# INTELLIGENT POWER MODULES

![Product image](https://novapart.co/image/farnell:3617603/)

**URL**: https://novapart.co/products/NFVA34065L32/intelligent-power-modules
**SKU**: NFVA34065L32
**Manufacturer**: ONSEMI
**Category**: Semiconductors - Discretes || Intelligent Power Modules
**Price**: €22.6100
**Stock**: 10+
**Lead Time**: 78 days (indicative)

## Specifications

| Parameter | Value |
|---|---|
| Svhc | No SVHC (25-Jun-2025) |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:3617603/)

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## ASPM 27 Series 

## **3−Phase 650 V, 40 A Automotive Smart Power Module** 

## NFVA34065L32 

## **General Description** 

NFVA34065L32 is an advanced Automotive SPM[®] module providing a fully−featured, high−performance inverter output stage for hybrid and electric vehicles. These modules integrate optimized gate drive of the built−in IGBTs to minimize EMI and losses, while also providing multiple on−module protection features including under−voltage lockouts, over−current shutdown, thermal monitoring of drive IC, and fault reporting. The built−in, high−speed HVIC requires only a single supply voltage and translates the incoming logic−level gate inputs to the high−voltage, high−current drive signals required to properly drive the module’s internal IGBTs. Separate negative IGBT terminals are available for each phase to support the widest variety of control algorithms. 

## **Features** 

- Automotive SPM in 27 Pin DIP Package 

- AEC & AQG324 Qualified and PPAP Capable 

- 650 V/40 A 3−Phase IGBT Inverter with Integral Gate Drivers and Protections 

- 175°C Guaranteed Short−Circuit Rated FS Trench IGBTs with Low Vce(sat) and Fast Switching 

- Outstanding Thermal Resistance Using AI2O3 DBC Substrate 

- Separated Open−Emitter Pins from Low−Side IGBTs for Three−Phase Current Sensing 

3D Package Drawing (Click to Activate 3D Content) 

**ASPM27−CCA CASE MODCB** 

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MARKING DIAGRAM<br>eS<br>XX<br>a<br>ON =  onsemi  Logo<br>XX = Version and Current Rate<br>XXXXXXXXXXXX = Specific Device Code<br>XXX = Lot Number<br>Y = Year<br>WW = Work Week<br>0000001 = Serial Number<br>**----- End of picture text -----**<br>


- Single−Grounded Power Supply 

- LVIC Temperature−Sensing Built−In for Temperature Monitoring 

- Isolation Rating: 2500 Vrms/1 min. 

- Pb−Free and RoHS Compliant 

## **ORDERING INFORMATION** 

See detailed ordering and shipping information on page 6 of this data sheet. 

- UI1557 Certified (File No. E209204) and UL94V−0 Compliant 

## **Applications** 

- Automotive high voltage auxiliary motors 

   - ♦ Climate e−Compressors 

   - ♦ Oil/Water Pumps 

   - ♦ Super/Turbo Chargers 

   - ♦ Variety Fans 

## **Related Resources** 

- AND9800 − Automotive Smart Power Module, 650 V ASPM27 Series 

- AN−9086 − SPM 3 Package Mounting Guidance 

## **Integrated Power Functions** 

- 650 V−40 A IGBT inverter for three−phase DC/AC power conversion (Refer to Figure 2) 

Publication Order Number: **NFVA34065L32/D** 

**1** 

© Semiconductor Components Industries, LLC, 2017 **June, 2024 − Rev. 6** 

**NFVA34065L32** 

## **Integrated Drive, Protection and System Control Functions** 

- For inverter high−side IGBTs: gate drive circuit, high−voltage isolated high−speed level shifting control circuit, Under−Voltage Lock−Out (UVLO) protection 

- For inverter low−side IGBTs: gate drive circuit, Short−Circuit Protection (SCP) control circuit, Under−Voltage Lock−Out Protection (UVLO) 

- Fault signaling: corresponding to UVLO (low−side supply) and SC faults 

- Input interface: active−HIGH interface, works with 3.3/5 V logic, Schmitt−trigger input 

## **PIN CONFIGURATION** 

**Figure 1. Top View** 

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**NFVA34065L32** 

## **PIN DESCRIPTIONS** 

|**Pin Number**<br>~~a~~|**Pin Name**|**Pin Description**|
|---|---|---|
|1<br>~~a~~|VDD(L)|Low−Side Common Bias Voltage for IC and IGBTs Driving|
|2<br>~~a~~|COM|Common Supply Ground|
|3<br>~~a~~|IN(UL)|Signal Input for Low−Side U−Phase|
|4<br>~~a~~|IN(VL)|Signal Input for Low−Side V−Phase|
|5<br>~~a~~|IN(WL)|Signal Input for Low−Side W−Phase|
|6<br>~~a~~|VFO|Fault Output|
|7<br>~~a~~|VTS|Output for LVIC Temperature Sensing Voltage Output|
|8<br>~~a~~|CSC|Shut Down Input for Short−Circuit Current Detection Input|
|9<br>~~a~~|IN(UH)|Signal Input for High−Side U−Phase|
|10<br>~~a~~|VDD(H)|High−Side Common Bias Voltage for IC and IGBTs Driving|
|11<br>~~a~~|VB(U)|High−Side Bias Voltage for U−Phase IGBT Driving|
|12<br>~~a~~|VS(U)|High−Side Bias Voltage Ground for U−Phase IGBT Driving|
|13<br>~~a~~|IN(VH)|Signal Input for High−Side V−Phase|
|14<br>~~a~~|VDD(H)|High−Side Common Bias Voltage for IC and IGBTs Driving|
|15<br>~~a~~|VB(V)|High−Side Bias Voltage for V−Phase IGBT Driving|
|16<br>~~a~~<br>~~a~~|VS(V)<br>~~es~~|High−Side Bias Voltage Ground for V−Phase IGBT Driving|
|17<br>~~a~~<br>~~a~~|IN(WH)<br>~~es~~|Signal Input for High−Side W−Phase|
|18<br>~~a~~|VDD(H)<br>~~es~~|High−Side Common Bias Voltage for IC and IGBTs Driving|
|19<br>~~a~~|VB(W)<br>|High−Side Bias Voltage for W−Phase IGBT Driving<br>|
|20<br>~~Ce~~|VS(W)<br>~~Ce~~|High−Side Bias Voltage Ground for W−Phase IGBT Driving<br>~~Ce~~|
|21<br>~~a~~|NU<br>~~a~~|Negative DC−Link Input for U−Phase<br>~~a~~|
|22<br>~~a~~|NV<br>~~a~~|Negative DC−Link Input for V−Phase<br>~~a~~|
|23<br>~~a~~|NW<br>~~a~~|Negative DC−Link Input for W−Phase<br>~~a~~|
|24<br>~~a~~|U<br>~~a~~|Output for U−Phase<br>~~a~~|
|25<br>~~a~~|V<br>~~a~~|Output for V−Phase<br>~~a~~|
|26<br>~~a~~|W<br>~~a~~|Output for W−Phase<br>~~a~~|
|27<br>~~a~~|P<br>~~a~~|Positive DC−Link Input<br>~~a~~|



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**NFVA34065L32** 

**INTERNAL EQUIVALENT CIRCUIT AND INPUT/OUTPUT PINS** 

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P (27)<br>(19) V B(W) VB<br>(18) V DD(H) VDD OUT<br>COM<br>(17) IN(WH) IN V S W (26)<br>ee (20) VS(W)<br>(15) V B(V) VB<br>(14) V DD(H) VDD OUT<br>COM<br>(13) IN(VH) IN VS V (25)<br>Left (16) VS(V) ||<br>(11) VB(U) VB<br>(10) V DD(H) VDD OUT<br>COM<br>(9) IN(UH) IN V S U (24)<br>(12) VS(U)<br>(8) C SC C SC OUT<br>(7) V TS<br>VTS N W (23)<br>(6) V FO<br>VFO<br>(5) IN(WL) IN OUT<br>(4) IN (VL)<br>IN NV (22)<br>(3) IN(UL)<br>IN<br>(2) COM<br>COM<br>(1) VDD(L) OUT<br>VDD<br>NU (21)<br>**----- End of picture text -----**<br>


NOTES: 

1. Inverter low−side is composed of three IGBTs, freewheeling diodes for each IGBT, and one control IC. It has gate drive and protection functions. 

2. Inverter power side is composed of four inverter DC−link input terminals and three inverter output terminals. 

3. Inverter high−side is composed of three IGBTs, freewheeling diodes, and three drive ICs for each IGBT. 

**Figure 2. Internal Block Diagram** 

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**NFVA34065L32** 

**ABSOLUTE MAXIMUM RATINGS** (TJ = 25 ° C unless otherwise noted) 

|**ABSOLUTE MAXIMUM RATINGS**|**ABSOLUTE MAXIMUM RATINGS**(TJ = 25J = 25= 25°C unless otherwise noted)|C unless otherwise noted)|||
|---|---|---|---|---|
|**Symbol**|**Parameter**|**Conditions**|**Rating**|**Unit**|
|**INVERTER PART**|||||
|VPN|Supply Voltage|Applied between P−NU, NV, NW|500|V|
|VPN(Surge)|Supply Voltage (Surge)|Applied between P−NU, NV, NW|550|V|
|VCES|Collector−Emitter Voltage||650|V|
|±IC|Each IGBT Collector Current|TC= 100°C, VDD ≥15 V, TJ ≤175°C|40|A|
|±ICP|Each IGBT Collector Current (Peak)|TC= 25°C, TJ ≤175°C, Under 1 ms|80|A|
|||Pulse Width|||
|PC|Collector Dissipation|TC= 25°C per One Chip|107|W|
|TJ|Operating Junction Temperature|IGBT and Diode|−40∼175|°C|
|||Driver IC|−40∼150||
|**CONTROL PART**|||||
|VDD|Control Supply Voltage|Applied between VDD(H), VDD(L)−COM|20|V|
|VBS|High−Side Control Bias Voltage|Applied between VB(U)−VS(U),|20|V|
|||VB(V)−VS(V), VB(W)−VS(W)|||
|VIN|Input Signal Voltage|Applied between IN(UH), IN(VH), IN(WH),<br>IN(UL), IN(VL), IN(WL)−COM|−0.3∼VDD+0.3|V|
|VFO|Fault Output Supply Voltage|Applied between VFO−COM|−0.3∼VDD+0.3|V|
|IFO|Fault Output Current|Sink Current at VFOpin|2|mA|
|VSC|Current Sensing Input Voltage|Applied between CSC−COM|−0.3∼VDD+0.3|V|
|**TOTAL SYSTEM**|||||
|tSC|Short Circuit Withstand Time|VDD= VBS ≤16.5 V, VPN ≤400 V,|3|s|
|||TJ= 150°C|||
|||Non−repetitive|||
|TSTG|Storage Temperature||−55∼175|°C|
|VISO|Isolation Voltage|60 Hz, Sinusoidal, AC 1 minute,|2500|Vrms|
|||Connection Pins to Heat Sink Plate|||



## **THERMAL RESISTANCE** 

|**Symbol**|**Parameter**|**Conditions**|**Min.**|**Typ.**|**Max.**|**Unit**|
|---|---|---|---|---|---|---|
|Rth(j−c)Q|Junction to Case Thermal Resistance<br>(Note 4)|Inverter IGBT part (per 1/6 module)|−|−|1.40|°C/W|
|Rth(j−c)F||Inverter FWD part (per 1/6 module)|−|−|2.20|°C/W|
|L|Package Stray Inductance|P to NU, NV, NW(Note 5)|−|24|−|nH|



4. For the measurement point of case temperature (TC), please refer to Figure 1. DBC discoloration and Picker Circle Printing allowed, please refer to application note AN−9190 (Impact of DBC Oxidation on SPM[®] Module Performance). 

5. Stray inductance per phase measured per IEC 60747−15. 

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**NFVA34065L32** 

**ELECTRICAL CHARACTERISTICS − INVERTER PART** (TJ as specified) 

|**ELECTRICAL CHARACTERISTICS − INVERTER PART**|**ELECTRICAL CHARACTERISTICS − INVERTER PART**|**ELECTRICAL CHARACTERISTICS − INVERTER PART**|**ELECTRICAL CHARACTERISTICS − INVERTER PART**(TJ as specified)J as specified)as specified)|||||
|---|---|---|---|---|---|---|---|
|**Symbol**<br>~~a~~||**Parameter**<br>~~a~~|**Conditions**|**Min.**|**Typ.**|**Max.**|**Unit**|
|VCE(SAT)<br>~~Pf~~<br>~~ee~~||Collector − Emitter Saturation Voltage<br>~~Pf~~<br>~~e~~|VDD= VBS= 15 V, VIN= 5 V,<br>IC= 40 A, TJ= 25°C|−<br>~~HE~~|1.50<br>~~HE~~|2.05<br>~~HE~~|V|
||||VDD= VBS= 15 V, VIN= 5 V,<br>IC= 40 A, TJ= 175°C<br>~~ee~~|~~HE~~<br>~~e~~|1.90<br>~~HE~~<br>~~e~~|2.50<br>~~HE~~<br>~~e~~|V<br>~~e~~|
|VF<br>~~ee~~||FWDi Forward Voltage<br>~~e~~|VIN=  0 V, IF= 40 A, TJ= 25°C<br>~~ee~~|−<br>~~e~~|1.75<br>~~e~~|2.35<br>~~e~~|V<br>~~e~~|
||||VIN=  0 V, IF= 40 A, TJ= 175°C<br>~~ee~~|~~e~~|1.70<br>~~e~~|2.30<br>~~e~~|V<br>~~e~~|
|HS<br>~~ee~~<br>~~——~~<br>~~——~~<br>~~——~~<br>~~———~~|tON<br>~~ee~~<br>~~——~~|High Side Switching Times<br>~~e~~|VPN= 300 V, VDD= 15 V, IC= 40 A,<br>TJ= 25°C<br>VIN=  0 V⇔5 V, Inductive Load<br>See Figure 5<br>(Note 6)<br>~~ee~~|0.75<br>~~e~~<br>~~ee~~|1.15<br>~~e~~<br>~~ee~~|1.75<br>~~e~~<br>~~ee~~|s<br>~~e~~<br>~~ee~~|
||tC(ON)<br>~~——~~<br>~~——~~|||−<br>~~ee~~<br>~~ee~~|0.25<br>~~ee~~<br>~~ee~~|0.75<br>~~ee~~<br>~~ee~~|s<br>~~ee~~<br>~~ee~~|
||tOFF<br>~~——~~<br>~~——~~<br>~~——~~|||−<br>~~ee~~<br>~~ee~~<br>~~ee~~|1.20<br>~~ee~~<br>~~ee~~<br>~~ee~~|1.70<br>~~ee~~<br>~~ee~~<br>~~ee~~|s<br>~~ee~~<br>~~ee~~<br>~~ee~~|
||tC(OFF)<br>~~——~~<br>~~——~~<br>~~———~~|||−<br>~~ee~~<br>~~ee~~<br>~~ee~~|0.15<br>~~ee~~<br>~~ee~~<br>~~ee~~|0.50<br>~~ee~~<br>~~ee~~<br>~~ee~~|s<br>~~ee~~<br>~~ee~~<br>~~ee~~|
||trr<br>~~——~~<br>~~———~~|||−<br>~~ee~~<br>~~ee~~|0.14<br>~~ee~~<br>~~ee~~|−<br>~~ee~~<br>~~ee~~|s<br>~~ee~~<br>~~ee~~|
|LS<br>~~———~~<br>~~——~~<br>~~——~~<br>~~——~~<br>~~——~~|tON<br>~~———~~<br>~~——~~|Low Side Switching Times|VPN= 300 V, VDD= 15 V, IC= 40 A,<br>TJ= 25°C<br>VIN=  0 V⇔5 V, Inductive Load<br>See Figure 5<br>(Note 6)|0.60<br>~~ee~~<br>~~ee~~|1.00<br>~~ee~~<br>~~ee~~|1.60<br>~~ee~~<br>~~ee~~|s<br>~~ee~~<br>~~ee~~|
||tC(ON)<br>~~——~~<br>~~——~~|||−<br>~~ee~~<br>~~ee~~|0.25<br>~~ee~~<br>~~ee~~|0.70<br>~~ee~~<br>~~ee~~|s<br>~~ee~~<br>~~ee~~|
||tOFF<br>~~——~~<br>~~——~~<br>~~——~~|||−<br>~~ee~~<br>~~ee~~<br>~~ee~~|1.25<br>~~ee~~<br>~~ee~~<br>~~ee~~|1.75<br>~~ee~~<br>~~ee~~<br>~~ee~~|s<br>~~ee~~<br>~~ee~~<br>~~ee~~|
||tC(OFF)<br>~~——~~<br>~~——~~<br>~~——~~|||−<br>~~ee~~<br>~~ee~~<br>~~ee~~|0.20<br>~~ee~~<br>~~ee~~<br>~~ee~~|0.55<br>~~ee~~<br>~~ee~~<br>~~ee~~|s<br>~~ee~~<br>~~ee~~<br>~~ee~~|
||trr<br>~~——~~<br>~~——~~|||−<br>~~ee~~<br>~~ee~~|0.14<br>~~ee~~<br>~~ee~~|−<br>~~ee~~<br>~~ee~~|s<br>~~ee~~<br>~~ee~~|
|ICES<br>~~——~~<br>~~a~~||Collector−Emitter Leakage Current<br>~~a~~|TJ= 25°C, VCE=  VCES<br>~~a~~|−<br>~~ee~~<br>~~a~~|−<br>~~ee~~<br>~~a~~|3<br>~~ee~~<br>~~a~~|mA<br>~~ee~~<br>~~a~~|



6. tON and tOFF include the propagation delay time of the internal drive IC. tC(ON) and tC(OFF) are the switching time  of IGBT itself under the given gate driving condition internally. For the detailed information see Figure 3. 

**PACKAGE MARKING AND ORDERING INFORMATION** 

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Part Number Top Marking Package Shipping<br>NFVA34065L32 NFVA34065L32 ASPM27−CCA 10 Units/Tube<br>eT<br>100% IC 100% IC<br>trr<br>VCE IC IC VCE<br>VIN VIN<br>tON tOFF<br>tc(ON) tc(OFF)<br>10% IC<br>VIN(ON) 90% IC 10% VCE VIN(OFF) 10% VCE 10% IC<br>(a) turn − on (b) turn − off<br>**----- End of picture text -----**<br>


**Figure 3. Switching Time Definition** 

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**NFVA34065L32** 

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One−Leg Diagram IC<br>DBS<br>CBS VDD VB<br>COM OUT LS Switching<br>RBS<br>IN VS<br>HS Switching VPN<br>U,V,W<br>V<br>Inductor<br>LS Switching IN 300 V<br>VDD<br>5 V VIN V =—t CC 4.7 k VVTSFO OUT HS Switching | 7T¢<br>0 V CSC<br>V COM<br>+15 V NU,V,W<br>V<br>+5 V<br>**----- End of picture text -----**<br>


**Figure 4. Example Circuit for Switching Test** 

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4000 Inductive Load, V PN = 300V, VDD=15V, TJ=25 ℃ 4000 Inductive Load, V PN = 300V, VDD=15V, TJ=150 ℃<br> IGBT Turn−on, Eon  IGBT Turn−on, Eon<br>3500  IGBT Turn−off, Eoff 3500  IGBT Turn−off, Eoff<br> FRD Turn−off, Erec FRD Turn−off, Erec<br>3000 3000<br>2500 2500<br>2000 2000<br>1500 1500<br>1000 1000<br>500 500<br>0 0<br>0 10 20 30 40 0 10 20 30 40<br>COLLECTOR CURRENT, IC [AMPERES] COLLECTOR CURRENT, IC [AMPERES]<br> [uJ]  [uJ]<br>SW SW<br>SWITCHING LOSS E SWITCHING LOSS E<br>**----- End of picture text -----**<br>


**Figure 5. Switching Loss Characteristics** 

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3.5<br>3.0<br>Sood aaad Gaceeee<br>2.5<br>So Go SG ee cee<br>2.0<br>SOSSGSGoGS Sanna<br>1.5 ppp<br>1.0 ee epee pee<br>esee<br>0.5<br>0 SaeeGgGaGaeaeeee<br>0 20 40 60 80 100 120 140 160<br>TLVIC [ ° C]<br>[V]<br>TS<br>V<br>**----- End of picture text -----**<br>


**Figure 6. Temperature Profile of VTS (Typical)** 

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**NFVA34065L32** 

## **CONTROL PART** (TJ = 25 ° C) 

|**CONTROL PART**|**CONTROL PART**(TJ = 25J = 25= 25°C)|||||||
|---|---|---|---|---|---|---|---|
|**Symbol**|**Parameter**|**Conditions**||**Min.**|**Typ.**|**Max.**|**Unit**|
|IQDDH<br>~~pf~~|Quiescent VDDSupply Current<br>~~pf~~|VDD(H)= 15 V,<br>IN(UH,VH.WH)= 0 V<br>~~pf~~|VDD(H)− COM|−|−|0.40|mA|
|IQDDL<br>~~pf~~||VDD(L)= 15 V,<br>IN(UL,VL.WL)= 0 V<br>~~pf~~|VDD(L)− COM|−|−|4.80|mA|
|IPDDH|Operating VDDSupply Current|VDD(H)= 15 V, fPWM= 20 kHz,<br>duty = 50%, applied to one<br>PWM signal input for High−<br>Side|VDD(H)− COM|−|−|0.48|mA|
|IPDDL||VDD(L)= 15 V, fPWM= 20 kHz,<br>duty = 50%, applied to one<br>PWM signal input for Low−<br>Side|VDD(L)− COM|−|−|8.80|mA|
|IQBS|Quiescent VBSSupply Current|VBS= 15 V,<br>IN(UH,VH.WH)= 0 V|VB(U)− VS(U),<br>VB(V)− VS(V),<br>VB(W)− VS(W),|−|−|0.24|mA|
|IPBS<br>~~|~~|Operating VBSSupply Current|VDD= VBS= 15 V,<br>fPWM= 20 kHz, duty = 50%,<br>applied to one PWM signal<br>input for High−Side<br>~~ee~~|VB(U)− VS(U),<br>VB(V)− VS(V),<br>VB(W)− VS(W),<br>~~ee~~|−<br>~~eee~~|−<br>~~eee~~|4.40<br>~~eee~~|mA<br>~~eee~~|
|VFOH<br>~~|~~<br>~~|~~|Fault Output Voltage|VDD= 15 V, VSC= 0 V, VFOCircuit: 4.7 k to 5 V<br>Pull−up<br>~~ee~~<br>~~ee ee~~||4.5<br>~~eee~~<br>~~ee~~|−<br>~~eee~~<br>~~ee~~|−<br>~~eee~~<br>~~ee~~|V<br>~~eee~~<br>~~ee~~|
|VFOL<br>~~|~~<br>~~|~~||VDD= 15 V, VSC= 1 V, VFOCircuit: 4.7 k to 5 V<br>Pull−up<br>~~ee ~~<br>~~ee ee~~||−<br> ~~eee~~<br>~~ee~~|−<br>~~eee~~<br>~~ee~~|0.50<br>~~eee~~<br>~~ee~~|V<br>~~eee~~<br>~~ee~~|
|VSC(ref)<br>~~|~~<br>~~a~~|Short Circuit Trip Level<br>~~a~~<br>~~a~~|VDD= 15 V (Note 7)<br>~~ee~~<br>~~a~~|CSC− COM(L)<br>~~ee ee~~|0.45<br>~~ee~~|0.50<br>~~ee~~|0.55<br>~~ee~~|V<br>~~ee~~|
|UVDDD<br>~~a~~|Supply Circuit Under−Voltage<br>Protection<br>~~a ~~<br>~~a~~<br>~~a~~<br>~~a~~|Detection Level<br> ~~a~~||9.80<br>~~a~~|−<br>~~a~~|13.3<br>~~a~~|V<br>~~a~~|
|UVDDR<br>~~a~~||Reset Level<br>~~a~~<br>~~a~~||10.3<br>~~a~~<br>~~a~~|−<br>~~a~~<br>~~a~~|13.8<br>~~a~~<br>~~a~~|V<br>~~a~~<br>~~a~~|
|UVBSD<br>~~a~~||Detection Level<br>~~a~~<br>~~a~~||9.00<br>~~a~~<br>~~a~~|−<br>~~a~~<br>~~a~~|12.5<br>~~a~~<br>~~a~~|V<br>~~a~~<br>~~a~~|
|UVBSR<br>~~a~~||Reset Level<br>~~a~~<br>~~a~~||9.50<br>~~a~~<br>~~a~~|−<br>~~a~~<br>~~a~~|13.0<br>~~a~~<br>~~a~~|V<br>~~a~~<br>~~a~~|
|tFOD<br>~~a~~<br>|Fault−Out Pulse Width<br>~~a~~<br>~~a~~|~~a~~<br>||50<br>~~a~~<br>|−<br>~~a~~<br>|−<br>~~a~~<br>|s<br>~~a~~<br>|
|VTS<br>~~ee~~|LVIC Temperature Sensing<br>Voltage Output<br>~~ee~~|VDD(L)= 15 V, TLVIC= 25°C (Note 8)<br>See Figure 6<br>~~ee~~||540<br>~~ee~~|640<br>~~ee~~|740<br>~~ee~~|mV<br>~~ee~~|
|VIN(ON)<br>~~ee~~<br>~~rs~~|ON Threshold Voltage<br>~~ee~~|Applied between IN(UH,VH.WH)− COM<br>IN(UL,VL.WL)− COM<br>~~ee~~||−<br>~~ee~~<br>~~yy~~|−<br>~~ee~~<br>~~yy~~|2.60<br>~~ee~~<br>~~yy~~|V<br>~~ee~~<br>~~yy~~|
|VIN(OFF)<br>~~ee~~<br>~~rs~~|OFF Threshold Voltage<br>~~ee~~|||0.80<br>~~ee~~<br>~~yy~~|−<br>~~ee~~<br>~~yy~~|−<br>~~ee~~<br>~~yy~~|V<br>~~ee~~<br>~~yy~~|



8. TLVIC is the temperature of LVIC itself. VTS is only for sensing temperature of LVIC and can not shutdown IGBTs automatically. 

## **RECOMMENDED OPERATING CONDITIONS** 

|~~a~~||~~ee~~|||||
|---|---|---|---|---|---|---|
|**Symbol**<br>~~ee~~<br>~~a~~|**Parameter**<br>~~ee ~~|**Conditions**<br> ~~ee~~|**Value**<br>~~a}~~|||**Unit**<br>~~a}~~|
||||**Min.**<br>~~a}~~|**Typ.**<br>~~a}~~|**Max.**<br>~~a}~~||
|VPN<br><br>~~a~~|Supply Voltage<br> <br>~~a~~|Applied between P − NU, NV, NW<br> ~~ee~~|−|300|400|V|
|VDD<br>~~a~~|Control Supply Voltage<br>~~a~~<br>~~a~~|Applied between VDD(H)− COM, VDD(L)− COM<br>~~a~~<br>~~a~~|14.0<br>~~a~~<br>~~a~~|15<br>~~a~~<br>~~a~~|16.5<br>~~a~~<br>~~a~~|V<br>~~a~~<br>~~a~~|
|VBS|High−Side Bias Voltage|Applied between VB(U)− VS(U), VB(V)− VS(V),<br>VB(W)− VS(W)|13.0|15|18.5|V|
|dVDD/dt,<br>dVBS/dt,<br>~~a~~<br>~~a~~|Control Supply Variation<br>~~a~~<br>~~ee~~<br>|~~a~~<br>~~ee~~|−1<br>~~a~~<br>~~ee~~<br>~~ee~~|−<br>~~a~~<br>~~ee~~|1<br>~~a~~<br>~~ee~~|V/ s<br>~~a~~<br>~~ee~~|
|tdead<br>~~a~~<br>~~a~~|Blanking Time for Preventing<br>Arm−Short<br>~~ee~~<br>|For Each Input Signal<br>~~ee~~|2.0<br>~~ee~~<br>~~ee~~|−<br>~~ee~~|−<br>~~ee~~|s<br>~~ee~~|
|fPWM<br>~~a ~~|PWM Input Signal<br> ~~a~~|−40°C≤TC≤125°C, −40°C≤TJ≤150°C<br>~~a~~|−<br>~~ee~~|−|20|kHz|
|VSEN|Voltage for Current Sensing|Applied between NU, NV, NW− COM<br>(Including Surge Voltage)|−5|−|5|V|



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**8** 

**NFVA34065L32** 

**RECOMMENDED OPERATING CONDITIONS** (continued) 

PWIN(ON) Minimum Input Pulse Width VDD = VBS = 15 V, IC ≤ 40 A, Wiring Inductance 2.0 − − s between NU,V,W and DC Link N < 10 nH PWIN(OFF) (Note 9) 2.0 − − ~~ee | P|]~~ PWIN(ON) VDD = VBS = 15 V, 40 A ≤ IC ≤ 80 A, Wiring Induc2.5 − − s ~~re~~ tance between NU,V,W and DC Link N < 10 nH PWIN(OFF) (Note 9) 2.5 − − ~~| P| |~~ TJ Junction Temperature −40 − 150 ° C ~~ae esGe~~ 9. This product might not make response if input pulse width is less than the recommended value. **MECHANICAL CHARACTERISTICS AND RATINGS Value Parameter Conditions Min. Typ. Max. Unit** ~~ee ee~~ Device Flatness ~~ee~~ See Figure 7 ~~|~~ 0 ~~|~~ − ~~ht~~ +150 m Mounting Torque Mounting Screw: M3 Recommended 0.7 N • m 0.6 0.7 0.8 N • m See Figure 8 Recommended 7.1 kg • cm 6.2 7.1 8.1 kg • cm ~~aee ee~~ Terminal Pulling Strength ~~Me~~ Load 19.8 N ~~ee~~ 10 ~~ee~~ − ~~ee~~ − s Terminal Bending Strength Load 9.8 N 90 deg. bend 2 − − times ~~a ss~~ Weight − 15 − g ~~es~~ 

9. This product might not make response if input pulse width is less than the recommended value. 

## **( + )** 

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( + )<br>**----- End of picture text -----**<br>


**Figure 7. Flatness Measurement Position** 

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**----- Start of picture text -----**<br>
Pre−Screwing:  1  →  2<br>Final Screwing: 2  →  1<br>**----- End of picture text -----**<br>


## NOTES: 

- 10.Do not make over torque when mounting screws. Much mounting torque may cause DBC cracks, as well as bolts and Al heat−sink destruction 

11. Avoid one−sided tightening stress. Figure 8 shows the recommended torque order for mounting screws. Uneven mounting can cause ∼ 

the DBC substrate of package to be damaged. The pre−screwing torque is set to 20 30% of maximum torque rating. 

**Figure 8. Mounting Screws Torque Order** 

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**9** 

**NFVA34065L32** 

**==> picture [334 x 181] intentionally omitted <==**

**----- Start of picture text -----**<br>
Input signal<br>Protection<br>Circuit State RESET SET RESET<br>UVDDR<br>a1 a6<br>Control UVDDD a3<br>Supply Voltage<br>a2<br>a4 a7<br>Output Current<br>a5<br>Fault Output Signal<br>SO Lg<br>**----- End of picture text -----**<br>


a1: Control supply voltage rises: After the voltage rises UVDDR, the circuits start to operate when next input is applied. a2: Normal operation: IGBT ON and carrying current. 

a3: Under voltage detection (UVDDD). 

a4: IGBT OFF in spite of control input condition. 

a5: Fault output operation starts with a fixed pulse width. 

a6: Under voltage reset (UVDDR). 

a7: Normal operation: IGBT ON and carrying current by triggering next signal from LOW to HIGH. 

**Figure 9. Under−Voltage Protection (Low−Side)** 

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**----- Start of picture text -----**<br>
Input signal<br>Protection<br>Circuit State RESET SET RESET<br>UVBSR<br>b1 b5<br>Control UVBSD b3<br>Supply Voltage b6<br>b2<br>b4<br>Output Current<br>−<br>High level (no fault output)<br>Fault Output Signal<br>**----- End of picture text -----**<br>


- b1: Control supply voltage rises: After the voltage rises UVBSR, the circuits start to operate when next input is applied. b2: Normal operation: IGBT ON and carrying current. 

- b3: Under voltage detection (UVBSD). 

- b4: IGBT OFF in spite of control input condition, but there is no fault output signal. b5: Under voltage reset (UVBSR). 

- b6: Normal operation: IGBT ON and carrying current by triggering next signal from LOW to HIGH. 

**Figure 10. Under−Voltage Protection (High−Side)** 

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**NFVA34065L32** 

**==> picture [266 x 230] intentionally omitted <==**

**----- Start of picture text -----**<br>
Lower Arms<br>Control Input c6 c7<br>Protection<br>Circuit State SET RESET<br>Internal IGBT c3 [c4]<br>Gate−Emitter Voltage c2 Internal delay<br>at protection circuit<br>SC current trip level<br>c8<br>c1<br>Output Current<br>SC reference voltage<br>Sensing Voltage<br>of Sense Resistor<br>Fault Output Signal c5 RC filter circuit<br>time constant<br>delay<br>**----- End of picture text -----**<br>


(with the external sense resistance and RC filter connection) 

c1: Normal operation: IGBT ON and carrying current. 

- c2: Short circuit current detection (SC trigger). 

c3: All low−side IGBT’s gate are hard interrupted. 

c4: All low−side IGBTs turn OFF. 

- c5: Fault output operation starts with a fixed pulse width. 

- c6: Input HIGH: IGBT ON state, but during the active period of fault output the IGBT doesn’t turn ON. 

- c7: Fault output operation finishes, but IGBT doesn’t turn on until triggering next signal from LOW to HIGH. 

- c8: Normal operation: IGBT ON and carrying current. 

**Figure 11. Short−Circuit Current Protection (Low−Side Operation Only)** 

## **INPUT/OUTPUT INTERFACE CIRCUIT** 

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**----- Start of picture text -----**<br>
+5V (MCU or Control power)<br>4.7 k Ω ASPM (WH)<br>IN(UH), IN(VH), IN(WH)<br>ee Oe| IN(UL), IN(VL), IN(WL)<br>MCU<br>VFO<br>COM<br>**----- End of picture text -----**<br>


## NOTE: 

- 12.RC coupling at each input might change depending on the PWM control scheme used in the application and the wiring impedance of the application’s printed circuit board. The input signal section of the ASPM27 product integrates 5k (typ.) pull−down resistor. Therefore, when using an external filtering resistor, please pay attention to the signal voltage drop at input terminal. 

## **Figure 12. Recommended CPU I/O Interface Circuit** 

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**NFVA34065L32** 

**==> picture [417 x 292] intentionally omitted <==**

**----- Start of picture text -----**<br>
Gating WH R1 (17) IN(WH) IN P (27)<br>(18) VDD(WH) VDD<br>R2 D1D2 C3 CC4 4 (20) V(19) VB(W)S(W) COMVB OUTVS W (26)<br>Gating VH R1 (13) IN(VH) IN<br>(14) VDD(VH) VDD<br>R2 D1D2 C3 CC 4 4 (15) V(16) VB(V)S(V) COMVB OUTVS V (25) M<br>M Gating UH R1 (9) IN(UH) IN<br>CU C1 C1 C1 5V line R2 D1D2 C3 CC 4 4 (12) V(11) V(10) VS(U)DD(UH)B(U) COMVVDDB OUTVS U (24) C7 VDC<br>VTS R3<br>B DR6 C6 (8) CSC CSC OUT<br>Fault R1 C5 (7) V(6) VTSFO VVTSFO NW (23) R4 A<br>Gating WL R1 (5) IN(WL) IN OUT<br>Gating ULGating VL RR11 (4) IN(3) IN(VL)(UL) ININ NV (22) R4 E<br>C1 C1 C1 C1 C1 15V line (1) V(2) COMDD(L) COMVDD OUT NU (21) R4 GND LinePower<br>D2 C2 C4<br>C<br>PET Gap W−Phase Current tt R5 Control<br>Input Signal for V−Phase Current R5 GND Line<br>Short−Circuit Protection U−Phase Current R5<br>C5 C5 C5<br>Lf<br>**----- End of picture text -----**<br>


NOTES: 

- 13.To avoid malfunction, the wiring of each input should be as short as possible. (less than 2−3 cm) 

- 14.VFO output is open−drain type. The signal line should be pulled up to the positive side of the MCU or control power supply with a resistor that makes IFO up to 2mA. Refer to Figure 12. 

- 15.Input signal is active−HIGH type. There is a 5 k resistor inside the IC to pull−down each input signal line to GND. RC coupling circuits should be adopted for the prevention of input signal oscillation. R1C1 time constant should be selected in the range 50 ∼ 150 ns. (Recommended R1 = 100 C1 = 1 nF) 

- 16.Each wiring pattern inductance of A point should be minimized (Recommended less than 10 nH). Use the shunt resistor R4 of surface mounted (SMD) type to reduce wiring inductance. To prevent malfunction, wiring of point E should be connected to the terminal of the shunt resistor R4 as close as possible. 

- 17.To prevent errors of the protection function, the wiring of B, C and D point should be as short as possible. 

- 18.In the short−circuit protection circuit, please select the R6C6 time constant in the range 1.5 ∼ 2 s. 

- 19.Each capacitor should be mounted as close to the pins of the ASPM27 product as possible. 

- 20.To prevent surge destruction, the wiring between the smoothing capacitor C7 and the P & GND pins should be as short as possible. The use of a high−frequency non−inductive capacitor between the P & GND pins is recommended. 

- 21.Relays are used at almost every systems of electrical equipment at industrial application. In these cases, there should be sufficient distance between the CPU and the relays. 

- 22.The zener diode or transient voltage suppressor should be adopted for the protection of ICs from the surge destruction between each pair of control supply terminals (Recommended zener diode is 22 V/1 W. which has the lower zener impedance characteristic than about 15 ). 

- 23.C2 of around 7 times larger than bootstrap capacitor C3 is recommended. 

- 24.Choose the electrolytic capacitor with good temperature characteristic in C3. Also choose 0.1 ∼ 0.2 F R−category ceramic capacitors with good temperature and frequency characteristics in C4. 

## **Figure 13. Typical Application Circuit** 

SPM is a registered trademark of Semiconductor Components Industries, LLC dba “ **onsemi** ” or its affiliates and/or subsidiaries in the United States and/or other countries. 

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MECHANICAL CASE OUTLINE **PACKAGE DIMENSIONS** 

## **27LD MODULE PDD STD** CASE MODCB ISSUE A 

DATE 30 JAN 2023 

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**----- Start of picture text -----**<br>
Electronic versions are uncontrolled except when accessed directly from the Document Repository.<br>DOCUMENT NUMBER: 98AON13500G Printed  versions are uncontrolled  except when stamped  “CONTROLLED COPY” in red.<br>DESCRIPTION: 27LD MODULE PDD STD PAGE 1 OF 1<br>**----- End of picture text -----**<br>


**onsemi** and                     are trademarks of Semiconductor Components Industries, LLC dba **onsemi** or its subsidiaries in the United States and/or other countries. **onsemi** reserves the right to make changes without further notice to any products herein. **onsemi** makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does **onsemi** assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. **onsemi** does not convey any license under its patent rights nor the rights of others. 

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© Semiconductor Components Industries, LLC, 2016 

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