# Programmable Timer, 3 MHz, 3 V to 18 V, TSSOP-14, -55 °C to 125 °C

![Product image](https://novapart.co/image/farnell:3610847/)

**URL**: https://novapart.co/products/NLV14541BDTR2G/programmable-timer-3-mhz-v-to-18-tssop-14-55-c-125
**SKU**: NLV14541BDTR2G
**Manufacturer**: ONSEMI
**Category**: Semiconductors - ICs || Clock,Timing & Frequency Management || Timers, Oscillators & Pulse Generators
**Price**: €0.3110
**Stock**: 10+

## Specifications

| Parameter | Value |
|---|---|
| Frequency | 3MHz |
| No. Of Pins | 14Pins |
| Digital Ic Case | TSSOP |
| Supply Voltage Max | 18V |
| Supply Voltage Min | 3V |
| Operating Temperature Max | 125°C |
| Operating Temperature Min | -55°C |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:3610847/)

**DATA SHEET www.onsemi.com** 

## Programmable Timer 

## MC14541B 

The MC14541B programmable timer consists of a 16-stage binary counter, an integrated oscillator for use with an external capacitor and two resistors, an automatic power-on reset circuit, and output control logic. 

Timing is initialized by turning on power, whereupon the power-on reset is enabled and initializes the counter, within the specified VDD range. With the power already on, an external reset pulse can be applied. Upon release of the initial reset command, the oscillator will oscillate with a frequency determined by the external RC network. The 16-stage counter divides the oscillator frequency (fosc) with the n[th] stage frequency being fosc/2[n] . 

## **Features** 

- Available Outputs 2[8] , 2[10] , 2[13] or 2[16] 

- Increments on Positive Edge Clock Transitions 

- Built-in Low Power RC Oscillator (±2% accuracy over temperature range and ±20% supply and ±3% over processing at < 10 kHz) 

- Oscillator May Be Bypassed if External Clock Is Available (Apply external clock to Pin 3) 

- External Master Reset Totally Independent of Automatic Reset Operation 

- Operates as 2[n] Frequency Divider or Single Transition Timer 

- Q/Q Select Provides Output Logic Level Flexibility 

- Reset (auto or master) Disables Oscillator During Resetting to Provide No Active Power Dissipation 

- Clock Conditioning Circuit Permits Operation with Very Slow Clock Rise and Fall Times 

- Automatic Reset Initializes All Counters On Power Up 

- Supply Voltage Range = 3.0 Vdc to 18 Vdc with Auto Reset 

Supply Voltage Range = Disabled (Pin 5 = VDD) Supply Voltage Range = 8.5 Vdc to 18 Vdc with Auto Reset Supply Voltage Range = Enabled (Pin 5 = VSS) 

- NLV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC-Q100 Qualified and PPAP Capable 

- These Devices are Pb-Free and are RoHS Compliant 

**SOIC-14 SOEIAJ-14 TSSOP-14 D SUFFIX F SUFFIX DT SUFFIX CASE 751A CASE 965 CASE 948G** 

## **PIN ASSIGNMENT** 

**==> picture [114 x 111] intentionally omitted <==**

**----- Start of picture text -----**<br>
Rtc 1 14 VDD<br>Ctc 2 13 B<br>RS 3 12 A<br>NC 4 11 NC<br>AR 5 10 MODE<br>MR 6 9 Q/Q SEL<br>VSS 7 8 Q<br>**----- End of picture text -----**<br>


NC = NO CONNECTION 

## **MARKING DIAGRAMS** 

**==> picture [168 x 212] intentionally omitted <==**

**----- Start of picture text -----**<br>
14<br>14<br>14541BG MC14541B<br>AWLYWW ALYWG<br>1<br>1<br>SOIC-14 SOEIAJ-14<br>14<br>14<br>541B<br>ALYW �<br>�<br>1<br>TSSOP-14<br>A = Assembly Location<br>WL, L = Wafer Lot<br>YY, Y = Year<br>WW, W = Work Week<br>G or  � = Pb-Free Package<br>**----- End of picture text -----**<br>


(Note: Microdot may be in either location) 

## **ORDERING INFORMATION** 

See detailed ordering and shipping information in the package dimensions section on page 2 of this data sheet. 

NOTE: Some of the devices on this data sheet have been **DISCONTINUED** . Please refer to the table on page 2. 

Publication Order Number: 

**1** 

© Semiconductor Components Industries, LLC, 2014 **October, 2025 − Rev. 16** 

**MC14541B/D** 

**MC14541B** 

**MAXIMUM RATINGS** (Voltages Referenced to VSS) 

|**MAXIMUM R**|**TINGS**(Voltages Referenced to VSS)|||
|---|---|---|---|
|**Symbol**|**Parameter**|**Value**|**Unit**|
|VDD|DC Supply Voltage Range|−0.5 to +18.0|V|
|Vin, Vout|Input or Output Voltage Range, (DC or Transient)|−0.5 to VDD+ 0.5|V|
|Iin|Input Current (DC or Transient)|±10 (per Pin)|mA|
|Iout|Output Current (DC or Transient)|±45 (per Pin)|mA|
|PD|Power Dissipation, per Package (Note 1)|500|mW|
|TA|Ambient Temperature Range|−55 to +125|°C|
|Tstg|Storage Temperature Range|−65 to +150|°C|
|TL|Lead Temperature, (8-Second Soldering)|260|°C|



Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. Operating the device outside its recommended conditions, but still within its maximum rated limits may not cause immediate damage. However, doing so can lead to reduced performance, unpredictable behavior, and potentially shorten the device’s lifespan or reliability. 

1. Temperature Derating: “D/DW” Packages: –7.0 mW/ ° C From 65 ° C To 125 ° C 

## **ORDERING INFORMATION** 

|**Device**|**Package**|**Shipping**†|
|---|---|---|
|MC14541BDG|SOIC-14<br>(Pb-Free)|55 Units / Rail|
|MC14541BDR2G|SOIC-14<br>(Pb-Free)|2500 / Tape & Reel|
|NLV14541BDR2G*|SOIC-14<br>(Pb-Free)|2500 / Tape & Reel|
|MC14541BDTR2G|TSSOP-14<br>(Pb-Free)|2500 / Tape & Reel|
|NLV14541BDTR2G*|TSSOP-14<br>(Pb-Free)|2500 / Tape & Reel|



## **DISCONTINUED** (Note 2) 

|NLV14541BDG*|SOIC-14<br>(Pb-Free)|55 Units / Rail|
|---|---|---|
|MC14541BFELG|SOEIAJ-14<br>(Pb-Free)|2000 / Tape & Reel|



† For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. 

* NLV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC-Q100 Qualified and PPAP Capable. 

2. **DISCONTINUED:** These devices are not recommended for new design. Please contact your **onsemi** representative for information. The most current information on these devices may be available on www.onsemi.com. 

**www.onsemi.com** 

**2** 

**MC14541B** 

## **ELECTRICAL CHARACTERISTICS** (Voltages Referenced to VSS) 

|**Characteristic**|**Symbol**|**VDD**<br>**Vdc**|**−55**�**C**|**−55**�**C**|**25**�**C**|**25**�**C**|**25**�**C**|**125** �**C**|**125** �**C**|**Unit**|
|---|---|---|---|---|---|---|---|---|---|---|
||||**Min**|**Max**|**Min**|**Typ**<br>(Note 3)|**Max**|**Min**|**Max**||
|Output Voltage<br>“0” Level<br>Vin=  VDDor 0<br>“1” Level<br>Vin= 0 or VDD|VOL|5.0<br>10<br>15|−<br>−<br>−|0.05<br>0.05<br>0.05|−<br>−<br>−|0<br>0<br>0|0.05<br>0.05<br>0.05|−<br>−<br>−|0.05<br>0.05<br>0.05|Vdc|
||VOH|5.0<br>10<br>15|4.95<br>9.95<br>14.95|−<br>−<br>−|4.95<br>9.95<br>14.95|5.0<br>10<br>15|−<br>−<br>−|4.95<br>9.95<br>14.95|−<br>−<br>−|Vdc|
|Input Voltage<br>“0” Level<br>(VO= 4.5 or 0.5 Vdc)<br>(VO= 9.0 or 1.0 Vdc)<br>(VO= 13.5 or 1.5 Vdc)<br>“1” Level<br>(VO= 0.5 or 4.5 Vdc)<br>(VO= 1.0 or 9.0 Vdc)<br>(VO= 1.5 or 13.5 Vdc)|VIL|5.0<br>10<br>15|−<br>−<br>−|1.5<br>3.0<br>4.0|−<br>−<br>−|2.25<br>4.50<br>6.75|1.5<br>3.0<br>4.0|−<br>−<br>−|1.5<br>3.0<br>4.0|Vdc|
||VIH|5.0<br>10<br>15|3.5<br>7.0<br>11|−<br>−<br>−|3.5<br>7.0<br>11|2.75<br>5.50<br>8.25|−<br>−<br>−|3.5<br>7.0<br>11|−<br>−<br>−|Vdc|
|Output Drive Current<br>(VOH= 2.5 Vdc)<br>Source<br>(VOH= 9.5 Vdc)<br>(VOH= 13.5 Vdc)<br>(VOL= 0.4 Vdc)<br>Sink<br>(VOL= 0.5 Vdc)<br>(VOL= 1.5 Vdc)|IOH|5.0<br>10<br>15|–4.19<br>–7.96<br>–16.3|−<br>−<br>−|–3.38<br>–6.42<br>–13.2|–6.75<br>–12.83<br>–26.33|−<br>−<br>−|–2.37<br>–4.49<br>−9.24|−<br>−<br>−|mAdc|
||IOL|5.0<br>10<br>15|1.93<br>4.96<br>19.3|−<br>−<br>−|1.56<br>4.0<br>15.6|3.12<br>8.0<br>31.2|−<br>−<br>−|1.09<br>2.8<br>10.9|−<br>−<br>−|mAdc|
|Input Current|Iin|15|−|±0.1|−|±0.00001|±0.1|−|±1.0|�Adc|
|Input Capacitance<br>(Vin= 0)|Cin|−|−|−|−|5.0|7.5|−|−|pF|
|Quiescent Current<br>(Pin 5 is High)<br>Auto Reset Disabled|IDD|5.0<br>10<br>15|−<br>−<br>−|5.0<br>10<br>20|−<br>−<br>−|0.005<br>0.010<br>0.015|5.0<br>10<br>20|−<br>−<br>−|150<br>300<br>600|�Adc|
|Auto Reset Quiescent Current<br>(Pin 5 is low)|IDDR|10<br>15|−<br>−|250<br>500|−<br>−|30<br>82|250<br>500|−<br>−|1500<br>2000|�Adc|
|Supply Current (Notes 4 & 5)<br>(Dynamic plus Quiescent)|ID|5.0<br>10<br>15|ID= (0.4�A/kHz) f + IDD<br>ID= (0.8�A/kHz) f + IDD<br>ID= (1.2�A/kHz) f + IDD|||||||�Adc|



Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. 

3. Data labelled “Typ” is not to be used for design purposes but is intended as an indication of the IC’s potential performance. 4. The formulas given are for the typical characteristics only at 25 ° C. 

5. When using the on chip oscillator the total supply current (in � Adc) becomes: IT = ID + 2 Ctc VDD f x 10[–3] where ID is in � A, Ctc is in pF, VDD in Volts DC, and f in kHz. (see Fig. 3) Dissipation during power-on with automatic reset enabled is typically 50 � A @ VDD = 10 Vdc. 

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**3** 

## **MC14541B** 

**SWITCHING CHARACTERISTICS** (Note 6) (CL = 50 pF, TA = 25 ° C) 

|**Characteristic**|**Symbol**|**VDD**|**Min**|**Typ**<br>(Note 7)|**Max**|**Unit**|
|---|---|---|---|---|---|---|
|Output Rise and Fall Time<br>tTLH, tTHL= (1.5 ns/pF) CL+ 25 ns<br>tTLH, tTHL= (0.75 ns/pF) CL+ 12.5 ns<br>tTLH, tTHL= (0.55 ns/pF) CL+ 9.5 ns|tTLH,<br>tTHL|5.0<br>10<br>15|−<br>−<br>−|100<br>50<br>40|200<br>100<br>80|ns|
|Propagation Delay, Clock to Q (28Output)<br>tPLH, tPHL= (1.7 ns/pF) CL+ 3415 ns<br>tPLH, tPHL= (0.66 ns/pF) CL+ 1217 ns<br>tPLH, tPHL= (0.5 ns/pF) CL+ 875 ns|tPLH<br>tPHL|5.0<br>10<br>15|−<br>−<br>−|3.5<br>1.25<br>0.9|10.5<br>3.8<br>2.9|�s|
|Propagation Delay, Clock to Q (216Output)<br>tPHL, tPLH= (1.7 ns/pF) CL+ 5915 ns<br>tPHL, tPLH= (0.66 ns/pF) CL+ 3467 ns<br>tPHL, tPLH= (0.5 ns/pF) CL+ 2475 ns|tPHL<br>tPLH|5.0<br>10<br>15|−<br>−<br>−|6.0<br>3.5<br>2.5|18<br>10<br>7.5|�s|
|Clock Pulse Width|tWH(cl)|5.0<br>10<br>15|900<br>300<br>225|300<br>100<br>85|−<br>−<br>−|ns|
|Clock Pulse Frequency (50% Duty Cycle)|fcl|5.0<br>10<br>15|−<br>−<br>−|1.5<br>4.0<br>6.0|0.75<br>2.0<br>3.0|MHz|
|MR Pulse Width|tWH(R)|5.0<br>10<br>15|900<br>300<br>225|300<br>100<br>85|−<br>−<br>−|ns|
|Master Reset Removal Time|trem|5.0<br>10<br>15|420<br>200<br>200|210<br>100<br>100|−<br>−<br>−|ns|



6. The formulas given are for the typical characteristics only at 25 ° C. 

7. Data labelled “Typ” is not to be used for design purposes but is intended as an indication of the IC’s potential performance. 

**==> picture [453 x 275] intentionally omitted <==**

**----- Start of picture text -----**<br>
VDD VDD<br>PULSE PULSE<br>GENERATOR RS GENERATOR RS<br>AR AR<br>Q/Q SELECT Q/Q SELECT<br>MODE Q MODE Q<br>A CL A CL<br>B B<br>MR MR<br>VSS VSS<br>20 ns 20 ns<br>(Rtc AND Ctc OUTPUTS ARE LEFT OPEN)<br>90%<br>50% 50%<br>20 ns 20 ns RS 10%<br>90% tPLH tPHL<br>50%<br>10% 50% 90% 50%<br>50% Q 10%<br>DUTY CYCLE tTLH tTHL<br>Figure 1. Power Dissipation Test Circuit Figure 2. Switching Time Test Circuit<br>and Waveform and Waveforms<br>**----- End of picture text -----**<br>


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**4** 

**MC14541B** 

## **EXPANDED BLOCK DIAGRAM** 

**==> picture [450 x 261] intentionally omitted <==**

**----- Start of picture text -----**<br>
A�12<br>B�13<br>1 OF 4<br>MUX<br>8�Q<br>Rtc�1 8‐STAGE 2 [10] 2 [13] 2 [16]<br>Ctc�2 OSC C COUNTER 2 [8] C 8‐STAGE<br>COUNTER<br>RS�3 RESET RESET RESET<br>AUTO RESET<br>POWER‐ON<br>5<br>RESET<br>6 10 9<br>MASTER RESET MODE Q/Q<br>SELECT<br>VDD = PIN 14<br>VSS = PIN 7<br>**----- End of picture text -----**<br>


## **FREQUENCY SELECTION TABLE** 

|**A**|**B**|**Number of**<br>**Counter Stages**<br>**n**|**Count**<br>**2n**|
|---|---|---|---|
|0|0|13|8192|
|0|1|10|1024|
|1|0|8|256|
|1|1|16|65536|



## **TRUTH TABLE** 

|**Pin**|**State**|**State**|
|---|---|---|
||**0**|**1**|
|Auto Reset,<br>5|Auto Reset<br>Operating|Auto Reset Disabled|
|Master Reset, 6|Timer Operational|Master Reset On|
|Q/Q<br>,<br>9|Output Initially Low<br>After Reset|Output Initially High<br>After Reset|
|Mode,<br>10|Single Cycle Mode|Recycle Mode|



**==> picture [262 x 136] intentionally omitted <==**

**----- Start of picture text -----**<br>
3<br>TO CLOCK<br>CIRCUIT<br>INTERNAL<br>RESET<br>2 1<br>Ctc<br>RS RTC<br>**----- End of picture text -----**<br>


**Figure 3. Oscillator Circuit Using RC Configuration** 

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**5** 

**MC14541B** 

## **TYPICAL RC OSCILLATOR CHARACTERISTICS** 

**==> picture [490 x 193] intentionally omitted <==**

**----- Start of picture text -----**<br>
8.0 100<br>VDD = 15 V 50 V DD  = 10 V<br>4.0<br>f AS A FUNCTION<br>20<br>OF RTC<br>0 10 (C = 1000 pF)<br>10 V 5.0 (RS ≈ 2RTC)<br>-�4.0 f AS A FUNCTION<br>2.0 OF C<br>-�8.0 1.0 (RTC = 56 k�)<br>5.0 V (RS = 120 k�)<br>0.5<br>-�12<br>RTC = 56 k�, RS = 0, f = 10.15 kHz @ VDD = 10 V, TA = 25 °C 0.2<br>-�16 C = 1000 pF RS = 120 k�, f = 7.8 kHz @ VDD = 10 V, TA = 25 °C 0.1<br>-�55 -�25 0 25 50 75 100 125 1.0 k 10 k 100 k 1.0 m<br>TA, AMBIENT TEMPERATURE (°C) RTC, RESISTANCE (OHMS)<br>0.0001 0.001 0.01 0.1<br>Figure 4. RC Oscillator Stability<br>C, CAPACITANCE (�F)<br>FREQUENCY DEVIATION (%)<br>f, OSCILLATOR FREQUENCY (kHz)<br>**----- End of picture text -----**<br>


**Figure 5. RC Oscillator Frequency as a Function of Rtc and Ctc** 

## **OPERATING CHARACTERISTICS** 

With Auto Reset pin set to a “0” the counter circuit is initialized by turning on power. Or with power already on, the counter circuit is reset when the Master Reset pin is set to a “1”. Both types of reset will result in synchronously resetting all counter stages independent of counter state. Auto Reset pin when set to a “1” provides a low power operation. 

The RC oscillator as shown in Figure 3 will oscillate with a frequency determined by the external RC network i.e., 

**==> picture [195 x 37] intentionally omitted <==**

The time select inputs (A and B) provide a two-bit address to output any one of four counter stages (2[8] , 2[10] , 2[13] and 2[16] ). The 2[n] counts as shown in the Frequency Selection Table represents the Q output of the N[th] stage of the counter. When A is “1”, 2[16] is selected for both states of B. However, 

when B is “0”, normal counting is interrupted and the 9th counter stage receives its clock directly from the oscillator (i.e., effectively outputting 2[8] ). 

The Q/Q select output control pin provides for a choice of output level. When the counter is in a reset condition and Q/Q select pin is set to a “0” the Q output is a “0”, correspondingly when Q/Q select pin is set to a “1” the Q output is a “1”. 

When the mode control pin is set to a “1”, the selected count is continually transmitted to the output. But, with mode pin “0” and after a reset condition the RS flip-flop (see Expanded Block Diagram) resets, counting commences, and after 2[n−1] counts the RS flip-flop sets which causes the output to change state. Hence, after another 2[n−1] counts the output will not change. Thus, a Master Reset pulse must be applied or a change in the mode pin level is required to reset the single cycle operation. 

## **DIGITAL TIMER APPLICATION** 

**==> picture [235 x 151] intentionally omitted <==**

**----- Start of picture text -----**<br>
Rtc<br>1 14 VDD<br>Ctc 2 13 B<br>3 12 A<br>RS<br>NC 4 11 N.C.<br>AR MODE<br>5 10<br>MR Q/Q<br>6 9 VDD<br>INPUT<br>7 8<br>OUTPUT<br>tMR<br>t + tMR<br>**----- End of picture text -----**<br>


When Master Reset (MR) receives a positive pulse, the internal counters and latch are reset. The Q output goes high and remains high until the selected (via A and B) number of clock pulses are counted, the Q output then goes low and remains low until another input pulse is received. 

This “one shot” is fully retriggerable and as accurate as the input frequency. An external clock can be used (pin 3 is the clock input, pins 1 and 2 are outputs) if additional accuracy is needed. 

Notice that a setup time equal to the desired pulse width output is required immediately following initial power up, during which time Q output will be high. 

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**6** 

**MC14541B** 

## **REVISION HISTORY** 

|**Revision**|**Description of Changes**|**Date**|
|---|---|---|
|16|Rebranded the Data Sheet to**onsemi**format.<br>NLV14541BDG, MC14541BFELG OPNs marked as Discontinued.|10/6/2025|



This document has undergone updates prior to the inclusion of this revision history table. The changes tracked here only reflect updates made on the noted approval dates. 

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**7** 

MECHANICAL CASE OUTLINE **PACKAGE DIMENSIONS** 

**SOEIAJ−14** CASE 965−01 ISSUE B 

## DATE 29 FEB 2008 

**SCALE 1:1** 

NOTES: 

1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 

2. CONTROLLING DIMENSION: MILLIMETER. 

**==> picture [281 x 183] intentionally omitted <==**

**----- Start of picture text -----**<br>
14 8 LE<br>Q1<br>E HE M �<br>1 7 L<br>DETAIL P<br>Z<br>D<br>VIEW P<br>e A<br>c<br>b A1<br>0.13 (0.005) [M] 0.10 (0.004)<br>**----- End of picture text -----**<br>


3. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS AND ARE MEASURED AT THE PARTING LINE. MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 

4. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 

5. THE LEAD WIDTH DIMENSION (b) DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE LEAD WIDTH DIMENSION AT MAXIMUM MATERIAL CONDITION. DAMBAR CANNOT BE LOCATED ON THE  LOWER RADIUS OR THE FOOT. MINIMUM SPACE BETWEEN PROTRUSIONS AND ADJACENT LEAD TO BE 0.46 ( 0.018). 

||**MILLIMETERS**|**MILLIMETERS**|**INCHES**|**INCHES**|
|---|---|---|---|---|
|**DIM**<br><br>**A**|**MIN**<br>---|**MAX**<br>2.05|**MIN**<br>---|**MAX**<br>0.081|
|**A1**|0.05|0.20|0.002|0.008|
|**b**|0.35|0.50|0.014|0.020|
|**c**|010|020|0004|0008|
|**D**|.<br>9.90|.<br>10.50|.<br>0.390|.<br>0.413|
|**E**|5.10|5.45|0.201|0.215|
|**e**|1.27 BSC<br><br>||0.050 BSC<br><br>||
|**HE**<br>**L**|7.40<br>0.50|8.20<br>0.85|0.291<br>0.020|0.323<br>0.033|
|**LE**|1.10|1.50|0.043|0.059|
|**M**|0<br>�|10�|0�|10�|
|**Q1**|0.70|0.90|0.028|0.035|
|**Z**|---|1.42|---|0.056|



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**----- Start of picture text -----**<br>
Electronic versions are uncontrolled except when accessed directly from the Document Repository.<br>DOCUMENT NUMBER: 98ASH70108A Printed  versions are uncontrolled  except when stamped  “CONTROLLED COPY” in red.<br>DESCRIPTION: 14 LD SOEIAJ PAGE 1 OF 1<br>**----- End of picture text -----**<br>


**onsemi** and                     are trademarks of Semiconductor Components Industries, LLC dba **onsemi** or its subsidiaries in the United States and/or other countries. **onsemi** reserves the right to make changes without further notice to any products herein. **onsemi** makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does **onsemi** assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. **onsemi** does not convey any license under its patent rights nor the rights of others. 

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© Semiconductor Components Industries, LLC, 2008 

MECHANICAL CASE OUTLINE **PACKAGE DIMENSIONS** 

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14<br>1<br>SCALE 1:1<br>**----- End of picture text -----**<br>


**SOIC−14 NB** CASE 751A−03 ISSUE L 

DATE 03 FEB 2016 

**==> picture [465 x 191] intentionally omitted <==**

**----- Start of picture text -----**<br>
D A NOTES:<br>B 1. DIMENSIONING AND TOLERANCING PER<br>ASME Y14.5M, 1994.<br>2. CONTROLLING DIMENSION: MILLIMETERS.<br>14 8 3. DIMENSION b DOES NOT INCLUDE DAMBAR<br>A3 PROTRUSION. ALLOWABLE PROTRUSION<br>SHALL BE 0.13 TOTAL IN EXCESS OF AT<br>MAXIMUM MATERIAL CONDITION.<br>H E 4. DIMENSIONS D AND E DO NOT INCLUDE<br>MOLD PROTRUSIONS.<br>L 5. MAXIMUM MOLD PROTRUSION 0.15 PER<br>SIDE.<br>1 7 DETAIL A<br>MILLIMETERS INCHES<br>0.25 M B [M] 13X b DIM MIN MAX MIN MAX<br>A 1.35 1.75 0.054 0.068<br>0.25 M C A S B [S] A1 0.10 0.25 0.004 0.010<br>A3 0.19 0.25 0.008 0.010<br>DETAIL A b 0.35 0.49 0.014 0.019<br>A X 45h � DE 3.808.55 4.008.75 0.1500.337 0.1570.344<br>e 1.27 BSC 0.050 BSC<br>H 5.80 6.20 0.228 0.244<br>h 0.25 0.50 0.010 0.019<br>0.10 e A1 C PLANESEATING M ML 0.400   � 1.257   � 0.0160   � 0.0497   �<br>**----- End of picture text -----**<br>


## **SOLDERING FOOTPRINT*** 

**==> picture [221 x 196] intentionally omitted <==**

**----- Start of picture text -----**<br>
6.50 14X<br>1.18<br>1<br>1.27<br>PITCH<br>14X<br>0.58<br>DIMENSIONS: MILLIMETERS<br>**----- End of picture text -----**<br>


**==> picture [116 x 145] intentionally omitted <==**

**----- Start of picture text -----**<br>
GENERIC<br>MARKING DIAGRAM*<br>14<br>XXXXXXXXXG<br>AWLYWW<br>1<br>XXXXX = Specific Device Code<br>A = Assembly Location<br>WL = Wafer Lot<br>Y = Year<br>WW = Work Week<br>G = Pb−Free Package<br>**----- End of picture text -----**<br>


   - *This information is generic. Please refer to device data sheet for actual part marking. Pb−Free indicator, “G” or microdot “ � ”, may or may not be present. Some products may not follow the Generic Marking. 

- *For additional information on our Pb−Free strategy and soldering details, please download the **onsemi** Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. 

## **STYLES ON PAGE 2** 

**==> picture [492 x 37] intentionally omitted <==**

**----- Start of picture text -----**<br>
Electronic versions are uncontrolled except when accessed directly from the Document Repository.<br>DOCUMENT NUMBER: 98ASB42565B Printed  versions are uncontrolled  except when stamped  “CONTROLLED COPY” in red.<br>DESCRIPTION: SOIC−14 NB PAGE 1 OF 2<br>**----- End of picture text -----**<br>


**onsemi** and                     are trademarks of Semiconductor Components Industries, LLC dba **onsemi** or its subsidiaries in the United States and/or other countries. **onsemi** reserves the right to make changes without further notice to any products herein. **onsemi** makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does **onsemi** assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. **onsemi** does not convey any license under its patent rights nor the rights of others. 

www.onsemi.com 

© Semiconductor Components Industries, LLC, 2019 

## **SOIC−14** CASE 751A−03 ISSUE L 

## DATE 03 FEB 2016 

- STYLE 1: STYLE 2: PIN 1. COMMON CATHODE CANCELLED 2. ANODE/CATHODE 3. ANODE/CATHODE 4. NO CONNECTION 5. ANODE/CATHODE 

   6. NO CONNECTION 

   7. ANODE/CATHODE 

   8. ANODE/CATHODE 9. ANODE/CATHODE 

   10. NO CONNECTION 

   11. ANODE/CATHODE 12. ANODE/CATHODE 13. NO CONNECTION 14. COMMON ANODE 

## STYLE 3: 

- PIN 1. NO CONNECTION 2. ANODE 3. ANODE 4. NO CONNECTION 5. ANODE 

6. NO CONNECTION 

7. ANODE 8. ANODE 9. ANODE 

10. NO CONNECTION 

11. ANODE 12. ANODE 13. NO CONNECTION 14. COMMON CATHODE 

- STYLE 4: PIN 1. NO CONNECTION 2. CATHODE 3. CATHODE 4. NO CONNECTION 5. CATHODE 6. NO CONNECTION 7. CATHODE 

   8. CATHODE 

   9. CATHODE 

   10. NO CONNECTION 11. CATHODE 12. CATHODE 13. NO CONNECTION 14. COMMON ANODE 

|STYLE 5:|STYLE 6:|
|---|---|
|PIN 1. COMMON CATHODE|PIN 1. CATHODE|
|2. ANODE/CATHODE|2. CATHODE|
|3. ANODE/CATHODE|3. CATHODE|
|4. ANODE/CATHODE|4. CATHODE|
|5. ANODE/CATHODE|5. CATHODE|
|6. NO CONNECTION|6. CATHODE|
|7. COMMON ANODE|7. CATHODE|
|8. COMMON CATHODE|8. ANODE|
|9. ANODE/CATHODE|9. ANODE|
|10. ANODE/CATHODE|10. ANODE|
|11. ANODE/CATHODE|11. ANODE|
|12. ANODE/CATHODE|12. ANODE|
|13. NO CONNECTION|13. ANODE|
|14. COMMON ANODE|14. ANODE|



STYLE 7: 

- PIN 1. ANODE/CATHODE 2. COMMON ANODE 3. COMMON CATHODE 4. ANODE/CATHODE 5. ANODE/CATHODE 6. ANODE/CATHODE 7. ANODE/CATHODE 8. ANODE/CATHODE 9. ANODE/CATHODE 

- 10. ANODE/CATHODE 11. COMMON CATHODE 12. COMMON ANODE 13. ANODE/CATHODE 14. ANODE/CATHODE 

- STYLE 8: PIN 1. COMMON CATHODE 2. ANODE/CATHODE 3. ANODE/CATHODE 4. NO CONNECTION 5. ANODE/CATHODE 6. ANODE/CATHODE 7. COMMON ANODE 8. COMMON ANODE 9. ANODE/CATHODE 

- 10. ANODE/CATHODE 11. NO CONNECTION 12. ANODE/CATHODE 13. ANODE/CATHODE 14. COMMON CATHODE 

Electronic versions are uncontrolled except when accessed directly from the Document Repository. **DOCUMENT NUMBER: 98ASB42565B** Printed  versions are uncontrolled  except when stamped  “CONTROLLED COPY” in red. **DESCRIPTION: SOIC−14 NB PAGE 2 OF 2** 

**onsemi** and                     are trademarks of Semiconductor Components Industries, LLC dba **onsemi** or its subsidiaries in the United States and/or other countries. **onsemi** reserves the right to make changes without further notice to any products herein. **onsemi** makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does **onsemi** assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. **onsemi** does not convey any license under its patent rights nor the rights of others. 

**www.onsemi.com** 

~~**2**~~ 

www.onsemi.com 

© Semiconductor Components Industries, LLC, 2019 

MECHANICAL CASE OUTLINE **PACKAGE DIMENSIONS** 

**TSSOP−14 WB** CASE 948G ISSUE C 

**==> picture [485 x 512] intentionally omitted <==**

**----- Start of picture text -----**<br>
14 ISSUE C<br>DATE 17 FEB 2016<br>1<br>SCALE 2:1 14X      REFK NOTES:<br>1. DIMENSIONING AND TOLERANCING PER<br>0.10 (0.004) M T U S V S ANSI Y14.5M, 1982.<br>2. CONTROLLING DIMENSION: MILLIMETER.<br>0.15 (0.006) T U S 3. DIMENSION A DOES NOT INCLUDE MOLD<br>FLASH,  PROTRUSIONS OR GATE BURRS.<br>N MOLD FLASH OR GATE BURRS SHALL NOT<br>14 8 0.25 (0.010) 4. EXCEED 0.15 (0.006) PER SIDE.DIMENSION B DOES NOT INCLUDE<br>2X L/2 INTERLEAD FLASH OR PROTRUSION.<br>M INTERLEAD FLASH OR PROTRUSION SHALL<br>NOT EXCEED 0.25 (0.010) PER SIDE.<br>L B 5. DIMENSION K DOES NOT INCLUDE DAMBAR<br>−U− N PROTRUSION. ALLOWABLE DAMBAR<br>PIN 1 PROTRUSION SHALL BE 0.08 (0.003) TOTAL<br>IDENT. F IN EXCESS OF THE K DIMENSION AT<br>MAXIMUM MATERIAL CONDITION.<br>1 7 DETAIL E 6. TERMINAL NUMBERS ARE SHOWN FOR<br>REFERENCE ONLY.<br>7. DIMENSION A AND B ARE TO BE<br>DETERMINED AT DATUM PLANE −W−.<br>0.15 (0.006) T U S A K MILLIMETERS INCHES<br>−V− K1 DIM MIN MAX MIN MAX<br>A 4.90 5.10 0.193 0.200<br>B 4.30 4.50 0.169 0.177<br>J J1 ÇÇÇÉÉÉ C −−− 1.20 −−− 0.047<br>D 0.05 0.15 0.002 0.006<br>ÇÇÇÉÉÉ F 0.50 0.75 0.020 0.030<br>SECTION N−N G 0.65 BSC 0.026 BSC<br>H 0.50 0.60 0.020 0.024<br>J 0.09 0.20 0.004 0.008<br>−W− J1 0.09 0.16 0.004 0.006<br>C K 0.19 0.30 0.007 0.012<br>K1 0.19 0.25 0.007 0.010<br>0.10 (0.004) ML 0   6.40 BSC � 8    � 0.252 BSC0    � 8    �<br>−T− SEATINGPLANE D G H DETAIL E<br>GENERIC<br>MARKING DIAGRAM*<br>RECOMMENDED<br>SOLDERING FOOTPRINT* 14<br>XXXX<br>7.06 XXXX<br>ALYW �<br>1 �<br>1<br>A = Assembly Location<br>L = Wafer Lot<br>Y = Year<br>0.65 W = Work Week<br>PITCH � = Pb−Free Package<br>(Note: Microdot may be in either location)<br>*This information is generic. Please refer to<br>0.3614X 1.2614X DIMENSIONS: MILLIMETERS device data sheet for actual part marking.Pb−Free indicator, “G” or microdot “or may not be present. Some products may � ”, may<br>*For additional information on our Pb−Free strategy and soldering not follow the Generic Marking.<br>**----- End of picture text -----**<br>


DATE 17 FEB 2016 

- *For additional information on our Pb−Free strategy and soldering details, please download the **onsemi** Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. 

## **DOCUMENT NUMBER: 98ASH70246A DESCRIPTION: TSSOP−14 WB** 

Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed  versions are uncontrolled  except when stamped  “CONTROLLED COPY” in red. 

**PAGE 1 OF 1** 

**onsemi** and                     are trademarks of Semiconductor Components Industries, LLC dba **onsemi** or its subsidiaries in the United States and/or other countries. **onsemi** reserves the right to make changes without further notice to any products herein. **onsemi** makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does **onsemi** assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. **onsemi** does not convey any license under its patent rights nor the rights of others. 

www.onsemi.com 

© Semiconductor Components Industries, LLC, 2019 

**onsemi** , , and other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “ **onsemi** ” or its affiliates and/or subsidiaries in the United States and/or other countries. **onsemi** owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of **onsemi** ’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. **onsemi** reserves the right to make changes at any time to any products or information herein, without notice. The information herein is provided “as−is” and **onsemi** makes no warranty, representation or guarantee regarding the accuracy of the information, product features, availability, functionality, or suitability of its products for any particular purpose, nor does **onsemi** assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using **onsemi** products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by **onsemi** . “Typical” parameters which may be provided in **onsemi** data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. **onsemi** does not convey any license under any of its intellectual property rights nor the rights of others. **onsemi** products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use **onsemi** products for any such unintended or unauthorized application, Buyer shall indemnify and hold **onsemi** and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that **onsemi** was negligent regarding the design or manufacture of the part. **onsemi** is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. 

## **ADDITIONAL INFORMATION** 

**TECHNICAL PUBLICATIONS** : **ONLINE SUPPORT** : www.onsemi.com/support **Technical Library:** www.onsemi.com/design/resources/technical−documentation **For additional information, please contact your local Sales Representative at onsemi Website:** www.onsemi.com www.onsemi.com/support/sales 

**==> picture [232 x 43] intentionally omitted <==**

 



## Links

- [View this product on Novapart](https://novapart.co/products/NLV14541BDTR2G/programmable-timer-3-mhz-v-to-18-tssop-14-55-c-125)
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---

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