# Power MOSFET, N Channel, 30 V, 1.4 A, 0.16 ohm, SOT-23, Surface Mount

![Product image](https://novapart.co/image/farnell:9845410/)

**URL**: https://novapart.co/products/NDS351AN/power-mosfet-n-channel-30-v-14-a-016-ohm-sot-23
**SKU**: NDS351AN
**Manufacturer**: ONSEMI
**Category**: Semiconductors - Discretes || FETs || Single MOSFETs
**Price**: €0.1740
**Stock**: 10+

## Description

Transistor Polarity:N Channel; Continuous Drain Current Id:1.4A; Drain Source Voltage Vds:30V; On Resistance Rds(on):0.25ohm; Rds(on) Test Vo; Available until stocks are exhausted Alternative available

## Specifications

| Parameter | Value |
|---|---|
| Msl | - |
| Svhc | No SVHC (10-Jun-2022) |
| No. Of Pins | 3Pins |
| Channel Type | N Channel |
| Product Range | - |
| Qualification | - |
| Power Dissipation | 500mW |
| Transistor Mounting | Surface Mount |
| Rds(On) Test Voltage | 10V |
| Transistor Case Style | SOT-23 |
| Drain Source Voltage Vds | 30V |
| Operating Temperature Max | 150°C |
| Continuous Drain Current Id | 1.4A |
| Drain Source On State Resistance | 0.16ohm |
| Gate Source Threshold Voltage Max | 2.1V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:9845410/)

## **ON Semiconductor** 

## **Is Now** 

**==> picture [390 x 69] intentionally omitted <==**

**To learn more about onsemi™, please visit our website at www.onsemi.com** 

**onsemi** and       and other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “ **onsemi** ” or its affiliates and/or subsidiaries in the United States and/or other countries. **onsemi** owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of **onsemi** product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent-Marking.pdf. **onsemi** reserves the right to make changes at any time to any products or information herein, without notice. The information herein is provided “as-is” and **onsemi** makes no warranty, representation or guarantee regarding the accuracy of the information, product features, availability, functionality, or suitability of its products for any particular purpose, nor does **onsemi** assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using **onsemi** products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by **onsemi** . “Typical” parameters which may be provided in **onsemi** data sheets and/ or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. **onsemi** does not convey any license under any of its intellectual property rights nor the rights of others. **onsemi** products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use **onsemi** products for any such unintended or unauthorized application, Buyer shall indemnify and hold **onsemi** and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that **onsemi** was negligent regarding the design or manufacture of the part. **onsemi** is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. Other names and brands may be claimed as the property of others. 

## **NDS351AN** 

## **N-Channel, Logic Level,  PowerTrench[] MOSFET General Description Features** 

These N-Channel Logic Level MOSFETs are produced • 1.4 A, 30 V. RDS(ON) = 160 mΩ @ VGS = 10 V using ON Semiconductor’s advanced PowerTrench process that has been especially tailored RDS(ON) = 250 mΩ @ VGS = 4.5 V to minimize the on-state resistance and yet maintain superior switching performance. 

These devices are particularly suited for low voltage applications in notebook computers, portable phones, PCMCIA cards, and other battery powered circuits where fast switching, and low in-line power loss are needed in a very small outline surface mount package. 

- Ultra-Low gate charge 

- Industry standard outline SOT-23 surface mount package using proprietary SuperSOT[TM] -3 design for superior thermal and electrical capabilities 

- High performance trench technology for extremely low RDS(ON) 

**==> picture [434 x 338] intentionally omitted <==**

**----- Start of picture text -----**<br>
D D<br>S<br>¢ a<br>G S<br>PP<br>TM G<br>SuperSOT  -3<br>Absolute Maximum Ratings TA=25 [o] C unless otherwise noted<br>Symbol Parameter Ratings Units<br>VDSS Drain-Source Voltage 30 V<br>VGSS Gate-Source Voltage ± 20 V<br>ID Drain Current – Continuous (Note 1a) 1.4 A<br>– Pulsed 10<br>PD Power Dissipation for Single Operation (Note 1a) 0.5 W<br>(Note 1b) 0.46<br>TJ, TSTG Operating and Storage Junction Temperature Range –55 to +150 °C<br>Thermal Characteristics<br>RθJA Thermal Resistance, Junction-to-Ambient  (Note 1a) 250 °C/W<br>RθJC Thermal Resistance, Junction-to-Case (Note 1) 75<br>eeoe<br>Package Marking and Ordering Information<br>Device Marking Device Reel Size Tape width Quantity<br>351A NDS351AN 7’’ 8mm 3000 units<br>—<br>**----- End of picture text -----**<br>


© 2003 Semiconductor Components Industries, LLC. September-2017, Rev. 5 

Publication Order Number: NDS351AN/D 

|||**Electrical Characteristics**|**Electrical Characteristics**|**Electrical Characteristics**|TA= 25°C unless otherwise noted||||
|---|---|---|---|---|---|---|---|---|
|||**Symbol**||**Parameter**|**Test Conditions**|**Min**|**Typ**|**Max**|
|||**Off Characteristics**|||||||
|||BVDSS||Drain–Source Breakdown Voltage|VGS= 0 V,<br>ID= 250µA|30|||
|||∆BVDSS<br>∆TJ||Breakdown Voltage Temperature<br>Coefficient|ID= 250µA,Referenced to 25°C||26||
|||IDSS||Zero Gate Voltage Drain Current|VDS= 24 V,<br>VGS= 0 V|||1|
||||||VDS= 24 V, VGS= 0 V, TJ= 55°C|||10|
|||IGSS||Gate–BodyLeakage|VGS=±20 V,<br>VDS= 0 V|||±100|
|||**On Characteristics**<br>**(Note 2)**|||||||
|||VGS(th)||Gate Threshold Voltage|VDS= VGS,<br>ID= 250µA|0.8|2.1|3|
|||∆VGS(th)<br>∆TJ||Gate Threshold Voltage<br>Temperature Coefficient|ID= 250µA,Referenced to 25°C||–4||
|||RDS(on)||Static Drain–Source<br>On–Resistance|VGS= 10 V,<br>ID= 1.4 A<br>VGS= 4.5 V,<br>ID= 1.2 A<br>VGS= 10V,ID= 1.4 A,TJ= 125°C||92<br>120<br>114|160<br>250<br>214|
|||ID(on)||On–State Drain Current|VGS= 4.5V,<br>VDS= 5 V|3.5|||
|||gFS||Forward Transconductance|VDS= 5 V,<br>ID= 1.4 A||4||
|||**Dynamic Characteristics**|||||||
|||Ciss||Input Capacitance|VDS= 15 V,<br>VGS= 0 V,<br>f = 1.0 MHz||145||
|||Coss||Output Capacitance|||35||
|||Crss||Reverse Transfer Capacitance|||15||
|||RG||Gate Resistance|VGS= 15 mV,<br>f = 1.0 MHz||1.6||
|||**Switching Characteristics**<br>**(Note 2)**|||||||
|||td(on)||Turn–On DelayTime|VDD= 15 V,<br>ID= 1 A,<br>VGS= 10 V,<br>RGEN= 6Ω||3|6|
|||tr||Turn–On Rise Time|||8|16|
|||td(off)||Turn–Off DelayTime|||16|29|
|||tf||Turn–Off Fall Time|||2|4|
|||Qg||Total Gate Charge|VDS= 15 V,<br>ID= 1.4 A,<br>VGS= 4.5 V||1.3|1.8|
|||Qgs||Gate–Source Charge|||0.5||
|||Qgd||Gate–Drain Charge|||0.5||
|||**Drain–Source Diode Characteristics and Maximum Ratings**|||||||
|||IS||Maximum Continuous Drain–Source Diode Forward Current||||0.42|
|||VSD||Drain–Source Diode Forward<br>Voltage|VGS= 0 V,<br>IS= 0.42 A<br>(Note 2)||0.8|1.2|
|||trr||Diode Reverse RecoveryTime|IF= 1.4 A,<br>diF/dt= 100 A/µs||11||
|||Qrr||Diode Reverse Recovery Charge|||4||
||**N**<br>**1**<br>S<br>**2**|**otes:**<br>**.**<br>RθJAis t<br>the drai<br>cale 1 : 1 o<br>**.**<br>Pulse T|he sum of the junction-to-case and case-to-ambient ther<br>n pins.  RθJCis guaranteed by design while RθCAis determ<br>a) 250°C/W when mounted on a<br>0.02 in2pad of 2 oz. copper.<br>n letter size paper<br>est: Pulse Width≤300µs, Duty Cycle≤2.0%||mal resistance where the case thermal reference<br>ined by the user's board design.<br>b) 270°C/W when mounted<br>minimum pad.|is defined<br>on a|as the sol||



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## **Typical Characteristics** 

**==> picture [186 x 132] intentionally omitted <==**

**----- Start of picture text -----**<br>
5<br>VGS = 10V 4.5V<br>6.0V<br>4<br>3<br>3.5V<br>2<br>1<br>3.0V<br>0<br>0 0.5 1 1.5 2<br>VDS, DRAIN TO SOURCE VOLTAGE (V)<br>, DRAIN CURRENT (A)ID<br>**----- End of picture text -----**<br>


**==> picture [188 x 127] intentionally omitted <==**

**----- Start of picture text -----**<br>
2.8<br>2.6<br>2.4<br>VGS = 3.5V<br>2.2<br>2<br>1.8<br>1.6  4.0V<br>1.4  4.5V<br> 5. 0V<br>1.2 6.0V<br>1  10V<br>0.8<br>0 1 2 3 4 5<br>ID, DRAIN CURRENT (A)<br>, NORMALIZED<br>DS(ON)<br>R<br>DRAIN-SOURCE ON-RESISTANCE<br>**----- End of picture text -----**<br>


**Figure 1. On-Region Characteristics.** 

**Figure 2. On-Resistance Variation with Drain Current and Gate Voltage.** 

**==> picture [200 x 131] intentionally omitted <==**

**----- Start of picture text -----**<br>
1.6<br>ID = 1.4A<br>VGS = 10V<br>1.4<br>1.2<br>1<br>0.8<br>0.6<br>-50 -25 0 25 50 75 100 125 150<br>TJ, JUNCTION TEMPERATURE ( [o] C)<br>, NORMALIZED<br>DS(ON)<br>R<br> DRAIN-SOURCE ON-RESISTANCE<br>**----- End of picture text -----**<br>


**==> picture [189 x 129] intentionally omitted <==**

**----- Start of picture text -----**<br>
0.25<br>ID = 0.7A<br>0.225<br>0.2<br>0.175<br>TA = 125 [o] C<br>0.15<br>0.125<br>0.1<br>TA = 25 [o] C<br>0.075<br>3 4 5 6 7 8 9 10<br>VGS, GATE TO SOURCE VOLTAGE (V)<br>, ON-RESISTANCE (OHM)<br>DS(ON)<br>R<br>**----- End of picture text -----**<br>


**==> picture [409 x 194] intentionally omitted <==**

**----- Start of picture text -----**<br>
Figure 3. On-Resistance Variation with Figure 4. On-Resistance Variation with<br>Temperature. Gate-to-Source Voltage.<br>5 10<br>VDS = 5V V GS  = 0V<br>4 1<br>T A  = 125 [o] C<br>3 0.1<br>25 [o] C<br>2 0.01<br>TA = 125 [o] C -55 [o] C<br>1 25 [o] C 0.001<br>-55 [o] C<br>0 0.0001<br>2 2.5 3 3.5 4 0 0.2 0.4 0.6 0.8 1 1.2<br>VGS, GATE TO SOURCE VOLTAGE (V) VSD,  BODY DIODE FORWARD VOLTAGE (V)<br>Figure 5. Transfer Characteristics. Figure 6. Body Diode Forward Voltage Variation<br>, DRAIN CURRENT (A)ID<br>, REVERSE DRAIN CURRENT (A)IS<br>**----- End of picture text -----**<br>


**Figure 6. Body Diode Forward Voltage Variation with Source Current and Temperature.** 

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## **Typical Characteristics** 

**==> picture [422 x 533] intentionally omitted <==**

**----- Start of picture text -----**<br>
10 200<br>8 ID =1.4A VDS = 10V 15V 180160 CISS f = 1 MHzVGS = 0 V<br>20V 140<br>6 120<br>100<br>4 80<br>60<br>COSS<br>2 40<br>20 C RSS<br>0 0<br>0 0.5 1 1.5 2 2.5 3 0 5 10 15 20 25 30<br>Qg, GATE CHARGE (nC) VDS, DRAIN TO SOURCE VOLTAGE (V)<br>Figure 7. Gate Charge Characteristics. Figure 8. Capacitance Characteristics.<br>100 5<br>SINGLE PULSE<br>RθJA = 270°C/W<br>10 100µs 4 TA = 25 ° C<br>RDS(ON) LIMIT<br>1ms<br>3<br>10ms<br>1<br>100ms<br>1s 2<br>V GS  = 10V DC<br>SINGLE PULSE<br>0.1<br>RθJA = 270 [o] C/W 1<br>TA = 25 [o] C<br>0.01 0<br>0.1 1 10 100 0.01 0.1 1 10 100 1000<br>VDS, DRAIN-SOURCE VOLTAGE (V) t1, TIME (sec)<br>Figure 9. Maximum Safe Operating Area. Figure 10. Single Pulse Maximum<br>Power Dissipation.<br>1<br>D = 0.5 RθJA(t) = r(t) * RθJA<br>0.2 R θJA = 270 [o] C/W<br>0.1 0.1<br>0.05 P(pk)<br>0.02 t 1<br>0.01 t2<br>0.01 TJ - TA = P * RθJA(t)<br>SINGLE PULSE Duty Cycle, D = t1 / t2<br>0.001<br>0.0001 0.001 0.01 0.1 1 10 100 1000<br>t1, TIME (sec)<br>Figure 11. Transient Thermal Response Curve.<br>Thermal characterization performed using the conditions described in Note 1b.<br>Transient thermal response will change depending on the circuit board design.<br>CAPACITANCE (pF)<br>, GATE-SOURCE VOLTAGE (V)<br>GS<br>V<br>, DRAIN CURRENT (A)ID<br>P(pk), PEAK TRANSIENT POWER (W)<br>THERMAL RESISTANCE<br>r(t), NORMALIZED EFFECTIVE TRANSIENT<br>**----- End of picture text -----**<br>


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4 

ON Semiconductor and      are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. 

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