# Power MOSFET, P Channel, 20 V, 6.5 A, 0.026 ohm, SOIC, Surface Mount

![Product image](https://novapart.co/image/farnell:2454058/)

**URL**: https://novapart.co/products/NDS8434/power-mosfet-p-channel-20-v-65-a-0026-ohm-soic
**SKU**: NDS8434
**Manufacturer**: ONSEMI
**Category**: Semiconductors - Discretes || FETs || Single MOSFETs
**Price**: €0.7280
**Stock**: 10+

## Specifications

| Parameter | Value |
|---|---|
| No. Of Pins | 8Pins |
| Channel Type | P Channel |
| Power Dissipation | 2.5W |
| Transistor Mounting | Surface Mount |
| Transistor Polarity | P Channel |
| Power Dissipation Pd | 2.5W |
| Rds(On) Test Voltage | 4.5V |
| On Resistance Rds(On) | 0.026ohm |
| Transistor Case Style | SOIC |
| Drain Source Voltage Vds | 20V |
| Operating Temperature Max | 150°C |
| Continuous Drain Current Id | 6.5A |
| Drain Source On State Resistance | 0.026ohm |
| Gate Source Threshold Voltage Max | 700mV |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:2454058/)

June 1996 

## **NDS8434 Single P-Channel Enhancement Mode Field Effect Transistor** 

## **General Description** 

These P-Channel enhancement mode power field effect transistors are produced using Fairchild's proprietary, high cell density, DMOS technology. This very high density process is especially tailored to minimize on-state resistance and provide superior switching performance. These devices are particularly suited for low voltage applications such as notebook computer power management  and other battery powered circuits where fast switching, low in-line power loss, and resistance to transients are needed. 

## **Features** 

- -6.5A,  -20V. RDS(ON) = 0.035Ω @ VGS = -4.5V RDS(ON) = 0.05Ω @ VGS = -2.7V. 

- High density cell design for extremely low RDS(ON). 

- High power and current handling capability in a widely used surface mount package. 

**==> picture [459 x 2] intentionally omitted <==**

**----- Start of picture text -----**<br>
___________________________________________________________________________________________<br>**----- End of picture text -----**<br>


||D<br>Da<br>D|<br>S<br>SO-8<br>iS)|G<br>s||5<br>6<br>7<br>8<br>4<br>3<br>2<br>1<br>~~Ae~~|5<br>6<br>7<br>8<br>4<br>3<br>2<br>1<br>~~Ae~~|5<br>6<br>7<br>8<br>4<br>3<br>2<br>1<br>~~Ae~~|5<br>6<br>7<br>8<br>4<br>3<br>2<br>1<br>~~Ae~~|5<br>6<br>7<br>8<br>4<br>3<br>2<br>1<br>~~Ae~~|5<br>6<br>7<br>8<br>4<br>3<br>2<br>1<br>~~Ae~~|5<br>6<br>7<br>8<br>4<br>3<br>2<br>1<br>~~Ae~~|5<br>6<br>7<br>8<br>4<br>3<br>2<br>1<br>~~Ae~~|5<br>6<br>7<br>8<br>4<br>3<br>2<br>1<br>~~Ae~~|5<br>6<br>7<br>8<br>4<br>3<br>2<br>1<br>~~Ae~~|||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|**Absolute Maximum Ratin**|**Absolute Maximum Ratings**TA= 25°C unless otherwise noted|= 25°C unless otherwise noted||||||||||||||
|**Symbol**|**Parameter**||||||**NDS8434**||||||||**Units**|
|VDSS|Drain-Source Voltage||||||||-20||||||V|
|VGSS|Gate-Source Voltage||||||||-8||||||V|
|ID|Drain Current - Continuous(Note 1a)|(Note 1a)|||||||-6.5||||||A|
||-  Pulsed||||||||-20|||||||
|PD|Maximum Power Dissipation(Note 1a)|(Note 1a)|||||||2.5||||||W|
||(Note 1b)|(Note 1b)|||||||1.2|||||||
||(Note 1c)|(Note 1c)|||||||1|||||||
|TJ,TSTG|Operating and Storage Temperature Range||||||-55 to 150||||||||°C|
|**THERMAL CHARACTERISTICS**||||||||||||||||
|RθJA|Thermal Resistance, Junction-to-Ambient(Note 1a)|(Note 1a)|||||||50||||||°C/W|
|RθJC|Thermal Resistance, Junction-to-Case(Note 1)|(Note 1)|||||||25||||||°C/W|



## **Absolute Maximum Ratings** TA = 25°C unless otherwise noted 

© 1997 Fairchild Semiconductor Corporation 

NDS8434 Rev. A3 

|**Electrical Characteristics **(TA= 25°C unless otherwise noted)|**Electrical Characteristics **(TA= 25°C unless otherwise noted)|**Electrical Characteristics **(TA= 25°C unless otherwise noted)||**Min**<br>**Typ**<br>**Max**<br>**Units**<br>-20<br>V<br>-1<br>µA<br>-10<br>µA<br>100<br>nA<br>-100<br>nA<br>-0.4<br>-0.7<br>-1<br>V<br>-0.3<br>-0.45<br>-0.8<br>0.026<br>0.035<br>Ω<br>0.037<br>0.07<br>0.036<br>0.05<br>-15<br>A<br>-10<br>18<br>S<br>2330<br>pF<br>1070<br>pF<br>360<br>pF<br>20<br>40<br>ns<br>38<br>80<br>ns<br>169<br>300<br>ns<br>63<br>120<br>ns<br>40<br>80<br>nC<br>5.3<br>nC<br>11<br>nC|**Min**<br>**Typ**<br>**Max**<br>**Units**<br>-20<br>V<br>-1<br>µA<br>-10<br>µA<br>100<br>nA<br>-100<br>nA<br>-0.4<br>-0.7<br>-1<br>V<br>-0.3<br>-0.45<br>-0.8<br>0.026<br>0.035<br>Ω<br>0.037<br>0.07<br>0.036<br>0.05<br>-15<br>A<br>-10<br>18<br>S<br>2330<br>pF<br>1070<br>pF<br>360<br>pF<br>20<br>40<br>ns<br>38<br>80<br>ns<br>169<br>300<br>ns<br>63<br>120<br>ns<br>40<br>80<br>nC<br>5.3<br>nC<br>11<br>nC|**Min**<br>**Typ**<br>**Max**<br>**Units**<br>-20<br>V<br>-1<br>µA<br>-10<br>µA<br>100<br>nA<br>-100<br>nA<br>-0.4<br>-0.7<br>-1<br>V<br>-0.3<br>-0.45<br>-0.8<br>0.026<br>0.035<br>Ω<br>0.037<br>0.07<br>0.036<br>0.05<br>-15<br>A<br>-10<br>18<br>S<br>2330<br>pF<br>1070<br>pF<br>360<br>pF<br>20<br>40<br>ns<br>38<br>80<br>ns<br>169<br>300<br>ns<br>63<br>120<br>ns<br>40<br>80<br>nC<br>5.3<br>nC<br>11<br>nC|
|---|---|---|---|---|---|---|
|**Symbol**|**Parameter**|**Conditions**||**Min**|**Typ**|**Max**|
|**OFF CHARACTERISTICS**|||||||
|BVDSS|Drain-Source Breakdown Voltage|V**GS**=  0 V, I**D**=  -250 µA||-20|||
|IDSS|Zero Gate Voltage  Drain Current|V**DS**=  -16 V, V**GS**=  0 V||||-1|
||||TJ= 55<br>oC|||-10|
|IGSSF|Gate - Body Leakage, Forward|V**GS**=  8 V, V**DS**=  0 V||||100|
|IGSSR|Gate - Body Leakage, Reverse|V**GS**=  -8 V, V**DS**=  0 V||||-100|
|**ON CHARACTERISTICS**(Note 2)|||||||
|VGS(th)|Gate Threshold Voltage|V**DS **=  V**GS**,  I**D **=  -250 µA||-0.4|-0.7|-1|
||||TJ= 125<br>oC|-0.3|-0.45|-0.8|
|RDS(ON)|Static Drain-Source On-Resistance|V**GS**=  -4.5 V,  I**D**= -6.5 A|||0.026|0.035|
||||TJ= 125<br>oC||0.037|0.07|
|||V**GS**=  -2.7 V,  I**D**=  -5.5 A|||0.036|0.05|
|ID(on)|On-State Drain Current|VGS=  -4.5 V, VDS=  -5 V||-15|||
|||VGS= -2.7 V, VDS= -5 V||-10|||
|gFS|Forward Transconductance|VDS=  -10 V, ID= -6.5 A|||18||
|**DYNAMIC CHARACTERISTICS**|||||||
|Ciss|Input Capacitance|VDS= -10 V,  VGS= 0 V,<br>f = 1.0 MHz|||2330||
|Coss|Output Capacitance||||1070||
|Crss|Reverse Transfer Capacitance||||360||
|**SWITCHING CHARACTERISTICS**(Note 2)|||||||
|tD(on)|Turn - On Delay Time|VDD= -6 V,  ID=  -1 A,<br>VGEN= -4.5 V, RGEN=  6Ω|||20|40|
|tr|Turn - On Rise Time||||38|80|
|tD(off)|Turn - Off Delay Time||||169|300|
|tf|Turn - Off Fall Time||||63|120|
|Qg|Total Gate Charge|VDS= -5 V,<br>ID=  -6.5 A,  VGS= -4.5 V|||40|80|
|Qgs|Gate-Source Charge||||5.3||
|Qgd|Gate-Drain Charge||||11||
||||||||



NDS8434 Rev. A3 

|**Electrical Characteristics **(TA= 25°C unless otherwise noted)|**Electrical Characteristics **(TA= 25°C unless otherwise noted)|**Electrical Characteristics **(TA= 25°C unless otherwise noted)|**Electrical Characteristics **(TA= 25°C unless otherwise noted)|**Electrical Characteristics **(TA= 25°C unless otherwise noted)|**Electrical Characteristics **(TA= 25°C unless otherwise noted)|**Electrical Characteristics **(TA= 25°C unless otherwise noted)|**Electrical Characteristics **(TA= 25°C unless otherwise noted)|**Electrical Characteristics **(TA= 25°C unless otherwise noted)|**Electrical Characteristics **(TA= 25°C unless otherwise noted)|**Electrical Characteristics **(TA= 25°C unless otherwise noted)|**Electrical Characteristics **(TA= 25°C unless otherwise noted)|
|---|---|---|---|---|---|---|---|---|---|---|---|
|**Symbol**||**Parameter**||||**Conditions**||**Min**|**Typ**|**Max**|**Units**|
|**DRAIN-SOURCE DIODE CHARACTERISTICS AND MAXIMUM RATINGS**||||||||||||
|IS||Maximum Continuous Drain-Source Diode Forward Current||||||||-2.1|A|
|VSD||Drain-Source D|||iode Forward Voltage|V**GS**= 0 V,  I**S**= -2.1 A (Note 2)|||-0.8|-1.2|V|
|Notes:<br>1. RθJAis the sum of t<br>design while RθCAis<br>_PD_(_t_) =<br>_TJ_ −_TA_<br>_R_θ_J A_(_t_)<br><br>Typical RθJAusing t<br>a. 50<br>oC/W<br>b. 105<br>oC/<br>c. 125<br>oC/<br>Scale 1 :<br>1a|||he<br>d|junction-to-cas<br>etermined by th|e and case-to-ambient thermal resistance where the c<br>e user's board design.<br>_I D_<br>2(_t_) ×_RDS_(_ON_ ) _TJ_<br>shown below on 4.5"x5" FR-4 PCB in a still air enviro<br>on a 1 in<br>2pad of 2oz copper.<br>on a 0.04 in<br>2pad of 2oz copper.<br>on a 0.006 in<br>2pad of 2oz copper.<br>per<br>1b||ase thermal reference is defined as the solder mounting surface of the drain pins. RθJCis guaranteed by<br>nment:<br>1c|||||
||||=|_TJ_ −_TA_<br>_R_θ_J C_+_R_θ_CA_(_t_)<br>=||||||||
||||h<br> <br>W<br>W|e board layouts<br>when mounted<br>when mounted<br>when mounted||||||||
||1a|||||||||||
|||||||||||||
|||||||||||||
||||1|on letter size pa||||||||



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2. Pulse Test: Pulse Width < 300µs, Duty Cycle < 2.0%.<br>**----- End of picture text -----**<br>


NDS8434 Rev. A3 

## **Typical Electrical Characteristics** 

**==> picture [432 x 522] intentionally omitted <==**

**----- Start of picture text -----**<br>
-25 2.5<br> V    = -4.5VGS<br> -3.0  V    = -2.0VGS<br>-20<br> -2.7 2<br> -2.5<br>-15<br> -2.0  -2.5<br>1.5  -2.7<br>-10  -3.0<br> -3.5<br>1 -4.5<br>-5<br> -1.5<br>0 0.5<br>0 -0.5 -1 -1.5 -2 -2.5 -3 0 -5 -10 -15 -20 -25<br>V     , DRAIN-SOURCE VOLTAGE (V)DS I    , DRAIN CURRENT (A)D<br>Figure 1. On-Region Characteristics. Figure 2. On-Resistance Variation<br>with Drain Current and Gate Voltage.<br>1.6 2<br>I   = -6.5AD  V     = -4.5V GS<br>1.4 V     = -4.5V GS<br>T  = 125°CJ<br>1.5<br>1.2<br> 25°C<br>1<br>1<br>  -55°C<br>0.8<br>0.6 0.5<br>-50 -25 0 25 50 75 100 125 150 0 -5 -10 -15 -20 -25<br>T  , JUNCTION TEMPERATURE (°C)J I    , DRAIN CURRENT (A)D<br>Figure 3. On-Resistance Variation  Figure 4. On-Resistance Variation<br>with Temperature. with Drain Current and Temperature.<br>-25 1.4<br>V     = -5.0VDS T   = -55°CJ 125°C V    = VDS GS<br>-20 1.2 I    = -250µAD<br>25°C<br>-15 1<br>-10 0.8<br>-5 0.6<br>0 0.4<br>0 -0.5 -1 -1.5 -2 -2.5 -3 -50 -25 0 25 50 75 100 125 150<br>V     , GATE TO SOURCE VOLTAGE (V)GS T  , JUNCTION TEMPERATURE (°C)J<br>DS(on)<br>R           , NORMALIZED<br>I    , DRAIN-SOURCE CURRENT (A)D DRAIN-SOURCE ON-RESISTANCE<br>DS(ON)<br>R            , NORMALIZED DS(on)<br>R           , NORMALIZED<br>DRAIN-SOURCE ON-RESISTANCE DRAIN-SOURCE ON-RESISTANCE<br>th<br>V    , NORMALIZED<br>I   , DRAIN CURRENT (A)<br>GATE-SOURCE THRESHOLD VOLTAGE<br>D<br>**----- End of picture text -----**<br>


**Figure 5. Transfer Characteristics.** 

**==> picture [138 x 21] intentionally omitted <==**

**----- Start of picture text -----**<br>
Figure 6. Gate Threshold Variation<br>with Temperature.<br>**----- End of picture text -----**<br>


NDS8434 Rev. A3 

## **Typical Electrical Characteristics (continued)** 

**==> picture [209 x 537] intentionally omitted <==**

**----- Start of picture text -----**<br>
1.08<br>I    = -250µAD<br>1.06<br>1.04<br>1.02<br>1<br>0.98<br>0.96<br>0.94<br>-50 -25 0 25 50 75 100 125 150<br>T    , JUNCTION TEMPERATURE (°C)J<br>Figure 7. Breakdown Voltage<br>Variation with Temperature.<br>5500<br>4000<br>C  iss<br>2000<br>C  oss<br>1000<br>800<br>500<br>f = 1 MHz C  rss<br>300 V     = 0V GS<br>200<br>0.1 0.2 0.5 1 2 5 10 20<br>-V     , DRAIN TO SOURCE VOLTAGE (V)DS<br>Figure 9. Capacitance Characteristics.<br>-VDD<br>R<br>VIN  L<br>D V OUT<br>V<br>GS<br>R<br>GEN DUT<br>G<br>S<br>BV        , NORMALIZED<br>DRAIN-SOURCE BREAKDOWN VOLTAGE<br>CAPACITANCE (pF)<br>DSS<br>**----- End of picture text -----**<br>


**==> picture [192 x 125] intentionally omitted <==**

**----- Start of picture text -----**<br>
25<br>10 V     = 0VGS<br>1 T  = 125°C J 25 ° C<br> -55°C<br>0.1<br>0.01<br>0.001<br>0.0001<br>0 0.2 0.4 0.6 0.8 1 1.2<br>-V     , BODY DIODE FORWARD VOLTAGE (V)SD<br>-I   , REVERSE DRAIN CURRENT (A)S<br>**----- End of picture text -----**<br>


**Figure 8. Body Diode Forward Voltage Variation with Source Current and Temperature.** 

**==> picture [212 x 343] intentionally omitted <==**

**----- Start of picture text -----**<br>
5<br>I    = -6.5AD V     = -5.0VDS -15V<br>4<br>-10V<br>3<br>2<br>1<br>0<br>0 10 20 30 40 50<br>Q    , GATE CHARGE (nC)g<br>Figure 10. Gate Charge Characteristics.<br>t t<br>on off<br>t d(on) tr t d(off) t f<br>90% 90%<br>V<br>OUT<br>10% 10%<br>90%<br>V IN 50% 50%<br>10%<br> PULSE W IDTH  INVERTED<br>GS<br>-V      , GATE-SOURCE VOLTAGE (V)<br>**----- End of picture text -----**<br>


**Figure 11. Switching Test Circuit.** 

**Figure 12. Switching Waveforms.** 

NDS8434 Rev. A3 

## **Typical Electrical and Thermal Characteristics (continued)** 

**==> picture [431 x 340] intentionally omitted <==**

**----- Start of picture text -----**<br>
40 2.5<br>V     = -5.0VDS 1a<br>32 T    J = -55°C<br>2<br>24  25°C<br>1.5<br>16  125°C 1b<br>1c<br>1<br>8<br>4.5"x5" FR-4 Board<br>T   = 25  CA o<br>Still Air<br>0 0.5<br>0 -4 -8 -12 -16 -20 0 0.2 0.4 0.6 0.8 1<br>I     , DRAIN CURRENT (A)D 2oz COPPER MOUNTING PAD AREA (in   )2<br>Figure 13. Transconductance Variation with Drain Figure 14. SO-8 Maximum Steady-State Power<br>Current and Temperature. Dissipation versus Copper Mounting Pad Area.<br>8 50<br>30<br>10<br>7<br>1a 3<br>1<br>6<br>0.3<br>5 1b 0.1 V     = -4. GS 5V<br>1c 4.5"x5" FR-4 BoardT   = 25  CStill AirA o 0.03 R     = See Note 1c  θ SINGLE PULSE [JA]<br>4 V    = -4.5VGS 0.01 T    = 25°CA<br>0 0.2 0.4 0.6 0.8 1 0.1 0.2 0.5 1 2 5 10 20 50<br>2oz COPPER MOUNTING PAD AREA (in   )2 - V     , DRAIN-SOURCE VOLTAGE (V)DS<br>10ms<br> 100ms<br>100us<br>1ms<br>1s<br>10s<br> DC<br>RDS(ON) LIMIT<br>g      , TRANSCONDUCTANCE (SIEMENS) STEADY-STATE POWER DISSIPATION (W)<br>D<br>-I   , DRAIN CURRENT (A)<br>D<br>-I   , STEADY-STATE DRAIN CURRENT (A)<br>FS<br>**----- End of picture text -----**<br>


**==> picture [207 x 20] intentionally omitted <==**

**----- Start of picture text -----**<br>
Figure 14. SO-8 Maximum Steady-State Power<br>Dissipation versus Copper Mounting Pad Area.<br>**----- End of picture text -----**<br>


**==> picture [376 x 31] intentionally omitted <==**

**----- Start of picture text -----**<br>
Figure 15. Maximum Steady-State Drain Figure 16. Maximum Safe Operating Area.<br>Current versus Copper Mounting Pad<br>Area.<br>**----- End of picture text -----**<br>


**==> picture [410 x 127] intentionally omitted <==**

**----- Start of picture text -----**<br>
1<br>0 .5  D = 0.5<br>0 .2   0.2   R       (t) = r(t)  *  R          θ [JA] θ [JA]<br>0 .1  0.1     R        = See Note 1c θ [JA]<br>0 .05  0.05<br> 0.02  P(pk)<br>0 .02<br> 0.01<br>0 .01  Single Pulse   t  1  t   2<br>0 .005 T  J - T    A = P  * R       (t)θ [JA]<br>0 .002 Duty Cycle, D = t   / t 1 2<br>0 .001<br>0 .0001 0 .001 0 .01 0 .1 1 10 100 300<br>t  , TIME (sec)1<br>r(t), NORMALIZED EFFECTIVE<br>TRANSIENT THERMAL RESISTANCE<br>**----- End of picture text -----**<br>


**==> picture [294 x 21] intentionally omitted <==**

**----- Start of picture text -----**<br>
Figure 17. Transient Thermal Response Curve .<br>Note: Thermal characterization performed using the conditions described in note 1c. Transient thermal response will change<br>depending on the circuit board design.<br>**----- End of picture text -----**<br>


NDS8434 Rev. A3 

## **TRADEMARKS** 

The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is not intended to be an exhaustive list of all such trademarks. 

|ACEx™|ISOPLANAR™|TinyLogic™|
|---|---|---|
|CoolFET™|MICROWIRE™|UHC™|
|CROSSVOLT™|POP™|VCX™|
|E2CMOSTM|PowerTrench™||
|FACT™|QFET™||
|FACT Quiet Series™|QS™||
|FAST®|Quiet Series™||
|FASTr™|SuperSOT™-3||
|GTO™|SuperSOT™-6||
|HiSeC™|SuperSOT™-8||



## **DISCLAIMER** 

FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. 

## **LIFE SUPPORT POLICY** 

FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 

1. Life support devices or systems are devices or 2. A critical component is any component of a life systems which, (a) are intended for surgical implant into support device or system whose failure to perform can the body, or (b) support or sustain life, or (c) whose be reasonably expected to cause the failure of the life failure to perform when properly used in accordance support device or system, or to affect its safety or with instructions for use provided in the labeling, can be effectiveness. reasonably expected to result in significant injury to the user. 

## **PRODUCT STATUS DEFINITIONS** 

## **Definition of Terms** 

|**Definition of Terms**|||
|---|---|---|
|**Datasheet Identification**|**Product Status**|**Definition**|
|Advance Information|Formative or<br>In Design|This datasheet contains the design specifications for<br>product development. Specifications may change in<br>any manner without notice.|
|Preliminary|First Production|This datasheet contains preliminary data, and<br>supplementary data will be published at a later date.<br>Fairchild Semiconductor reserves the right to make<br>changes at any time without notice in order to improve<br>design.|
|No Identification Needed|Full Production|This datasheet contains final specifications. Fairchild<br>Semiconductor reserves the right to make changes at<br>any time without notice in order to improve design.|
|Obsolete|Not In Production|This datasheet contains specifications on a product<br>that has been discontinued by Fairchild semiconductor.<br>The datasheet is printed for reference information only.|





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