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MUN12AD03-SECM
Non Isolated POL DC/DC Converter, Micro Module, 16.5 W, 800 mV, 5.5 V, 3 A
⚠️ Reference pricing provided. In case of supply shortages, we will connect you with our trusted procurement partners to ensure your project's continuity.
- Manufacturer: CYNTEC
- Product type: DC / DC Non Isolated Board Mount Converters - Adjustable Output
- SVHC: No SVHC (21-Jan-2025)
- Depth: 3mm
- Width: 2.8mm
- Height: 1.7mm
- Product Range: -
- Output Power Max: 16.5W
- Output Current Max: 3A
- Output Voltage Max: 5.5V
- Output Voltage Min: 800mV
- Input Voltage DC Max: 17V
- Input Voltage DC Min: 4.5V
- DC / DC Converter Type: Micro Module
- Power Supply Applications: -
- DC / DC Converter Output Type: Adjustable
| Delivery and price | |
|---|---|
| Units per pack | 500 |
| Price | 1.79 € |
| Current stock | 10+ |
| Lead time | 30 days |
Datasheet
## **uPOL MODULE**
## **3A, High Efficiency uPOL Module**
## **MUN12AD03-SECM**
## **FEATURES:**
- High Density uPOL Module
- 3A Output Current
- 92% Peak Efficiency at 12VIN
- Input Voltage Range from 4.5V to 17V
- Output Voltage Range from 0.8V to 5.5V
- Enable / PGOOD Function
- Automatic Power Saving/PWM Mode
- Protections (OCP: Non-latching, OTP)
- Adjustable Soft Start Function
- Compact Size: 3.0mm*2.8mm*1.7mm
- Pb-free for RoHS compliant
- MSL 2, 260℃ Reflow
## **APPLICATIONS:** kee
- Point of Load Conversion
- LDOs Replacement
- Set Top Box / DSL Modem / AP Router
- Industrial Personal Computer
## **GENERAL DESCRIPTION:**
The uPOL module is non-isolated dc-dc converter that can deliver up to 3A of output current. The PWM switching regulator, high frequency power inductor are integrated in one hybrid package. It only needs input/output capacitors and one voltage dividing resistor to perform properly.
The module has automatic operation with PWM mode and power saving mode according to loading, through constant on-time control, the module offers a simpler control loop and faster transient response. Other features include remote enable function, internal soft-start, non-latching over current protection, power good, input under voltage locked-out capability.
The low profile and compact size package (3.0mm × 2.8mm x 1.7mm) is suitable for automated assembly by standard surface mount equipment. The uPOL module is Pb-free and
RoHS compliance.
## **TYPICAL APPLICATION CIRCUIT & PACKAGE:** ~~ee~~
**==> picture [412 x 129] intentionally omitted <==**
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VBia s 1.7mm(Max)<br>EN<br>RPG VP GOOD<br>EN P GOOD<br>3.0mm<br>VIN VOUT tyZa 2.8mm<br>VIN Vout<br>uP OL Module<br>RFB_T<br>C IN SS FB COUT<br>CSS GND RFB_B<br>**----- End of picture text -----**<br>
**FIG.1 Typical Application Circuit**
**FIG.2 High Density Low Profile**
**uPOL Module**
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**MUN12AD03-SECM**
|**MUN12AD03-SECM**<br>Geyntec|**MUN12AD03-SECM**<br>Geyntec|**MUN12AD03-SECM**<br>Geyntec|**MUN12AD03-SECM**<br>Geyntec|**MUN12AD03-SECM**<br>Geyntec|**MUN12AD03-SECM**<br>Geyntec|
|---|---|---|---|---|---|
|**ORDER INFORMATION:**<br>~~|~~||||||
|**Operating Temperature**||**Package**||||
|**Part Number**|||**MSL**||**Note**|
|**Range (°C)**||**(Pb-Free)**||||
|MUN12AD03-SECM<br>-40 ~ +125||DFN|Level 2||-|
|||||||
|**Order Code**||**Packing**|||**Quantity**|
|MUN12AD03-SECM||Tape and reel|Tape and reel||2000|
**==> picture [461 x 236] intentionally omitted <==**
**----- Start of picture text -----**<br>
PIN CONFIGURATION: |<br>@. [4<br>EN (1) (8) SS<br>L _| aa L _|<br>Vin (2) rq aon (7) PGOOD<br>Ld | (9) GND pL<br>- 7 | rT<br>GND (3) Lt | Po (6) FB<br>rT ro rT<br>Vout (4) (5) Vout<br>**----- End of picture text -----**<br>
Top View
**Fig.3 Pin configuration**
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**MUN12AD03-SECM**
## **PIN DESCRIPTION:** CC
|**Symbol**|**Pin No.**|**Description**|
|---|---|---|
|EN|1|On/Off control pin for module.<br>EN = LOW, the module is off.<br>EN = HIGH, the module is on.<br>This pin has an internal pull-down resistor of 402 kΩ when the module is<br>disabled.|
|VIN|2|Power input pin. It needs to be connected to input rail.|
|GND|3, 9|Power ground pin for signal, input, and output return path. This pin<br>needs to be connected to one or moregroundplane directly.|
|VOUT|4, 5|Power output pin. Connect to output for the load.|
|FB|6|Feedback input. Connect an external resistor divider to set the output<br>voltage.|
|PGOOD|7|Power Good indicator. The pin output is an open drain that can connect<br>to Vout byresistor.|
|SS|8|Soft startup pin.|
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**MUN12AD03-SECM**
## **ELECTRICAL SPECIFICATIONS:** ~~Cn~~
CAUTION: Do not operate at or near absolute maximum rating listed for an extended period of time. This stress may adversely impact product reliability and result in failures outside of warranty.
|**Parameter**<br>~~es~~|**Description**|**Min.**|**Typ.**|**Max.**|**Unit**|
|---|---|---|---|---|---|
|◼<br>Absolute Maximum Ratings<br>~~es~~<br>~~a~~<br>~~ee~~||||||
|VIN to GND<br>~~ee~~<br>~~ee~~|~~ee~~|-|-|+19.0|V|
|VOUT to GND<br>~~ee~~<br>~~ee~~<br>~~ee~~|~~ee~~|-|-|+6.5|V|
|FB to GND<br>~~ee ~~<br>~~ee~~<br>~~es~~|~~ee~~|-|-|+4.0|V|
|EN to GND<br>~~ee~~<br>~~es~~||-|-|VIN+0.3|V|
|PGOOD to GND<br>~~es~~<br>~~ee~~|~~ee~~|-<br>~~ee~~|-<br>~~ee~~|+19.0<br>~~ee~~|V<br>~~ee~~|
|Reflow Peak Temperature<br>~~ee~~<br>~~ee~~<br>~~es~~|Reflow Peak Temperature<br>~~ee~~<br>~~ee~~<br>~~es~~|-<br>~~ee~~<br>~~ee~~<br>~~es~~|-<br>~~ee~~<br>~~ee~~<br>~~es~~|+260<br>~~ee~~<br>~~ee~~<br>~~es~~|°C<br>~~ee~~<br>~~ee~~<br>~~es~~|
|Tc<br>~~ee~~<br>~~es~~<br>~~ee~~|Case Temperature of Inductor<br>~~ee~~<br>~~es~~<br>~~ee~~|-<br>~~ee~~<br>~~es~~<br>~~ee~~|-<br>~~ee~~<br>~~es~~<br>~~ee~~|+110<br>~~ee~~<br>~~es~~<br>~~ee~~|°C<br>~~ee~~<br>~~es~~<br>~~ee~~|
|Tj<br>~~es~~<br>~~ee~~<br>~~ee~~|Junction Temperature<br>~~es~~<br>~~ee~~<br>~~es~~|-<br>~~es~~<br>~~ee~~<br>~~es~~|-<br>~~es~~<br>~~ee~~<br>~~es~~|+150<br>~~es~~<br>~~ee~~<br>~~es~~|°C<br>~~es~~<br>~~ee~~<br>~~es~~|
|Tstg<br>~~ee~~<br>~~ee~~|Storage Temperature<br>~~ee~~<br>~~es~~|-40<br>~~ee~~<br>~~es~~|-<br>~~ee~~<br>~~es~~|+125<br>~~ee~~<br>~~es~~|°C<br>~~ee~~<br>~~es~~|
|ESD Rating<br>~~ee~~|Human Body Model (HBM)<br>~~es~~|-<br>~~es~~<br>~~ee~~|-<br>~~es~~|2k<br>~~es~~|V<br>~~es~~|
||Machine Model (MM)<br>~~ee~~|-<br>~~ee~~<br>~~ee~~<br>~~ee~~|-<br>~~ee~~|200<br>~~ee~~|V<br>~~ee~~|
||Charge Device Model (CDM)<br>~~ee~~|-<br>~~ee~~<br>~~ee~~<br>~~ee~~|-<br>~~ee~~|500<br>~~ee~~|V<br>~~ee~~|
|◼<br>Recommendation Operating Ratings<br>~~ee~~<br>~~a~~<br>~~ee~~||||||
|VIN<br>~~ee~~<br>~~ee~~|Input Supply Voltage|+4.5|-|+17.0|V|
|VOUT<br>~~ee~~<br>~~ee~~|Adjusted Output Voltage|+0.8|-|+5.5|V|
|IOUT<br>~~ee~~<br>~~a~~<br>~~es~~|Output continuous current range<br>~~ns~~|0<br>~~ns~~|-<br>~~ns~~|3<br>~~ns~~|A<br>~~ns~~|
|VPGOOD<br>~~es~~|Power Good Voltage<br>~~ns~~|-<br>~~ns~~|-<br>~~ns~~|+17.0<br>~~ns~~|V<br>~~ns~~|
|Tj<br>~~es~~<br>~~a~~|Junction Temperature<br>~~ns~~<br>|-40<br>~~ns~~<br>|-<br>~~ns~~<br>|+125<br>~~ns~~<br>|°C<br>~~ns~~<br>|
|Ta<br>~~es~~|Operating Temperature Range (Note 2)<br>~~es~~|Operating Temperature Range (Note 2)<br>-40<br>~~es~~|-<br>~~es~~|+125<br>~~es~~|°C<br>~~es~~|
|◼<br>Thermal Information<br>~~a~~<br>~~eeeeeeee~~||||||
|Rth(jchoke-a)<br>~~a~~|Thermal resistance from junction to<br>ambient. (Note 1)<br>~~a~~<br>~~ee~~|-<br>~~a~~<br>~~ee~~|39<br>~~a~~<br>~~ee~~|-<br>~~a~~<br>~~ee~~|°C/W<br>~~a~~|
2. For maximum operating temperature, thermal derating to be taken into account.
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**MUN12AD03-SECM**
## **ELECTRICAL SPECIFICATIONS: (Cont.)** ~~Cn~~
Conditions: TA = 25 ºC, unless otherwise specified. Test Board Information: 30mm× 30mm× 1.6mm, 4 layers, 2oz. The output ripple and transient response are measured by short loop probing and limited to 20MHz bandwidth. Cin = 10uF/25V/1206*1, Cout = 22uF/10V/0805*2.
|**Symbol**<br>~~a~~<br>~~en~~|**Symbol**<br>**Parameter**<br>~~en~~|**Conditions**|**Min. Typ. Max.**|**Min. Typ. Max.**|**Min. Typ. Max.**|**Min. Typ. Max.**<br>**Unit**|
|---|---|---|---|---|---|---|
|◼<br>Input Characteristics<br>~~en~~<br>~~esOO~~|||||||
|IQ<br>~~en~~<br>~~es~~<br>~~es~~|Quiescent current<br>~~en~~<br>~~OO~~<br>~~a~~|Iout=0,VFB=VREF*105%<br>~~OO~~<br>~~OO~~|-<br>~~OO~~<br>~~OO~~|100<br>~~OO~~|-<br>~~OO~~|uA<br>~~OO~~|
|ISD(IN)<br>~~es~~<br>~~es~~|Input shutdown current<br>~~OO~~<br>~~a~~|Vin =12V, EN = GND<br>~~OO~~<br>~~OO~~|-<br>~~OO~~<br>~~OO~~<br>~~ee~~|5.5<br>~~OO~~<br>~~ee~~|-<br>~~OO~~<br>~~ee~~|uA<br>~~OO~~|
|IS(IN)<br>~~es~~|Input supply current<br>~~a~~|Vin =12V, EN = VIN<br>~~OO~~<br>~~ee~~|-<br>~~OO~~<br>~~ee~~<br>~~ee~~<br>~~ee~~|-<br>~~ee~~<br>~~ee~~<br>~~ee~~|-<br>~~ee~~<br>~~ee~~|-<br>~~ee~~|
|||Iout = 0A, Vout = 1.8V<br>~~ee~~|-<br>~~ee~~<br>~~ee~~<br>~~ee~~<br>~~ee~~|0.14<br>~~ee~~<br>~~ee~~<br>~~ee~~<br>~~ee~~|-<br>~~ee~~<br>~~ee~~|mA<br>~~ee~~|
|||Iout = 3A, Vout = 1.8V<br>~~ee~~<br>~~ee~~|-<br>~~ee~~<br>~~ee~~<br>~~ee~~<br>~~ee~~|0.62<br>~~ee~~<br>~~ee~~<br>~~ee~~<br>~~ee~~|-<br>~~ee~~<br>~~ee~~|A<br>~~ee~~<br>~~ee~~|
|◼<br>Output Characteristics<br>~~ee~~<br>~~ee~~<br>~~ee~~|||||||
|ΔVOUT<br>/ΔVIN<br>~~a~~|Line regulation accuracy|Vin = 4.5V to 17V<br>Vout = 1.8V,Iout = 1.5A|-|0.1|0.5|% VO(SET)|
|ΔVOUT<br>/ΔIOUT<br>~~a~~|Load regulation accuracy|Iout = 0.5A to 3A<br>Vin = 12V,Vout = 1.8V|-|0.2|1|% VO(SET)|
|VOUT(AC)<br>~~2~~|Output ripple voltage|Vin = 12V, Vout = 3.3V|-|-|-|-|
|||Iout = 0A<br>~~ee~~|-<br>~~ee~~|12<br>~~ee~~|-<br>~~ee~~|mVp-p<br>~~ee~~|
|||Iout = 3A<br>~~ee~~|-<br>~~ee~~|6<br>~~ee~~|-<br>~~ee~~|mVp-p<br>~~ee~~|
|◼<br>Dynamic Characteristics<br>~~|~~|||||||
|ΔVOUT-DP|Voltage change for positive load<br>step|Iout = 1.5 A to 3A<br>Current slew rate = 2.5A/uS<br>Vin = 12V,Vout = 1.8V|-|40|-|mVp-p|
|ΔVOUT-DN|Voltage change for negative load<br>step|Iout = 3A to 1.5A<br>Current slew rate = 2.5A/uS<br>Vin = 12V,Vout = 1.8V|-|40|-|mVp-p|
|◼ Control Characteristics<br>~~ee~~|||||||
|VFB<br>~~es~~|Feedback regulation voltage<br>|PWM Mode<br>~~ee~~|0.788 0.800 0.812<br>~~ee~~<br>~~ee~~|0.788 0.800 0.812<br>~~ee~~<br>~~ee~~|0.788 0.800 0.812<br>~~ee~~|V<br>~~ee~~|
|||PWM Mode, Ta=-40~85°C<br>~~ee~~<br>|0.78<br>~~ee~~<br>~~ee~~<br>~~ee~~<br>|0.800<br>~~ee~~<br>~~ee~~<br>~~ee~~<br>|0.82<br>~~ee~~<br>|V<br>~~ee~~<br>|
|||PFM Mode, Ta=-40~85°C<br>~~ee~~<br>|0.788 0.800 0.824<br>~~ee~~<br>~~ee~~<br>~~ee~~<br>|0.788 0.800 0.824<br>~~ee~~<br>~~ee~~<br>~~ee~~<br>|0.788 0.800 0.824<br>~~ee~~<br>|V<br>~~ee~~<br>|
|DMAX<br>~~es~~<br>~~es~~|Maximum duty cycle<br>~~**GO**~~|Vout(MAX)= Vin * DMAX<br>~~**GO**~~|70<br>~~ee~~<br>~~**GO**~~|-<br>~~ee~~<br>~~**GO**~~|-<br>~~**GO**~~|%<br>~~**GO**~~|
|FOSC<br>~~es~~<br>~~es~~|Oscillator frequency<br>~~**GO**~~|PWM Operation<br>~~**GO**~~|-<br>~~ee~~<br>~~**GO**~~|1.0<br>~~ee~~<br>~~**GO**~~|-<br>~~**GO**~~|MHz<br>~~**GO**~~|
|VUVLO<br><br>~~es~~<br>~~a~~<br>~~es~~|Input UVLO threshold<br>~~**GO**~~<br>~~GO~~|~~**GO**~~<br>~~GO~~|-<br>~~**GO**~~<br>~~GO~~|-<br>~~**GO**~~<br>~~GO~~|4.5<br>~~**GO**~~<br>~~GO~~|V<br>~~**GO**~~<br>~~GO~~|
|VPG<br>~~es~~<br>~~es~~|Power good threshold<br>~~GO~~<br>~~GO~~|VFBrising<br>~~GO~~<br>~~GO~~|88<br>~~GO~~<br>~~GO~~|90<br>~~GO~~<br>~~GO~~|92<br>~~GO~~<br>~~GO~~|%VREF<br>~~GO~~<br>~~GO~~|
|VPG,HYS<br>~~es~~<br>~~es~~<br>~~es~~|Power good hysteresis<br>~~GO~~<br>~~GO~~<br>~~GO~~|~~GO~~<br>~~GO~~<br>~~GO~~|-<br>~~GO~~<br>~~GO~~<br>~~GO~~|2<br>~~GO~~<br>~~GO~~<br>~~GO~~|-<br>~~GO~~<br>~~GO~~<br>~~GO~~|%VREF<br>~~GO~~<br>~~GO~~<br>~~GO~~|
|VPGL<br>~~es~~<br>~~es~~<br>~~—_————————E~~|PGOOD output low<br>~~GO~~<br>~~GO~~<br>~~—_————————E~~|IPGOOD=4mA<br>~~GO~~<br>~~GO~~<br>~~—_————————E~~|0.04<br>~~GO~~<br>~~GO~~<br>~~—_————————E~~|0.15<br>~~GO~~<br>~~GO~~<br>~~—_————————E~~|0.3<br>~~GO~~<br>~~GO~~<br>~~—_————————E~~|V<br>~~GO~~<br>~~GO~~<br>~~—_————————E~~|
|VEN_TH<br>~~es~~<br>~~—_————————E~~<br>~~a~~<br>~~a~~<br>~~a~~|Enable rising threshold voltage<br>~~GO~~<br>~~—_————————E~~<br>~~a~~<br>~~ee~~|~~GO~~<br>~~—_————————E~~<br>~~ee~~|1.5<br>~~GO~~<br>~~—_————————E~~<br>~~ee~~|-<br>~~GO~~<br>~~—_————————E~~<br>~~ee~~|-<br>~~GO~~<br>~~—_————————E~~<br>~~ee~~|V<br>~~GO~~<br>~~—_————————E~~<br>~~ee~~|
||Enable falling threshold voltage<br>~~—_————————E~~<br>~~a~~<br>~~ee~~<br>|~~—_————————E~~<br>~~ee~~<br>|-<br>~~—_————————E~~<br>~~ee~~<br>~~ee~~<br>|-<br>~~—_————————E~~<br>~~ee~~<br>~~ee~~<br>|0.4<br>~~—_————————E~~<br>~~ee~~<br>~~ee~~<br>|V<br>~~—_————————E~~<br>~~ee~~<br>|
|REN<br>~~—_————————E~~<br>~~a~~<br>~~a~~<br>~~a~~|Internal resistor between EN and<br>GNDpins<br>~~—_————————E~~<br>~~a~~<br>~~ee~~<br>|~~—_————————E~~<br>~~ee~~<br>|-<br>~~—_————————E~~<br>~~ee~~<br>~~ee~~<br>|402<br>~~—_————————E~~<br>~~ee~~<br>~~ee~~<br>|-<br>~~—_————————E~~<br>~~ee~~<br>~~ee~~<br>|kΩ<br>~~—_————————E~~<br>~~ee~~<br>|
|TOTP<br>~~a~~<br>~~a~~<br>~~a~~|Over temp protection<br>~~a~~<br>~~ee~~<br>|~~ee~~<br>|-<br>~~ee~~<br>~~ee ~~<br>|150<br>~~ee~~<br> ~~ee~~<br>|-<br>~~ee~~<br>~~ee~~<br>|°C<br>~~ee~~<br>|
|OCP<br>~~sO~~|Protection Output Current<br>~~sO~~|~~sO~~|3.8<br>~~sO~~|-<br>~~sO~~|5.2<br>~~sO~~|A<br>~~sO~~|
5
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**MUN12AD03-SECM**
## **TYPICAL PERFORMANCE CHARACTERISTICS: (1.0VOUT)**
Conditions: TA = 25 ºC, unless otherwise specified. Test Board Information: 30mm× 30mm× 1.6mm, 4 layers, 2oz. The output ripple and transient response are measured by short loop probing and limited to 20MHz bandwidth. Vin = 12 V, Vout = 1.0 V, unless otherwise noted.
Cin = 10uF/25V/1206*1, Cout = 22uF/10V/0805*2.
**==> picture [400 x 379] intentionally omitted <==**
**----- Start of picture text -----**<br>
FIG.4 Efficiency V.S. Load Current FIG.5 De-rating Curve<br>fek Stop cee eer | Tek Stop QF<br>pp | la | al | te __.| iti... {) Sahin Jie, WO ae WO sa car ae ala,<br>VOUT VOUT<br>|Pf |a |<br>@ 500m 08 2.00ms 5.00MS/s oO. @ 500m 08 T.00ys 2.5088/<br>G¥504.0000y 100k points -200yV G504,0000ps 100k points<br>@ Peak-Peak 5.40m¥ @ Peak-Peak 3.60mV<br>FIG.6 Output Ripple FIG.7 Output Ripple<br>(Iout=0A) (Iout=3A)<br>Tek Stop cee | eer S| Tek Stop ees ees<br>VOUT VOUT<br>PGOOD<br>IOUT<br>EN<br>2.5A/us D<br>40.0ps 250MS/s f<br>7 @D 50.0mv v5 G+¥97,620001s 100k points 2.204<br>@ Pesk-Peak 78,0mV @ iv i) 1,00ms 10.0MS/s<br>@ ax 37.0m¥ 100¥ & UW¥504.0000s 100k points<br>@win -41.0mV<br>FIG.8 Transient Response FIG.9 Turn-on<br>(50% to 100% Load Step) (Iout=3A)<br>**----- End of picture text -----**<br>
6
Rev.03
**MUN12AD03-SECM**
## **TYPICAL PERFORMANCE CHARACTERISTICS: (1.8VOUT)**
Conditions: TA = 25 ºC, unless otherwise specified. Test Board Information: 30mm× 30mm× 1.6mm, 4 layers, 2oz. The output ripple and transient response are measured by short loop probing and limited to 20MHz bandwidth. Vin = 12 V, Vout = 1.8 V, unless otherwise noted. Cin = 10uF/25V/1206*1, Cout = 22uF/10V/0805*2.
**==> picture [406 x 378] intentionally omitted <==**
**----- Start of picture text -----**<br>
FIG.10 Efficiency V.S. Load Current FIG.11 De-rating Curve at 12Vin<br>eee: ees Ae Tek Stop ces eee Sess<br>VOUT VOUT<br>om v4 .00ms 10.0MS/s oO. @ 500m 08 T.00ys 2,5088/s oO.<br>G4¥504,0000) 100k points -200pV Gy504.0000,1s 100k points -200pV<br>IG.12 Output Ripple FIG.13 Output Ripple<br>(12Vin, Iout=0A) (12Vin, Iout=3A)<br>ces | eer S| Tek Stop cee | eer |<br>VOUT VOUT<br>PGOOD<br>IOUT<br>EN<br>2.5A/us Di<br>40.0ps 250MS/s f<br>50.0 Jlii>¥97.62000ys 100k points __2.20<br>Pesk-Peak 82.0mV @ 200 Ry 1.00ms 10,0MS/s f<br>ax 39,0m¥ 2.00¥ W G¥504.0000ys 100k points 4.40V<br>-43,0mV<br>FIG.14 Transient Response FIG.15 Turn-on<br>(12Vin, 50% to 100% Load Step) (12Vin, Iout=3A)<br>**----- End of picture text -----**<br>
7
Rev.03
**MUN12AD03-SECM**
## **TYPICAL PERFORMANCE CHARACTERISTICS: (3.3VOUT)**
Conditions: TA = 25 ºC, unless otherwise specified. Test Board Information: 30mm× 30mm× 1.6mm, 4 layers, 2oz. The output ripple and transient response are measured by short loop probing and limited to 20MHz bandwidth. Vin = 12 V, Vout = 3.3 V, unless otherwise noted.
Cin = 10uF/25V/1206*1, Cout = 22uF/10V/0805*2.
**==> picture [408 x 379] intentionally omitted <==**
**----- Start of picture text -----**<br>
FIG.16 Efficiency V.S. Load Current FIG.17 De-rating Curve at 12Vin<br>Tek Stop [OT<br>VOUT VOUT<br>om 40h 25.0MS/s oO. @ 500m 05 T.00ys 2.5088/5 oO.<br>@0.000000 100k points _-6.00mV t+v0.000000 100k points 900pV<br>FIG.18 Output Ripple FIG.19 Output Ripple<br>(12Vin, Iout=0A) (12Vin, Iout=3A)<br>p Se | Tek Stop A ee<br>VOUT VOUT<br>PGOOD<br>IOUT<br>EN<br>2.5A/us ia,<br>40.0ps 250MS/s f<br>Jlii>¥97.62000ys 100k points __2.20<br>Pesk-Peak 88.0m¥ @ 20 &y 1.00ms 10,0MS/s f<br>ax 39,0m¥ 2.00¥ © G¥504.0000ys 100k points 4.40V<br>-49,0mV<br>FIG.20 Transient Response FIG.21 Turn-on<br>(12Vin, 50% to 100% Load Step) (12Vin, Iout=3A)<br>**----- End of picture text -----**<br>
8
Rev.03
**MUN12AD03-SECM**
## **TYPICAL PERFORMANCE CHARACTERISTICS: (5.0VOUT)**
Conditions: TA = 25 ºC, unless otherwise specified. Test Board Information: 30mm× 30mm× 1.6mm, 4 layers, 2oz. The output ripple and transient response are measured by short loop probing and limited to 20MHz bandwidth. Vin = 12 V, Vout = 5.0 V, unless otherwise noted. Cin = 10uF/25V/1206*1, Cout = 22uF/10V/0805*2.
**FIG.22 Efficiency V.S. Load Current**
**FIG.23 De-rating Curve at 12Vin**
**VOUT VOUT** 10.0my 44 20048 50.0MS/s oO. @D 5.00my 44 1.00ps 2.5088/s Gv0.000000 100k points 2.20mV Gv0.000000 100k points **FIG.24 Output Ripple FIG.25 Output Ripple (12Vin, Iout=0A) (12Vin, Iout=3A)** p ~~cee~~ | ~~eer S|~~ Tek Stop ~~eee: eee:~~ **VOUT VOUT PGOOD IOUT EN 2.5A/us** [2 40.0ps 250MS/s f 50.0 Jlii>¥97.62000ys 100k points 2.20A Pesk-Peak 96.0m¥ @ 5.00v i) 1,00ms 10.0MS/s ax 39,0m¥ 5.00¥ & UW¥504.0000s 100k points -57.0mV **FIG.26 Transient Response FIG.27 Turn-on (12Vin, 50% to 100% Load Step) (12Vin, Iout=3A)**
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Rev.03
**MUN12AD03-SECM**
> **APPLICATIONS INFORMATION:** ~~i~~
## **REFERENCE CIRCUIT FOR GENERAL APPLICATION:**
Figure 28 show the module application schematics for input voltage +12V.
The output capacitor is selected to handle the output ripple noise requirements and system stability. The out capacitance have to be followed COUT_Min shown in the TABLE 1
**TABLE 1 Output capacitor setting**
|**VIN(V)**|**VOUT(V)**|**COUT_Min(uF)**|
|---|---|---|
|4.5~17|1|22|
|4.5~17|1.2|22|
|4.5~7|1.5|22*2|
|8~17|1.5|22|
|4.5~7|1.8|22*2|
|8~17|1.8|22|
|5~17|3.3|22*2|
|7~17|5|22*2|
**FIG.28 Reference Circuit for General Application**
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Rev.A1
**MUN12AD03-SECM**
> **APPLICATIONS INFORMATION: (Cont.)** ~~Lt~~
## **SAFETY CONSIDERATIONS:**
Certain applications and/or safety agencies may require fuses at the inputs of power conversion components. Fuses should also be used when there is the possibility of sustained input voltage reversal which is not current limited. For greatest safety, we recommend a fast blow fuse installed in the ungrounded input supply line. The installer must observe all relevant safety standards and regulations. For safety agency approvals, install the converter in compliance with the end-user safety standard.
## **INPUT FILTERING:**
The module should be connected to a source supply of low AC impedance and high inductance in which line inductance can affect the module stability. An input capacitor must be placed as near as possible to the input pin of the module so to minimize input ripple voltage and ensure module stability.
## **OUTPUT FILTERING:**
To reduce output ripple and improve the dynamic response as the step load changes, an additional capacitor at the output must be connected. Low ESR polymer and ceramic capacitors are recommended to improve the output ripple and dynamic response of the module.
## **PROGRAMMING OUTPUT VOLTAGE:**
The module has an internal 0.8V ± 1.5% reference voltage. The output voltage can be programmed by the dividing resistor (RFB_T and RFB_B). The output voltage can be calculated by Equation 1, resistor choice may be referred to TABLE 2.
(EQ.1)
**TABLE 2 Resistor values for common output voltages**
|VOUT(V)|RFB_T(k)|RFB_B(k)|
|---|---|---|
|1.0|124|499|
|1.2|124|243|
|1.5|124|140|
|1.8|124|100|
|3.3|124|39.2|
|5.0|124|23.7|
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Rev.A1
**MUN12AD03-SECM**
## **APPLICATIONS INFORMATION: (Cont.)**
## **Soft Startup Capacitor Selection**
Leave SS pin floating for default 1ms soft-start time. For longer than 1ms soft-start time, connect a capacitance between the SS pin and the GND allows programming the startup slope of the output voltage. A constant current of 4 μ A charges the external capacitor. The capacitance required for a given soft startup time for the output voltage is given by Equation 2:
**==> picture [34 x 10] intentionally omitted <==**
## **Thermal Considerations:**
All of thermal testing condition is complied with JEDEC EIJ/JESD 51 Standards. Therefore, the test board size is 30mm× 30mm× 1.6mm with 4 layers 2oz. The case temperature of module sensing point is shown as Figure 29. Then Rth(jchoke-a) is measured with the component mounted on an effective thermal conductivity test board on 0 LFM condition. The MUN12AD03-SECM modules are designed for using when the case temperature is below 110°C regardless the change of output current, input/output voltage or ambient temperature.
Sensing point (Defined case temperature)
**FIG. 29 Case Temperature Sensing Point**
12
Rev.A1
**MUN12AD03-SECM**
## **REFLOW PARAMETERS:** ~~|~~
Lead-free soldering process is a standard of electronic products production. Solder alloys like Sn/Ag, Sn/Ag/Cu and Sn/Ag/Bi are used extensively to replace the traditional Sn/Pb alloy. Sn/Ag/Cu alloy (SAC) is recommended for this power module process. In the SAC alloy series, SAC305 is a very popular solder alloy containing 3% Ag and 0.5% Cu and easy to obtain. Figure 30 shows an example of the reflow profile diagram. Typically, the profile has three stages. During the initial stage from room temperature to 150°C, the ramp rate of temperature should not be more than 3°C/sec. The soak zone then occurs from 150°C to 200°C and should last for 60 to 120 seconds. Finally, keep at over 217°C for 60~150 seconds limit to melt the solder and make the peak temperature at the range from 255°C to 260°C (Do not exceed 30 sec). It is noted that the time of peak temperature should depend on the mass of the PCB board. The reflow profile is usually supported by the solder vendor and one should adopt it for optimization according to various solder type and various manufacturers’ formulae.
## **FIG.30 RECOMMENDATION REFLOW PROFILE***
## **(Not to scale)**
## ***Refer to the Classification Reflow Profile of J-STD-020.**
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Rev.A1
**MUN12AD03-SECM**
**==> picture [461 x 14] intentionally omitted <==**
**----- Start of picture text -----**<br>
PACKAGE OUTLINE DRAWING: Co<br>**----- End of picture text -----**<br>
**==> picture [52 x 9] intentionally omitted <==**
**----- Start of picture text -----**<br>
Unit: mm<br>**----- End of picture text -----**<br>
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**----- Start of picture text -----**<br>
FIG.31 Package Outline Drawing<br>**----- End of picture text -----**<br>
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Rev.A1
**==> picture [154 x 11] intentionally omitted <==**
**----- Start of picture text -----**<br>
MUN12AD03-SECM<br>**----- End of picture text -----**<br>
**==> picture [461 x 284] intentionally omitted <==**
**----- Start of picture text -----**<br>
LAND PATTERN REFERENCE: Cn<br>Unit: mm<br>en 1.10<br>|<br>ax04 |7 | =a<br>08 |<br>ee<br>RECOMMENDED LAND PATTERN<br>**----- End of picture text -----**<br>
**==> picture [216 x 10] intentionally omitted <==**
**----- Start of picture text -----**<br>
RECOMMENDED STENCIL PATTERN<br>**----- End of picture text -----**<br>
*Based on 0.1~0.15mm thickness stencil (Reference only) *Recommended solder paste coverage 55~100%
**FIG.32 Land Pattern Reference**
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Rev.A1
**MUN12AD03-SECM**
> **PACKING REFERENCE:** ~~Ln~~
|Unit: mm<br>**Package In Tape Loading Orientation**<br>**Tape Dimension**<br>Pini<br>Sprocket hole<br>in<br>Do<br>Po<br>P2<br>B<br>—<br>i<br>a:<br>:<br>|<br>~ PPO P/O 0:0 0<br>5°(MAX)<br>Le<br>RougnpbHoBOSs-|<br>£7H<br>wll?<br>|<br>D1<br>~B Pulling Direction|Unit: mm<br>**Package In Tape Loading Orientation**<br>**Tape Dimension**<br>Pini<br>Sprocket hole<br>in<br>Do<br>Po<br>P2<br>B<br>—<br>i<br>a:<br>:<br>|<br>~ PPO P/O 0:0 0<br>5°(MAX)<br>Le<br>RougnpbHoBOSs-|<br>£7H<br>wll?<br>|<br>D1<br>~B Pulling Direction|Unit: mm<br>**Package In Tape Loading Orientation**<br>**Tape Dimension**<br>Pini<br>Sprocket hole<br>in<br>Do<br>Po<br>P2<br>B<br>—<br>i<br>a:<br>:<br>|<br>~ PPO P/O 0:0 0<br>5°(MAX)<br>Le<br>RougnpbHoBOSs-|<br>£7H<br>wll?<br>|<br>D1<br>~B Pulling Direction|
|---|---|---|
||A0|3.02±0.10<br>E1<br>1.75±0.10|
||B0|3.17±0.10<br>K0<br>1.82±0.10|
||F|5.50±0.05<br>P0<br>4.00±0.10|
||W|12.00 ±0.30<br>P1<br>4.00±0.10|
||D0|φ1.55 ±0.05<br>P2<br>2.00±0.05|
||D1|φ1.5 +0.1/-0<br>T<br>0.23±0.10|
|||**FIG.33 Packing Reference**|
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Rev.A1
**MUN12AD03-SECM**
## **PACKING REFERENCE: (Cont.)**
**==> picture [353 x 184] intentionally omitted <==**
**----- Start of picture text -----**<br>
Unit: mm<br>Reel Dimension<br>See Detail A ==<br>\<br>| _ | |<br>| -)<br>Detail A<br>Ge =<br>**----- End of picture text -----**<br>
## **Peel Strength of Top Cover Tape**
The peel speed shall be about 300mm/min.
The peel force of top cover tape shall be between 0.1N to 1.3N
17
Rev.A1
**MUN12AD03-SECM**
## **REVISION HISTORY:** ~~|~~
|**Date**|**Revision**|**Changes**|
|---|---|---|
|2021.04.20|00|Release the preliminary specification.|
|2021.07.14|01|Add 402Kohm resistor between EN to GND inside the module.|
|2022.03.30|02|Modify reflow parameters.(Page.13)|
|2022.12.20|03|Page 12, change test board size from 2 layers to 4 layers and add<br>information”2oz”. Correct the case temperature to110°C.|
|2024.12.16|A1|Synchronized with document management number|
18
Rev.A1
Updated at June 9, 2026
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