# IGBT, 100 A, 1.65 V, 223 W, 600 V, TO-247, 3 Pins

![Product image](https://novapart.co/image/farnell:2321651/)

**URL**: https://novapart.co/products/NGTB50N60FLWG/igbt-100-a-165-v-223-w-600-to-247-3-pins
**SKU**: NGTB50N60FLWG
**Manufacturer**: ONSEMI
**Category**: Semiconductors - Discretes || IGBTs || Single IGBTs
**Price**: €2.1100
**Stock**: 10+

## Description

DC Collector Current:100A; Collector Emitter Saturation Voltage Vce(on):1.65V; Power Dissipation Pd:223W; Collector Emitter Voltage V(br)ceo:600V; Transistor Case Style:TO-247; No. of Pins:3Pin

## Specifications

| Parameter | Value |
|---|---|
| No. Of Pins | 3Pins |
| Product Range | - |
| Power Dissipation | 223W |
| Transistor Mounting | Through Hole |
| Transistor Case Style | TO-247 |
| Operating Temperature Max | 150°C |
| Continuous Collector Current | 100A |
| Collector Emitter Voltage Max | 600V |
| Collector Emitter Saturation Voltage | 1.65V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:2321651/)

## NGTB50N60FLWG 

## IGBT 

This Insulated Gate Bipolar Transistor (IGBT) features a robust and cost effective Trench construction, and provides superior performance in demanding switching applications, offering both low on state voltage and minimal switching loss. 

## **Features** 

**http://onsemi.com** 

- Low Saturation Voltage using Trench with Field Stop Technology 

- Low Switching Loss Reduces System Power Dissipation 

- Soft Fast Reverse Recovery Diode 

- Optimized for High Speed Switching 

**50 A, 600 V VCEsat = 1.65 V EOFF = 0.6 mJ** 

- 5 s Short−Circuit Capability 

• These are Pb−Free Devices C **Typical Applications** • Solar Inverters • Uninterruptible Power Supplies (UPS) G **ABSOLUTE MAXIMUM RATINGS** E **Rating Symbol Value Unit** Collector−emitter voltage VCES 600 V Collector current IC A @ TC = 25 ° C 100 @ TC = 100 ° C 50 Diode Forward Current IF A G **TO−247** ~~a~~ @ T@ TCC = 25 = 100 ° C ° C 10050 C E **CASE 340LSTYLE 4** Diode Pulsed Current IFM 200 A TPULSE Limited by TJ Max ~~ee ee~~ Pulsed collector current, Tpulse ICM 200 A **MARKING DIAGRAM** limited by TJmax ~~a~~ Short−circuit withstand time tSC 5 s VGE = 15 V, VCE = 300 V, TJ ≤ +150 ° C ~~ee~~ Gate−emitter voltage VGE 20 V 50N60FL V AYWWG Transient gate−emitter voltage 30 (TPULSE = 5 s, D < 0.10) ~~ere oe~~ Power Dissipation PD W @ TC = 25 ° C 223 @ TC = 100 ° C 89 ~~a Oe | |~~ Operating junction temperature TJ −55 to +150 ° C range A = Assembly Location ~~eeee~~ Storage temperature range ~~es~~ T ~~ee~~ stg −55 to +150 ~~eeee~~ ° C YWW Uy = Work Week= Year Lead temperature for soldering, 1/8” TSLD 260 ° C G = Pb−Free Package from case for 5 seconds ~~ee ee ee~~ Stresses exceeding Maximum Ratings may damage the device. Maximum **ORDERING INFORMATION** Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the **Device Package Shipping** Recommended Operating Conditions may affect device reliability. NGTB50N60FLWG TO−247 30 Units / Rail (Pb−Free) ~~TIE~~ 

Publication Order Number: **NGTB50N60FLW/D** 

**1** 

© Semiconductor Components Industries, LLC, 2013 **January, 2013 − Rev. 1** 

**NGTB50N60FLWG** 

## **THERMAL CHARACTERISTICS** 

|**THERMAL CHARACTERISTICS**||||
|---|---|---|---|
|**Rating**|**Symbol**|**Value**|**Unit**|
|Thermal resistance junction−to−case, for IGBT|R�JC|0.56|°C/W|
|Thermal resistance junction−to−case, for Diode|R�JC|0.74|°C/W|
|Thermal resistance junction−to−ambient|R�JA|40|°C/W|



**ELECTRICAL CHARACTERISTICS** (TJ = 25 ° C unless otherwise specified) 

|**Parameter**|**Test Conditions**|**Symbol**|**Min**|**Typ**|**Max**|**Unit**|
|---|---|---|---|---|---|---|
|**STATIC CHARACTERISTIC**|||||||
|Collector−emitter breakdown voltage,<br>gate−emitter short−circuited|VGE=0 V, IC= 500�A|V(BR)CES|600|−|−|V|
|Collector−emitter saturation voltage|VGE= 15 V, IC= 50 A<br>VGE= 15 V, IC= 50 A, TJ= 150°C|VCEsat|1.40<br>−|1.65<br>1.85|1.90<br>−|V|
|Gate−emitter threshold voltage|VGE= VCE, IC= 350�A|VGE(th)|4.5|5.5|6.5|V|
|Collector−emitter cut−off current, gate−<br>emitter short−circuited|VGE= 0 V, VCE= 600 V<br>VGE= 0 V, VCE= 600 V, TJ =150°C|ICES|−<br>−|−<br>−|0.5<br>2|mA|
|Gate leakage current, collector−emitter<br>short−circuited|VGE= 20 V , VCE= 0 V|IGES|−|−|200|nA|
|**DYNAMIC CHARACTERISTIC**|||||||
|Input capacitance|VCE= 20 V, VGE= 0 V, f = 1 MHz|Cies|−|7500|−|pF|
|Output capacitance||Coes|−|300|−||
|Reverse transfer capacitance||Cres|−|190|−||
|Gate charge total|VCE= 480 V, IC= 50 A, VGE= 15 V|Qg|−|310|−|nC|
|Gate to emitter charge||Qge|−|60|−||
|Gate to collector charge||Qgc|−|150|−||
|**SWITCHING CHARACTERISTIC, INDUCTIVE LOAD**|||||||
|Turn−on delay time|TJ= 25°C<br>VCC= 400 V, IC= 50 A<br>Rg= 10�<br>VGE= 0 V/ 15 V|td(on)|−|116|−|ns|
|Rise time||tr|−|43|−||
|Turn−off delay time||td(off)|−|292|−||
|Fall time||tf|−|78|−||
|Turn−on switching loss||Eon|−|1.1|−|mJ|
|Turn−off switching loss||Eoff|−|0.6|−||
|Total switching loss||Ets|−|1.7|−||
|Turn−on delay time|TJ= 150°C<br>VCC= 400 V, IC= 50 A<br>Rg= 10�<br>VGE= 0 V/ 15 V|td(on)|−|110|−|ns|
|Rise time||tr|−|45|−||
|Turn−off delay time||td(off)|−|300|−||
|Fall time||tf|−|105|−||
|Turn−on switching loss||Eon|−|1.4|−|mJ|
|Turn−off switching loss||Eoff|−|1.1|−||
|Total switching loss||Ets|−|2.5|−||
|**DIODE CHARACTERISTIC**|||||||
|Forward voltage|VGE= 0 V, IF= 50 A<br>VGE= 0 V, IF= 50 A, TJ= 150°C|VF|1.55<br>−|1.85<br>1.85|2.1<br>−|V|
|Reverse recovery time|TJ= 25°C<br>IF= 50 A, VR= 200 V<br>diF/dt = 200 A/�s|trr|−|85|−|ns|
|Reverse recovery charge||Qrr|−|0.40|−|�C|
|Reverse recovery current||Irrm|−|8|−|A|



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**NGTB50N60FLWG** 

## **TYPICAL CHARACTERISTICS** 

**==> picture [239 x 170] intentionally omitted <==**

**----- Start of picture text -----**<br>
250<br>TJ = 25 ° C<br>VGE = 17 V to 13 V<br>200<br>11 V<br>150<br>10 V<br>100<br>9 V<br>50<br>7 V<br>8 V<br>0<br>0 1 2 3 4 5 6 7 8<br>VCE, COLLECTOR−EMITTER VOLTAGE (V)<br>, COLLECTOR CURRENT (A)<br>IC<br>**----- End of picture text -----**<br>


**Figure 1. Output Characteristics** 

**==> picture [238 x 170] intentionally omitted <==**

**----- Start of picture text -----**<br>
300<br>TJ = 150 ° C VGE = 17 V to 13 V<br>250<br>200<br>150 11 V<br>10 V<br>100<br>9 V<br>50<br>8 V<br>7 V<br>0<br>0 1 2 3 4 5 6 7 8<br>VCE, COLLECTOR−EMITTER VOLTAGE (V)<br>, COLLECTOR CURRENT (A)<br>IC<br>**----- End of picture text -----**<br>


**Figure 2. Output Characteristics** 

**==> picture [492 x 396] intentionally omitted <==**

**----- Start of picture text -----**<br>
250 200<br>TJ = −55 ° C<br>180<br>VGE = 17 V to 13 V<br>200 160 TJ = 25 ° C T J  = 150 ° C<br>11 V 140<br>150 120<br>100<br>10 V<br>100 80<br>60<br>50 7 V 40<br>9 V<br>20<br>8 V<br>0 0<br>0 1 2 3 4 5 6 7 8 0 4 8 12 16<br>VCE, COLLECTOR−EMITTER VOLTAGE (V) VGE, GATE−EMITTER VOLTAGE (V)<br>Figure 3. Output Characteristics Figure 4. Typical Transfer Characteristics<br>3.00 100000<br>IC = 100 A<br>2.50<br>10000 Cies<br>2.00<br>IC = 50 A<br>1.50 IC = 25 A 1000<br>1.00 IC = 5 A Coes<br>100<br>0.50 Cres<br>0.00 10<br>−75 −25 25 75 125 175 0 10 20 30 40 50 60 70 80 90 100<br>TJ, JUNCTION TEMPERATURE ( ° C) VCE, COLLECTOR−EMITTER VOLTAGE (V)<br>Figure 5. VCE(sat) vs. TJ Figure 6. Typical Capacitance<br>, COLLECTOR CURRENT (A) , COLLECTOR CURRENT (A)<br>IC IC<br>VOLTAGE (V)<br>, COLLECTOR−EMITTER CAPACITANCE (pF)<br>CE<br>V<br>**----- End of picture text -----**<br>


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**NGTB50N60FLWG** 

## **TYPICAL CHARACTERISTICS** 

**==> picture [237 x 170] intentionally omitted <==**

**----- Start of picture text -----**<br>
120<br>100<br>TJ = 25 ° C<br>80<br>TJ = 150 ° C<br>60<br>40<br>20<br>0<br>0 0.5 1 1.5 2 2.5 3 3.5<br>VF, FORWARD VOLTAGE (V)<br>, FORWARD CURRENT (A)<br>IF<br>**----- End of picture text -----**<br>


**Figure 7. Diode Forward Characteristics** 

**==> picture [242 x 170] intentionally omitted <==**

**----- Start of picture text -----**<br>
20<br>15 VCE = 480 V<br>10<br>5<br>0<br>0 50 100 150 200 250 300 350<br>QG, GATE CHARGE (nC)<br>, GATE−EMITTER VOLTAGE (V)<br>GE<br>V<br>**----- End of picture text -----**<br>


**Figure 8. Typical Gate Charge** 

**==> picture [493 x 170] intentionally omitted <==**

**----- Start of picture text -----**<br>
1.6 1000<br>1.4<br>td(off)<br>Eon<br>1.2<br>td(on)<br>100<br>1 tf<br>Eoff<br>0.8 tr<br>0.6<br>10<br>0.4 VCE = 400 V VCE = 400 V<br>VGE = 15 V VGE = 15 V<br>0.2 I C = 50 A IC = 50 A<br>Rg = 10  � Rg = 10  �<br>0 1<br>0 20 40 60 80 100 120 140 160 0 20 40 60 80 100 120 140 160<br>TJ, JUNCTION TEMPERATURE ( ° C) TJ, JUNCTION TEMPERATURE ( ° C)<br>SWITCHING LOSS (mJ) SWITCHING TIME (ns)<br>**----- End of picture text -----**<br>


**Figure 9. Switching Loss vs. Temperature** 

**Figure 10. Switching Time vs. Temperature** 

**==> picture [493 x 170] intentionally omitted <==**

**----- Start of picture text -----**<br>
4.5 1000<br>VCE = 400 V<br>4 VGE = 15 V td(off)<br>3.5 TRJg = 150 = 10  °� C Eon tf<br>3 100<br>td(on)<br>2.5<br>Eoff<br>2<br>tr<br>1.5 10<br>VCE = 400 V<br>1 VGE = 15 V<br>0.5 TJ = 150 ° C<br>Rg = 10  �<br>0 1<br>8 20 32 44 56 68 80 92 104 8 20 32 44 56 68 80 92 104<br>IC, COLLECTOR CURRENT (A) IC, COLLECTOR CURRENT (A)<br>SWITCHING LOSS (mJ) SWITCHING TIME (ns)<br>**----- End of picture text -----**<br>


**Figure 11. Switching Loss vs. IC** 

**Figure 12. Switching Time vs. IC** 

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**NGTB50N60FLWG** 

## **TYPICAL CHARACTERISTICS** 

**==> picture [489 x 170] intentionally omitted <==**

**----- Start of picture text -----**<br>
7 10000<br>VCE = 400 V<br>65 VTI JGE C = 150 = 50 A = 15 V ° C Eon 1000 td(off)<br>td(on)<br>4<br>100<br>3 E off tf<br>tr<br>2<br>10 VCE = 400 V<br>VGE = 15 V<br>1<br>IC = 50 A<br>TJ = 150 ° C<br>0 1<br>5 15 25 35 45 55 65 75 85 5 15 25 35 45 55 65 75 85<br>RG, GATE RESISTOR ( � ) RG, GATE RESISTOR ( � )<br>SWITCHING LOSS (mJ) SWITCHING TIME (ns)<br>**----- End of picture text -----**<br>


**Figure 13. Switching Loss vs. RG** 

**Figure 14. Switching Time vs. RG** 

**==> picture [491 x 170] intentionally omitted <==**

**----- Start of picture text -----**<br>
3 1000<br>VGE = 15 V<br>IC = 50 A td(off)<br>2.4 Rg = 10  �<br>TJ = 150 ° C Eon td(on)<br>100<br>1.8 tf<br>Eoff tr<br>1.2<br>10<br>VGE = 15 V<br>0.6 IC = 50 A<br>Rg = 10  �<br>TJ = 150 ° C<br>0 1<br>175 225 275 325 375 425 475 525 575 175 225 275 325 375 425 475 525 575<br>VCE, COLLECTOR−EMITTER VOLTAGE (V) VCE, COLLECTOR−EMITTER VOLTAGE (V)<br>SWITCHING LOSS (mJ) SWITCHING TIME (ns)<br>**----- End of picture text -----**<br>


**Figure 15. Switching Loss vs. VCE** 

**Figure 16. Switching Time vs. VCE** 

**==> picture [243 x 170] intentionally omitted <==**

**----- Start of picture text -----**<br>
1000<br>50  � s<br>100 100  � s<br>1 ms<br>10 dc operation<br>1<br>Single Nonrepetitive<br>Pulse TC = 25 ° C<br>0.1 Curves must be derated<br>linearly with increase<br>in temperature<br>0.01<br>1 10 100 1000<br>VCE, COLLECTOR−EMITTER VOLTAGE (V)<br>, COLLECTOR CURRENT (A)<br>IC<br>**----- End of picture text -----**<br>


**Figure 17. Safe Operating Area** 

**==> picture [244 x 170] intentionally omitted <==**

**----- Start of picture text -----**<br>
1000<br>100<br>10<br>VGE = 15 V, TC = 125 ° C<br>1<br>1 10 100 1000<br>VCE, COLLECTOR−EMITTER VOLTAGE (V)<br>, COLLECTOR CURRENT (A)<br>IC<br>**----- End of picture text -----**<br>


**Figure 18. Reverse Bias Safe Operating Area** 

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**NGTB50N60FLWG** 

## **TYPICAL CHARACTERISTICS** 

**==> picture [252 x 174] intentionally omitted <==**

**----- Start of picture text -----**<br>
250<br>200 80 ° C<br>150 80 ° C 110 ° C<br>100 110 ° C<br>VCE = 400 V, TJ  ≤  150 ° C<br>50 Rgate = 10 W, VGE = 0/15 V,<br>Tcase = 80 or 110 ° C<br>(as noted), D = 0.5<br>0<br>0.01 0.1 1 10 100 1000<br>FREQUENCY (kHz)<br>Ipk (A)<br>**----- End of picture text -----**<br>


**Figure 19. Collector Current vs. Switching Frequency** 

**==> picture [491 x 371] intentionally omitted <==**

**----- Start of picture text -----**<br>
1<br>50% Duty Cycle R � JC = 0.56<br>20%<br>0.1 10% Ri ( ° C/W) � i (sec)<br>5% Junction R1 R2 Rn Case 0.050410.02087 5.48E−51.0E−4<br>0.07919 0.002<br>2% Ci =  � i/Ri 0.11425 0.03<br>0.01 1% 0.19393 0.1<br>C1 C2 Cn 0.09951 2.0<br>Single Pulse Duty Factor = t1/t2<br>Peak T J  = P DM  x Z � JC  + T C<br>0.001<br>0.000001 0.00001 0.0001 0.001 0.01 0.1 1 10 100 1000<br>PULSE TIME (sec)<br>Figure 20. IGBT Transient Thermal Impedance<br>1<br>50% Duty Cycle R � JC = 0.74<br>20%<br>0.1 10%<br>5% Junction R1 R2 Rn Case Ri ( ° C/W) � i (sec)<br>0.07958 4.89E−4<br>2% Ci =  � i/Ri 0.13798 0.002<br>0.18744 0.03<br>0.01 1% 0.23523 0.1<br>C1 C2 Cn 0.09951 2.0<br>Duty Factor = t1/t2<br>Single Pulse Peak T J  = P DM  x Z � JC  + T C<br>0.001<br>0.000001 0.00001 0.0001 0.001 0.01 0.1 1 10 100 1000<br>PULSE TIME (sec)<br>C/W)<br>°<br>R(t) (<br>C/W)<br>°<br>R(t) (<br>**----- End of picture text -----**<br>


**Figure 21. Diode Transient Thermal Impedance** 

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**NGTB50N60FLWG** 

**Figure 22.  Test Circuit for Switching Characteristics** 

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**NGTB50N60FLWG** 

**Figure 23. Definition of Turn On Waveform** 

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**NGTB50N60FLWG** 

**Figure 24. Definition of Turn Off Waveform** 

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**NGTB50N60FLWG** 

## **PACKAGE DIMENSIONS** 

**TO−247** CASE 340L−02 ISSUE F 

**==> picture [448 x 211] intentionally omitted <==**

**----- Start of picture text -----**<br>
−T− NOTES:<br>1. DIMENSIONING AND TOLERANCING PER ANSI<br>C Y14.5M, 1982.<br>− B− 2. CONTROLLING DIMENSION: MILLIMETER.<br>E<br>MILLIMETERS INCHES<br>U L DIMA 20.32 MIN 21.08 MAX 0.800 MIN MAX 8.30<br>N 4 B 15.75 16.26 0.620 0.640<br>C 4.70 5.30 0.185 0.209<br>A −Q− DE 1.001.90 1.402.60 0.0400.075 0.0550.102<br>1 2 3 _ 0.63 (0.025) [M] T B M F 1.65 2.13 0.065 0.084<br>G 5.45 BSC 0.215 BSC<br>H 1.50 2.49 0.059 0.098<br>P J 0.40 0.80 0.016 0.031<br>−Y− K 19.81 20.83 0.780 0.820<br>L 5.40 6.20 0.212 0.244<br>K N 4.32 5.49 0.170 0.216<br>P --- 4.50 --- 0.177<br>Q 3.55 3.65 0.140 0.144<br>U 6.15 BSC 0.242 BSC<br>W 2.87 3.12 0.113 0.123<br>W J<br>F 2 PL H STYLE 4:PIN 1. GATE<br>tt G  : ===  2. COLLECTOR<br>I D 3 PL |  3. EMITTER<br> 4. COLLECTOR<br>0.25 (0.010) [M] Y Q S<br>**----- End of picture text -----**<br>


**ON Semiconductor** and          are registered trademarks of Semiconductor Components Industries, LLC (SCILLC).  SCILLC owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf.  SCILLC reserves the right to make changes without further notice to any products herein.  SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.  “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time.  All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts.  SCILLC does not convey any license under its patent rights nor the rights of others.  SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur.  Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part.  SCILLC is an Equal Opportunity/Affirmative Action Employer.  This literature is subject to all applicable copyright laws and is not for resale in any manner. 

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