# Pressure Sensor, 30 bar, Digital, Sealed Gauge, 3 V, 0.01 µA

![Product image](https://novapart.co/image/farnell:3397833/)

**URL**: https://novapart.co/products/MS583730BA01-50/pressure-sensor-30-bar-digital-sealed-gauge-3-v
**SKU**: MS583730BA01-50
**Manufacturer**: TE CONNECTIVITY
**Category**: Sensors & Transducers || Sensors || Pressure Sensors, Transducers || Pressure Transducers
**Price**: €7.1000
**Stock**: 1000+
**Lead Time**: 2 days (indicative)

## Specifications

| Parameter | Value |
|---|---|
| Sensor Output | Digital |
| Supply Current | 0.01µA |
| Voltage Rating | 3V |
| Operating Pressure Max | 30bar |
| Pressure Measurement Type | Sealed Gauge |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:3397833/)

## MS5837-30BA 

## Ultra Small Gel Filled Pressure Sensor 

## SPECIFICATIONS 

- **Ceramic - metal package, 3.3 x 3.3 x 2.75mm** 

- **High-resolution module 0.2 mbar** 

- **Fast conversion down to 0.5 ms** 

- **Low power, 0.6 µA (standby < 0.1 µA at 25°C)** 

- **Integrated digital pressure sensor (24 bit ΔΣ ADC)** 

- **Supply voltage 1.5 to 3.6 V** 

- **Operating range: 0 to 30 bar, -20 to +85 °C** 

- **I[2] C interface** 

- **No external components (Internal oscillator)** 

- **Excellent long term stability** 

- **Hermetically sealable for outdoor devices** 

- **Sealing designed for 1.8 x 0.8mm O-ring** 

The MS5837-30BA is a new generation of high resolution pressure sensors with I[2] C bus interface for depth measurement systems with a water depth resolution of 2 mm. The sensor module includes a high linearity pressure sensor and an ultra-low power 24 bit ΔΣ ADC with internal factory calibrated coefficients. It provides a precise digital 24 Bit pressure and temperature value and different operation modes that allow the user to optimize for conversion speed and current consumption. A high resolution temperature output allows the implementation in depth measurement systems and thermometer function without any additional sensor. The MS5837-30BA can be interfaced to virtually any microcontroller. The communication protocol is simple, without the need of programming internal registers in the device. The gel protection and antimagnetic stainless steel cap make the module water resistant. This new sensor module generation is based on leading MEMS technology and latest benefits from MEAS Switzerland proven experience and know-how in high volume manufacturing, which has been widely used for over a decade. 

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SENSOR SOLUTIONS /// MS5837-30BA 

MS5837-30BA Ultra Small Gel Filled Pressure Sensor 

## PERFORMANCE SPECIFICATIONS 

## **ABSOLUTE MAXIMUM RATINGS** 

|**Parameter**|**Symbol**|**Conditions**|**Min.**|**Typ. **|**Max**|**Unit**|
|---|---|---|---|---|---|---|
|Supplyvoltage|VDD||-0.3||+4|V|
|Storage temperature|TS||-40||+85|°C|
|Overpressure|Pmax|ISO 22810|||50|Bar|
|Maximum Soldering<br>Temperature|Tmax|40 sec max|||250|°C|
|ESD rating||Human Body<br>Model|-2||+2|kV|
|Latch up||JEDEC standard<br>No 78|-100||+100|mA|



## **ELECTRICAL CHARACTERISTICS** 

|**Parameter**|**Symbol**|**Conditions**|**Min.**|**Typ. **|**Max**|**Unit**|
|---|---|---|---|---|---|---|
|OperatingSupplyvoltage|VDD||1.5|3.0|3.6|V|
|OperatingTemperature|T||-20|+25|+85|°C|
|Supply current<br>(1 sample per sec.)|IDD|OSR<br>8192<br>4096<br>2048<br>1024<br>512<br>256||20.09<br>10.05<br>5.02<br>2.51<br>1.26<br>0.63||µA|
|Peak supplycurrent||duringconversion||1.25||mA|
|Standbysupplycurrent||at 25°C||0.01|0.1|µA|
|VDD Capacitor||From VDD to GND|100|470||nF|



## **ANALOG DIGITAL CONVERTER (ADC)** 

|**Parameter**|**Symbol**|**Conditions**|**Min.**|**Typ. **|**Max**|**Unit**|
|---|---|---|---|---|---|---|
|Output Word||||24||Bit|
|Conversion time(1)|tc|OSR               8192<br>4096<br>2048<br>1024<br>512<br>256|<br>14.8<br>7.40<br>3.72<br>1.88<br>0.95<br>0.48|16.44<br>8.22<br>4.13<br>2.08<br>1.06<br>0.54|18.08<br>9.04<br>4.54<br>2.28<br>1.17<br>0.60|ms|



(1): Maximum values must be applied to determine w aiting times in I2C communication 

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SENSOR SOLUTIONS /// MS5837-30BA 

MS5837-30BA Ultra Small Gel Filled Pressure Sensor 

## PERFORMANCE SPECIFICATIONS (CONTINUED) 

## **PRESSURE OUTPUT CHARACTERISTICS (VDD** = 3 V, T = 25°C UNLESS OTHERWISE NOTED **)** 

|**Parameter**|**Conditions**|**Conditions**|**Min.**|**Typ. **|**Max**|**Unit**|
|---|---|---|---|---|---|---|
|OperatingPressure Range|Prange|Full Accuracy|0||30|Bar|
|Absolute Accuracy (1),<br>Temperature range:  0 … 40°C|0 … 6 bar<br>0 … 20 bar<br>0 … 30 bar||-50<br>-100<br>-200||+50<br>+100<br>+200|mbar|
|Absolute Accuracy (1),<br>Temperature range: -20 … 85°C|0 … 6 bar<br>0 … 20 bar<br>0 … 30 bar||-100<br>-200<br>-400||+100<br>+200<br>+400|mbar|
|Maximum error with supply<br>voltage(2)|VDD= 1.5 V … 3.6 V|||±30||mbar|
|Long-term stability||||±30||mbar/year|
|Resolution RMS|OSR<br>8192<br>4096<br>2048<br>1024<br>512<br>256|||0.20<br>0.28<br>0.38<br>0.54<br>0.84<br>1.57||mbar|
|Reflow soldering impact|IPC/JEDEC J-STD-020D.1<br>(See application note AN808<br>on http://meas-spec.com)|||-8||mbar|
|Recoveringtime after reflow(3)||||7||Days|



- (1) With autozero at one pressure point 

- (2) With autozero at 3V point 

- (3) Time to recover at least 66% of the reflow  impact. 

## **TEMPERATURE OUTPUT CHARACTERISTICS (VDD = 3 V, T = 25°C** UNLESS **OTHERWISE NOTED)** 

|**Parameter**|**Conditions**|**Min.**|**Typ. **|**Max**|**Unit**|
|---|---|---|---|---|---|
|Absolute Accuracy|0 …10 bar, 25°C<br>0 …10 bar, 0..60°C<br>-20..85°C|-1.5<br>-2.0<br>-4.0||+1.5<br>+2.0<br>+4.0|°C|
|Maximum error with supply<br>voltage|VDD= 1.5 V … 3.6 V||± 0.3||°C|
|Resolution RMS|OSR<br>8192<br>4096<br>2048<br>1024<br>512<br>256||0.0022<br>0.0026<br>0.0033<br>0.0041<br>0.0055<br>0.0086||°C|



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SENSOR SOLUTIONS /// MS5837-30BA 

MS5837-30BA Ultra Small Gel Filled Pressure Sensor 

## PERFORMANCE SPECIFICATIONS (CONTINUED) 

## **DIGITAL INPUTS (SCL, SDA)** 

|**DIGITAL INPUTS (SCL, SDA)**|||||||
|---|---|---|---|---|---|---|
|**Parameter**|**Symbol**|**Conditions**|**Min.**|**Typ. **|**Max**|**Unit**|
|Serial data clock|SCL||||400|kHz|
|Input high voltage|VIH||80% VDD||100% VDD|V|
|Input low voltage|VIL||0% VDD||20% VDD|V|
|Input leakage current|Ileak25°C|at 25°c|||0.1|µA|



## **DIGITAL OUTPUTS (SDA)** 

|**DIGITAL OUTPUTS (SDA)**|||||||
|---|---|---|---|---|---|---|
|**Parameter**|**Symbol**|**Conditions**|**Min.**|**Typ. **|**Max**|**Unit**|
|Output high voltage|VOH|Isource= 0.6 mA|80% VDD||100% VDD|V|
|Output low voltage|VOL|Isink= 0.6 mA|0% VDD||20% VDD|V|



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SENSOR SOLUTIONS /// MS5837-30BA 

MS5837-30BA Ultra Small Gel Filled Pressure Sensor 

## PERFORMANCE CHARACTERISTICS 

## **PRESSURE ERROR VS PRESSURE AND TEMPERATURE** 

## **TEMPERATURE ERROR VS PRESSURE AND TEMPERATURE** 

## **PRESSURE AND TEMPERATURE ERROR VS POWER SUPPLY** 

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SENSOR SOLUTIONS /// MS5837-30BA 

MS5837-30BA Ultra Small Gel Filled Pressure Sensor 

## FUNCTIONAL DESCRIPTION 

## **GENERAL** 

The MS5837-30BA consists of a piezo-resistive sensor and a sensor interface IC. The main function of the MS5837-30BA is to convert the uncompensated analogue output voltage from the piezo -resistive pressure sensor to a 24-bit digital value, as well as providing a 24-bit digital value for the temperature of the sensor. 

## **FACTORY CALIBRATION** 

Every module is individually factory calibrated at two temperatures and two pressures. As a result, 6 coefficients necessary to compensate for process variations and temperature variations are calculated and stored in the 112bit PROM of each module. These bits (partitioned into 6 coefficients W1 to W6) must be read by the microcontroller software and used in the program converting D1 and D2 into compensated pressure and temperature values. 

The coefficients W0 is for factory configuration and CRC. 

## **SERIAL I2C INTERFACE** 

The external microcontroller clocks in the data through the input SCL (Serial CLock) and SDA (Serial DAta). The sensor responds on the same pin SDA which is bidirectional for the I[2] C bus interface. So this interface type uses only 2 signal lines and does not require a chip select. 

|**Module ref**|**Mode**|**Pins used**|
|---|---|---|
|MS5837-30BA|I~~2~~C|SDA,SCL|



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SENSOR SOLUTIONS /// MS5837-30BA 

MS5837-30BA Ultra Small Gel Filled Pressure Sensor 

## **PRESSURE AND TEMPERATURE CALCULATION** 

**Start** 

Maximum v alues f or calculation results: PMIN = 0 bar   PMAX = 30 bar 

T MIN = -20°C T MAX = 85°C T REF = 20°C **Convert calibration data into coefficients (see bit pattern of W1 to W4)Read calibration data (factory calibrated) from PROM Recommended Size [1] Value Example / Variable Description | Equation variable type [bit] min max Typical** _C1_ Pressure sensitiv ity | SENS      T1 unsigned int 16 16 0 65535 34982 _C2_ Pressure of f set | OFF    T1 unsigned int 16 16 0 65535 36352 _C3_ Temperature coef f icient of pressure sensitiv ity | TCS unsigned int 16 16 0 65535 20328 _C4_ Temperature coef f icient of pressure of fset | TCO unsigned int 16 16 0 65535 22354 _C5_ Ref erence temperature | T      REF unsigned int 16 16 0 65535 26646 _C6_ Temperature coef f icient of the temperature | TEMPSENS unsigned int 16 16 0 65535 26146 ~~a~~ **Read igital preRead digital pressure and temperature datasure and temperature data** _D1_ Digital pressure v alue unsigned int 32 24 0 16777215 4958179 _D2_ Digital temperature v alue unsigned int 32 24 0 16777215 6815414 **Calculate temperature** _dT_ Dif f erence between actual and ref erence temperature _dT_ = D2 - TREF = _D2_ - _C5 * 28_ [2] signed int 32 25 -16776960 16777215 -5962 Actual temperature (-40…85°C with 0.01°C resolution) 1981 _TEMP TEMP_ = 20°C+dT*TEMPSENS = 2000+ _dT_ * _C6 /2_ 23 signed int 32 41 -4000 8500 = 19.81 °C **Calculate temCalculate temperature compensated pressureture compensated pressure** Of f set at actual temperature    [3] _OFF OFF_ =OFFT1 + TCO* dT = _C2_ * 216 + (C4* _dT_ ) / 27 signed int 64 41 -17179344900 25769410560 2381326464 Sensitiv ity  at actual temperature     [4] _SENS SENS_ =SENS  T1+TCS * dT= _C1 * 215_ + ( _C3_ * _dT_ ) / 28 signed int 64 41 -8589672450 12884705280 1145816755 Temperature compensated pressure (0…30 bar with 39998 _P_ 0.25mbar resolution) signed int 32 58 0 300000 _P_ = D1 * SENS - OFF = _(D1 * SENS / 2      21 - OFF) / 2 13_ = 3999.8 mbar **Display pressure and temperature value** ~~——~~ Notes [1] Maximal size of  intermediate result during ev aluation of  v ariable [2] min and max hav e to be def ined 

- [3] min and max hav e to be def ined 

- [4] min and max hav e to be def ined 

Flow chart for pressure and temperature reading and software compensation. 

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SENSOR SOLUTIONS /// MS5837-30BA 

MS5837-30BA Ultra Small Gel Filled Pressure Sensor 

## SECOND ORDER TEMPERATURE COMPENSATION 

**==> picture [422 x 346] intentionally omitted <==**

**----- Start of picture text -----**<br>
Pressure and Temperature parameters values first order:<br>OFF, SENS and TEMP<br>Yes No<br>(TEMP/ 100)< 20°C<br>Low temperature  Low temperature High temperature<br>Ti = 3  dT [2]  / 2 [33] Ti = 2  dT [2]  / 2 [37]<br>OFFi = 3  (TEMP – 2000) [2 ] / 2 [1] OFFi = 1  (TEMP – 2000) [2]  / 2 [4]<br>SENSi = 5  (TEMP – 2000) [2]  / 2 [3] SENSi = 0<br>Yes No<br>(TEMP/ 100) < -15°C<br>Very low temperature<br>OFFi = OFFi + 7  (TEMP + 1500) [2]<br>SENSi = SENSi + 4  (TEMP + 1500) [2]<br>Calculate pressure and temperature 2 [nd]  order<br>OFF2 = OFF - OFFi<br>SENS2 = SENS - SENSi<br>TEMP2 = (TEMP – Ti) / 100 [°C]<br>P2 = ((( D1    SENS2 ) / 2 [21]  – OFF2) / 2 [13] ) / 10  [mbar]<br>**----- End of picture text -----**<br>


Flow chart for pressure and temperature to the optimum accuracy. 

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SENSOR SOLUTIONS /// MS5837-30BA 

MS5837-30BA Ultra Small Gel Filled Pressure Sensor 

## I[2] C INTERFACE 

## **COMMANDS** 

The MS5837-30BA has only five basic commands: 

1. Reset 

2. Read PROM (112 bit of calibration words) 

3. D1 conversion 

4. D2 conversion 

5. Read ADC result (24 bit pressure / temperature) 

Each I[2] C communication message starts with the start condition and it is ended with the stop condition. The MS5837-30BA address is 1110110x (write: x=0, read: x=1). 

Size of each command is 1 byte (8 bits) as described in the table below. After ADC read commands, the device will return 24 bit result and after the PROM read 16 bit results. The address of the PROM is embedded inside of the PROM read command using the a2, a1 and a0 bits. 

||**Command byte**|**Command byte**|**Command byte**|**Command byte**|**Command byte**|**Command byte**|**Command byte**|**Command byte**|**hex value**|
|---|---|---|---|---|---|---|---|---|---|
|Bit number|0|1|2|3|4|5|6|7||
|Bit name|PRO<br>M|CO<br>NV|-|Typ|Ad2/<br>Os2|Ad1/<br>Os1|Ad0/<br>Os0|Stop||
|Command||||||||||
|Reset|0|0|0|1|1|1|1|0|0x1E|
|Convert D1(OSR=256)|0|1|0|0|0|0|0|0|0x40|
|Convert D1(OSR=512)|0|1|0|0|0|0|1|0|0x42|
|Convert D1(OSR=1024)|0|1|0|0|0|1|0|0|0x44|
|Convert D1(OSR=2048)|0|1|0|0|0|1|1|0|0x46|
|Convert D1(OSR=4096)|0|1|0|0|1|0|0|0|0x48|
|Convert D1(OSR=8192)|0|1|0|0|1|0|1|0|0x4A|
|Convert D2(OSR=256)|0|1|0|1|0|0|0|0|0x50|
|Convert D2(OSR=512)|0|1|0|1|0|0|1|0|0x52|
|Convert D2(OSR=1024)|0|1|0|1|0|1|0|0|0x54|
|Convert D2(OSR=2048)|0|1|0|1|0|1|1|0|0x56|
|Convert D2(OSR=4096)|0|1|0|1|1|0|0|0|0x58|
|Convert D2(OSR=8192)|0|1|0|1|1|0|1|0|0x5A|
|ADC Read|0|0|0|0|0|0|0|0|0x00|
|PROM Read|1|0|1|0|Ad2|Ad1|Ad0|0|0xA0 to<br>0xAE|



Command structure 

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SENSOR SOLUTIONS /// MS5837-30BA 

MS5837-30BA Ultra Small Gel Filled Pressure Sensor 

## **RESET SEQUENCE** 

The Reset sequence shall be sent once after power-on to make sure that the calibration PROM gets loaded into the internal register. It can be also used to reset the device PROM from an unknown condition. 

The reset can be sent at any time. In the event that there is not a successful power on reset this may be caused by the SDA being blocked by the module in the acknowledge state. The only way to get the MS5837-30BA to function is to send several SCLs followed by a reset sequence or to repeat power on reset. 

**==> picture [288 x 54] intentionally omitted <==**

**----- Start of picture text -----**<br>
1 1 1 0 1 1 0 0 0 0 0 0 1 1 1 1 0 0<br>Device Address command<br>S Device Address W A cmd byte A P<br>From Master S = Start Condition W = Write A = Acknowledge<br>From Slave P = Stop Condition R = Read N = Not Acknowledge<br>**----- End of picture text -----**<br>


I[2] C Reset Command 

## **PROM READ SEQUENCE** 

The read command for PROM shall be executed once after reset by the user to read the content of the calibration PROM and to calculate the calibration coefficients. There are in total 7 addresses resulting in a total memory of 112 bit. Addresses contain factory data and the setup, calibration coefficients, the serial code and CRC. The command sequence is 8 bits long with a 16 bit result which is clocked with the MSB first. The PROM Read command consists of two parts. First command sets up the system into PROM read mode. The second part gets the data from the system. 

||1|1|1|0|1|1|0|0|0|1|0|1|0|0|1|1<br>0|0|||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|||Device||Address||||||||command||||||||
|S||Device||Address||||W|A|||cmd||byte|||A|P||
|||||||||||||||||||||
||From||Master||||S = Start|||Condition||||||W = Write|||A = Acknowledge|
||From||Slave||||P = Stop Condition|||||||||R = Read|||N = Not Acknowledge|



I[2] C Command to read memory address= 011 

|1<br>1<br>1<br>0<br>1<br>1<br>0<br>1<br>0<br>X<br>X<br>X<br>X<br>X<br>X<br>X<br>X<br>0<br>X<br>X<br>X<br>X<br>X<br>X<br>X<br>X<br>0<br>Device Address<br>data<br>data|1<br>1<br>1<br>0<br>1<br>1<br>0<br>1<br>0<br>X<br>X<br>X<br>X<br>X<br>X<br>X<br>X<br>0<br>X<br>X<br>X<br>X<br>X<br>X<br>X<br>X<br>0<br>Device Address<br>data<br>data|1<br>1<br>1<br>0<br>1<br>1<br>0<br>1<br>0<br>X<br>X<br>X<br>X<br>X<br>X<br>X<br>X<br>0<br>X<br>X<br>X<br>X<br>X<br>X<br>X<br>X<br>0<br>Device Address<br>data<br>data|1<br>1<br>1<br>0<br>1<br>1<br>0<br>1<br>0<br>X<br>X<br>X<br>X<br>X<br>X<br>X<br>X<br>0<br>X<br>X<br>X<br>X<br>X<br>X<br>X<br>X<br>0<br>Device Address<br>data<br>data|1<br>1<br>1<br>0<br>1<br>1<br>0<br>1<br>0<br>X<br>X<br>X<br>X<br>X<br>X<br>X<br>X<br>0<br>X<br>X<br>X<br>X<br>X<br>X<br>X<br>X<br>0<br>Device Address<br>data<br>data|1<br>1<br>1<br>0<br>1<br>1<br>0<br>1<br>0<br>X<br>X<br>X<br>X<br>X<br>X<br>X<br>X<br>0<br>X<br>X<br>X<br>X<br>X<br>X<br>X<br>X<br>0<br>Device Address<br>data<br>data|1<br>1<br>1<br>0<br>1<br>1<br>0<br>1<br>0<br>X<br>X<br>X<br>X<br>X<br>X<br>X<br>X<br>0<br>X<br>X<br>X<br>X<br>X<br>X<br>X<br>X<br>0<br>Device Address<br>data<br>data|1<br>1<br>1<br>0<br>1<br>1<br>0<br>1<br>0<br>X<br>X<br>X<br>X<br>X<br>X<br>X<br>X<br>0<br>X<br>X<br>X<br>X<br>X<br>X<br>X<br>X<br>0<br>Device Address<br>data<br>data|1<br>1<br>1<br>0<br>1<br>1<br>0<br>1<br>0<br>X<br>X<br>X<br>X<br>X<br>X<br>X<br>X<br>0<br>X<br>X<br>X<br>X<br>X<br>X<br>X<br>X<br>0<br>Device Address<br>data<br>data|
|---|---|---|---|---|---|---|---|---|
|S|Device Address|R|A|Memory bit 15-8|A|Memory bit 7-0|N|P|
|From Master<br>S = Start Condition<br>W = Write<br>A = Acknowledge<br>From Slave<br>P = Stop Condition<br>R = Read<br>N = Not Acknowledage|||||||||
||||||||||
||||||||||



I[2] C answer from MS5837-30BA 

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SENSOR SOLUTIONS /// MS5837-30BA 

MS5837-30BA Ultra Small Gel Filled Pressure Sensor 

## **CONVERSION SEQUENCE** 

The conversion command is used to initiate uncompensated pressure (D1) or uncompensated temperature (D2) conversion. After the conversion, using ADC read command the result is clocked out with the MSB first. If the conversion is not executed before the ADC read command, or the ADC read command is repeated, it will give 0 as the output result. If the ADC read command is sent during conversion the result will be 0, the conversion will not stop and the final result will be wrong. Conversion sequence sent during the already started conversion process will yield incorrect result as well. A conversion can be started by sending the command to MS5837-30BA. When command is sent to the system it stays busy until conversion is done. When conversion is finished the data can be accessed by sending a Read command, when acknowledge is sent from the MS5837-30BA, 24 SCL cycles may be sent to receive all result bits. Every 8 bits the system waits for an acknowledge signal. 

|||||1<br>1<br>1<br>0<br>1<br>1|0<br>0<br>0<br>0<br>1<br>0<br>0<br>1<br>0|0<br>0|0||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|
|||||S<br>W A<br>A<br>P<br>cmd byte<br>Device Address<br>Device Address<br>command<br>~~a~~<br>~~0~~|||||||||
|||||From Master<br>From Slave<br>~~o~~|S = Start Condition<br>P = Stop Condition|W = Write<br>R = Read||||A = Acknowledge<br>N = Not Acknowledge|||
|||||I2C command to initiate a pressure conversion (OSR=4096, typ=D1)|C command to initiate a pressure conversion (OSR=4096, typ=D1)|||C command to initiate a pressure conversion (OSR=4096, typ=D1)|||||
|||||1<br>1<br>1<br>0<br>1<br>1|0<br>0<br>0<br>0<br>0<br>0<br>0<br>0<br>0|0<br>0|0||||||
|||||S<br>Device Address<br>Device Address<br>~~a~~|W A<br>cmd byte<br>command<br>~~OO~~||A|P|||||
|||||From Master<br>From Slave<br>~~cI~~|S = Start Condition<br>P = Stop Condition|W = Write<br>R = Read||||A = Acknowledge<br>N = Not Acknowledge|||
||||||I2C ADC read sequence||||||||
|||1|1|1<br>0<br>1<br>1<br>0<br>1<br>0<br>X<br>X|X<br>X<br>X<br>X<br>X<br>X<br>0<br>X<br>X|X<br>X|X|X|X|X<br>0<br>X<br>X<br>X<br>X<br>X<br>X<br>X<br>X|0||
|S<br>R<br>A<br>Dev ice A ddress<br>Dev ice A ddress<br>~~CLD~~|||||A<br>Data 23-16<br>data|Data 15 - 8<br>data||A<br>Data 7 - 0<br>Data 15 - 8<br>data<br>~~ee~~|||N|P|
|~~A~~|~~A~~|From Master<br>From Slave<br>~~A~~||From Master<br>S = Start C ondition<br>W = Write<br>From Slave<br>P = Stop C ondition<br>R = Read||A  = A cknowledge<br>N = Not A cknowledge|||||||



I[2] C answer from MS5837-30BA 

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SENSOR SOLUTIONS /// MS5837-30BA 

MS5837-30BA Ultra Small Gel Filled Pressure Sensor 

## CYCLIC REDUNDANCY CHECK (CRC) 

MS5837-30BA contains a PROM memory with 112-Bit. A 4-bit CRC has been implemented to check the data validity in memory. The besides C code describes in detail CRC-4 calculation. 

**==> picture [426 x 378] intentionally omitted <==**

**----- Start of picture text -----**<br>
C6  [D] D D D D D D D D D D D D D D D<br>B B B B B B<br>B B B B B B B B B B<br>1 1 1 1 1 1<br>9 8 7 6 5 4 3 2 1 0<br>5  4 3 2 1 0<br>0  CRC Factory defined<br>1  C1<br>2  C2<br>3  C3<br>4  C4<br>5  C5<br>6<br>Memory PROM mapping<br>C Code example for CRC-4 calculation:<br>unsigned char crc4(unsigned int n_prom[])  // n_prom defined as 8x unsigned int (n_prom[8])<br>{<br>int cnt; // simple counter<br>unsigned int n_rem=0; // crc remainder<br>unsigned char n_bit;<br>n_prom[0]=((n_prom[0]) & 0x0FFF); // CRC byte is replaced by 0<br>n_prom[7]=0;  // Subsidiary value, set to 0<br>for (cnt = 0; cnt < 16; cnt++) // operation is performed on bytes<br>{ // choose LSB or MSB<br>if (cnt%2==1) n_rem ^= (unsigned short) ((n_prom[cnt>>1]) & 0x00FF);<br>else n_rem ^= (unsigned short) (n_prom[cnt>>1]>>8);<br>for (n_bit = 8; n_bit > 0; n_bit--)<br>{<br>if (n_rem & (0x8000)) n_rem = (n_rem << 1) ^ 0x3000;<br>else n_rem = (n_rem << 1);<br>}<br>}<br>n_rem= ((n_rem >> 12) & 0x000F); // final 4-bit remainder is CRC code<br>return (n_rem ^ 0x00);<br>**----- End of picture text -----**<br>


} 

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SENSOR SOLUTIONS /// MS5837-30BA 

MS5837-30BA Ultra Small Gel Filled Pressure Sensor 

## APPLICATION CIRCUIT 

The MS5837 is a circuit that can be used in conjunction with a microcontroller in mobile altimeter applications. 

Typical application circuit 

## PIN CONFIGURATION AND DEVICE PACKAGE OUTLINE 

## **UNLESS OTHERWISE SPECIFIED DIMENSIONS ARE IN MILLIMETERS. GENERAL TOLERANCE ± 0.1** 

|1 GND|1 GND|GROUND|
|---|---|---|
|2 VDD|2 VDD|POSITIVE SUPPLY|
|3 SCL|3 SCL|I2C CLOCK|
|4 SDA|4 SDA|I2C DATA|



Package outlines and Pin configuration 

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MS5837-30BA Ultra Small Gel Filled Pressure Sensor 

## RECOMMENDED PAD LAYOUT 

Pad layout for bottom side of the MS5837-30BA soldered onto printed circuit board. 

Recommended PCB footprint 

## SHIPPING PACKAGE 

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SENSOR SOLUTIONS /// MS5837-30BA 

MS5837-30BA Ultra Small Gel Filled Pressure Sensor 

## MOUNTING AND ASSEMBLY CONSIDERATIONS 

## **SOLDERING** 

Please refer to the application note AN808 available on our website for all soldering recommendations. 

## **MOUNTING** 

The MS5837-30BA can be placed with automatic Pick & Place equipment using vacuum nozzles. It will not be damaged by the vacuum. Due to the low stress assembly the sensor does not show pressure hysteresis effects. It is important to solder all contact pads. 

## **CONNECTION TO PCB** 

The package outline of the module allows the use of a flexible PCB for interconnection. This can be important for applications in watches and other special devices. 

## **SEALING WITH O-RINGS** 

In applications such as outdoor watches the electronics must be protected against direct water or humidity. For such applications the MS5837-30BA provides the possibility to seal with an O-ring. The O-ring shall be placed at the groove location, i.e. the small outer diameter of the metal lid. The following O-ring / housing dimensions are recommended: 

|O-ringinnerdiameter|1.8±0.05mm|
|---|---|
|O-ring cross-sectiondiameter|0.8±0.03mm|
|Housing bore diameter|3.07 ±0.03mm|



Please refer to the application note AN523 available on our website for O-ring mounting recommendations. 

## **CLEANING** 

The MS5837-30BA has been manufactured under clean-room conditions. It is therefore recommended to assemble the sensor under class 10’000 or better conditions. Should this not be possible, it is recommended to protect the sensor opening during assembly from entering particles and dust. To avoid cleaning of the PCB, solder paste of type “no-clean” shall be used. Warning: cleaning might damage the sensor. 

## **ESD PRECAUTIONS** 

The electrical contact pads are protected against ESD up to 2 kV HBM (human body model). It is therefore essential to ground machines and personnel properly during assembly and handling of the device. The MS583730BA is shipped in antistatic transport boxes. Any test adapters or production transport boxes used during the assembly of the sensor shall be of an equivalent antistatic material. 

## **DECOUPLING CAPACITOR** 

Particular care must be taken when connecting the device to the power supply. A minimum of 100nF ceramic capacitor must be placed as close as possible to the MS5837-30BA VDD pin. This capacitor will stabilize the power supply during data conversion and thus, provide the highest possible accuracy. 

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SENSOR SOLUTIONS /// MS5837-30BA 

MS5837-30BA Ultra Small Gel Filled Pressure Sensor 

## ORDERING INFORMATION 

|**Part Number / Art. Number**|**Product**|**Delivery Form**|
|---|---|---|
|MS583730BA01-50|MS5837-30BA Ultra Small Gel Filled Pressure Sensor|Tape & Reel|



## **NORTH AMERICA** 

Measurement Specialties, Inc., a TE Connectiv ity  company 45738 Northport Loop West Fremont, CA 94538 Tel:  +1 800 767 1888 Fax: +1 510 498 1578 e-mail: pf g.cs.amer@meas-spec.com Website: www.meas-spec.com 

## **EUROPE** 

## **ASIA** 

MEAS Switzerland Sàrl, Measurement Specialties (China), Ltd., a TE Connectiv ity  company a TE Connectiv ity  company Ch. Chapons-des-Prés 11 No. 26 Langshan Road CH-2022 Bev aix, Switzerland Shenzhen High-Tech Park (North) Nanshan Tel:  +41 32 847 9550 District, Shenzhen, 518057 Fax: +41 32 847 9569 China e-mail: sales.ch@meas-spec.com Tel:  +86 755 3330 5088 Website: www.meas-spec.com Fax: +86 755 3330 5099 e-mail: pf g.cs.asi@ameas-spec.com Website: www.meas-spec.com 

## **TE.com/sensorsolutions** 

Measurement Specialties, Inc., a TE Connectivity company. 

Measurement Speci alties, TE Connecti vity, TE Connecti vity (logo) and EVERY CONNECTION COUNTS are trademar ks. All other logos, products and/or company names referred to herein might be trademarks of their respective owners. 

The information given herein, includi ng drawings, illustrati ons and schematics which are i ntended for illustration purposes o nl y, is believed to be reliable. H owever, TE Connecti vity makes no warranties as to its accur acy or completeness and disclai ms any liability in connection with its use. TE Connecti vity‘s obligations shall onl y be as set forth i n TE Connecti vity‘s Standard Terms and Conditions of Sale for this product and in no case will TE Connectivity be liable for any incidental, indirect or consequential damages arising out of the sale, resale, use or misuse of the product. Users of TE Connectivity products should make their own evaluation to determine the suitability of each such product for the specific application. 

© 2015 TE Connectivity Ltd. family of companies All Rights Reserved. 

CDOC-DA-0093 4 

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SENSOR SOLUTIONS /// MS5837-30BA 



## Links

- [View this product on Novapart](https://novapart.co/products/MS583730BA01-50/pressure-sensor-30-bar-digital-sealed-gauge-3-v)
- [Request a quote for this part](https://novapart.co/quote/)
- [Supplier page](https://es.farnell.com/en-ES/te-connectivity/ms583730ba01-50/gel-filled-pressure-sensor-30bar/dp/3397833)
---

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