# Power MOSFET, N Channel, 52 V, 2.6 A, 0.11 ohm, SOT-223, Surface Mount

![Product image](https://novapart.co/image/farnell:2724404/)

**URL**: https://novapart.co/products/NCV8440ASTT1G/power-mosfet-n-channel-52-v-26-a-011-ohm-sot-223
**SKU**: NCV8440ASTT1G
**Manufacturer**: ONSEMI
**Category**: Semiconductors - Discretes || FETs || Single MOSFETs
**Price**: €0.4480
**Stock**: 200+

## Description

Transistor Polarity:N Channel; Continuous Drain Current Id:2.6A; Drain Source Voltage Vds:52V; On Resistance Rds(on):0.095ohm; Rds(on) Test Voltage Vgs:10V; Threshold Voltage Vgs:1.5

## Specifications

| Parameter | Value |
|---|---|
| Msl | MSL 1 - Unlimited |
| Svhc | No SVHC (25-Jun-2025) |
| No. Of Pins | 4Pins |
| Channel Type | N Channel |
| Product Range | - |
| Qualification | AEC-Q101 |
| Power Dissipation | 1.69W |
| Transistor Mounting | Surface Mount |
| Rds(On) Test Voltage | 10V |
| Transistor Case Style | SOT-223 |
| Drain Source Voltage Vds | 52V |
| Operating Temperature Max | 150°C |
| Continuous Drain Current Id | 2.6A |
| Drain Source On State Resistance | 0.11ohm |
| Gate Source Threshold Voltage Max | 1.5V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:2724404/)

NCV8440, NCV8440A 

## Protected Power MOSFET 

## **2.6 A, 52 V, N−Channel, Logic Level, Clamped MOSFET w/ ESD Protection** 

## **Features** 

- Diode Clamp Between Gate and Source 

- ESD Protection − Human Body Model 5000 V 

- Active Over−Voltage Gate to Drain Clamp 

- Scalable to Lower or Higher RDS(on) 

- Internal Series Gate Resistance 

- These are Pb−Free Devices 

## **Benefits** 

- High Energy Capability for Inductive Loads 

- Low Switching Noise Generation 

## **Applications** 

- Automotive and Industrial Markets: 

Solenoid Drivers, Lamp Drivers, Small Motor Drivers 

- NCV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q100 Qualified and PPAP Capable 

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(Clamped)VDSS RDS(ON) TYP ID MAX<br>52 V 95 m  @ 10 V 2.6 A<br>a a<br>Drain (Pins 2, 4)<br>Overvoltage<br>Gate<br>Protection<br>(Pin 1)<br>ESD Protection<br>Source (Pin 3)<br>MARKING<br>DIAGRAM<br>DRAIN<br>4<br>SOT−223<br>CASE 318E AYW<br>STYLE 3 xxxxx<br>1 = Gate 1 2 3<br>2 = Drain<br>3 = Source GATE SOURCE<br>DRAIN<br>A = Assembly Location<br>Y = Year<br>W = Work Week<br>xxxxx = V8440 or 8440A<br>= Pb−Free Package<br>**----- End of picture text -----**<br>


(Note: Microdot may be in either location) 

## **ORDERING INFORMATION** 

See detailed ordering and shipping information in the package dimensions section on page 8 of this data sheet. 

Publication Order Number: 

**1** 

© Semiconductor Components Industries, LLC, 2016 **October, 2018 − Rev. 8** 

**NCV8440/D** 

**NCV8440, NCV8440A** 

**MAXIMUM RATINGS** (TJ = 25 ° C unless otherwise noted) 

|**MAXIMUM RATINGS**(TJ= 25°C unless otherwise noted)||||
|---|---|---|---|
|**Rating**|**Symbol**|**Value**|**Unit**|
|Drain−to−Source Voltage Internally Clamped|VDSS|52−59|V|
|Gate−to−Source Voltage − Continuous|VGS|±15|V|
|Drain Current<br>− Continuous @ TA= 25°C<br>− Single Pulse (tp= 10�s) (Note 1)|ID<br>IDM|2.6<br>10|A|
|Total Power Dissipation @ TA= 25°C (Note 1)|PD|1.69|W|
|Operating and Storage Temperature Range|TJ, Tstg|−55 to 150|°C|
|Single Pulse Drain−to−Source Avalanche Energy<br>(VDD= 50 V, ID(pk)= 1.17 A, VGS= 10 V, L = 160 mH, RG= 25�)|EAS|110|mJ|
|Load Dump Voltage (VGS= 0 and 10 V, RI= 2.0�, RL= 9.0�, td = 400 ms)|VLD|60|V|
|Thermal Resistance,<br>Junction−to−Ambient (Note 1)<br>Junction−to−Ambient (Note 2)|R�JA<br>R�JA|74<br>169|°C/W|
|Maximum Lead Temperature for Soldering<br>Purposes, 1/8″from Case for 10 Seconds|TL|260|°C|



Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 

1. When surface mounted to a FR4 board using 1 ″ pad size, (Cu area 1.127 in[2] ). 

2. When surface mounted to a FR4 board using minimum recommended pad size, (Cu area 0.412 in[2] ). 

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**----- Start of picture text -----**<br>
+<br>ID<br>DRAIN<br>IG<br>VDS<br>+ GATE<br>SOURCE<br>VGS<br>− −<br>**----- End of picture text -----**<br>


**Figure 1. Voltage and Current Convention** 

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**2** 

## **NCV8440, NCV8440A** 

## **MOSFET ELECTRICAL CHARACTERISTICS** (TJ = 25 ° C unless otherwise noted) 

|**MOSFET ELECTRICAL CHARACTERISTICS**(TJ= 25°C unless otherwis|**MOSFET ELECTRICAL CHARACTERISTICS**(TJ= 25°C unless otherwis|e noted)|||||
|---|---|---|---|---|---|---|
|**Characteristic**||**Symbol**|**Min**|**Typ**|**Max**|**Unit**|
|**OFF CHARACTERISTICS**|||||||
|Drain−to−Source Breakdown Voltage (Note 3)<br>(VGS= 0 V, ID= 1.0 mA, TJ= 25°C)<br>(VGS= 0 V, ID= 1.0 mA, TJ= −40°C to 125°C) (Note 4)<br>Temperature Coefficient (Negative)||V(BR)DSS|52<br>50.8|55<br>54<br>−9.3|59<br>59.5|V<br>V<br>mV/°C|
|Zero Gate Voltage Drain Current<br>(VDS= 40 V, VGS= 0 V)<br>(VDS= 40 V, VGS= 0 V, TJ= 125°C) (Note 4)||IDSS|||10<br>25|�A|
|Gate−Body Leakage Current<br>(VGS=±8 V, VDS= 0 V)<br>(VGS=±14 V, VDS= 0 V)||IGSS||±35|±10|�A|
|**ON CHARACTERISTICS**(Note 3)|||||||
|Gate Threshold Voltage (Note 3)<br>(VDS= VGS, ID= 100�A)<br>Threshold Temperature Coefficient (Negative)||VGS(th)|1.1|1.5<br>−4.1|1.9|V<br>mV/°C|
|Static Drain−to−Source On−Resistance (Note 3)<br>(VGS= 3.5 V, ID= 0.6 A)<br>(VGS= 4.0 V, ID= 1.5 A)<br>(VGS= 10 V, ID= 2.6 A)||RDS(on)||150<br>135<br>95|180<br>160<br>110|m�|
|Forward Transconductance (Note 3) (VDS= 15 V, ID= 2.6 A)||gFS||3.8||Mhos|
|**DYNAMIC CHARACTERISTICS**|||||||
|Input Capacitance|VDS= 35 V, VGS= 0 V,<br>f = 10 kHz|Ciss||155||pF|
|Output Capacitance||Coss||60|||
|Transfer Capacitance||Crss||25|||
|Input Capacitance|VDS= 25 V, VGS= 0 V,<br>f = 10 kHz|Ciss||170||pF|
|Output Capacitance||Coss||70|||
|Transfer Capacitance||Crss||30|||



Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. 

3. Pulse Test: Pulse Width ≤ 300 � s, Duty Cycle ≤ 2%. 

4. Not subject to production testing. 

5. Switching characteristics are independent of operating junction temperatures. 

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**3** 

**NCV8440, NCV8440A** 

**MOSFET ELECTRICAL CHARACTERISTICS** (TJ = 25 ° C unless otherwise noted) 

|**MOSFET ELECTRICAL CHARACTERISTICS**(TJ= 25°C unless otherwis|**MOSFET ELECTRICAL CHARACTERISTICS**(TJ= 25°C unless otherwis|e noted)|||||
|---|---|---|---|---|---|---|
|**Characteristic**||**Symbol**|**Min**|**Typ**|**Max**|**Unit**|
|**SWITCHING CHARACTERISTICS**(Note 5)|||||||
|Turn−On Delay Time|VGS= 4.5 V, VDD= 40 V,<br>ID= 2.6 A, RD= 15.4�|td(on)||375||ns|
|Rise Time||tr||1525|||
|Turn−Off Delay Time||td(off)||1530|||
|Fall Time||tf||1160|||
|Turn−On Delay Time|VGS= 4.5 V, VDD= 40 V,<br>ID= 1.0 A, RD= 40�|td(on)||325||ns|
|Rise Time||tr||1275|||
|Turn−Off Delay Time||td(off)||1860|||
|Fall Time||tf||1150|||
|Turn−On Delay Time|VGS= 10 V, VDD= 15 V,<br>ID= 2.6 A, RD= 5.8�|td(on)||190||ns|
|Rise Time||tr||710|||
|Turn−Off Delay Time||td(off)||2220|||
|Fall Time||tf||1180|||
|Gate Charge|VGS= 4.5 V, VDS= 40 V,<br>ID= 2.6 A (Note 3)|QT||4.5||nC|
|||Q1||0.9|||
|||Q2||2.6|||
|Gate Charge|VGS= 4.5 V, VDS= 15 V,<br>ID= 1.5 A (Note 3)|QT||3.9||nC|
|||Q1||1.0|||
|||Q2||1.7|||
|**SOURCE−DRAIN DIODE CHARACTERISTICS**|||||||
|Forward On−Voltage|IS= 2.6 A, VGS= 0 V (Note 3)<br>IS= 2.6 A, VGS= 0 V, TJ= 125°C|VSD||0.81<br>0.66|1.5|V|
|Reverse Recovery Time|IS= 1.5 A, VGS= 0 V,<br>dIs/dt = 100 A/�s (Note 3)|trr||730||ns|
|||ta||200|||
|||tb||530|||
|Reverse Recovery Stored Charge||QRR||6.3||�C|
|**ESD CHARACTERISTICS**(Note 4)|||||||
|Electro−Static Discharge Capability|Human Body Model (HBM)|ESD|5000|||V|
||Machine Model (MM)||500||||



Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. 

3. Pulse Test: Pulse Width ≤ 300 � s, Duty Cycle ≤ 2%. 

4. Not subject to production testing. 

5. Switching characteristics are independent of operating junction temperatures. 

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**4** 

**NCV8440, NCV8440A** 

## **TYPICAL PERFORMANCE CURVES** 

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**----- Start of picture text -----**<br>
10 25 ° C<br>100 ° C<br>150 ° C<br>1<br>0.1 1 10 100<br>L, LOAD INDUCTANCE (mH)<br>Figure 1. Single Pulse Maximum Switch−off<br>Current vs. Load Inductance<br>10<br>VGS = 10 V 5 V<br>TJ = 25 ° C 4 V<br>8 3.8 V<br>3.6 V<br>6<br>3.4 V<br>3.2 V<br>4<br>3 V<br>2.8 V<br>2<br>2.6 V<br>2.4 V<br>0<br>0 1 2 3 4 5<br>VDS, DRAIN−TO−SOURCE VOLTAGE (VOLTS)<br>Figure 3. On−State Output Characteristics<br>350<br>ID = 2 A<br>300<br>150 ° C<br>250<br>200<br>25 ° C<br>150<br>100<br>−40 ° C<br>50<br>3 4 5 6 7 8 9 10<br>VGS, GATE−TO−SOURCE VOLTAGE (V)<br>, MAX SWITCH−OFF CURRENT (A)<br>max<br>IL<br>DRAIN CURRENT (AMPS)<br>ID,<br>) �<br> (m<br>DS(on)<br>R<br>**----- End of picture text -----**<br>


**Figure 5. RDS(on) vs. Gate−Source Voltage** 

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100<br>25 ° C<br>100 ° C<br>150 ° C<br>10<br>0.1 1 10 100<br>L, LOAD INDUCTANCE (mH)<br>Figure 2. Single Pulse Maximum Switching<br>Energy vs. Load Inductance<br>10<br>VDS ≥  10 V<br>8<br>6<br>4<br>2 T J = 150 ° C<br>TJ = 25 ° C<br>0 TJ = −40 ° C<br>1 1.5 2 2.5 3 3.5 4<br>, MAX SWITCHING ENERGY (mJ)<br>max<br>E<br>DRAIN CURRENT (AMPS)<br>ID,<br>**----- End of picture text -----**<br>


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VGS, GATE−TO−SOURCE VOLTAGE (VOLTS)<br>**----- End of picture text -----**<br>


**Figure 4. Transfer Characteristics** 

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300<br>250<br>150 ° C, VGS = 5 V<br>200<br>150 ° C, VGS = 10 V<br>150<br>25 ° C, VGS = 5 V<br>100 25 ° C, VGS = 10 V<br>−40 ° C, VGS = 5 V −40 ° C, VGS = 10 V<br>50<br>1 2 3 4 5 6 7 8 9 10<br>ID, DRAIN CURRENT (A)<br>) �<br> (m<br>DS(on)<br>R<br>**----- End of picture text -----**<br>


**Figure 6. RDS(on) vs. Drain Current** 

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**5** 

**NCV8440, NCV8440A** 

## **TYPICAL PERFORMANCE CURVES** 

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2.00 1.2<br>ID = 2 A ID = 100  � A,<br>1.75 1.1 VDS = VGS<br>1.50 1.0<br>VGS = 5 V<br>1.25 0.9<br>1.00 0.8<br>VGS = 10 V<br>0.75 0.7<br>0.50 0.6<br>−40 −20 0 20 40 60 80 100 120 140 −40 −20 0 20 40 60 80 100 120 140<br>TJ, JUNCTION TEMPERATURE ( ° C) TJ, JUNCTION TEMPERATURE ( ° C)<br>Figure 7. Normalized RDS(on) vs. Temperature Figure 8. Normalized Threshold Voltage vs.<br>Temperature<br>1000 10<br>VGS = 0 V<br>100<br>8<br>10<br>6<br>1 150 ° C<br>4<br>0.1<br>100 ° C<br>0.01 2 150 ° C<br>25 ° C<br>25 ° C −40 ° C<br>0.001 0<br>10 15 20 25 30 35 40 45 50 0.5 0.6 0.7 0.8 0.9 1<br>VDS , DRAIN−TO−SOURCE VOLTAGE (V) VSD, SOURCE−TO−DRAIN VOLTAGE (V)<br>Figure 9. Drain−to−Source Leakage Current Figure 10. Source−Drain Diode Forward<br>Characteristics<br>500 5 50<br>Ciss TJ = 25 ° C QT<br>VDS<br>400 VDS = 0 V VGS = 0 V 4 40<br>VGS<br>Q GS Q GD<br>300 Crss 3 30<br>200 2 20<br>Ciss<br>100 Coss 1 ID = 2.6 A 10<br>Crss TJ = 25 ° C<br>0 0 0<br>10 5 0 5 10 15 20 25 30 35 0 1 2 3 4 5<br>VGS VDS QG, TOTAL GATE CHARGE (nC)<br> (V)<br>DS(on)<br>GS(th)<br>NORMALIZED R<br>NORMALIZED V<br>A)<br>�<br> (<br>IDSS<br>, SOURCE CURRENT (A)<br>IS<br>V<br>DS<br>C, CAPACITANCE (pF)<br>GATE−TO−SOURCE VOLTAGE (VOLTS)<br>GS,<br>V<br>, DRAIN−TO−SOURCE VOLTAGE (VOLTS)<br>**----- End of picture text -----**<br>


GATE−TO−SOURCE OR DRAIN−TO−SOURCE VOLTAGE (VOLTS) 

**Figure 11. Capacitance Variation** 

**Figure 12. Gate−to−Source Voltage vs. Total Gate Charge** 

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**6** 

**NCV8440, NCV8440A** 

## **TYPICAL PERFORMANCE CURVES** 

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**----- Start of picture text -----**<br>
3000 10,000<br>VDD = 40 V td(off) VDD = 40 V<br>2500 VDD = 15 V VDD = 15 V<br>td(off)<br>2000 ID = 2.6 A<br>RG = 0  �<br>1500 1000 tf<br>tf tr<br>1000<br>tr td(on)<br>500<br>td(on)<br>0 100<br>4 5 6 7 8 9 10 1 10 100 1000 10,000<br>VGS (V) RG ( � )<br>Figure 13. Resistive Load Switching Time vs. Figure 14. Resistive Load Switching Time vs.<br>Gate−Source Voltage Gate Resistance (VGS = 5 V, ID = 2.6 A)<br>10,000 110<br>VDD = 40 V<br>VDD = 15 V 100<br>td(off)<br>90<br>tf PCB Cu thickness, 1.0 oz<br>1000 80<br>tr<br>70<br>td(on)<br>60<br>PCB Cu thickness, 2.0 oz<br>100 50<br>1 10 100 1000 10,000 0 50 100 150 200 250 300 350 400 450 500<br>RG ( � ) COPPER HEAT SPREADER AREA (mm [2] )<br>TIME (ns) TIME (ns)<br>C/W)<br>°<br> (<br>JA<br>TIME (ns) �<br>R<br>**----- End of picture text -----**<br>


**Figure 15. Resistive Load Switching Time vs. Gate Resistance (VGS = 10 V, ID = 2.6 A)** 

**Figure 16. R � JA vs. Copper Area** 

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**----- Start of picture text -----**<br>
100<br>50% Duty Cycle<br>20%<br>10 10%<br>5%<br>2%<br>1%<br>1<br>Single Pulse<br>0.1<br>0.000001 0.00001 0.0001 0.001 0.01 0.1 1 10 100 1000<br>PULSE TIME (sec)<br>/W<br>°<br> C<br>2<br> 788 mm<br>JA<br>�<br>R<br>**----- End of picture text -----**<br>


**Figure 17. Transient Thermal Resistance** 

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**7** 

**NCV8440, NCV8440A** 

## **ORDERING INFORMATION** 

|**ORDERING INFORMATION**|||
|---|---|---|
|**Device**|**Package**|**Shipping**†|
|NCV8440STT1G|SOT−223<br>(Pb−Free)|1000 / Tape & Reel|
|NCV8440ASTT1G|SOT−223<br>(Pb−Free)|1000 / Tape & Reel|
|NCV8440STT3G|SOT−223<br>(Pb−Free)|4000 / Tape & Reel|
|NCV8440ASTT3G|SOT−223<br>(Pb−Free)|4000 / Tape & Reel|



†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. 

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**8** 

**onsemi** , , and other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “ **onsemi** ” or its affiliates and/or subsidiaries in the United States and/or other countries. **onsemi** owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of **onsemi** ’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. **onsemi** reserves the right to make changes at any time to any products or information herein, without notice. The information herein is provided “as−is” and **onsemi** makes no warranty, representation or guarantee regarding the accuracy of the information, product features, availability, functionality, or suitability of its products for any particular purpose, nor does **onsemi** assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using **onsemi** products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by **onsemi** . “Typical” parameters which may be provided in **onsemi** data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. **onsemi** does not convey any license under any of its intellectual property rights nor the rights of others. **onsemi** products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use **onsemi** products for any such unintended or unauthorized application, Buyer shall indemnify and hold **onsemi** and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that **onsemi** was negligent regarding the design or manufacture of the part. **onsemi** is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. 

## **PUBLICATION ORDERING INFORMATION** 

**LITERATURE FULFILLMENT** : **TECHNICAL SUPPORT Email Requests to:** orderlit@onsemi.com **North American Technical Support: Europe, Middle East and Africa Technical Support:** Voice Mail: 1 800−282−9855 Toll Free USA/Canada Phone: 00421 33 790 2910 **onsemi Website:** www.onsemi.com Phone: 011 421 33 790 2910 For additional information, please contact your local Sales Representative 

◊ 

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## Links

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- [Supplier page](https://es.farnell.com/on-semiconductor/ncv8440astt1g/mosfet-aec-q100-n-ch-55v-sot-223/dp/2724404)
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