# IGBT, 50 A, 2 V, 385 W, 1.2 kV, TO-247, 3 Pins

![Product image](https://novapart.co/image/farnell:2492858/)

**URL**: https://novapart.co/products/NGTB25N120SWG/igbt-50-a-2-v-385-w-12-kv-to-247-3-pins
**SKU**: NGTB25N120SWG
**Manufacturer**: ONSEMI
**Category**: Semiconductors - Discretes || IGBTs || Single IGBTs
**Price**: €1.3300
**Stock**: 10+

## Specifications

| Parameter | Value |
|---|---|
| No. Of Pins | 3Pins |
| Power Dissipation | 385W |
| Transistor Mounting | Through Hole |
| Transistor Case Style | TO-247 |
| Operating Temperature Max | 175°C |
| Continuous Collector Current | 50A |
| Collector Emitter Voltage Max | 1.2kV |
| Collector Emitter Saturation Voltage | 2V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:2492858/)

## NGTB25N120SWG 

## IGBT - Inverter Welding 

This Insulated Gate Bipolar Transistor (IGBT) features a robust and cost effective Trench construction, and provides superior performance in demanding switching applications, offering both low on state voltage and minimal switching loss. The IGBT is well suited for welding applications. Incorporated into the device is a soft and fast co−packaged free wheeling diode with a low forward voltage. 

## **http://onsemi.com** 

**25 A, 1200 V VCEsat = 2.0 V Eoff = 0.60 mJ** 

## **Features** 

- TJmax = 175°C 

- Soft Fast Reverse Recovery Diode 

- Optimized for High Speed Switching 

- 10 s Short Circuit Capability 

**==> picture [461 x 396] intentionally omitted <==**

**----- Start of picture text -----**<br>
|||||||||
|---|---|---|---|---|---|---|---|
|C|
|•|These are Pb−Free Devices|
|Typical Applications|
|•|Welding|G|
|ABSOLUTE MAXIMUM RATINGS|
|E|
|ee|Rating|Ge|Symbol|Value|ee|Unit|
|Collector−emitter voltage|VCES|1200|V|
|Collector current|IC|A|
|@ TC = 25|°|C|50|
|@ TC = 100|°|C|25|
|ae|
|Pulsed collector current, Tpulse|ICM|ee|100|A|
|——|limited by TJmax|G|C|TO−247|
|||ae|E|CASE 340AL|
|Diode forward current|IF|A|
|@ TC = 25|°|C|50|
|@ TC = 100|°|C|25|
|PS|
|Diode pulsed current, Tpulse limited|IFM|100|A|
|by TJmax|MARKING DIAGRAM|
|Gate−emitter voltage|VGE|20|V|
|OF|Transient gate−emitter voltage|±|30|_|
|(Tpulse = 5 s, D < 0.10)|
|ae|l|o|l|
|Power Dissipation|PD|W|
|@ T@|TCC  = 25= 100|°|C|°|C|385192|25N120SAYWWG|
|Short Circuit Withstand Time|TSC|10|s|
|VGE = 15 V, VCE = 500 V, TJ|≤|150|°|C|
|ee|Operating junction temperature|TJ|−55 to +175|°|C||_||
|range|
|eees|Storage temperature range|Tstg|−55 to +175|°|C|UY|
|Lead temperature for soldering, 1/8”|TSLD|260|°|C|A|= Assembly Location|
|from case for 5 seconds|Y|= Year|
|ee|[ee]|es|WW|= Work Week|
|Stresses exceeding those listed in the Maximum Ratings table may damage the|
|G|= Pb−Free Package|

**----- End of picture text -----**<br>


- These are Pb−Free Devices 

## **Typical Applications** 

- Welding 

Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 

## **ORDERING INFORMATION** 

**==> picture [185 x 34] intentionally omitted <==**

**----- Start of picture text -----**<br>
||||
|---|---|---|
|Device|Package|Shipping|
|NGTB25N120SWG|TO−247|30 Units / Rail|
|(Pb−Free)|

**----- End of picture text -----**<br>


Publication Order Number: **NGTB25N120SW/D** 

**1** 

© Semiconductor Components Industries, LLC, 2014 **November, 2014 − Rev. 0** 

**NGTB25N120SWG** 

## **THERMAL CHARACTERISTICS** 

|**THERMAL CHARACTERISTICS**||||
|---|---|---|---|
|**Rating**|**Symbol**|**Value**|**Unit**|
|Thermal resistance junction−to−case, for IGBT|R�JC|0.39|°C/W|
|Thermal resistance junction−to−case, for Diode|R�JC|0.59|°C/W|
|Thermal resistance junction−to−ambient|R�JA|40|°C/W|
|**ELECTRICAL CHARACTERISTICS**(TJ= 25°C unless otherwise specified)||||



|**THERMAL CHARACTERISTICS**|**THERMAL CHARACTERISTICS**||||||
|---|---|---|---|---|---|---|
|**Rating**||**Symbol**|**Value**|||**Unit**|
|Thermal resistance junction−to−case, for IGBT||R�JC|0.39|||°C/W|
|Thermal resistance junction−to−case, for Diode||R�JC|0.59|||°C/W|
|Thermal resistance junction−to−ambient||R�JA|40|||°C/W|
|**ELECTRICAL CHARACTERISTICS**(TJ= 25°C unless otherwise specified)|||||||
|**Parameter**|**Test Conditions**|**Symbol**|**Min**|**Typ**|**Max**|**Unit**|
|**STATIC CHARACTERISTIC**|||||||
|Collector−emitter breakdown voltage,<br>gate−emitter short−circuited|VGE=0 V, IC= 500�A|V(BR)CES|1200|−|−|V|
|Collector−emitter saturation voltage|VGE= 15 V, IC= 25 A<br>VGE= 15 V, IC= 25 A, TJ= 175°C|VCEsat|−<br>−|2.00<br>2.40|2.40<br>−|V|
|Gate−emitter threshold voltage|VGE= VCE, IC= 400�A|VGE(th)|4.5|5.5|6.5|V|
|Collector−emitter cut−off current, gate−<br>emitter short−circuited|VGE= 0 V, VCE= 1200 V<br>VGE= 0 V, VCE= 1200 V, TJ =175°C|ICES|−<br>−|−<br>−|0.4<br>2|mA|
|Gate leakage current, collector−emitter<br>short−circuited|VGE= 20 V , VCE= 0 V|IGES|−|−|200|nA|
||||||||
|Input capacitance|VCE= 20 V, VGE= 0 V, f = 1 MHz|Cies|−|4420|−|pF|
|Output capacitance||Coes|−|151|−||
|Reverse transfer capacitance||Cres|−|81|−||
|Gate charge total|VCE= 600 V, IC= 25 A, VGE= 15 V|Qg|−|178|−|nC|
|Gate to emitter charge||Qge|−|39|−||
|Gate to collector charge||Qgc|−|83|−||
|**SWITCHING CHARACTERISTIC, INDUCTIVE LOAD**|||||||
|Turn−on delay time|TJ= 25°C<br>VCC= 600 V, IC= 25 A<br>Rg= 10�<br>VGE= 0 V/ 15V|td(on)|−|87|−|ns|
|Rise time||tr|−|74|−||
|Turn−off delay time||td(off)|−|179|−||
|Fall time||tf|−|136|−||
|Turn−on switching loss||Eon|−|1.95|−|mJ|
|Turn−off switching loss||Eoff|−|0.60|−||
|Total switching loss||Ets|−|2.55|−||
|Turn−on delay time|TJ= 150°C<br>VCC= 600 V, IC= 25 A<br>Rg= 10�<br>VGE= 0 V/ 15V|td(on)|−|84|−|ns|
|Rise time||tr|−|94|−||
|Turn−off delay time||td(off)|−|185|−||
|Fall time||tf|−|245|−||
|Turn−on switching loss||Eon|−|2.39|−|mJ|
|Turn−off switching loss||Eoff|−|1.26|−||
|Total switching loss||Ets|−|3.65|−||
|**DIODE CHARACTERISTIC**|||||||
|Forward voltage|VGE= 0 V, IF= 25 A<br>VGE= 0 V, IF= 50 A, TJ= 175°C|VF|−<br>−|2.10<br>2.30|2.60<br>−|V|
|Reverse recovery time|TJ= 25°C<br>IF= 25 A, VR= 400 V<br>diF/dt = 200 A/�s|trr|−|154|−|ns|
|Reverse recovery charge||Qrr|−|1.3|−|�c|
|Reverse recovery current||Irrm|−|15|−|A|



Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. 

**http://onsemi.com** 

**2** 

**NGTB25N120SWG** 

## **TYPICAL CHARACTERISTICS** 

**==> picture [243 x 593] intentionally omitted <==**

**----- Start of picture text -----**<br>
100<br>90 VGEto 20 V = 13 V T J  = 25 ° C<br>80<br>70<br>11 V<br>60<br>50<br>40 10 V<br>30<br>20 9 V<br>10 7 V 8 V<br>0<br>0 1 2 3 4 5 6 7 8<br>VCE, COLLECTOR−EMITTER VOLTAGE (V)<br>Figure 1. Output Characteristics<br>10,000<br>C ies<br>1000<br>100 Coes<br>Cres<br>10<br>TJ = 25 ° C<br>1<br>0 10 20 30 40 50 60 70 80 90 100<br>VCE, COLLECTOR−EMITTER VOLTAGE (V)<br>Figure 3. Typical Capacitance<br>16<br>14<br>12<br>10<br>8<br>6<br>4 VCE = 600 V<br>VGE = 25 V<br>2 I C  = 25 A<br>0<br>0 50 100 150 200<br>QG, GATE CHARGE (nC)<br>, COLLECTOR CURRENT (A)<br>IC<br>C, CAPACITANCE (pF)<br>, GATE−EMITTER VOLTAGE (V)<br>GE<br>V<br>**----- End of picture text -----**<br>


**Figure 5. Typical Gate Charge** 

**==> picture [240 x 592] intentionally omitted <==**

**----- Start of picture text -----**<br>
100<br>TJ = 150 ° C<br>90<br>80 VGE = 13 V<br>to 20 V<br>70<br>60 11 V<br>50<br>10 V<br>40<br>30<br>9 V<br>20<br>8 V<br>10<br>7 V<br>0<br>0 1 2 3 4 5 6 7 8<br>VCE, COLLECTOR−EMITTER VOLTAGE (V)<br>Figure 2. Output Characteristics<br>40<br>35<br>TJ = 25 ° C<br>30<br>TJ = 150 ° C<br>25<br>20<br>15<br>10<br>5<br>0<br>0 0.5 1.0 1.5 2.0 2.5 3.0 3.5<br>VF, FORWARD VOLTAGE (V)<br>Figure 4. Diode Forward Characteristics<br>5<br>Eon<br>V CE  = 600 V<br>4 VTJ GE  = 150= 15 V ° C<br>Rg = 10  �<br>3<br>Eoff<br>2<br>1<br>0<br>0 10 20 30 40 50 60<br>IC, COLLECTOR CURRENT (A)<br>, COLLECTOR CURRENT (A)<br>IC<br>, FORWARD CURRENT (A)<br>IF<br>SWITCHING LOSS (mJ)<br>**----- End of picture text -----**<br>


**Figure 6. Switching Loss vs. IC** 

**http://onsemi.com** 

**3** 

**NGTB25N120SWG** 

## **TYPICAL CHARACTERISTICS** 

**==> picture [492 x 605] intentionally omitted <==**

**----- Start of picture text -----**<br>
1000 1000<br>VCE = 600 V<br>VGE = 15 V<br>TJ = 150 ° C<br>tf Rg = 10  � 100<br>t d(off)<br>100 10 dc operation<br>t d(on) 50  � s<br>Single Nonrepetitive 100  � s<br>1 Pulse TC = 25 ° C<br>Curves must be derated 1 ms<br>tr linearly with increase<br>in temperature<br>10 0.1<br>0 10 20 30 40 50 60 1 10 100 1000 10k<br>IC, COLLECTOR CURRENT (A) VCE, COLLECTOR−EMITTER VOLTAGE (V)<br>Figure 7. Switching Time vs. IC Figure 8. Safe Operating Area<br>1<br>50% Duty Cycle R � JC  = 0.39<br>0.1 20%<br>10%<br>5% Junction R 1 R 2 R n Case R i  ( ° C/W) C i  (J/ ° C)<br>0.01 2% 0.003402 0.000294<br>0.002017 0.001568<br>0.000965 0.010366<br>0.013782 0.002294<br>C1 C2 Cn 0.001409 0.070949<br>0.001<br>0.048322 0.0065442<br>Duty Factor = t1/t2 0.244018 0.4098053<br>Single Pulse Peak T J  = P DM  x Z � JC  + T C<br>0.0001<br>0.000001 0.00001 0.0001 0.001 0.01 0.1 1<br>ON−PULSE WIDTH (s)<br>Figure 9. IGBT Die Self−heating Square−wave Duty Cycle Transient Thermal Response<br>1<br>50% Duty Cycle R � JC  = 0.59<br>20% Junction R1 R2 Rn Case Ri ( ° C/W) Ci (J/ ° C)<br>0.1 0.003402 0.000294<br>10% 0.002017 0.001568<br>0.000965 0.010366<br>5% 0.013782 0.002294<br>2% C 1 C 2 C n 0.0014090.048322 0.0709490.006544<br>Duty Factor = t1/t2 0.244018 0.409805<br>Single Pulse Peak TJ = PDM x Z � JC + TC<br>0.01<br>0.000001 0.00001 0.0001 0.001 0.01 0.1 1<br>ON−PULSE WIDTH (s)<br>SWITCHING TIME (ns)<br>, COLLECTOR CURRENT (A)<br>IC<br>C/W)<br>°<br>SQUARE−WAVE PEAK R(t) (<br>C/W)<br>°<br>SQUARE−WAVE PEAK R(t) (<br>**----- End of picture text -----**<br>


**Figure 10. Diode Die Self−heating Square−wave Duty Cycle Transient Thermal Response** 

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**4** 

**NGTB25N120SWG** 

## **PACKAGE DIMENSIONS** 

**TO−247** CASE 340AL ISSUE A 

NOTES: 

1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 

2. CONTROLLING DIMENSION: MILLIMETERS. 

**==> picture [483 x 198] intentionally omitted <==**

**----- Start of picture text -----**<br>
NOTE 4 A B SEATINGPLANE 0.635 [M] B A [M] 3.4. SLOT REQUIRED, NOTCH MAY BE ROUNDED.DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH.<br>E A P NOTE 6 MOLD FLASH SHALL NOT EXCEED 0.13 PER SIDE. THESE<br>DIMENSIONS ARE MEASURED AT THE OUTERMOST<br>E2/2 EXTREME OF THE PLASTIC BODY.<br>5. LEAD FINISH IS UNCONTROLLED IN THE REGION DEFINED BY<br>E2 Q S 6. L1.∅P SHALL HAVE A MAXIMUM DRAFT ANGLE OF 1.5° TO THE<br>NOTE 4 TOP OF THE PART WITH A MAXIMUM DIAMETER OF 3.91.<br>D 7. DIMENSION A1 TO BE MEASURED IN THE REGION DEFINED<br>NOTE 3 BY L1.<br>4<br>MILLIMETERS<br>1 2 3 DIM MIN MAX<br>fey, A 4.70 5.30<br>L1 A1 2.20 2.60<br>b 1.00 1.40<br>b2 1.65 2.35<br>L NOTE 5 b4 2.60 3.40<br>c 0.40 0.80<br>D 20.30 21.40<br>E 15.50 16.25<br>E2 4.32 5.49<br>2X b2 c e 5.45 BSC<br>b4 A1 L1L 19.803.50 20.804.50<br>3X b NOTE 7 P 3.55 3.65<br>T e 0.25 [M] B A [M] QS 5.406.15 BSC6.20<br>**----- End of picture text -----**<br>


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## **PUBLICATION ORDERING INFORMATION** 

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**NGTB25N120SW/D** 

**5** 



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