# Bipolar (BJT) Single Transistor, NPN, 100 V, 8 A, 20 W, TO-252 (DPAK), Surface Mount

![Product image](https://novapart.co/image/farnell:2630301/)

**URL**: https://novapart.co/products/NJVMJD122T4G-VF01/bipolar-bjt-single-transistor-npn-100-v-8-a-20-w
**SKU**: NJVMJD122T4G-VF01
**Manufacturer**: ONSEMI
**Category**: Semiconductors - Discretes || Transistors || Bipolar Transistors || Single Bipolar Junction Transistors - BJT
**Price**: €0.2160
**Stock**: 10+

## Specifications

| Parameter | Value |
|---|---|
| No. Of Pins | 3Pins |
| Qualification | AEC-Q101 |
| Power Dissipation | 20W |
| Dc Current Gain Hfe | 300hFE |
| Transistor Mounting | Surface Mount |
| Transistor Polarity | NPN |
| Transistor Case Style | TO-252 (DPAK) |
| Dc Current Gain Hfe Min | 300hFE |
| Operating Temperature Max | 150°C |
| Continuous Collector Current | 8A |
| Collector Emitter Voltage Max | 100V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:2630301/)

## MJD122,  NJVMJD122 (NPN), MJD127, NJVMJD127 (PNP) 

## Complementary Darlington Power Transistor **DPAK For Surface Mount Applications** 

Designed for general purpose amplifier and low speed switching applications. 

## **Features** 

## **http://onsemi.com** 

**SILICON POWER TRANSISTOR 8 AMPERES 100 VOLTS, 20 WATTS** 

- Lead Formed for Surface Mount Applications in Plastic Sleeves 

- Surface Mount Replacements for 2N6040−2N6045 Series, TIP120−TIP122 Series, and TIP125−TIP127 Series 

- Monolithic Construction With Built−in Base−Emitter Shunt Resistors 

- High DC Current Gain: hFE = 2500 (Typ) @ IC = 4.0 Adc 

**DPAK CASE 369C STYLE 1** 

- Epoxy Meets UL 94 V−0 @ 0.125 in 

- ESD Ratings: 

   - ♦ Human Body Model, 3B > 8000 V 

   - ♦ Machine Model, C > 400 V 

- NJV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q101 Qualified and PPAP Capable 

- These are Pb−Free Devices* 

COLLECTOR 2, 4 BASE 1 

EMITTER 3 

## **MARKING DIAGRAM** 

A = Assembly Location Y = Year AYWW WW = Work Week J12xG x = 2 or 7 ~~cm~~ G = Pb−Free Package 

## **ORDERING INFORMATION** 

|**Device**|**Package**|**Shipping**†|
|---|---|---|
|MJD122G|DPAK<br>(Pb−Free)|75 Units/Rail|
|MJD122T4G|DPAK<br>(Pb−Free)|2,500/Tape & Reel|
|NJVMJD122T4G|DPAK<br>(Pb−Free)|2,500/Tape & Reel|
|MJD127G|DPAK<br>(Pb−Free)|75 Units/Rail|
|MJD127T4G|DPAK<br>(Pb−Free)|2,500/Tape & Reel|
|NJVMJD127T4G|DPAK<br>(Pb−Free)|2,500/Tape & Reel|



- *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. 

- †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D. 

Publication Order Number: 

**1** 

© Semiconductor Components Industries, LLC, 2013 **September, 2013 − Rev. 13** 

**MJD122/D** 

## **MJD122,  NJVMJD122 (NPN), MJD127,  NJVMJD127 (PNP)** 

## **MAXIMUM RATINGS** 

|**MAXIMUM RATINGS**||||
|---|---|---|---|
|**Rating**|**Symbol**|**Value**|**Unit**|
|Collector−Emitter Voltage|VCEO|100|Vdc|
|Collector−Base Voltage|VCB|100|Vdc|
|Emitter−Base Voltage|VEB|5|Vdc|
|Collector Current<br>Continuous<br>Peak|IC|8<br>16|Adc|
|Base Current|IB|120|mAdc|
|Total Power Dissipation<br>@ TC= 25°C<br>Derate above 25°C|PD|20<br>0.16|W<br>W/°C|
|Total Power Dissipation (Note 1)<br>@ TA= 25°C<br>Derate above 25°C|PD|1.75<br>0.014|W<br>W/°C|
|Operating and Storage Junction Temperature Range|TJ, Tstg|−65 to +150|°C|



Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 

## **THERMAL CHARACTERISTICS** 

|**THERMAL CHARACTERISTICS**||||
|---|---|---|---|
|**Characteristic**|**Symbol**|**Max**|**Unit**|
|Thermal Resistance, Junction−to−Case|R�JC|6.25|°C/W|
|Thermal Resistance,<br>Junction−to−Ambient (Note1)|R�JA|71.4|°C/W|



1. These ratings are applicable when surface mounted on the minimum pad sizes recommended. 

**http://onsemi.com** 

**2** 

**MJD122,  NJVMJD122 (NPN), MJD127,  NJVMJD127 (PNP)** 

## **ELECTRICAL CHARACTERISTICS** (TC = 25 � C unless otherwise noted) 

|**Characteristic**|**Symbol**|**Min**|**Max**|**Unit**|
|---|---|---|---|---|
|**OFF CHARACTERISTICS**|||||
|Collector−Emitter Sustaining Voltage<br>(IC= 30 mAdc, IB= 0)|VCEO(sus)|100|−|Vdc|
|Collector Cutoff Current<br>(VCE= 50 Vdc, IB= 0)|ICEO|−|10|�Adc|
|Collector Cutoff Current<br>(VCB= 100 Vdc, IE= 0)|ICBO|−|10|�Adc|
|Emitter Cutoff Current<br>(VBE= 5 Vdc, IC= 0)|IEBO|−|2|mAdc|
|**ON CHARACTERISTICS**|||||
|DC Current Gain<br>(IC= 4 Adc, VCE= 4 Vdc)<br>(IC= 8 Adc, VCE= 4 Vdc)|hFE|1000<br>100|12,000<br>−|−|
|Collector−Emitter Saturation Voltage<br>(IC= 4 Adc, IB= 16 mAdc)<br>(IC= 8 Adc, IB= 80 mAdc)|VCE(sat)|−<br>−|2<br>4|Vdc|
|Base−Emitter Saturation Voltage (Note 2)<br>(IC= 8 Adc, IB= 80 mAdc)|VBE(sat)|−|4.5|Vdc|
|Base−Emitter On Voltage<br>(IC= 4 Adc, VCE= 4 Vdc)|VBE(on)|−|2.8|Vdc|
|**DYNAMIC CHARACTERISTICS**|||||
|Current−Gain−Bandwidth Product<br>(IC= 3 Adc, VCE= 4 Vdc, f = 1 MHz)||hfe||4|−|MHz|
|Output Capacitance<br>(VCB= 10 Vdc, IE= 0, f = 0.1 MHz)<br>MJD127, NJVMJD127T4G<br>MJD122, NJVMJD122T4G|Cob|−<br>−|300<br>200|pF|
|Small−Signal Current Gain<br>(IC= 3 Adc, VCE= 4 Vdc, f = 1 kHz)|hfe|300|−|−|



2. Pulse Test: Pulse Width � 300 � s, Duty Cycle � 2%. 

**==> picture [250 x 182] intentionally omitted <==**

**----- Start of picture text -----**<br>
TA TC<br>2.5 25<br>2 20<br>1.5 15 T C<br>1 10 TA<br>SURFACE<br>MOUNT<br>0.5 5<br>0 0<br>25 50 75 100 125 150<br>T, TEMPERATURE (°C)<br>PD, POWER DISSIPATION (WATTS)<br>**----- End of picture text -----**<br>


**Figure 1. Power Derating** 

**http://onsemi.com** 

**3** 

**MJD122,  NJVMJD122 (NPN), MJD127,  NJVMJD127 (PNP)** 

## **TYPICAL ELECTRICAL CHARACTERISTICS** 

**==> picture [56 x 8] intentionally omitted <==**

**----- Start of picture text -----**<br>
PNP MJD127<br>**----- End of picture text -----**<br>


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**----- Start of picture text -----**<br>
NPN MJD122<br>**----- End of picture text -----**<br>


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**----- Start of picture text -----**<br>
20,000 20,000<br>VCE = 4 V VCE = 4 V<br>10,000 10,000<br>7000<br>5000 TJ = 150°C 5000 TJ = 150°C<br>3000 3000<br>2000 2000<br>25°C 25°C<br>1000 1000<br>700 -�55°C -�55°C<br>500 500<br>300 300<br>200 200<br>0.1 0.2 0.3 0.5 0.7 1 2 3 5 7 10 0.1 0.2 0.3 0.5 0.7 1 2 3 5 7 10<br>IC, COLLECTOR CURRENT (AMP) IC, COLLECTOR CURRENT (AMP)<br>Figure 2. DC Current Gain<br>3 3<br>TJ = 25°C TJ = 25°C<br>2.6 IC = 2 A 4 A 6 A 2.6 IC = 2 A 4 A 6 A<br>2.2 2.2<br>1.8 1.8<br>1.4 1.4<br>1 1<br>0.3 0.5 0.7 1 2 3 5 7 10 20 30 0.3 0.5 0.7 1 2 3 5 7 10 20 30<br>IB, BASE CURRENT (mA) IB, BASE CURRENT (mA)<br>Figure 3. Collector Saturation Region<br>3 3<br>TJ = 25°C TJ = 25°C<br>2.5 2.5<br>2 2<br>1.5 VBE @ VCE = 4 V 1.5 VBE(sat) @ IC/IB = 250<br>VBE @ VCE = 4 V<br>1 VBE(sat) @ IC/IB = 250 1<br>VCE(sat) @ IC/IB = 250<br>VCE(sat) @ IC/IB = 250<br>0.5 0.5<br>0.1 0.2 0.3 0.5 0.7 1 2 3 5 7 10 0.1 0.2 0.3 0.5 0.7 1 2 3 5 7 10<br>IC, COLLECTOR CURRENT (AMP) IC, COLLECTOR CURRENT (AMP)<br>hFE, DC CURRENT GAIN hFE, DC CURRENT GAIN<br>VCE, COLLECTOR-EMITTER VOLTAGE (VOLTS) VCE, COLLECTOR-EMITTER VOLTAGE (VOLTS)<br>V, VOLTAGE (VOLTS) V, VOLTAGE (VOLTS)<br>**----- End of picture text -----**<br>


**Figure 4. “On” Voltages** 

**http://onsemi.com** 

**4** 

**MJD122,  NJVMJD122 (NPN), MJD127,  NJVMJD127 (PNP)** 

## **TYPICAL ELECTRICAL CHARACTERISTICS** 

**==> picture [487 x 407] intentionally omitted <==**

**----- Start of picture text -----**<br>
PNP MJD127 NPN MJD122<br>+�5 +�5<br>+�4 *IC/IB ≤ hFE/3 +�4 *IC/IB ≤ hFE/3<br>+�3 +�3 25°C to 150°C<br>+�2 +�2 -�55°C to 25°C<br>+�1 +�1<br>0 25°C to 150°C 0<br>-�1 �VC for VCE(sat) -�1 *�VC for VCE(sat)<br>-�2 -�55°C to 25°C -�2<br>-�3-�4 �VB for VBE 25°C to 150°C -�55°C to 25°C -�3-�4 �VB for VBE 25°C to 150°C -�55°C to 25°C<br>-�5 -�5<br>0.1 0.2 0.3 0.5 1 2 3 5 7 10 0.1 0.2 0.3 0.5 0.7 1 2 3 5 7 10<br>IC, COLLECTOR CURRENT (AMP) IC, COLLECTOR CURRENT (AMP)<br>Figure 5. Temperature Coefficients<br>10 [5] 10 [5]<br>REVERSE FORWARD REVERSE FORWARD<br>10 [4] 10 [4]<br>10 [3] VCE = 30 V 10 [3] VCE = 30 V<br>10 [2] 10 [2]<br>T J  = 150°C TJ = 150 ° C<br>10 [1] 10 [1]<br>100 ° C<br>10 [0] 25°C 10 [0] 100°C<br>25°C<br>10 [-1] 10 [-1]<br>+�0.6 +�0.4 +�0.2 0 -�0.2 -�0.4 -�0.6 -�0.8 -�1 -�1.2 -�1.4 -�0.6 -�0.4 -�0.2 0 +�0.2 +�0.4 +�0.6 +�0.8 +�1 +�1.2 +�1.4<br>VBE, BASE-EMITTER VOLTAGE (VOLTS) VBE, BASE-EMITTER VOLTAGE (VOLTS)<br>C)V, TEMPERATURE COEFFICIENTS (mV/θ° C)V, TEMPERATURE COEFFICIENTS (mV/θ°<br>μ μ<br>, COLLECTOR CURRENT (��A) , COLLECTOR CURRENT (��A)<br>IC IC<br>**----- End of picture text -----**<br>


**Figure 6. Collector Cut−Off Region** 

**==> picture [489 x 170] intentionally omitted <==**

**----- Start of picture text -----**<br>
10,000 300<br>5000 TJ = 25°C<br>3000 200<br>2000<br>1000<br>Cob<br>500 TC = 25°C 100<br>300 VCE = 4 Vdc<br>200 IC = 3 Adc<br>70<br>100<br>Cib<br>50 PNP 50 PNP<br>30<br>20 NPN NPN<br>10 30<br>1 2 5 10 20 50 100 200 500 1000 0.1 0.2 0.5 1 2 5 10 20 50 100<br>f, FREQUENCY (kHz) VR, REVERSE VOLTAGE (VOLTS)<br>C, CAPACITANCE (pF)<br>hfe , SMALL-SIGNAL CURRENT GAIN<br>**----- End of picture text -----**<br>


**Figure 7. Small−Signal Current Gain** 

**Figure 8. Capacitance** 

**http://onsemi.com** 

**5** 

**MJD122,  NJVMJD122 (NPN), MJD127,  NJVMJD127 (PNP)** 

**==> picture [497 x 614] intentionally omitted <==**

**----- Start of picture text -----**<br>
5<br>RB & RC VARIED TO OBTAIN DESIRED CURRENT LEVELS VCC 3 ts PNP NPN<br>�D1, MUST BE FAST RECOVERY TYPE, e.g.: -�30 V 2<br>��1N5825 USED ABOVE IB ≈ 100 mA<br>��MSD6100 USED BELOW IB ≈ 100 mA RC SCOPE 1 tf<br>TUT<br>V2 RB 0.7<br>APPROX 0.5<br>+�8 V<br>0 51 D1 ≈ 8 k ≈ 120 0.3<br>V1 0.2 VCC = 30 V tr<br>APPROX + 4 V IC/IB = 250<br>-12 Vtr, tf ≤ 10 ns 25 �sFOR td AND tr, D1 IS DISCONNECTED 0.070.050.1 ITB1J = 25 = IB2°C td @ VBE(off) = 0 V<br>DUTY CYCLE = 1% AND V2 = 0 0.1 0.2 0.3 0.5 0.7 1 2 3 5 7 10<br>FOR NPN TEST CIRCUIT REVERSE ALL POLARITIES. IC, COLLECTOR CURRENT (AMP)<br>Figure 9. Switching Times Test Circuit Figure 10. Switching Times<br>1<br>0.7 D = 0.5<br>0.5<br>0.3 0.2<br>0.2<br>0.1<br>0.1 0.05 R R � � JC JC = 6.25 (t) = r(t) °  R C/W �JC P(pk)<br>0.07 0.01 D CURVES APPLY FOR POWER<br>0.05 PULSE TRAIN SHOWN t 1<br>0.030.02 SINGLE PULSE TREAD TIME AT J(pk) - TC = P(ptk1) �JC(t) DUTY CYCLE, D = t t 2 1/t2<br>0.01<br>0.01 0.02 0.03 0.05 0.1 0.2 0.3 0.5 1 2 3 5 10 20 30 50 100 200 300 500 1000<br>t, TIME OR PULSE WIDTH (ms)<br>Figure 11. Thermal Response<br>20 There are two limitations on the power handling ability of<br>15<br>10 500�� 100�� a transistor: average junction temperature and second<br>5 σ σ breakdown. Safe operating area curves indicate IC − VCE<br>3 limits of the transistor that must be observed for reliable<br>2 operation; i.e., the transistor must not be subjected to greater<br>1 TJ = 150°C 1�ms 5�ms dissipation than the curves indicate.<br>0.5 The data of Figure 12 is based on TJ(pk) = 150�C; TC is<br>0.3 BONDING WIRE LIMIT variable depending on conditions. Second breakdown pulse<br>0.2<br>THERMAL LIMIT dc limits are valid for duty cycles to 10% provided TJ(pk)<br>0.1 TC = 25°C (SINGLE PULSE) < 150�C.  TJ(pk) may be calculated from the data in<br>0.05 SECOND BREAKDOWN LIMIT Figure 11. At high case temperatures, thermal limitations<br>0.03 CURVES APPLY BELOW RATED VCEO will reduce the power that can be handled to values less than<br>0.02 1 2 3 5 7 10 20 30 50 70 100 the limitations imposed by second breakdown.<br>VCE, COLLECTOR-EMITTER VOLTAGE (VOLTS)<br>μ<br>t, TIME (��s)<br>r(t), EFFECTIVE TRANSIENT<br>THERMAL RESISTANCE (NORMALIZED)<br>IC, COLLECTOR CURRENT (AMP)<br>**----- End of picture text -----**<br>


**Figure 12. Maximum Forward Bias Safe Operating rea** 

**http://onsemi.com** 

**6** 

**MJD122,  NJVMJD122 (NPN), MJD127,  NJVMJD127 (PNP)** 

**==> picture [310 x 122] intentionally omitted <==**

**----- Start of picture text -----**<br>
PNP COLLECTOR NPN COLLECTOR<br>BASE BASE<br>≈ 8 k ≈ 120 ≈ 8 k ≈ 120<br>EMITTER EMITTER<br>**----- End of picture text -----**<br>


**Figure 13. Darlington Schematic** 

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**7** 

**MJD122,  NJVMJD122 (NPN), MJD127,  NJVMJD127 (PNP)** 

## **PACKAGE DIMENSIONS** 

**==> picture [467 x 415] intentionally omitted <==**

**----- Start of picture text -----**<br>
DPAK<br>CASE 369C<br>ISSUE D<br>NOTES:<br>C 1. DIMENSIONING AND TOLERANCING PER ASME<br>A Y14.5M, 1994.<br>E A 2.3. CONTROLLING DIMENSION: INCHES.THERMAL PAD CONTOUR OPTIONAL WITHIN DI-<br>MENSIONS b3, L3 and Z.<br>b3 B c2 4. DIMENSIONS D AND E DO NOT INCLUDE MOLD<br>FLASH, PROTRUSIONS, OR BURRS. MOLD<br>it FLASH, PROTRUSIONS, OR GATE BURRS SHALL<br>NOT EXCEED 0.006 INCHES PER SIDE.<br>L3 4 Z 5. DIMENSIONS D AND E ARE DETERMINED AT THEOUTERMOST EXTREMES OF THE PLASTIC BODY.<br>1 2 3 D DETAIL A H 6. DATUMS A AND B ARE DETERMINED AT DATUMPLANE H.<br>7 4<br>INCHES MILLIMETERS<br>DIM MIN MAX MIN MAX<br>L4 A 0.086 0.094 2.18 2.38<br>b2 A1 0.000 0.005 0.00 0.13<br>b c b 0.025 0.035 0.63 0.89<br>b2 0.030 0.045 0.76 1.14<br>G e 0.005 (0.13) a M C H b3 0.180 0.215 4.57 5.46<br>c 0.018 0.024 0.46 0.61<br>L2 [GAUGE] PLANE C SEATINGPLANE c2D 0.0180.235 0.0240.245 0.465.97 0.616.22<br>E 0.250 0.265 6.35 6.73<br>e 0.090 BSC 2.29 BSC<br>H 0.370 0.410 9.40 10.41<br>L A1 L 0.055 0.070 1.40 1.78<br>L1 L1 0.108 REF 2.74 REF<br>L2 0.020 BSC 0.51 BSC<br>DETAIL A L3 0.035 0.050 0.89 1.27<br>ROTATED 9  CW L4 −−− 0.040 −−− 1.01<br>Z 0.155 −−− 3.93 −−−<br>SOLDERING FOOTPRINT* STYLE 1:PIN 1. BASE<br>2. COLLECTOR<br>3. EMITTER<br>6.20 3.0 4. COLLECTOR<br>0.244 0.118<br>2.58<br>0.101<br>fare [a]<br>5.80<br>1.6 6.172<br>0.228<br>0.063 0.243<br>SCALE 3:1 mm<br>inches<br>**----- End of picture text -----**<br>


*For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. 

**ON Semiconductor** and          are registered trademarks of Semiconductor Components Industries, LLC (SCILLC).  SCILLC reserves the right to make changes without further notice to any products herein.  SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time.  All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts.  SCILLC does not convey any license under its patent rights nor the rights of others.  SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur.  Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part.  SCILLC is an Equal Opportunity/Affirmative Action Employer.  This literature is subject to all applicable copyright laws and is not for resale in any manner. 

## **PUBLICATION ORDERING INFORMATION** 

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## **LITERATURE FULFILLMENT** : 

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**MJD122/D** 



## Links

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---

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