br>~~ee~~<br>~~ee~~|0.360<br>0.455<br>0.540<br>~~ee~~<br>~~ee~~||
|IR<br>~~es~~<br>~~a~~|Maximum Instantaneous Reverse Current (Note 2), See Figure 4<br>(VR= 20 V)<br>(VR= 10 V)<br>(VR= 5.0 V)<br>~~ee ~~<br>~~ee ee~~<br>~~a~~|**TJ = 25****C**<br> ~~ee~~<br>~~ee~~<br>~~fT~~|**TJ = 100****C**<br>~~ee~~<br>~~ee~~<br>~~fT~~|A<br>~~ee~~<br>~~ee~~|
|||10<br>1.0<br>0.5<br>~~ee~~<br>~~fT~~|1600<br>500<br>300<br>~~ee~~<br>~~fT~~||



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10 10<br>TJ = 150C<br>TJ = 100C TJ = 25C TJ = 150C<br>TJ = −40C TJ = 100C<br>1.0 1.0<br>iffff | | TJ = 25C<br>HHSS Ff yy)ae a ———<br>| fi f | f/fHh {ff |oh[| eya) aA ee i<br>0.1 f/f if| | | 0.1 EL AsA se | |<br>0.2 0.4 0.6 0.8 0.2 0.4 0.6 0.8<br>vF, INSTANTANEOUS FORWARD VOLTAGE (VOLTS) VF, MAXIMUM INSTANTANEOUS FORWARD VOLTAGE<br>(VOLTS)<br>Figure 1. Typical Forward Voltage Figure 2. Maximum Forward Voltage<br>100E−3 100E−3<br>10E−3 10E−3 TJ = 150  C<br>1E−3 TJ = 150  C 1E−3 T J  = 100  C<br>SSS oe<br>100E−6 TJ = 100  C 100E−6<br>10E−6 10E−6<br>TJ = 25  C<br>1E−6 1E−6<br>100E−9 T J = 25C 100E−9<br>10E−9 10E−9<br>0 5.0 10 15 20 0 5.0 10 15 20<br>VR, REVERSE VOLTAGE (VOLTS) VR, REVERSE VOLTAGE (VOLTS)<br>Figure 3. Typical Reverse Current Figure 4. Maximum Reverse Current<br>1.8 0.7<br>FREQ = 20 kHz dc<br>dc<br>1.6 ee ee 0.6 SQUARE<br>WAVE<br>1.4 Ipk/Io =<br>0.5<br>1.2 ee SQUARE WAVE Ipk/Io = 5 |<br>1.0 0.4<br>e Ipk/Io =  e ee Ipk/Io = 10 eV 29<br>0.8 ee 0.3 |VK<br>Ipk/Io = 5 Ipk/Io = 20<br>0.6 ee ee Ve|<br>Ipk/Io = 10 0.2<br>0.4<br>Ipk/Io = 20 0.1<br>0.2 a GF<br>0 Ss 0 A | | tT ft lt<br>25 45 65 85 105 125 145 165 0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6<br>TL, LEAD TEMPERATURE (C) IO, AVERAGE FORWARD CURRENT (AMPS)<br>, INSTANTANEOUS FORWARD CURRENT (AMPS) , INSTANTANEOUS FORWARD CURRENT (AMPS)<br>iF iF<br>, REVERSE CURRENT (AMPS)<br>IR<br>, MAXIMUM REVERSE CURRENT (AMPS)<br>IR<br>, AVERAGE DISSIPATION (WATTS)<br>FO<br>P<br>, AVERAGE FORWARD CURRENT (AMPS)<br>IO<br>**----- End of picture text -----**<br>


**Figure 5. Current Derating** 

**Figure 6. Forward Power Dissipation** 

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1000 150<br>Rtja = 33.72C/W<br>TJ = 25C 51C/W<br>SSSSSSSS== 148 || | 69 T C/W R<br>83.53C/W<br>100<br>96C/W<br>BS SSR yy] NN<br>======———— 146 \<br>P| | f[ | f[ | f[ f[ [|<br>10 FERRER EEE 144<br>0 2.0 4.0 6.0 8.0 10 12 14 16 18 20 0 2.0 4.0 6.0 8.0 10 12 14 16 18 20<br>VR, REVERSE VOLTAGE (VOLTS) VR, DC REVERSE VOLTAGE (VOLTS)<br>C)<br>(<br>C, CAPACITANCE (pF)<br>, DERATED OPERATING TEMPERATURE<br>J<br>T<br>**----- End of picture text -----**<br>


**Figure 7. Capacitance** 

**Figure 8. Typical Operating Temperature Derating*** 

* Reverse power dissipation and the possibility of thermal runaway must be considered when operating this device under any reverse voltage conditions. Calculations of TJ therefore must include forward and reverse power effects. The allowable operating TJ may be calculated from the equation: TJ = TJmax − r(t)(Pf + Pr) where 

r(t) = thermal impedance under given conditions, Pf = forward power dissipation, and Pr = reverse power dissipation 

This graph displays the derated allowable TJ due to reverse bias under DC conditions only and is calculated as TJ = TJmax − r(t)Pr, where r(t) = Rthja. For other power applications further calculations must be performed. 

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1.0<br>a SB 0 oe nS ES ES RS SS GO OS SG HO<br>a ee a es oe a es es 0 0 ee<br>50% a OO GGG | OB GG 0G OOO<br>pn<br>0.1 a==... 20% 10% rsSoooee—__ee2seeronl| ttrr  Me EYeee Seeeee eee eee eee<br>— A A es ae OP ee OO OO SO OO GG ON GO<br>5.0%<br>Pe_<br>a 5 eh a a a a |<br>pee PA TE ETRE PEP TEA]<br>2.0%<br>0.01 = e 1.0% se0aeA eSSSCSOOSOS0SSa=eeGS BORS GG 0WSee CD=0OE SS|GN OeSSS SSS0EGS|DGSes0GO llS(O OO<br>*<br>PSETT Ty Rtjl(t) = Rtjl r(t) a aI ee0| a |0 OO|0OO O00 OOO<br>0.001<br>0.00001 0.0001 0.001 0.01 0.1 1.0 10 100<br>T, TIME (s)<br>Figure 9. Thermal Response Junction to Lead<br>1.0 ee<br>SSa 0 SSSeBB OO 0 0 ee ee eee ee ee ee<br>oea OO DG OD a a<br>SSE 50% a aer| |<br>20% Oa<br>0.1 PE 10% aeeAnt== OOeee0 eeraee oteerrrce A | eett FSeeeeeee a DGeeNCEEGG OO<br>5.0%<br>PET OO a Ms a Pt BO OO OB OO |<br>ne eee TT Pe<br>es a ekOe |<br>0.01 ae0 2.0% ASecnnA ctceteeOtSS OSaOO6eee GN GS OSeeSS EGfca A|fnGG 6 eeGG GS OS A eeGG| GS |<br>Ss es ee<br>a Yrs fT Try eee eee eee ee eee eee<br>ee | Rtjl(t) = Rtjl * r(t) a |e ee | | | |<br>1.0%<br>0.001<br>0.00001 0.0001 0.001 0.01 0.1 1.0 10 100 1,000<br>T, TIME (s)<br>, TRANSIENT THERMAL RESISTANCE (NORMALIZED)<br>(T)<br>R<br>, TRANSIENT THERMAL RESISTANCE (NORMALIZED)<br>(T)<br>R<br>**----- End of picture text -----**<br>


**Figure 10. Thermal Response Junction to Ambient** 

POWERMITE is a registered trademarks of and used under a license from Microsemi Corporation. 

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MECHANICAL CASE OUTLINE **PACKAGE DIMENSIONS** 

## **POWERMITE 1.90x1.96x1.00** 

CASE 457 ISSUE H 

DATE 16 MAY 2025 

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GENERIC<br>MARKING DIAGRAMS*<br>M M<br>1 2 1 2<br>XXX XXX<br>STYLE 1:<br>i= =<br>PIN 1.<br>STYLE 1 STYLE 2 2.<br>M<br>1 2<br>XXX<br>XXX = Specific Device Code<br>M = Date Code<br>STYLE 3 = Pb−Free Package<br>DOCUMENT NUMBER: 98ASB14853C<br>DESCRIPTION: POWERMITE 1.90x1.96x1.00<br>**----- End of picture text -----**<br>


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STYLE 1: STYLE 2: STYLE 3:<br>FLASH, PROTRUSIONS OR GATE BURRS.<br>PIN 1. CATHODE PIN 1. ANODE OR CATHODE PIN 1. ANODE<br>2. ANODE 2. CATHODE OR ANODE 2. CATHODE<br>(BI−DIRECTIONAL)<br>**----- End of picture text -----**<br>


*This information is generic. Please refer to device data sheet for actual part marking. Pb−Free indicator, “G” or microdot “ ”, may or may not be present. Some products may not follow the Generic Marking. Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed  versions are uncontrolled  except when stamped  “CONTROLLED COPY” in red. 

**PAGE 1 OF 1** 

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