# Bipolar (BJT) Single Transistor, NPN, 50 V, 100 mA, 150 mW, SOT-323, Surface Mount

![Product image](https://novapart.co/image/farnell:2317557/)

**URL**: https://novapart.co/products/MSD1819A-RT1G/bipolar-bjt-single-transistor-npn-50-v-100-ma-150
**SKU**: MSD1819A-RT1G
**Manufacturer**: ONSEMI
**Category**: Semiconductors - Discretes || Transistors || Bipolar Transistors || Single Bipolar Junction Transistors - BJT
**Price**: €0.0340
**Stock**: 1000+
**Lead Time**: 2 days (indicative)

## Description

Transistor Polarity:NPN; Collector Emitter Voltage V(br)ceo:50V; Transition Frequency ft:-; Power Dissipation Pd:150mW; DC Collector Current:100mA; DC Current Gain hFE:90hFE; Trans

## Specifications

| Parameter | Value |
|---|---|
| Msl | MSL 1 - Unlimited |
| Svhc | No SVHC (25-Jun-2025) |
| No. Of Pins | 3Pins |
| Product Range | - |
| Qualification | AEC-Q101 |
| Power Dissipation | 150mW |
| Transistor Mounting | Surface Mount |
| Transistor Polarity | NPN |
| Transition Frequency | - |
| Transistor Case Style | SOT-323 |
| Dc Current Gain Hfe Min | 90hFE |
| Operating Temperature Max | 150°C |
| Continuous Collector Current | 100mA |
| Collector Emitter Voltage Max | 50V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:2317557/)

MSD1819A-RT1G, NSVMSD1819A-RT1G 

## General Purpose Amplifier Transistor 

## **NPN Silicon Surface Mount** 

**www.onsemi.com** 

This NPN Silicon Epitaxial Planar Transistor is designed for general purpose amplifier applications. This device is housed in the SC-70/SOT-323 package which is designed for low power surface mount applications. 

## **Features** 

- High hFE, 210−460 

- Low VCE(sat), < 0.5 V 

- Moisture Sensitivity Level 1 

- ESD Protection: 

   - ♦ Human Body Model > 4000 V 

   - ♦ Machine Model > 400 V 

- NSV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q101 Qualified and PPAP Capable 

- These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS Compliant 

## **SC−70 (SOT−323) CASE 419 STYLE 3** 

COLLECTOR 3 ~~i~~ 1 2 BASE EMITTER 

**MAXIMUM RATINGS** (TA = 25 ° C) **MARKING DIAGRAM Rating Symbol Value Unit** Collector-Base Voltage V(BR)CBO 60 Vdc ZR M Collector-Emitter Voltage V(BR)CEO 50 Vdc 1 Emitter-Base Voltage V(BR)EBO 7.0 Vdc Collector Current − Continuous IC 100 mAdc ZR = Device Code M = Date Code* ~~ra~~ Collector Current − Peak IC(P) 200 mAdc = Pb−Free Package **THERMAL CHARACTERISTICS** (Note: Microdot may be in either location) **Characteristic Symbol Max Unit** *Date Code orientation may vary depending upon manufacturing location. Power Dissipation (Note 1) PD 150 mW Junction Temperature TJ 150 ° C Storage Temperature Range Tstg −55 to +150 ° C **ORDERING INFORMATION** Stresses exceeding those listed in the Maximum Ratings table may damage the **Device Package Shipping**[†] device. If any of these limits are exceeded, device functionality should not be MSD1819A−RT1G SC−70 3,000 / assumed, damage may occur and reliability may be affected. 1. Device mounted on a FR-4 glass epoxy printed circuit board using the (Pb−Free) Tape & Reel minimum recommended footprint. NSVMSD1819A−RT1G SC−70 3,000 / (Pb−Free) Tape & Reel ~~== FF~~ †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. © Semiconductor Components Industries, LLC, 2016 **1** Publication Order Number: **May, 2016 − Rev. 10 MSD1819A−RT1/D** 

**MSD1819A−RT1G, NSVMSD1819A−RT1G** 

## **ELECTRICAL CHARACTERISTICS** 

|**ELECTRICAL CHARACTERISTICS**|||||
|---|---|---|---|---|
|**Characteristic**|**Symbol**|**Min**|**Max**|**Unit**|
|Collector-Emitter Breakdown Voltage (IC= 2.0 mAdc, IB= 0)|V(BR)CEO|50|−|Vdc|
|Collector-Base Breakdown Voltage (IC= 10�Adc, IE= 0)|V(BR)CBO|60|−|Vdc|
|Emitter-Base Breakdown Voltage (IE= 10�Adc, IE= 0)|V(BR)EBO|7.0|−|Vdc|
|Collector-Base Cutoff Current (VCB= 20 Vdc, IE= 0)|ICBO|−|0.1|�A|
|Collector-Emitter Cutoff Current (VCE= 10 Vdc, IB= 0)|ICEO|−|0.1|�A|
|DC Current Gain (Note 2)<br>(VCE= 10 Vdc, IC= 2.0 mAdc)<br>(VCE= 2.0 Vdc, IC= 100 mAdc)|hFE1<br>hFE2|210<br>90|340<br>−|−|
|Collector-Emitter Saturation Voltage (Note 2)<br>(IC= 100 mAdc, IB= 10 mAdc)|VCE(sat)|−|0.5|Vdc|



Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. 2. Pulse Test: Pulse Width ≤ 300 � s, D.C. ≤ 2%. 

**==> picture [490 x 382] intentionally omitted <==**

**----- Start of picture text -----**<br>
250 0.30<br>IC/IB = 10<br>0.25<br>200<br>0.20<br>150 150 ° C<br>0.15<br>100<br>0.10 25 ° C<br>−55 ° C<br>50 R � JA = 833 ° C/W 0.05<br>0 0<br>−50 0 50 100 150 0.0001 0.001 0.01 0.1 1<br>TA, AMBIENT TEMPERATURE ( ° C) IC, COLLECTOR CURRENT (A)<br>Figure 1. Derating Curve Figure 2. Collector Emitter Saturation Voltage<br>vs. Collector Current<br>450<br>°<br>150 C (10 V) 0.95 IC/IB = 10 −55 ° C<br>400<br>350 150 ° C (2 V) 0.85 25 ° C<br>300 ° 0.75<br>25 C (10 V)<br>250 25 ° C (2 V) 0.65 150 ° C<br>200<br>−55 ° C (10 V) 0.55<br>150<br>−55 ° C (2 V) 0.45<br>100<br>50 0.35<br>0 0.25<br>0.0001 0.001 0.01 0.1 1 0.0001 0.001 0.01 0.1 1<br>IC, COLLECTOR CURRENT (A) IC, COLLECTOR CURRENT (A)<br>, POWER DISSIPATION (mW)D , COLLECTOR−EMITTERCE(sat) SATURATION VOLTAGE (V)<br>P V<br>, DC CURRENT GAIN , BASE−EMITTER SATURA- TION VOLTAGE (V)<br>FE<br>h<br>BE(sat)<br>V<br>**----- End of picture text -----**<br>


**Figure 3. DC Current Gain vs. Collector Current** 

**Figure 4. Base Emitter Saturation Voltage vs. Collector Current** 

**www.onsemi.com** 

**2** 

**MSD1819A−RT1G, NSVMSD1819A−RT1G** 

**==> picture [491 x 620] intentionally omitted <==**

**----- Start of picture text -----**<br>
1.0 1.2<br>1 mA TA = 25 ° C<br>0.9<br>−55 ° C 1.0<br>0.8 10 mA 50 mA IC = 100 mA<br>0.8<br>0.7 25 ° C<br>0.6 0.6<br>0.5<br>150 ° C 0.4<br>0.4<br>0.2<br>0.3<br>0.2 0 500  � A<br>0.0001 0.001 0.01 0.1 1 0.000001 0.00001 0.0001 0.001 0.01<br>IC, COLLECTOR CURRENT (A) IB, BASE CURRENT (A)<br>Figure 5. Base Emitter Turn−On Voltage vs. Figure 6. Collector Saturation Region<br>Collector Current<br>18 6.0<br>17 5.5<br>16<br>5.0<br>15<br>4.5<br>14<br>4.0<br>13 Cibo (pF) 3.5 Cobo (pF)<br>12<br>3.0<br>11<br>2.5<br>10<br>9 2.0<br>8 1.5<br>7 1.0<br>0 1 2 3 4 5 6 0 5 10 15 20 25 30 35 40<br>Veb, EMITTER BASE VOLTAGE (V) Vcb, COLLECTOR BASE VOLTAGE (V)<br>Figure 7. Input Capacitance Figure 8. Output Capacitance<br>1<br>1.0 ms<br>100 ms<br>0.1<br>10 ms<br>1.0 s<br>0.01<br>1 10 100<br>VCE, COLLECTOR−EMITTER VOLTAGE (V)<br>, BASE−EMITTER TURN ON VOLTAGE (V) , COLLECTOR−EMITTER VOLTAGE (V)<br>CE<br>V<br>BE(on)<br>V<br>, INPUT CAPACITANCE (pF)<br>, OUTPUT CAPACITANCE (pF)<br>ibo<br>C obo<br>C<br>, COLLECTOR CURRENT (A)<br>IC<br>**----- End of picture text -----**<br>


**Figure 9. Safe Operating Area** 

**www.onsemi.com** 

**3** 

**MSD1819A−RT1G, NSVMSD1819A−RT1G** 

## **PACKAGE DIMENSIONS** 

**==> picture [462 x 378] intentionally omitted <==**

**----- Start of picture text -----**<br>
SC−70 (SOT−323)<br>CASE 419−04<br>ISSUE N<br>D NOTES:<br>1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.<br>e1 2. CONTROLLING DIMENSION: INCH.<br>MILLIMETERS INCHES<br>3 DIM MIN NOM MAX MIN NOM MAX<br>A 0.80 0.90 1.00 0.032 0.035 0.040<br>HE E A1 0.00 0.05 0.10 0.000 0.002 0.004<br>1 2 A2 0.70 REF 0.028 REF<br>; b 0.30 0.35 0.40 0.012 0.014 0.016<br>c 0.10 0.18 0.25 0.004 0.007 0.010<br>( a n = D 1.80 2.10 2.20 0.071 0.083 0.087<br>b E 1.15 1.24 1.35 0.045 0.049 0.053<br>e 1.20 1.30 1.40 0.047 0.051 0.055<br>be e ———————— e1 0.65 BSC 0.026 BSC<br>L 0.20 0.38 0.56 0.008 0.015 0.022<br>H E 2.00 2.10 2.40 0.079 0.083 0.095<br>44 —————————<br>STYLE 3:<br>c<br>A A2 PIN 1. BASE<br>2. EMITTER<br>3. COLLECTOR<br>0.05 (0.002) L<br>A1<br>SOLDERING FOOTPRINT*<br>0.65<br>0.65 0.025<br>0.025<br>1.9<br>aia<br>0.075<br>0.9<br>0.035<br>0.7<br>iE<br>0.028<br>SCALE 10:1 mm<br>at — inches<br>**----- End of picture text -----**<br>


*For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. 

ON Semiconductor and      are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. 

## **PUBLICATION ORDERING INFORMATION** 

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## **LITERATURE FULFILLMENT** : 

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**MSD1819A−RT1/D** 

**4** 



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