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MUN12AD03-SEC
Non Isolated POL DC/DC Converter, Micro Module, 16.5 W, 800 mV, 5.5 V, 3 A
⚠️ Reference pricing provided. In case of supply shortages, we will connect you with our trusted procurement partners to ensure your project's continuity.
- Manufacturer: CYNTEC
- Product type: DC / DC Non Isolated Board Mount Converters - Adjustable Output
- SVHC: No SVHC (21-Jan-2025)
- Depth: 3mm
- Width: 2.8mm
- Height: 1.5mm
- Product Range: -
- Output Power Max: 16.5W
- Output Current Max: 3A
- Output Voltage Max: 5.5V
- Output Voltage Min: 800mV
- Input Voltage DC Max: 17V
- Input Voltage DC Min: 4.5V
- DC / DC Converter Type: Micro Module
- Power Supply Applications: -
- DC / DC Converter Output Type: Adjustable
| Delivery and price | |
|---|---|
| Units per pack | 500 |
| Price | 3.57 € |
| Current stock | 1000+ |
| Lead time | 30 days |
## **uPOL MODULE**
## **3A, High Efficiency uPOL Module**
## **MUN12AD03-SEC**
## **FEATURES:** ~~SS~~
- High Density uPOL Module
- 3A Output Current
- 91% Peak Efficiency at 12VIN
- Input Voltage Range from 4.5V to 17V
- Output Voltage Range from 0.8V to 5.5V
- Enable / PGOOD Function
- Automatic Power Saving/PWM Mode
- Protections (OCP: Non-latching, OTP)
- Adjustable Soft Start Function
- Compact Size: 3.0mm*2.8mm*1.5mm
- Pb-free for RoHS compliant
- ◼ MSL 2, 260℃ Reflow
## **APPLICATIONS:** ~~|~~
- Point of Load Conversion
- ◼ LDOs Replacement
- Set Top Box / DSL Modem / AP Router
- Industrial Personal Computer
## **GENERAL DESCRIPTION:**
The uPOL module is non-isolated dc-dc converter that can deliver up to 3A of output current. The PWM switching regulator, high frequency power inductor are integrated in one hybrid package. It only needs input/output capacitors and one voltage dividing resistor to perform properly.
The module has automatic operation with PWM mode and power saving mode according to loading, through constant on-time control, the module offers a simpler control loop and faster transient response. Other features include remote enable function, internal soft-start, non-latching over current protection, power good, input under voltage locked-out capability.
The low profile and compact size package (3.0mm × 2.8mm x 1.5mm) is suitable for automated assembly by standard surface mount equipment. The uPOL module is Pb-free and RoHS compliance.
**==> picture [461 x 246] intentionally omitted <==**
**----- Start of picture text -----**<br>
TYPICAL APPLICATION CIRCUIT & PACKAGE:<br>LT<br>1.5mm(Max)<br>VBias<br>EN<br>R PG VPGOOD<br>EN PGOOD<br>3.0mm 2.8mm<br>VIN VOUT<br>VIN Vout<br>uPOL Module<br>R FB_T<br>C IN SS FB C OUT<br>C SS GND R FB_B<br>ACE e<br>FIG.1 Typical Application Circuit FIG.2 High Density Low Profile<br>uPOL Module<br>**----- End of picture text -----**<br>
1
Rev.A1
## **MUN12AD03-SEC** G'eyntec **ORDER INFORMATION:** ~~a~~
||**Operating Temperature**|**Operating Temperature**|**Package**|||||
|---|---|---|---|---|---|---|---|
|**Part Number**|||||**MSL**||**Note**|
||**Range (°C)**||**(Pb-Free)**|||||
|MUN12AD03-SEC|-40 ~ +125||DFN||Level 2||-|
|||||||||
|**Order Code**|||**Packing**||||**Quantity**|
|MUN12AD03-SEC|||Tape and reel|Tape and reel|Tape and reel||2000|
## **PIN CONFIGURATION:** ~~i~~
**==> picture [355 x 164] intentionally omitted <==**
**----- Start of picture text -----**<br>
EN (1) (8) SS<br>|_| yf | L _J<br>Vin (2) rq an (7) PGOOD<br>Ly | (9) GND pL<br>- 3 | Tr<br>GND (3) Lt | a (6) FB<br>[4 | rT<br>Vout (4) (5) Vout<br>**----- End of picture text -----**<br>
## Top View
**Fig.3 Pin configuration**
2
Rev.A1
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## **PIN DESCRIPTION:** ~~ee~~
|**Symbol**|**Pin No.**|**Description**|
|---|---|---|
|EN|1|On/Off control pin for module.<br>EN = LOW, the module is off.<br>EN = HIGH, the module is on.<br>Do not float.|
|VIN|2|Power input pin. It needs to be connected to input rail.|
|GND|3, 9|Power ground pin for signal, input, and output return path. This pin<br>needs to be connected to one or moregroundplane directly.|
|VOUT|4, 5|Power output pin. Connect to output for the load.|
|FB|6|Feedback input. Connect an external resistor divider to set the output<br>voltage.|
|PGOOD|7|Power Good indicator. The pin output is an open drain that can connect to<br>Vout byresistor.|
|SS|8|Soft startup pin.|
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## **ELECTRICAL SPECIFICATIONS:** ~~ee~~
CAUTION: Do not operate at or near absolute maximum rating listed for an extended period of time. This stress may adversely impact product reliability and result in failures outside of warranty.
|**Parameter**<br>~~es~~|**Description**<br>~~ee~~|**Min.**<br>~~ee~~<br>~~ee~~|**Typ.**<br>~~ee~~|**Max.**<br>~~ee~~|**Unit**<br>~~ee~~|
|---|---|---|---|---|---|
|◼<br>Absolute Maximum Ratings<br>~~esee~~<br>~~ee~~<br>~~a~~<br>~~ee~~||||||
|VIN to GND<br>~~a~~<br>~~ee~~<br>~~ee~~|~~a~~|-<br>~~a~~|-<br>~~a~~|+19.0<br>~~a~~|V<br>~~a~~|
|VOUT to GND<br>~~ee~~<br>~~ee~~<br>~~ee~~||-|-|+6.5|V|
|FB to GND<br>~~ee~~<br>~~ee~~<br>~~ee~~||-|-|+4.0|V|
|EN to GND<br>~~ee~~<br>~~ee~~||-|-|VIN+0.3|V|
|PGOOD to GND<br>~~ee~~<br>~~ed~~|~~ed~~|-<br>~~ed~~|-<br>~~ed~~|+19.0<br>~~ed~~|V<br>~~ed~~|
|Reflow Peak Temperature<br>~~ed~~|Reflow Peak Temperature<br>~~ed~~|-<br>~~ed~~|-<br>~~ed~~|+260<br>~~ed~~|°C<br>~~ed~~|
|Tc<br>~~ed~~|Case Temperature of Inductor<br>~~ed~~|-<br>~~ed~~|-<br>~~ed~~|+110<br>~~ed~~|°C<br>~~ed~~|
|Tj<br>~~ed~~|Junction Temperature<br>~~ed~~|-<br>~~ed~~|-<br>~~ed~~|+150<br>~~ed~~|°C<br>~~ed~~|
|Tstg<br>~~ed~~|Storage Temperature<br>~~ed~~|-40<br>~~ed~~<br>~~ee~~|-<br>~~ed~~<br>~~ee~~|+125<br>~~ed~~|°C<br>~~ed~~|
|ESD Rating|Human Body Model (HBM)<br>~~ee~~|-<br>~~ee~~<br>~~ee~~|-<br>~~ee~~<br>~~ee~~|2k<br>~~ee~~|V<br>~~ee~~|
||Machine Model (MM)<br>~~ee~~|-<br>~~ee~~<br>~~ee~~<br>~~ee~~|-<br>~~ee~~<br>~~ee~~|200<br>~~ee~~|V<br>~~ee~~|
||Charge Device Model (CDM)<br>~~ee~~|-<br>~~ee~~<br>~~ee~~|-<br>~~ee~~|500<br>~~ee~~|V<br>~~ee~~|
|◼<br>Recommendation Operating Ratings<br>~~ee~~<br>~~a~~<br>~~ee~~||||||
|VIN<br>~~ee~~<br>~~ee~~|Input Supply Voltage|+4.5|-|+17.0|V|
|VOUT<br>~~ee~~<br>~~ee~~<br>~~es~~|Adjusted Output Voltage|+0.8|-|+5.5|V|
|PGOOD<br>~~ee~~<br>~~es~~|Power Good Voltage|-|-|+17.0|V|
|Tj<br>~~es~~<br>~~a~~|Junction Temperature<br>~~a~~|-40<br>~~a~~|-<br>~~a~~|+125<br>~~a~~|°C<br>~~a~~|
|Ta<br>~~a~~<br>~~a~~|Operating Temperature Range (Note 2)<br>~~a~~<br>~~a~~|Operating Temperature Range (Note 2)<br>-40<br>~~a~~<br>~~a~~|-<br>~~a~~<br>~~a~~|+125<br>~~a~~<br>~~a~~|°C<br>~~a~~<br>~~a~~|
|◼<br>Thermal Information<br>~~a~~<br>~~a~~<br>~~ee~~<br>~~eeeeeeee~~||||||
|Rth(jchoke-a)<br>~~ee~~|Thermal resistance from junction to<br>ambient.(Note 1)<br>~~ee~~|-<br>~~ee~~|39<br>~~ee~~|-<br>~~ee~~|°C/W|
2. For maximum operating temperature, thermal derating to be taken into account.
Rev.A1
4
**MUN12AD03-SEC**
~~ee~~ **ELECTRICAL SPECIFICATIONS: (Cont.)** Conditions: TA = 25 ºC, unless otherwise specified. Test Board Information: 30mm× 30mm× 1.6mm, 4 layers, 2oz. The output ripple and transient response are measured by short loop probing and limited to 20MHz bandwidth. Cin = 10uF/25V/1206*1, Cout = 22uF/10V/0805*2.
|**Symbol**<br>~~a~~|**Symbol**<br>**Parameter**<br>~~es ee~~|**Conditions**<br>~~ee~~|**Min. Typ. Max.**|**Min. Typ. Max.**|**Min. Typ. Max.**|**Min. Typ. Max.**<br>**Unit**|
|---|---|---|---|---|---|---|
|◼<br>Input Characteristics<br>~~a~~<br>~~es ee~~<br>~~a~~|||||||
|IQ<br>~~a~~<br>~~a~~|Quiescent current<br>~~a~~<br>~~a~~|Iout=0,VFB=VREF*105%<br>~~a~~<br>~~a~~|-<br>~~a~~<br>~~a~~|100<br>~~a~~<br>~~a~~|-<br>~~a~~<br>~~a~~|uA<br>~~a~~<br>~~a~~|
|ISD(IN)<br>~~a~~<br>~~a~~|Input shutdown current<br>~~a~~<br>~~a~~|Vin =12V, EN = GND<br>~~a~~<br>~~a~~|-<br>~~a~~<br>~~a~~<br>~~ee~~|5.5<br>~~a~~<br>~~a~~|-<br>~~a~~<br>~~a~~|uA<br>~~a~~<br>~~a~~|
|IS(IN)|Input supply current|Vin =12V, EN = VIN<br>~~ee~~|-<br>~~ee~~<br>~~ee~~<br>~~ee~~|-<br>~~ee~~<br>~~ee~~|-<br>~~ee~~|-<br>~~ee~~|
|||Iout = 0A, Vout = 1.8V<br>~~ee~~|-<br>~~ee~~<br>~~ee~~<br>~~ee~~<br>~~ee~~|0.13<br>~~ee~~<br>~~ee~~|-<br>~~ee~~|mA<br>~~ee~~|
|||Iout = 3A, Vout = 1.8V<br>~~ee~~<br>~~ee~~|-<br>~~ee~~<br>~~ee~~<br>~~ee~~<br>~~ee~~|0.58<br>~~ee~~<br>~~ee~~<br>~~ee~~|-<br>~~ee~~<br>~~ee~~|A<br>~~ee~~<br>~~ee~~|
|◼<br>Output Characteristics<br>~~ee~~<br>~~ee~~<br>~~a~~|||||||
|IOUT(DC)<br>~~a~~<br>~~a~~|Output continuous current range<br>~~a~~<br>~~a~~|Output continuous current range<br>~~a~~<br>~~a~~|0<br>~~a~~<br>~~a~~|-<br>~~a~~<br>~~a~~|3<br>~~a~~<br>~~a~~|A<br>~~a~~<br>~~a~~|
|ΔVOUT<br>/ΔVIN<br>~~a~~|Line regulation accuracy<br>~~a~~|Vin = 4.5V to 17V<br>Vout = 1.8V,Iout = 1.5A<br>~~a~~|-<br>~~a~~|0.1<br>~~a~~|0.5<br>~~a~~|% VO(SET)<br>~~a~~|
|ΔVOUT<br>/ΔIOUT<br>~~a~~|Load regulation accuracy<br>~~a~~|Iout = 0.5A to 3A<br>Vin = 12V,Vout = 1.8V<br>~~a~~|-<br>~~a~~<br>~~ee~~|0.2<br>~~a~~<br>~~es~~|1<br>~~a~~|% VO(SET)<br>~~a~~|
|VOUT(AC)|Output ripple voltage|Vin = 12V, Vout = 3.3V<br>~~es~~|-<br>~~es~~<br>~~ee~~|-<br>~~es~~<br>~~es~~|-<br>~~es~~|-<br>~~es~~|
|||Iout = 0A<br>~~es~~<br>~~ee~~|-<br>~~es~~<br>~~ee ~~<br>~~ee~~<br>~~ee~~|28<br>~~es~~<br> ~~es~~<br>~~ee~~<br>~~es~~|-<br>~~es~~<br>~~ee~~<br>~~ee~~|mVp-p<br>~~es~~<br>~~ee~~|
|||Iout = 3A<br>~~ee~~<br>~~ee~~|-<br>~~ee~~<br>~~ee~~<br>~~ee~~|15<br>~~ee~~<br>~~ee~~<br>~~es~~|-<br>~~ee~~<br>~~ee~~<br>~~ee~~|mVp-p<br>~~ee~~<br>~~ee~~|
|◼<br>Dynamic Characteristics<br>~~ee~~<br>~~ee es ee~~<br>~~ee~~|||||||
|ΔVOUT-DP|Voltage change for positive load<br>step|Iout = 1.5 A to 3A<br>Current slew rate = 0.15A/uS<br>Vin = 12V,Vout = 1.8V|-|25|-|mVp-p|
|ΔVOUT-DN|Voltage change for negative load<br>step|Voltage change for negative load<br>Iout = 3A to 1.5A<br>Current slew rate = 0.15A/uS<br>Vin = 12V,Vout = 1.8V|-|25|-|mVp-p|
|◼ Control Characteristics<br>~~a~~<br>~~ee~~|||||||
|VFB<br>~~a~~<br>~~a~~|Feedback regulation voltage<br>~~a~~<br>|PWM Mode<br>~~a~~<br>~~ee~~|0.788 0.800 0.812<br>~~a~~<br>~~ee~~<br>~~ee~~<br>~~ee~~|0.788 0.800 0.812<br>~~a~~<br>~~ee~~|0.788 0.800 0.812<br>~~a~~<br>~~ee~~|V<br>~~a~~<br>~~ee~~|
|||PWM Mode, Ta=-40~85°C<br>~~ee~~<br>~~ee~~<br>|0.78<br>~~ee~~<br>~~ee~~<br>~~ee~~<br>~~ee~~<br>~~ee~~<br>|0.800<br>~~ee~~<br>~~ee~~<br>|0.82<br>~~ee~~<br>~~ee~~<br>|V<br>~~ee~~<br>~~ee~~<br>|
|||PFM Mode, Ta=-40~85°C<br>~~ee~~<br>|0.788 0.800 0.824<br>~~ee~~<br>~~ee~~<br>~~ee~~<br>|0.788 0.800 0.824<br>~~ee~~<br>|0.788 0.800 0.824<br>~~ee~~<br>|V<br>~~ee~~<br>|
|DMAX<br>~~a~~|Maximum duty cycle<br>~~ee~~|Vout(MAX)= Vin * DMAX<br>~~ee~~|70<br>~~ee~~<br>~~ee~~|-<br>~~ee~~|-<br>~~ee~~|%<br>~~ee~~|
|FOSC<br>~~a~~|Oscillator frequency|PWM Operation|-|1.0|-|MHz|
|VUVLO<br>~~a~~|Input UVLO threshold||-|-|4.5|V|
|VPG<br>~~a~~|Power good threshold|VFBrising|88|90|92|%VREF|
|VPG,HYS<br>~~a~~|Power good hysteresis|||2||%VREF|
|VPGL<br>~~a~~|PGOOD output low<br>|IPGOOD=4mA<br>|0.04<br>|0.15<br>|0.3|V|
|VEN_TH<br>~~ppt~~|Enable rising threshold voltage<br>~~ppt~~|~~ppt~~|1.5<br>~~ppt~~|-<br>~~ppt~~|-|V|
||Enable falling threshold voltage<br>~~ppt~~<br>~~ee~~|~~ppt~~<br>~~ee~~|-<br>~~ppt~~<br>~~ee~~|-<br>~~ppt~~<br>~~ee~~|0.4<br>~~ee~~|V<br>~~ee~~|
|TOTP<br>~~a~~|Over temp protection<br>~~OO~~|~~OO~~|-<br>~~OO~~|150<br>~~OO~~|-<br>~~OO~~|°C<br>~~OO~~|
|OCP<br>~~a~~|Protection Output Current||3.8|-|5.2|A|
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5
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## **TYPICAL PERFORMANCE CHARACTERISTICS: (1.0VOUT)**
Conditions: TA = 25 ºC, unless otherwise specified. Test Board Information: 30mm× 30mm× 1.6mm, 4 layers, 2oz. The output ripple and transient response are measured by short loop probing and limited to 20MHz bandwidth. Vin = 12 V, Vout = 1.0 V, unless otherwise noted.
Cin = 10uF/25V/1206*1, Cout = 22uF/10V/0805*2.
**==> picture [411 x 378] intentionally omitted <==**
**----- Start of picture text -----**<br>
FIG.4 Efficiency V.S. Load Current FIG.5 De-rating Curve<br>a Jie Stop |<br>“ ot : =<br>VOUT VOUT<br>Value 1.0m vs 40,0ms 2510 0k S/spoints___-4.20VOo CDSat VS__/1.00ysYltio¥0.0000005 2.5068/s—100kpoints [14.209wa<br>Mean Min Max Std Dey (2) Value Mean Min Max Std Dev4<br>FIG.6 Output Ripple FIG.7 Output Ripple<br>(Iout=0A) (Iout=3A)<br>cee eee A | lekStop Tee<br>VOUT<br>VOUT<br>IOUT PGOOD<br>EN<br>20m 05 200ys 50.0MS/s | a 2 sre emenrtrtrlinie sikenash eter bdr tilde leielsber it Pw . ae ae<br>© 2.004 Qh Jl ¥-480.0000ys _ 100k points 14.4mV : :<br>Peak-Peak 35,2mVValue Mean39,9m Min35,2m Max44,8m Std Dev3.4m L@ iov &§ A @ i j 1,00ms L 1.00MS/s [2 Wi<br>20,0m¥ 23,2m 20.0m 26,4m 158m 5.00 ¥ By Gv4,000000ps 10k points 2.00 ¥<br>-15.2mV. ~16.7m =19,2m -13.6m 1.66m<br>FIG.8 Transient Response FIG.9 Turn-on<br>(50% to 100% Load Step) (Iout=3A)<br>**----- End of picture text -----**<br>
6
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## **TYPICAL PERFORMANCE CHARACTERISTICS: (1.8VOUT)**
Conditions: TA = 25 ºC, unless otherwise specified. Test Board Information: 30mm× 30mm× 1.6mm, 4 layers, 2oz. The output ripple and transient response are measured by short loop probing and limited to 20MHz bandwidth. Vin = 12 V, Vout = 1.8 V, unless otherwise noted.
Cin = 10uF/25V/1206*1, Cout = 22uF/10V/0805*2.
**FIG.10 Efficiency V.S. Load Current FIG.11 De-rating Curve at 12Vin**
**VOUT VOUT**
**IG.12 Output Ripple FIG.13 Output Ripple (12Vin, Iout=0A) (12Vin, Iout=3A) VOUT VOUT** ~~ae~~ Tek Stop A eee cece: **IOUT PGOOD** | ' **EN** @ 20.0mv ww 200ys 50.0MS/s i a D tr 2.004 Q& _Jlii+¥—480.0000ys 100k points 14.4mV i : @ Peak—Peak Value41.6mV 41.8mMean 39.2mMin 44.8mMax Std135m Dey @iov » @ 1,00ms L 1.00MS/s i Oma 24,0mV 24,1m 22.4m 26.4m 867p 5.00 ¥ y G+¥4.000000ys 10k points @win ~17.6mV -17.7m =19,2m ~16.0m 740p **FIG.14 Transient Response FIG.15 Turn-on (12Vin, 50% to 100% Load Step) (12Vin, Iout=3A)**
Rev.A1
7
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## **TYPICAL PERFORMANCE CHARACTERISTICS: (2.5VOUT)**
Conditions: TA = 25 ºC, unless otherwise specified. Test Board Information: 30mm× 30mm× 1.6mm, 4 layers, 2oz. The output ripple and transient response are measured by short loop probing and limited to 20MHz bandwidth. Vin = 12 V, Vout = 2.5 V, unless otherwise noted.
Cin = 10uF/25V/1206*1, Cout = 22uF/10V/0805*2.
|100%<br>95%<br>es a Da a Ok Os<br>Os<br>90%<br>(oo<br>——<br>~85%<br>S<br>=80%<br>ee<br>><br>= 75%<br>Pt} |} fT<br>ttt tN<br>&<br>=<br>= 70%<br>ooo<br>ott<br><>)<br>65%<br>poof **f**t<br>y}<br>—=Vin=5V<br>60%<br>ey a<br>es Gee SsSs SS<br>GR Ge<br>5<br>55%<br>So<br>evin=t2v<br>50%<br>0.01<br>0.1<br>1<br>Load current (A)|4<br>3<br>z<br>E<br>FA<br>&<br>|e,<br>&<<br>=<br>8<br>Cid?<br>><br>E<br>o<br>4<br>5<br>25<br>35<br>45<br>55<br>65<br>75<br>85<br>95<br>105<br>1s<br>125<br>AMBIENTOFTEMPERATURE(°C)|
|---|---|
|**FIG.16 Efficiency V.S. Load Current**<br>|<br>~~eesA~~|**FIG.17 De-rating Curve at 12Vin**<br>ekStop|
|**VOUT**<br>fek<br>Stop<br>~~A eee~~<br>|<br>~~eesA~~<br>KONO<br>UM<br>UN <br>20.0ms<br>500k8/s<br>1 Wa<br>CoB<br>nV Mi-~0.000000s<br>100kpoints<br>4.207<br>Value<br>Mean<br>Min<br>Max<br>StdDev<br>@|**VOUT**<br>ekStop<br> LAA<br>ACA ALA AAA<br>q<br>\<br>EVV<br>MOMMY<br>V<br>:<br>{oops<br>2.500875<br>7<br>C1.<br>0.0000005<br>100kpoints<br>4.70V<br>Value<br>Mean<br>Min<br>Max<br>StdDev<br>(2]|
|**FIG.18 Output Ripple**<br>**(12Vin, Iout=0A)**<br>~~ae~~ee|**FIG.19 Output Ripple**<br>**(12Vin, Iout=3A)**<br>TekStopcereeeeA|
|**VOUT**<br>**IOUT**<br>~~ae~~ ee<br>@<br>20.0mv va<br>200ys<br>50.0MS/s<br>@O-<br>2.00A 2<br>Ghy-480.0000ys<br>100k points<br>16.0mVv<br>Value<br>Mean<br>Min<br>Max<br>Std Dev<br>@<br>Peak-Peak<br>48.8mV<br>49.9m<br>48.8m<br>51.2m<br>950p<br>Oma<br>26,4mV<br>27.0m<br>26.4m<br>28,0m<br>566)!<br>@nwin<br>~22.4mV<br>-22.9m<br>-24.0m<br>-22.4m<br>733y|**EN**<br>**VOUT**<br>**PGOOD**<br>Tek Stop cere eee A<br>ar<br>=<br>"<br>™<br>@20v<br>4<br>@<br>—<br>\(2.00ms<br>5.00MS/s<br>[2 a<br>5.00 ¥<br>8<br>0.000000<br>100k points<br>8.40|
|**FIG.20 Transient Response**<br>**(12Vin, 50% to 100% Load Step)**|**FIG.21 Turn-on**<br>**(12Vin, Iout=3A)**|
8
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## **TYPICAL PERFORMANCE CHARACTERISTICS: (3.3VOUT)**
Conditions: TA = 25 ºC, unless otherwise specified. Test Board Information: 30mm× 30mm× 1.6mm, 4 layers, 2oz. The output ripple and transient response are measured by short loop probing and limited to 20MHz bandwidth. Vin = 12 V, Vout = 3.3 V, unless otherwise noted.
Cin = 10uF/25V/1206*1, Cout = 22uF/10V/0805*2.
**==> picture [400 x 378] intentionally omitted <==**
**----- Start of picture text -----**<br>
FIG.22 Efficiency V.S. Load Current FIG.23 De-rating Curve at 12Vin<br>Tek Stop<br>\ \ KUALA N, \ | otal aN Wah, teCO<br>RT ONT Se AE ND OAD OND ONT RA AWD tA<br>VOUT VOUT<br>eaValue T000020.0ms 500875omkpots o-OY TTJu100ys onto: 2506/3took poine Pro<br>Mean Min Max Std Dev @ Value Mean Min( Max Std Dev4<br>FIG.24 Output Ripple FIG.25 Output Ripple<br>(12Vin, Iout=0A) (12Vin, Iout=3A)<br>ES Se ees Ae Tek Stop a eee eesA<br>VOUT<br>VOUT<br>PGOOD<br>IOUT<br>EN<br>Dow Ww 20ps 50.0MS/s DZ DF ssaintiinetehiniemiimeanimeniaiiin<br>2.004 Q& — |\G+¥-480,0000ps 100k points 16.0mV i :<br>Value Mean Min Max Std Dey : :<br>Peak-Peak 60.0m¥ 57.2m 48.38m 60.0m 3.39m @ 2.00¥ 4 @ 7 1.00ms 1,00MS/s [2 Wa<br>33,6m¥ 31.8m 26,4m 34.4m 2.22m 5.00 ¥ fy G+74,000000us 10k points 2.00<br>-26.4mV -25.5m -27.2m -22.4m 1.38m ¥<br>FIG.26 Transient Response FIG.27 Turn-on<br>(12Vin, 50% to 100% Load Step) (12Vin, Iout=3A)<br>**----- End of picture text -----**<br>
9
Rev.A1
**MUN12AD03-SEC**
## **TYPICAL PERFORMANCE CHARACTERISTICS: (5.0VOUT)**
Conditions: TA = 25 ºC, unless otherwise specified. Test Board Information: 30mm× 30mm× 1.6mm, 4 layers, 2oz. The output ripple and transient response are measured by short loop probing and limited to 20MHz bandwidth. Vin = 12 V, Vout = 5.0 V, unless otherwise noted.
Cin = 10uF/25V/1206*1, Cout = 22uF/10V/0805*2.
**FIG.28 Efficiency V.S. Load Current FIG.29 De-rating Curve at 12Vin** ek Stop ~~Se~~ | ~~es A~~ po WAPATO AN reyy **VOUT VOUT** CC@® 10.0 20.0msY>v0.000000 SO0KS/s100k points oO!4.70 CC@® 10.0 Jv1.00ps 0.000000s 2506/5100k points QD4.70V (2] 4 4 4 1.54mi @reik-P i **FIG.30 Output Ripple FIG.31 Output Ripple (12Vin, Iout=0A) (12Vin, Iout=3A) VOUT VOUT** ~~ee~~ ekstop ~~ee~~ **PGOOD IOUT EN** @ 500m ww 200ps 50.0MS/s Ov erste sttctrenerenenpnnnisineinarstenaeners @ Peak—Peak Value86,0mV 2.00AMean87.1mQ& —Jli+¥-480.0000ysMin84,0m Max90.0m100k points Std Dey1.44m—_-25.0mV¥ @ 5.00v 4 @ A : 1.00ms] 1.00MS/s (2 Wi Oma 46,0mV 45.4m, 44,0m 46,0m 914p 5.00¥ 8y G+ ¥4.000000ys 10k points 2.00 ¥ @win —40.0mV -41,.6m -44.0m -40.0m 1.07m **FIG.32 Transient Response FIG.33 Turn-on (12Vin, 50% to 100% Load Step) (12Vin, Iout=3A)**
10
Rev.A1
**MUN12AD03-SEC**
## **APPLICATIONS INFORMATION:**
## **REFERENCE CIRCUIT FOR GENERAL APPLICATION:**
Figure 34 show the module application schematics for input voltage +12V.
The output capacitor is selected to handle the output ripple noise requirements and system stability. The out capacitance have to be followed COUT_Min shown in the TABLE 1
**TABLE 1 Output capacitor setting**
|**VIN (V)**|**VOUT (V)**|**COUT_Min (uF)**|
|---|---|---|
|4.5~17|1|22|
|4.5~17|1.2|22|
|4.5~7|1.5|22*2|
|8~17|1.5|22|
|4.5~7|1.8|22*2|
|8~17|1.8|22|
|5~17|3.3|22*2|
|7~17|5|22*2|
**FIG.34 Reference Circuit for General Application**
11
**MUN12AD03-SEC**
## ~~ee~~ **APPLICATIONS INFORMATION: (Cont.)**
## **SAFETY CONSIDERATIONS:**
Certain applications and/or safety agencies may require fuses at the inputs of power conversion components. Fuses should also be used when there is the possibility of sustained input voltage reversal which is not current limited. For greatest safety, we recommend a fast blow fuse installed in the ungrounded input supply line. The installer must observe all relevant safety standards and regulations. For safety agency approvals, install the converter in compliance with the end-user safety standard.
## **INPUT FILTERING:**
The module should be connected to a source supply of low AC impedance and high inductance in which line inductance can affect the module stability. An input capacitor must be placed as near as possible to the input pin of the module so to minimize input ripple voltage and ensure module stability.
## **OUTPUT FILTERING:**
To reduce output ripple and improve the dynamic response as the step load changes, an additional capacitor at the output must be connected. Low ESR polymer and ceramic capacitors are recommended to improve the output ripple and dynamic response of the module.
## **PROGRAMMING OUTPUT VOLTAGE:**
The module has an internal 0.8V ± 1.5% reference voltage. The output voltage can be programmed by the dividing resistor (RFB_T and RFB_B). The output voltage can be calculated by Equation 1, resistor choice may be referred to TABLE 2.
(EQ.1)
**TABLE 2 Resistor values for common output voltages**
|VOUT(V)|RFB_T(k)|RFB_B(k)|
|---|---|---|
|1.0|124|499|
|1.2|124|243|
|1.5|124|140|
|1.8|124|100|
|3.3|124|39.2|
|5.0|124|23.7|
12
**MUN12AD03-SEC**
## **APPLICATIONS INFORMATION: (Cont.)**
## **Soft Startup Capacitor Selection**
Leave SS pin floating for default 1ms soft-start time. For longer than 1ms soft-start time, connect a capacitance between the SS pin and the GND allows programming the startup slope of the output voltage. A constant current of 4 μ A charges the external capacitor. The capacitance required for a given soft startup time for the output voltage is given by Equation 2:
**==> picture [181 x 9] intentionally omitted <==**
## **Thermal Considerations:**
All of thermal testing condition is complied with JEDEC EIJ/JESD 51 Standards. Therefore, the test board size is 30mm× 30mm× 1.6mm with 4 layers 2oz. The case temperature of module sensing point is shown as Figure 35. Then Rth(jchoke-a) is measured with the component mounted on an effective thermal conductivity test board on 0 LFM condition. The MUN12AD03-SEC modules are designed for using when the case temperature is below 110°C regardless the change of output current, input/output voltage or ambient temperature.
Sensing point (Defined case temperature)
**FIG. 35 Case Temperature Sensing Point**
13
**MUN12AD03-SEC**
## **REFLOW PARAMETERS:**
## **REFLOW PARAMETERS:**
Lead-free soldering process is a standard of electronic products production. Solder alloys like Sn/Ag, Sn/Ag/Cu and Sn/Ag/Bi are used extensively to replace the traditional Sn/Pb alloy. Sn/Ag/Cu alloy (SAC) is recommended for this power module process. In the SAC alloy series, SAC305 is a very popular solder alloy containing 3% Ag and 0.5% Cu and easy to obtain. Figure 36 shows an example of the reflow profile diagram. Typically, the profile has three stages. During the initial stage from room temperature to 150°C, the ramp rate of temperature should not be more than 3°C/sec. The soak zone then occurs from 150°C to 200°C and should last for 60 to 120 seconds. Finally, keep at over 217°C for 60~150 seconds limit to melt the solder and make the peak temperature at the range from 255°C to 260°C (Do not exceed 30 sec). It is noted that the time of peak temperature should depend on the mass of the PCB board. The reflow profile is usually supported by the solder vendor and one should adopt it for optimization according to various solder type and various manufacturers’ formulae.
## **FIG.36 RECOMMENDATION REFLOW PROFILE***
## **(Not to scale)**
## ***Refer to the Classification Reflow Profile of J-STD-020.**
14
## **MUN12AD03-SEC**
## **PACKAGE OUTLINE DRAWING:**
Unit: mm
**FIG.37 Package Outline Drawing**
15
**MUN12AD03-SEC**
**LAND PATTERN REFERENCE:** ~~ee~~
**==> picture [69 x 10] intentionally omitted <==**
**----- Start of picture text -----**<br>
Unit: mm<br>**----- End of picture text -----**<br>
RECOMMENDED LAND PATTERN
RECOMMENDED STENCIL PATTERN
*Based on 0.1~0.15mm thickness stencil (Reference only)
*Recommended solder paste coverage 55~100%
**FIG.38 Land Pattern Reference**
16
## **MUN12AD03-SEC**
## **PACKING REFERENCE:**
|Unit: mm|Unit: mm|||||||
|---|---|---|---|---|---|---|---|
|||||**Package In Tape Loading Orientation**||||
|||||Pini||Sprocket hole||
|||||QD|©|||
|||||LA<br>{al||\e||
|||||**Tape Dimension**||||
|Do<br>Po<br>P2<br>B<br>=<br>| |<br>a<br>:<br>|<br>& oP<br>0 P}O 0:0<br>0 4<br>_<br>auponhheneaH* <br>:<br>|<br>;<br>D1<br>~B<br>Pulling Direction|||||||5'(MAX)<br> «Hs|
|||A0||3.200.10|E1|E1<br>1.750.10|0.10|
|||B0||3.300.10|K0|K0<br>1.650.10|0.10|
|||F||5.500.05|P0|P0<br>4.000.10|0.10|
|||W||12.000.30|P1|P1<br>4.000.10|0.10|
|||D0||φ1.550.05|P2|P2<br>2.000.05|0.05|
|||D1||φ1.5 +0.1/-0|T|0.250.10|0.10|
**FIG.39 Packing Reference**
17
**MUN12AD03-SEC**
## **PACKING REFERENCE: (Cont.)**
**==> picture [349 x 177] intentionally omitted <==**
**----- Start of picture text -----**<br>
Unit: mm<br>Reel Dimension<br>See Detail A<br>Detail A<br>**----- End of picture text -----**<br>
## **Peel Strength of Top Cover Tape**
The peel speed shall be about 300mm/min.
The peel force of top cover tape shall be between 0.1N to 1.3N
18
**MUN12AD03-SEC**
## **REVISION HISTORY:** ~~ee~~
|**Date**|**Revision**|**Changes**|
|---|---|---|
|2020.07.22|00|Release the preliminary specification.|
|2022.02.21|01|Update module outline drawing.|
|2022.10.30|02|Modify reflow parameters.(Page.14)|
|2022.12.20|03|Page 9, change test board size from 2 layers to 4 layers and add<br>information”2oz”. Correct the case temperature to110°C.|
|2024.12.16|A1|1、Synchronized with document management number|
19
Updated at June 9, 2026
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