# Fast / Ultrafast Diode, 400 V, 1 A, Single, 1.1 V, 65 ns, 35 A

![Product image](https://novapart.co/image/farnell:2441596/)

**URL**: https://novapart.co/products/MURA140T3G/fast-ultrafast-diode-400-v-1-a-single-11-65-ns-35
**SKU**: MURA140T3G
**Manufacturer**: ONSEMI
**Category**: Semiconductors - Discretes || Diodes & Rectifiers || Fast & Ultrafast Recovery Rectifier Diodes
**Price**: €0.0910
**Stock**: 10+
**Lead Time**: 85 days (indicative)

## Description

Repetitive Reverse Voltage Vrrm Max:400V; Forward Current If(AV):1A; Diode Configuration:Single; Forward Voltage VF Max:1.1V; Reverse Recovery Time trr Max:65ns; Forward Surge Curre

## Specifications

| Parameter | Value |
|---|---|
| Svhc | No SVHC (25-Jun-2025) |
| No. Of Pins | 2 Pin |
| Product Range | MURA1 |
| Qualification | - |
| Diode Case Style | DO-214AC (SMA) |
| Diode Configuration | Single |
| Forward Voltage Max | 1.1V |
| Forward Surge Current | 35A |
| Reverse Recovery Time | 65ns |
| Average Forward Current | 1A |
| Operating Temperature Max | 175°C |
| Repetitive Peak Reverse Voltage | 400V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:2441596/)

## MURA130T3G, SURA8130T3G, MURA140T3G, SURA8140T3G 

## **Preferred Devices** 

## Surface Mount Ultrafast Power Rectifiers 

Ideally suited for high voltage, high frequency rectification, or as free wheeling and protection diodes in surface mount applications where compact size and weight are critical to the system. 

## **http://onsemi.com** 

**ULTRAFAST RECTIFIERS 1 AMPERE, 300−400 VOLTS** 

## **Features** 

- Small Compact Surface Mountable Package with J−Bend Leads 

- Rectangular Package for Automated Handling 

- High Temperature Glass Passivated Junction 

- Low Forward Voltage Drop (0.8 V Max @ 1.0 A, TJ = 150  C) 

- AEC−Q101 Qualified and PPAP Capable 

- SURA8 Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements 

**==> picture [44 x 27] intentionally omitted <==**

**----- Start of picture text -----**<br>
SMA<br>CASE 403D<br>PLASTIC<br>**----- End of picture text -----**<br>


## **MARKING DIAGRAM** 

- All Packages are Pb−Free* 

## **Mechanical Characteristics:** 

- Case: Epoxy, Molded 

- Weight: 70 mg (Approximately) 

- Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable 

- Lead and Mounting Surface Temperature for Soldering Purposes: 260  C Max. for 10 Seconds 

- Polarity: Polarity Band Indicates Cathode Lead 

- ESD Protection: 

U4x AYWW U4x = Device Code x = F for MURA130T3 = G for MURA140T3 A = Assembly Location Y = Year WW = Work Week = Pb−Free Package 

- Human Body Model > 4000 V (Class 3) 

- Machine Model > 400 V (Class C) 

## **ORDERING INFORMATION** 

|**Device**|**Package**|**Shipping**†|
|---|---|---|
|MURA130T3G|SMA<br>(Pb−Free)|5,000/Tape & Reel|
|SURA8130T3G|SMA<br>(Pb−Free)|5,000/Tape & Reel|
|MURA140T3G|SMA<br>(Pb−Free)|5,000/Tape & Reel|
|SURA8140T3G|SMA<br>(Pb−Free)|5,000/Tape & Reel|



- †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. 

**Preferred** devices are recommended choices for future use and best overall value. 

> *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. 

Publication Order Number: **MURA130T3/D** 

**1** 

 Semiconductor Components Industries, LLC, 2012 **January, 2012 − Rev. 5** 

**MURA130T3G, SURA8130T3G, MURA140T3G, SURA8140T3G** 

## **MAXIMUM RATINGS** 

|**MAXIMUM RATINGS**||||
|---|---|---|---|
|**Rating**|**Symbol**|**Value**|**Unit**|
|Peak Repetitive Reverse Voltage<br>Working Peak Reverse Voltage<br>DC Blocking Voltage<br>MURA130T3G/SURA8130T3G<br>MURA140T3G/SURA8140T3G|VRRM<br>VRWM<br>VR|300<br>400|V|
|Average Rectified Forward Current<br>@ TL= 150C<br>@ TL= 125C|IF(AV)|1.0<br>2.0|A|
|Non-Repetitive Peak Surge Current<br>(Surge Applied at Rated Load Condtions Halfwave, Single Phase, 60 Hz)|IFSM|35|A|
|Operating Junction Temperature Range|TJ|−65 to +175|C|



Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 

## **THERMAL CHARACTERISTICS** 

|**THERMAL CHARACTERISTICS**||||
|---|---|---|---|
|**Characteristic**|**Symbol**|**Max**|**Unit**|
|Thermal Resistance, Junction−to−Lead (TL= 25C) (Note 1)<br>Thermal Resistance, Junction−to−Ambient (Note 1)|PsiJL<br>(Note 2)<br>RJA|24<br>216|C/W|



1. Rating applies when surface mounted on the minimum pad size recommended, PC Board FR−4. 

2. In compliance with JEDEC 51, these values (historically represented by RJL) are now referenced as PsiJL. 

## **ELECTRICAL CHARACTERISTICS** 

|**ELECTRICAL CHARACTERISTICS**||||
|---|---|---|---|
|**Characteristic**|**Symbol**|**Max**|**Unit**|
|Maximum Instantaneous Forward Voltage (Note 3)<br>(iF= 1.0 A, TJ= 25C)<br>(iF= 1.0 A, TJ= 150C)|vF|1.1<br>0.8|V|
|Maximum Instantaneous Reverse Current (Note 3)<br>(Rated DC Voltage, TJ= 25C)<br>(Rated DC Voltage, TJ= 150C)|iR|5.0<br>150|A|
|Maximum Reverse Recovery Time<br>(iF= 1.0 A, di/dt = 50 A/s)|trr|65|ns|



3. Pulse Test: Pulse Width = 300 � s, Duty Cycle  2.0%. 

**http://onsemi.com** 

**2** 

**MURA130T3G, SURA8130T3G, MURA140T3G, SURA8140T3G** 

**==> picture [490 x 390] intentionally omitted <==**

**----- Start of picture text -----**<br>
100 1000<br>TJ = 175C<br>10 TJ = 175C<br>100<br>TJ = 100C<br>1<br>10 TJ = 100C<br>0.1<br>TJ = 25C TJ = 25C<br>0.01 1<br>50 100 150 200 250 300 350 400 50 100 150 200 250 300 350 400<br>VR, REVERSE VOLTAGE (VOLTS) VR, REVERSE VOLTAGE (VOLTS)<br>Figure 1. Typical Reverse Current Figure 2. Maximum Reverse Current<br>10 10<br>TC = 175C 100C TC = 175C 100C<br>25C 25C<br>1 1<br>0.1 0.1<br>0.01 0.01<br>0.3 0.4 0.5 0.6 0.7 0.8 0.9 1 1.1 1.2 1.3 1.4 0.5 0.6 0.7 0.8 0.9 1 1.1 1.2 1.3 1.4 1.5<br>VF, INSTANTANEOUS VOLTAGE (VOLTS) VF, INSTANTANEOUS VOLTAGE (VOLTS)<br>A) A)<br>� �<br>, REVERSE CURRENT ( , REVERSE CURRENT (<br>IR IR<br>, INSTANTANEOUS FORWARD CURRENT (A)<br>, INSTANTANEOUS FORWARD CURRENT (A)IF IF<br>**----- End of picture text -----**<br>


**Figure 3. Typical Forward Voltage** 

**Figure 4. Maximum Forward Voltage** 

**http://onsemi.com** 

**3** 

**MURA130T3G, SURA8130T3G, MURA140T3G, SURA8140T3G** 

**==> picture [488 x 171] intentionally omitted <==**

**----- Start of picture text -----**<br>
30 30<br>NOTE: TYPICAL NOTE: MAXIMUM<br>25 CAPACITANCE AT 25 CAPACITANCE AT<br>0 V = 26 pF 0 V = 29 pF<br>20 20<br>15 15<br>10 10<br>5 5<br>0 0<br>0 4 8 12 16 20 24 28 32 36 40 0 4 8 12 16 20 24 28 32 36 40<br>VR, REVERSE VOLTAGE (VOLTS) VR, REVERSE VOLTAGE (VOLTS)<br>C, CAPACITANCE (pF) C, CAPACITANCE (pF)<br>**----- End of picture text -----**<br>


**Figure 5. Typical Capacitance** 

**Figure 6. Maximum Capacitance** 

**==> picture [489 x 402] intentionally omitted <==**

**----- Start of picture text -----**<br>
5 1<br>dc<br>4<br>0.75<br>dc<br>3<br>SQUARE WAVE<br>0.5<br>2 SQUARE WAVE<br>0.25<br>1<br>0 0<br>80 90 100 110 120 130 140 150 160 170 180 0 20 40 60 80 100 120 140 160 180<br>TL, LEAD TEMPERATURE (C) TA, AMBIENT TEMPERATURE (C)<br>Figure 7. Current Derating, Lead Figure 8. Current Derating, Ambient<br>(FR−4 Board with Minimum Pad)<br>4<br>3.5<br>dc<br>3<br>2.5<br>SQUARE WAVE<br>2<br>1.5<br>1<br>0.5<br>0<br>0 0.5 1 1.5 2 2.5 3 3.5<br>IF(AV), AVERAGE FORWARD CURRENT (AMPS)<br>, AVERAGE FORWARD CURRENT (A) , AVERAGE FORWARD CURRENT (A)<br>IF(AV) IF(AV)<br>, AVERAGE POWER DISSIPATION (W)<br>F<br>P<br>**----- End of picture text -----**<br>


**Figure 9. Power Dissipation** 

**http://onsemi.com** 

**4** 

**MURA130T3G, SURA8130T3G, MURA140T3G, SURA8140T3G** 

## **PACKAGE DIMENSIONS** 

**SMA** CASE 403D−02 ISSUE F 

**==> picture [471 x 404] intentionally omitted <==**

**----- Start of picture text -----**<br>
HE<br>NOTES:<br>1. DIMENSIONING AND TOLERANCING PER ANSI<br>E Y14.5M, 1982.<br>2. CONTROLLING DIMENSION: INCH.<br>3. 403D−01 OBSOLETE, NEW STANDARD IS 403D−02.<br>=<br>MILLIMETERS INCHES<br>DIM MIN NOM MAX MIN NOM MAX<br>b D A 1.97 2.10 2.20 0.078 0.083 0.087<br>A1 0.05 0.10 0.15 0.002 0.004 0.006<br>b 1.27 1.45 1.63 0.050 0.057 0.064<br>c 0.15 0.28 0.41 0.006 0.011 0.016<br>Le POLARITY INDICATOR D 2.29 2.60 2.92 0.090 0.103 0.115<br>OPTIONAL AS NEEDED bay S=SS== E 4.06 4.32 4.57 0.160 0.170 = 0.180<br>(SEE STYLES) H E 4.83 5.21 5.59 0.190 0.205 0.220<br>L 0.76 1.14 1.52 0.030 0.045 0.060<br>STYLE 1:<br>PIN 1. CATHODE (POLARITY BAND)<br>2. ANODE<br>A<br>A1<br>=], L c on<br>SOLDERING FOOTPRINT*<br>4.0<br>0.157<br>2.0<br>0.0787<br>oo<br>oe<br>2.0<br>_<br>0.0787<br>SCALE 8:1 mm<br>(—) inches<br>*For additional information on our Pb−Free strategy and soldering<br>details, please download the ON Semiconductor Soldering and<br>Mounting Techniques Reference Manual, SOLDERRM/D.<br>**----- End of picture text -----**<br>


**ON Semiconductor** and          are registered trademarks of Semiconductor Components Industries, LLC (SCILLC).  SCILLC reserves the right to make changes without further notice to any products herein.  SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time.  All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts.  SCILLC does not convey any license under its patent rights nor the rights of others.  SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur.  Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part.  SCILLC is an Equal Opportunity/Affirmative Action Employer.  This literature is subject to all applicable copyright laws and is not for resale in any manner. 

## **PUBLICATION ORDERING INFORMATION** 

**LITERATURE FULFILLMENT** : 

Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA **Phone** : 303−675−2175 or 800−344−3860 Toll Free USA/Canada **Fax** : 303−675−2176 or 800−344−3867 Toll Free USA/Canada **Email** : orderlit@onsemi.com 

**N. American Technical Support** : 800−282−9855 Toll Free USA/Canada 

**Europe, Middle East and Africa Technical Support:** Phone: 421 33 790 2910 **Japan Customer Focus Center** Phone: 81−3−5817−1050 

**ON Semiconductor Website** : **www.onsemi.com** 

**Order Literature** : http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative 

**http://onsemi.com** 

**MURA130T3/D** 

**5** 



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