# Power MOSFET, N Channel, 60 V, 4 A, 0.1 ohm, SOT-223, Surface Mount

![Product image](https://novapart.co/image/farnell:1471071RL/)

**URL**: https://novapart.co/products/NDT3055/power-mosfet-n-channel-60-v-4-a-01-ohm-sot-223
**SKU**: NDT3055
**Manufacturer**: ONSEMI
**Category**: Semiconductors - Discretes || FETs || Single MOSFETs
**Price**: €0.3410
**Stock**: 1000+
**Lead Time**: 127 days (indicative)

## Description

Transistor Polarity:N Channel; Continuous Drain Current Id:4A; Drain Source Voltage Vds:60V; On Resistance Rds(on):0.1ohm; Rds(on) Test Voltage Vgs:10V; Threshold Voltage Vgs:3V; Power Dissipatio

## Specifications

| Parameter | Value |
|---|---|
| Msl | MSL 1 - Unlimited |
| Svhc | No SVHC (25-Jun-2025) |
| No. Of Pins | 4Pins |
| Channel Type | N Channel |
| Product Range | - |
| Qualification | - |
| Power Dissipation | 3W |
| Transistor Mounting | Surface Mount |
| Rds(On) Test Voltage | 10V |
| Transistor Case Style | SOT-223 |
| Drain Source Voltage Vds | 60V |
| Operating Temperature Max | 150°C |
| Continuous Drain Current Id | 4A |
| Drain Source On State Resistance | 0.1ohm |
| Gate Source Threshold Voltage Max | 3V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:1471071RL/)

## **Is Now Part of** 

**To learn more about ON Semiconductor, please visit our website at www.onsemi.com** 

ON Semiconductor and the ON Semiconductor logo are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent-Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. 

FAIRCHILD re 

May  1998 

SEMICONDUCTOR m 

## **NDT3055** 

## **N-Channel Enhancement Mode Field Effect Transistor** 

## **General  Description                                                               Features** 

These N-Channel enhancement mode power field effect transistors are produced using Fairchild's proprietary, high cell density, DMOS technology. This very high density process is especially tailored to minimize on-state resistance and provide superior switching performance. These devices are particularly suited for low voltage applications such as DC motor control and DC/DC conversion where fast switching, low in-line power loss, and resistance to transients are needed. 

- 4 A, 60 V. RDS(ON) = 0.100 Ω @ VGS = 10 V. 

- High density cell design for extremely low RDS(ON). 

- High power and current handling capability in a widely used surface mount package. 

**==> picture [430 x 149] intentionally omitted <==**

**----- Start of picture text -----**<br>
SuperSOTTM-3 SuperSOTTM-6 SuperSOTTM-8 SO-8 SOT-223 SOIC-16<br>D D D D<br>S S<br>D<br>G G D S G G S<br>SOT-223<br>SOT-223*<br>(J23Z)<br>**----- End of picture text -----**<br>


|**Absolute Maximum Ratings**TA= 25<br>oC unless  otherwise  noted|**Absolute Maximum Ratings**TA= 25<br>oC unless  otherwise  noted|**Absolute Maximum Ratings**TA= 25<br>oC unless  otherwise  noted|**Absolute Maximum Ratings**TA= 25<br>oC unless  otherwise  noted|||
|---|---|---|---|---|---|
|**Symbol**|**Parameter**|||**NDT3055**|**Units**|
|VDSS|Drain-Source Voltage|||60|V|
|VGSS|Gate-Source Voltage - Continuous|||±20|V|
|ID|Maximum Drain Current - Continuous|Maximum Drain Current - Continuous(Note 1a)||4|A|
||- Pulsed|||25||
|PD|Maximum Power Dissipation(Note 1a)|(Note 1a)||3|W|
||(Note 1b)|(Note 1b)||1.3||
||(Note 1c)|(Note 1c)||1.1||
|TJ,TSTG|Operating and Storage Temperature Range|||-65 to 150|°C|
|**THERMAL CHARACTERISTICS**||||||
|RθJA|Thermal Resistance, Junction-to-Ambient(Note 1a)|||42|°C/W|
|RθJC|Thermal Resistance, Junction-to-Case|Thermal Resistance, Junction-to-Case(Note 1)||12|°C/W|



* Order option J23Z for cropped center drain lead. 

NDT3055 Rev.B 

© 1998 Fairchild Semiconductor Corporation 

## **Electrical Characteristics** (TA = 25[O] C unless otherwise noted ) 

|**Electrical**|**Characteristics **(TA= 25OC unless other|wise noted )|wise noted )|||||
|---|---|---|---|---|---|---|---|
|**Symbol**|**Parameter**<br>|**Conditions**||**Min**|**Typ**|**Max**|**Units**|
|**OFF CHARACTERISTICS**||||||||
|BVDSS|Drain-Source Breakdown Voltage<br>|VGS= 0 V, ID = 250 µA||60|||V|
|∆BVDSS/∆TJ|Breakdown Voltage Temp. Coefficient<br>I|D= 250 µA, Referenced to  25<br>oC|||63||mV/<br>oC|
|IDSS|Zero Gate Voltage  Drain Current<br>|VDS= 48 V, VGS = 0 V||||10|µA|
||||TJ =125°C|||100|µA|
|IGSSF|Gate - Body Leakage, Forward<br>|VGS= 20 V, VDS= 0 V||||100|nA|
|IGSSR|Gate - Body Leakage, Reverse<br>|VGS= -20 V, VDS= 0 V||||-100|nA|
|**ON CHARACTERISTICS**(Note 2)||||||||
|VGS(th)|Gate Threshold Voltage<br>|VDS=  VGS,  ID= 250 µA||2|3|4|V|
||||TJ =125°C|1.5|2.4|3||
|RDS(ON)|Static Drain-Source On-Resistance<br>|VGS= 10 V,  ID= 4 A|||0.084|0.1|Ω|
||||TJ =125°C||0.14|0.18||
|ID(ON)|On-State Drain Current<br>|VGS= 10 V, VDS= 10 V||15|||A|
|gFS|Forward Transconductance<br>|VDS= 15 V,  ID= 4 A|||6||S|
|**DYNAMIC CHARACTERISTICS**||||||||
|Ciss|Input Capacitance<br><br> <br>Output Capacitance<br>Reverse Transfer Capacitance|VDS= 30 V,  VGS= 0 V,<br>f  = 1.0 MHz|||250||pF|
|Coss|||||100||pF|
|Crss|||||30||pF|
|**SWITCHING CHARACTERISTICS**(Note 2)||||||||
|tD(on)|Turn - On Delay Time<br><br><br>Turn - On Rise Time<br>Turn - Off Delay Time<br>Turn - Off Fall Time|VDD= 25 V,  ID= 1.2 A,<br>VGS= 10 V,  RGEN= 50Ω|||10|25|ns|
|tr|||||18|50|ns|
|tD(off)|||||37|65|ns|
|tf|||||30|60|ns|
|Qg|Total Gate Charge<br><br><br>Gate-Source Charge<br>Gate-Drain Charge|VDS= 40 V,  ID= 4 A,<br>VGS= 10 V|||9|15|nC|
|Qgs|||||2.3||nC|
|Qgd|||||2.6||nC|
|**DRAIN-SOURCE DIODE CHARACTERISTICS AND MAXIMUM RATINGS**||||||||
|IS|Maximum Continuous Drain-Source Diode Forward Current|||||2.5|A|
|VSD|Drain-Source Diode Forward Voltage<br>|VGS= 0 V,  IS= 2.5 A (Note|2)||0.85|1.2|V|



Notes: 

1. RθJA is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the  solder mounting surface of              the drain pins. RθJC is guaranteed by design while RθCA is determined by the user's board design. 

Typical RθJA using the board layouts shown below on  FR-4 PCB in a still air environment: 

**==> picture [89 x 84] intentionally omitted <==**

|a. 42<br>oC/W when mounted on a 1 in<br>2pad of<br>2oz Cu.||b. 95<br>oC/W when mounted on a      0.066 in<br>2<br>pad of 2oz Cu.<br>c. 110<br>oC/W when mounted on a 0.00123<br>in<br>2pad of 2oz Cu.|b. 95<br>oC/W when mounted on a      0.066 in<br>2<br>pad of 2oz Cu.<br>c. 110<br>oC/W when mounted on a 0.00123<br>in<br>2pad of 2oz Cu.|b. 95<br>oC/W when mounted on a      0.066 in<br>2<br>pad of 2oz Cu.<br>c. 110<br>oC/W when mounted on a 0.00123<br>in<br>2pad of 2oz Cu.|
|---|---|---|---|---|
||||c<br>i||
|||||. 110<br>oC/W when mounted on a 0.00123<br>n<br>2pad of 2oz Cu.|
||||||



Scale 1 : 1 on letter size paper 

2. Pulse Test: Pulse Width < 300µs, Duty Cycle < 2.0% 

NDT3055 Rev.B 

## **Typical Electrical Characteristics** 

**==> picture [217 x 130] intentionally omitted <==**

**----- Start of picture text -----**<br>
15<br>V     =10VGS<br> 8.0V<br>12  7.0V<br>9<br> 6.0V<br>6<br> 5.5V<br>3  5.0V<br>4.5V<br>0<br>0 1 2 3 4 5<br>V     , DRAIN-SOURCE VOLTAGE (V)DS<br>I   , DRAIN-SOURCE CURRENT (A)D<br>**----- End of picture text -----**<br>


**Figure 1. On-Region Characteristics.** 

**==> picture [217 x 130] intentionally omitted <==**

**----- Start of picture text -----**<br>
2<br>I   = 4AD<br>V     =10VGS<br>1.6<br>1.2<br>0.8<br>0.4<br>-50 -25 0 25 50 75 100 125 150<br>T  , JUNCTION TEMPERATURE (°C)J<br>DS(ON)<br>R             , NORMALIZED<br>DRAIN-SOURCE ON-RESISTANCE<br>**----- End of picture text -----**<br>


## **Figure 3. On-Resistance Variation with Temperature.** 

**==> picture [210 x 130] intentionally omitted <==**

**----- Start of picture text -----**<br>
10<br>V     = 10VDS T  = -55°CJ 25°C125°C<br>8<br>6<br>4<br>2<br>0<br>2 4 6 8<br>V     , GATE TO SOURCE VOLTAGE (V)GS<br>I   , DRAIN CURRENT (A)D<br>**----- End of picture text -----**<br>


**Figure  5. Transfer Characteristics.** 

**==> picture [215 x 307] intentionally omitted <==**

**----- Start of picture text -----**<br>
3<br>V     = 5.5VGS<br>2.5  6.0V<br> 6.5V<br>2  7.0V<br>1.5  8.0V<br> 10V<br>1<br>0.5<br>0 4 8 12 16 20<br>I   , DRAIN CURRENT (A)D<br>Figure 2. On-Resistance Variation with<br>                      Drain Current and Gate Voltage.<br>0.4<br>I   = 2AD<br>0.3<br>0.2 T  = 125°C A<br>0.1<br>T  = 25°CA<br>0<br>4 6 8 10<br>V    , GATE TO SOURCE VOLTAGE (V)GS<br>DS(ON)<br>R            , NORMALIZED<br>DRAIN-SOURCE ON-RESISTANCE<br>DS(ON)<br>R           , ON-RESISTANCE (OHM)<br>**----- End of picture text -----**<br>


**Figure 4. On-Resistance Variation with** 

**Gate-to- Source Voltage.** 

**==> picture [190 x 123] intentionally omitted <==**

**----- Start of picture text -----**<br>
10<br>V     = 0VGS<br>1 T  A = 125°C<br>0.1 25°C<br>0.01 -55°C<br>0.001<br>0.0001<br>0 0.2 0.4 0.6 0.8 1 1.2<br>V     , BODY DIODE FORWARD VOLTAGE (V)SD<br>I   , REVERSE DRAIN CURRENT (A)S<br>**----- End of picture text -----**<br>


**Figure 6.  Body Diode Forward Voltage Variation with Current and Temperature.** 

NDT3055 Rev.B 

## **Typical Electrical Characteristics (continued)** 

**==> picture [449 x 308] intentionally omitted <==**

**----- Start of picture text -----**<br>
15 1000<br>I    = 4AD V     = 10VDS<br>20V 500<br>12<br>40V<br>C   iss<br>200<br>9<br>C  oss<br>100<br>6<br>50 C  rss<br>3<br>f = 1 MHz<br>20 V     = 0VGS<br>0<br>0 3 6 9 12 15 10<br>Q   , GATE CHARGE (nC)g 0.1 0.3 1 4 10 30 60<br>V     , DRAIN TO SOURCE VOLTAGE (V)DS<br>Figure 7. Gate Charge Characteristics. Figure 8. Capacitance Characteristics.<br>50 80<br>SINGLE PULSE<br>10 60 R     θJA =110°C/W<br>3  T  = 25°CA<br>1<br>40<br>0.3<br>0.1 V     GS = 10V<br>SINGLE PULSE 20<br>0.03 R     = 110  C/W θ JA o<br>T    = 25°CA<br>0.010.1 0.2 0.5 1 2 5 10 30 60 100 0.0010 0.01 0.1 1 10 100 300<br> V     , DRAIN-SOURCE VOLTAGE (V)DS SINGLE PULSE TIME (SEC)<br>10ms<br>RDS(ON) LIMIT<br>100ms<br>1s<br>100us<br>1ms<br>10s<br> DC<br>CAPACITANCE (pF)<br>GS<br>V      , GATE-SOURCE VOLTAGE (V)<br>POWER (W)<br>I   , DRAIN CURRENT (A)D<br>**----- End of picture text -----**<br>


**Figure 9. Maximum Safe Operating Area.** 

**Figure 10. Single Pulse Maximum Power Dissipation.** 

**==> picture [410 x 126] intentionally omitted <==**

**----- Start of picture text -----**<br>
1<br>0.5  D = 0.5<br>0.2   0.2<br>0.050.1  0.05  0.1  R       (t)     R        = 110 θ [JA] θ [JA] = r(t)  * °   R          C/Wθ [JA]<br>0.02  0.02  P(pk)<br>0.01  0.01<br> t  1<br>0.005  t   2<br>0.002  Single Pulse  T  - T    = P  * R       (t) J A θ [JA]<br>Duty Cycle, D = t  / t1 2<br>0.001<br>0.0001 0.001 0.01 0.1 1 10 100 300<br>t  , TIME (sec)1<br>r(t), NORMALIZED EFFECTIVE<br>TRANSIENT THERMAL RESISTANCE<br>**----- End of picture text -----**<br>


**Figure 11. Transient Thermal Response Curve** . 

**==> picture [220 x 12] intentionally omitted <==**

**----- Start of picture text -----**<br>
                Thermal characterization performed using the conditions described in note 1c.<br>                           Transient thermal response will change depending on the circuit board design.<br>**----- End of picture text -----**<br>


NDT3055 Rev.B 

**==> picture [474 x 631] intentionally omitted <==**

**----- Start of picture text -----**<br>
6.70<br>B<br>6.20<br>0.10 C B<br>3.10<br>2.90 3.25<br>4<br>1.90<br>A<br>3.70<br>6.10<br>3.30<br>1.90<br>1 3<br>0.84<br>0.60<br>2.30<br>0.95 2.30<br>4.60<br>0.10 C B LAND PATTERN RECOMMENDATION<br>SEE DETAIL A<br>1.80 MAX<br>0.08 C 7.30<br>C 6.70<br>0.10<br>0.00<br>NOTES: UNLESS OTHERWISE SPECIFIED<br>   A)  DRAWING BASED ON JEDEC REGISTRATION<br>        TO-261C, VARIATION AA.<br>   B)  ALL DIMENSIONS ARE IN MILLIMETERS.<br>R0.15±0.05<br>10°    C) DIMENSIONS DO NOT INCLUDE BURRS<br>GAGE 5°        OR MOLD FLASH. MOLD FLASH OR BURRS<br>R0.15±0.05        DOES NOT EXCEED 0.10MM.<br>PLANE<br>   D) DIMENSIONING AND TOLERANCING PER<br>        ASME Y14.5M-2009.<br>10° 0.35    E)  LANDPATTERN NAME: SOT230P700X180-4BN<br>0° [ TYP] 0.20    F)  DRAWING FILENAME: MKT-MA04AREV3<br>0.25 10°<br>5° 0.60 MIN<br>SEATING<br>1.70<br>PLANE<br>DETAIL A<br>SCALE: 2:1<br>**----- End of picture text -----**<br>


ON Semiconductor and      are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. 

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